Wafer jacking mechanism and wafer detection equipment

Abstract

The utility model relates to a wafer jacking mechanism and wafer detection equipment. The wafer jacking mechanism comprises a wafer bearing module, a mounting block and a first driving mechanism, the wafer bearing module comprises a chuck, an ejector pin and an ejector pin mounting plate, and the chuck is used for bearing a wafer; the ejector pin is mounted on the ejector pin mounting plate, the chuck is provided with an ejector pin hole, the chuck and the ejector pin mounting plate are detachably arranged on the mounting block, the ejector pin mounting plate can move relative to the chuck, and the first driving mechanism is used for driving the ejector pin mounting plate to move. The ejector pin mounting plate drives each ejector pin to stretch out and draw back relative to the corresponding ejector pin hole; the wafer bearing module can be integrally disassembled and assembled. According to the technical scheme provided by the utility model, the wafer bearing module can be integrally disassembled and assembled, so that the chuck and the ejector pin can be integrally assembled in equipment after being assembled outside a machine table, and the offline installation of the chuck and the ejector pin is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer lifting mechanism and wafer detection equipment. Background Art

[0002] The wafer inspection equipment has a chuck for carrying the wafer. After the wafer is inspected, a pin will push the wafer off the chuck surface for unloading. The chuck is provided with a pin hole, and the pin (also called a pin) responsible for lifting the wafer is inserted into the pin hole and can be extended relative to the pin hole.

[0003] At present, in the process of assembling wafer inspection equipment, the ejector pin is generally installed on the machine platform of the wafer inspection equipment first, and then the chuck is installed, so that the ejector pin hole on the chuck is connected with the corresponding ejector pin to realize the assembly of the chuck and the ejector pin. Since the diameter of the ejector pin and the corresponding ejector pin hole on the chuck is small, and the installation space on the machine platform is limited, the process of installing the chuck often encounters difficulties in alignment, which is time-consuming and labor-intensive. Once a mistake is made, the ejector pin will be damaged, so this situation needs to be solved. Utility Model Content

[0004] In view of this, the utility model provides a wafer lifting mechanism and a wafer detection device, the main technical problem to be solved is: how to improve the safety of assembling both the ejector pin and the chuck and reduce the risk of damaging the ejector pin during the chuck assembly process.

[0005] In order to achieve the above purpose, the utility model mainly provides the following technical solutions:

[0006] The embodiment of the utility model provides a wafer lifting mechanism, which includes a wafer carrying module, a mounting block and a first driving mechanism; the wafer carrying module includes a chuck, an ejector pin and an ejector pin mounting plate, the chuck is used to carry the wafer; the ejector pin is mounted on the ejector pin mounting plate, the chuck is provided with an ejector pin hole, the ejector pin is inserted into the ejector pin hole, the number of the ejector pins is more than two, the number of the ejector pin holes is equal to the number of the ejector pins, and they are arranged one-to-one;

[0007] The chuck and the ejector mounting plate can be detachably arranged on the mounting block, and the ejector mounting plate can also move relative to the chuck, and the first driving mechanism is used to drive the ejector mounting plate to move, so that the ejector mounting plate drives each ejector to extend and retract relative to the corresponding ejector hole;

[0008] Wherein, the wafer carrying module can be disassembled and assembled as a whole.

[0009] In some embodiments, the ejector mounting plate is provided with plugging holes, and the number of the plugging holes is equal to the number of ejectors; one end of each ejector has a first external thread section, and each ejector is plugged into the corresponding plugging hole through its first external thread section to be mounted on the ejector mounting plate;

[0010] Wherein, a nut is sleeved on the first external thread section of each ejector pin, and each nut is used to abut against the ejector pin mounting plate to control the depth of each first external thread section inserted into the corresponding plug-in hole.

[0011] In some embodiments, the wafer carrying module includes a connecting block and a slider disposed on the connecting block, the connecting block is connected to the mounting block, and the ejector mounting plate is disposed on the slider so as to move relative to the chuck through the slider.

