Blue film jacking device
By designing a blue film hoisting device including a hoisting mechanism and a backlight source, applying a slight pressure to the wafer to expand the cutting joint, the problem of detecting the quality of small cutting joints in the prior art is solved, and efficient and low-cost detection is achieved Effect.
Patent Information
- Application Number
- CN202323284360.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-01
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-01
AI Technical Summary
The prior art is difficult to effectively detect the quality of wafer cutting joints, especially because the cutting joints are extremely small, and they need to be enlarged by the visual system before detection, and it is difficult to expand the cutting joints for easy detection during the detection process.
A blue film hoisting device is designed, including a base, hoisting mechanism and a backlight source, and a light source is applied to the wafer through the hoisting mechanism, which expands the cutting seam and uses the backlight source to provide a light source for easy detection. The hoisting mechanism uses a screw rod and connecting rod mechanism driven by a servo motor to achieve precise control and prevent the cutting joint from breaking.
It realizes high-precision and low-cost quality inspection of wafer cutting joints, reducing detection time and cost, and providing a convenient detection light source and improving detection efficiency.
Smart Images
Figure CN222261014U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wafer chip detection, in particular to a blue film lifting device for detecting the quality of wafer chip cutting seams. Background Art
[0002] After the wafer is processed into a chip, it needs to be diced and cut. Since the GPP blue film product is directly used for packaging after cutting, the surface quality and cutting quality of the GPP blue film product need to be tested again. The detection includes whether there are defects such as edge collapse and cutting deviation. Since the cutting seam of the wafer is extremely small, it needs to be magnified by a visual system to detect the cutting quality. In order to better detect the cutting quality, the cutting seam can be enlarged after the wafer is slightly deformed. Therefore, a device is needed to lift and press the wafer. Summary of the invention
[0003] The utility model aims to provide a high-precision and high-efficiency blue film lifting device, which can pressurize a wafer arranged on the blue film, expand a cutting seam, and perform detection.
[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:
[0005] The blue film lifting device is characterized in that it includes a base, a lifting mechanism, a backlight source and a blue film ring storage table; the base is provided with a support column; the blue film ring storage table is hollow and is supported by the support column above the base; the lifting mechanism is provided on the base, and the backlight source is connected to the lifting mechanism and is lifted and lowered at the hollow position of the blue film ring storage table. The cut wafer with the blue film is placed on the blue film ring storage table, and the lifting mechanism drives the backlight source to lift and slightly apply a force to the wafer, causing it to deform slightly and expand the cutting seam, thereby facilitating the detection of the cutting quality of the cutting seam. While lifting, the backlight source can also provide a light source for wafer cutting seam detection from below, which is more convenient for the detection of the cutting quality of the cutting seam.
[0006] Its further feature is that a backlight source platform is arranged on the lifting mechanism, and the backlight source is fixed on the backlight source platform.
[0007] Preferably, the blue film ring storage table has two layers, the upper layer and the lower layer, and the blue film wafer is positioned in the gap between the upper layer and the lower layer. This structure facilitates the insertion and positioning of the blue film wafer.
[0008] Preferably, the lifting mechanism includes a lead screw driven by a servo motor, a nut arranged on the lead screw, and a cross-arranged connecting rod mechanism; the connecting rod mechanism drives the nut on the lead screw to adjust the cross angle to achieve lifting. The lead screw and connecting rod mechanism driven by a servo motor are used to lift the backlight source, which makes the lifting control more precise, makes the force applied to the wafer more accurate, and prevents the cutting seam from breaking while ensuring the expansion of the cutting seam.
[0009] Preferably, the connecting rod mechanism is divided into two groups, which are connected by a connecting rod and are lifted synchronously. The two groups of synchronously arranged connecting rod mechanisms can make the lifting of the backlight source more uniform.
[0010] Preferably, the screw rod is a trapezoidal screw rod, which has low manufacturing cost, good self-locking performance and is suitable for short-distance driving and positioning.
[0011] Preferably, there are four support columns, which are respectively arranged at the four corners of the base, so that the support for the blue diaphragm ring storage table is more stable.