[0012] In some embodiments, the ejector mounting plate and the slider are detachably connected via a first screw, wherein a first screw hole is provided on the ejector mounting plate, and a first screw through hole is provided on the slider, and the first screw is used to pass through the first screw through hole on the slider and be threadedly connected in the first screw hole.

[0013] In some embodiments, the connecting block and the mounting block are detachably connected via a second screw, a second screw through hole is provided on the connecting block, and a second screw hole is provided on the mounting block. The second screw is used to pass through the second screw through hole and be threadedly connected to the second screw hole.

[0014] In some embodiments, the mounting block is provided with a leveling piece, the number of the leveling pieces is more than two, and the leveling pieces are evenly spaced and arranged in the circumferential direction of the mounting block; one end of each of the leveling pieces has a second external thread segment, and each of the leveling pieces is threadedly connected to the mounting block through its own second external thread segment;

[0015] The number of the second screw holes is equal to the number of the leveling members, and each second screw hole is arranged on a corresponding leveling member in a one-to-one correspondence.

[0016] In some embodiments, the chuck is disposed on the connection block to be connected to the mounting block via the connection block, wherein the chuck is detachable relative to the connection block.

[0017] In some embodiments, the first driving mechanism includes a first ball screw structure and a driving cylinder, and the driving cylinder is arranged on a nut seat of the first ball screw structure; the first driving mechanism drives the driving cylinder to move through the nut seat of the first needle screw structure, so that the driving rod of the driving cylinder pushes the ejector mounting plate to move through the side.

[0018] In some embodiments, the mounting block is a movable block, and the wafer lifting mechanism further includes a second driving mechanism, and the second driving mechanism is used to drive the mounting block to move, so that the mounting block drives the chuck to move to a set unloading position.

[0019] An embodiment of the utility model further provides a wafer inspection device, which may include any one of the wafer lifting mechanisms described above.

[0020] By means of the above technical solution, the wafer lifting mechanism and wafer inspection equipment of the utility model have at least the following beneficial effects:

[0021] Since the wafer carrier module can be disassembled as a whole, the chuck and ejector pins can be assembled outside the machine first, and then assembled into the equipment as a whole, thus realizing the offline installation of the chuck and ejector pins. Compared with the narrow space on the machine, since there is more space outside the machine, it is convenient for operators to smoothly insert each ejector pin into the ejector pin hole on the chuck, thereby improving the safety of the assembly of the ejector pin and the chuck, and reducing the risk of damaging the ejector pin during the assembly of the chuck. In addition, the chuck is easy to install, which improves the efficiency of maintenance and adjustment.

[0022] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1 This is a structural schematic diagram of a wafer lifting mechanism provided by an embodiment of the utility model;

[0025] Figure 2 It is a structural schematic diagram of a wafer carrying module;

[0026] Figure 3 It is a partial structural schematic diagram of the wafer carrying module from another perspective;

[0027] Figure 4 It is a partial structural schematic diagram of the wafer carrying module from another perspective;

[0028] Figure 5 yes Figure 4A cross-sectional view of the wafer carrier module;

[0029] Figure 6 It is a partial structural schematic diagram of the wafer carrying module from another perspective;

[0030] Figure 7 yes Figure 6 The enlarged schematic diagram of point A in the middle;

[0031] Figure 8 It is a structural schematic diagram of a wafer lifting mechanism provided by an embodiment of the utility model from another perspective;

[0032] Fig. 9 It is a structural schematic diagram of the leveling component.

[0033] Figure numerals: 1. base; 2. first driving mechanism; 3. mounting block; 4. wafer carrying module; 6. leveling member; 7. guide column; 8. second driving mechanism; 41. chuck; 42. ejector pin; 43. ejector pin mounting plate; 44. connecting ring; 45. connecting block; 46. connecting plate; 411. ejector pin hole; 61. second screw hole; 62. second external threaded section; 421. nut; 422. first external threaded section; 431. first screw hole; 441. second screw through hole; 451. first screw through hole; 452. plug-in hole. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0037] like Figures 1 to 9 As shown, an embodiment of the utility model proposes a wafer lifting mechanism, which includes a wafer carrying module 4, a mounting block 3 and a first driving mechanism. The wafer carrying module 4 includes a chuck 41, an ejector pin 42 and an ejector pin mounting plate 43. The chuck 41 is used to carry a wafer. The ejector pin 42 is mounted on the ejector pin mounting plate 43, and the chuck 41 is provided with an ejector pin hole 411, and the ejector pin 42 is inserted into the ejector pin hole 411. Among them, the number of ejector pins 42 is more than two, and the number of ejector pin holes 411 is equal to the number of ejector pins 42, and they are arranged one-to-one. Each ejector pin 42 is plugged into the corresponding ejector pin hole 411 in a one-to-one correspondence.

[0038] The aforementioned chuck 41 and ejector mounting plate 43 are both detachably arranged on the mounting block 3, and the ejector mounting plate 43 can also move relative to the chuck 41. The aforementioned first driving mechanism is used to drive the ejector mounting plate 43 to move, so that the ejector mounting plate 43 drives each ejector 42 to extend and retract relative to the corresponding ejector hole 411. When each ejector 42 extends out of the corresponding ejector hole 411, the wafer on the chuck 41 can be ejected from the surface of the chuck 41 to facilitate the subsequent unloading action.

[0039] The aforementioned wafer carrying module 4 can be disassembled as a whole.

[0040] In the above example, since the wafer carrying module 4 can be disassembled as a whole, the chuck 41 and the ejector pin 42 can be assembled outside the machine first, and then assembled into the equipment as a whole, thus realizing the offline installation of the chuck 41 and the ejector pin 42. Compared with the narrow space on the machine, since there is a larger space outside the machine, it is convenient for the operator to smoothly insert each ejector pin 42 into the ejector pin hole 411 on the chuck 41, thereby improving the safety of the assembly of the ejector pin 42 and the chuck 41 and reducing the risk of damaging the ejector pin 42 during the assembly of the chuck 41. In addition, the chuck 41 is easy to install, which improves the efficiency of maintenance and adjustment.

[0041] Among them, after the ejector pin 42 and the chuck 41 are assembled, a wafer carrying module 4 is formed, and then the operator installs the wafer carrying module 4 as a whole on the equipment machine, thereby achieving the purpose of installing the chuck 41 and the ejector pin 42 on the equipment machine, and can also improve the efficiency of the installation of the chuck 41 and reduce the damage of the ejector pin 42.

[0042] In order to achieve the purpose of installing the ejector pin 42 on the ejector pin mounting plate 43, in some embodiments, as shown in FIG. Figure 7 As shown, the ejector mounting plate 43 may be provided with plug holes 452, and the number of the plug holes 452 is equal to the number of the ejector pins 42. One end of each ejector pin 42 has a first external thread section 422, and each ejector pin 42 is plugged into the corresponding plug hole 452 through its first external thread section 422 to be installed on the ejector mounting plate 43.

[0043] The first external thread section 422 of each ejector pin 42 may be sleeved with a nut 421 , and each nut 421 is used to abut against the ejector pin mounting plate 43 to control the insertion depth of each first external thread section 422 into the corresponding plug hole 452 .

[0044] In the above example, the installation height of the corresponding ejector pin 42 on the ejector pin installation plate 43 can be adjusted when the nuts 421 are screwed. Since the ejector pins 42 are assembled outside the machine, the ejector pins 42 can be adjusted to the same height more conveniently.

[0045] In order to achieve the purpose of the ejector mounting plate 43 being able to move relative to the chuck 41, Figure 5 As shown, the aforementioned wafer carrying module 4 may further include a connecting block 44 and a slider 45 disposed on the connecting block 44, and a guide rail structure is formed between the slider 45 and the connecting block 44 so that the slider 45 can slide on the connecting block 44. The connecting block 44 is connected to the mounting block 3. The aforementioned ejector mounting plate 43 is disposed on the slider 45 so as to move relative to the chuck 41 through the slider 45.