[0012] The utility model uses a backlight source to lift the cut wafer, so that the wafer is slightly deformed and the cutting seam is enlarged, thereby facilitating the detection of the cutting quality of the cutting seam. While lifting, the backlight source can also provide a light source for wafer cutting seam detection from below, making it easier to detect the cutting quality of the cutting seam. The utility model has a simple structure and low manufacturing cost, and can greatly reduce the detection time and cost of wafer cutting seam quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG1 is a schematic diagram of the structure of the utility model.
[0014] FIG. 2 is a side view schematic diagram of the utility model.
[0015] FIG3 is a schematic diagram of the decomposition of the utility model. DETAILED DESCRIPTION
[0016] like Figure 1-3 As shown, a blue film lifting device includes a base 11, a lifting mechanism, a backlight source 3 and a blue film ring storage platform 1. Four support columns 2 are arranged at the four corners of the base 11. The blue film ring storage platform 1 is hollow and has two upper and lower layers. It is supported and arranged above the base 11 by the support columns 2, and the blue film wafer is positioned in the gap between the upper and lower layers of the blue film ring storage platform 1. The lifting mechanism is arranged on the base 11, and the backlight source 3 is arranged on the backlight source platform 4 of the lifting mechanism, and is raised and lowered at the hollow position of the blue film ring storage platform 1.
[0017] The lifting mechanism includes a trapezoidal screw 10 driven by a servo motor 7, a nut 9 arranged on the trapezoidal screw 10, and two sets of cross-arranged connecting rod mechanisms 5. The servo motor 7 is connected to the trapezoidal screw 10 through a coupling 8. The two sets of connecting rod mechanisms 5 are connected through a connecting rod 6 and are lifted synchronously. The connecting rod mechanism 5 is driven by the nut 9 on the trapezoidal screw 10 to adjust the cross angle to achieve lifting.
[0018] When the utility model is working, the wafer with the blue film attached after cutting is placed on the blue film ring storage table 1, the servo motor 7 rotates, driving the trapezoidal screw 10 to rotate, the nut 9 on the trapezoidal screw 10 drives the cross angle of the connecting rod mechanism 5 to become smaller, and the backlight source 3 on the backlight source platform 4 is lifted upward, exerting force on the wafer to slightly deform it, and the cutting seam is enlarged, so as to facilitate the detection of the cutting quality of the cutting seam. While lifting, the backlight source 3 can also provide a light source for the wafer cutting seam detection from below, which is more convenient for the detection of the cutting quality of the cutting seam.
Claims
1. Blue film lifting device, characterized by: It includes a base, a lifting mechanism, a backlight source and a blue diaphragm ring storage table; the base is provided with a supporting column; the blue diaphragm ring storage table is hollow and is supported by the supporting column and arranged above the base; the lifting mechanism is arranged on the base; the backlight source is connected to the lifting mechanism and rises and falls at the hollow position of the blue diaphragm ring storage table.
2. The blue film lifting device according to claim 1, characterized in that: The lifting mechanism is provided with a backlight source platform, and the backlight source is fixed on the backlight source platform.
3. The blue film lifting device according to claim 1, characterized in that: The blue film ring storage table has two layers, an upper layer and a lower layer, and the blue film wafer is positioned in the gap between the upper layer and the lower layer.
4. The blue film lifting device according to any one of claims 1 to 3, characterized in that: The lifting mechanism comprises a lead screw driven by a servo motor, a nut arranged on the lead screw, and a cross-arranged connecting rod mechanism; the connecting rod mechanism is driven by the nut on the lead screw to adjust the cross angle to achieve lifting.
5. The blue film lifting device according to claim 4, characterized in that: The connecting rod mechanism comprises two groups, which are connected by a connecting rod and are lifted synchronously.
6. The blue film lifting device according to claim 5, characterized in that: The lead screw is a trapezoidal lead screw.
7. The blue film lifting device according to any one of claims 1 to 3, characterized in that: There are four supporting columns, which are respectively arranged at the four corners of the base.