[0046] In the above example, the connecting block 44 is fixed to the mounting block 3, and the chuck 41 is also fixed to the mounting block 3, that is, the chuck 41 is fixed to the connecting block 44; and the ejector mounting plate 43 can move relative to the connecting block 44 through the slider 45, so that the ejector mounting plate 43 can move relative to the chuck 41 through the slider 45, thereby achieving the purpose of the ejector mounting plate 43 being able to move relative to the chuck 41.

[0047] In order to achieve the purpose of the aforementioned ejector mounting plate 43 being detachable, as Figure 4 and Figure 5As shown, the ejector mounting plate 43 is detachably connected to the slider 45. Specifically, the ejector mounting plate 43 is detachably connected to the slider 45 by a first screw. The ejector mounting plate 43 is provided with a first screw hole 431, and the slider 45 is provided with a first screw through hole 451 (such as Figure 3 The first screw is used to pass through the first screw through hole 451 on the slider 45 and be threadedly connected in the first screw hole 431 .

[0048] In the above example, the ejector mounting plate 43 is fixed to the slider 45 from the back by a first screw. Since the wafer supporting module 4 is assembled offline outside the equipment, it is convenient to fix the ejector mounting plate 43 to the slider 45 from the back.

[0049] In some embodiments, the aforementioned connecting block 44 is detachably connected to the mounting block 3. Specifically, the aforementioned connecting block 44 and the mounting block 3 are detachably connected by a second screw. The connecting block 44 is provided with a second screw hole 441, and the mounting block 3 is provided with a second screw hole 61 (such as Fig. 9 As shown), the second screw is used to pass through the second screw hole 441 and be threadedly connected with the second screw hole 61.

[0050] In the above example, the connecting block 44 can be fixed to the mounting block 3 from the front by a second screw, so that it is convenient to install the wafer supporting module 4 on the machine.

[0051] In some embodiments, Figure 8 and Fig. 9 As shown, the aforementioned mounting block 3 may be provided with leveling members 6, the number of which is more than two, and which are evenly spaced and arranged in the circumferential direction of the mounting block 3. One end of each leveling member 6 has a second external thread section 62, and each leveling member 6 is threadedly connected to the mounting block 3 through its own second external thread section 62. The number of the aforementioned second screw holes 61 is equal to the number of the leveling members 6, and each second screw hole 61 is arranged on the corresponding leveling member 6 in a one-to-one correspondence.

[0052] In the above example, when each leveling member 6 is screwed, the installation height of each leveling member 6 on the installation block 3 can be adjusted to level each ejector pin 42 through the connecting block 44 so that each ejector pin 42 cooperates to keep the wafer horizontal and eject it.

[0053] In order to realize the detachable function of the aforementioned chuck 41, in a specific application example, the chuck 41 can be set on the aforementioned connecting block 44 to be connected to the mounting block 3 through the connecting block 44. The chuck 41 can be detachable relative to the connecting block 44. Specifically, the chuck 41 can be detachably connected to the connecting block 44 by screws.

[0054] In order to realize the function of the aforementioned first driving mechanism, in a specific application example, Figure 8 As shown, the first driving mechanism may include a first ball screw structure 2 and a driving cylinder 21. The driving cylinder 21 is disposed on a nut seat of the first ball screw structure 2. The first driving mechanism drives the driving cylinder 21 to move through the nut seat of the first needle screw structure 2, so that the driving rod of the driving cylinder 21 pushes the ejector mounting plate 43 to move through the side.

[0055] In the above example, the driving rod of the driving cylinder 21 can abut against the ejector mounting plate 43 from the side, wherein Figure 8 As shown, the aforementioned slider 45 may be provided with a connecting plate 46, and the ejector mounting plate 43 is arranged on the slider 45. The driving rod of the driving cylinder 21 may abut the connecting plate 46 from the side, so as to abut the ejector mounting plate 43 through the connecting plate 46. The nut seat of the first ball screw structure 2 may drive the driving cylinder 21 to rise together, so that the driving rod of the driving cylinder 21 pushes the ejector mounting plate 43 to rise together through the side, so as to drive the ejector 42 to extend out of the ejector hole 411 on the chuck 41.

[0056] In a specific application example, Figure 8 As shown, the aforementioned mounting block 3 can be a movable block, and the aforementioned wafer lifting mechanism can also include a second driving mechanism 8, which is used to drive the mounting block 3 to move, so that the mounting block 3 drives the chuck 41 to move to the set unloading position to facilitate subsequent unloading actions.

[0057] It should be noted that the second driving mechanism 8 can be another ball screw structure, wherein the specific configuration of the ball screw structure is prior art and will not be described in detail here.

[0058] like Figure 1 As shown, the aforementioned wafer lifting mechanism may further include a base 1, on which a guide mechanism may be provided, and the guide mechanism is used to guide the movement of the mounting block 3. In a specific application example, the mounting block 3 may be a moving plate. Figure 1 As shown, the guide mechanism may include a guide column 7 to guide the movement of the mounting block 3 through the guide column 7. The number of the guide columns 7 may be more than two, and they are arranged in sequence and spaced apart in the circumferential direction of the mounting block 3, so that the guiding accuracy of the mounting block 3 can be improved.

[0059] The embodiment of the utility model also provides a wafer detection device, which may include any of the above-mentioned wafer lifting mechanisms. In this example, because the wafer detection device adopts the above-mentioned wafer lifting mechanism, and because the wafer carrying module 4 can be disassembled and assembled as a whole, the chuck 41 and the ejector pin 42 can be assembled outside the machine first, and then assembled into the device as a whole, thereby realizing the offline installation of the chuck 41 and the ejector pin 42. Compared with the narrow space on the machine, since there is a larger space outside the machine, it is convenient for the operator to smoothly insert each ejector pin 42 into the ejector pin hole 411 on the chuck 41, thereby improving the safety of the assembly of the ejector pin 42 and the chuck 41, and reducing the risk of damaging the ejector pin 42 during the assembly of the chuck 41. In addition, the chuck 41 is easy to install, which improves the efficiency of maintenance and adjustment.

[0060] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A wafer lifting mechanism, characterized in that: The invention comprises a wafer carrying module (4), a mounting block (3) and a first driving mechanism; the wafer carrying module (4) comprises a chuck (41), an ejector pin (42) and an ejector pin mounting plate (43); the chuck (41) is used to carry a wafer; the ejector pin (42) is mounted on the ejector pin mounting plate (43); an ejector pin hole (411) is provided on the chuck (41); the ejector pin (42) is inserted into the ejector pin hole (411); the number of the ejector pins (42) is more than two; the number of the ejector pin holes (411) is equal to the number of the ejector pins (42) and they are arranged in a one-to-one correspondence; The chuck (41) and the ejector mounting plate (43) are both detachably arranged on the mounting block (3), and the ejector mounting plate (43) is also movable relative to the chuck (41), and the first driving mechanism is used to drive the ejector mounting plate (43) to move, so that the ejector mounting plate (43) drives each ejector (42) to extend and retract relative to the corresponding ejector hole (411); Wherein, the wafer carrying module (4) can be disassembled and assembled as a whole.

2. The wafer lifting mechanism according to claim 1, characterized in that: The ejector mounting plate (43) is provided with plugging holes (452), and the number of the plugging holes (452) is equal to the number of the ejector pins (42); one end of each ejector pin (42) has a first external thread section (422), and each ejector pin (42) is plugged into the corresponding plugging hole (452) through its first external thread section (422) so as to be installed on the ejector mounting plate (43); Wherein, a nut (421) is sleeved on the first external thread section (422) of each ejector pin (42), and each nut (421) is used to abut against the ejector pin mounting plate (43) to control the depth of each first external thread section (422) inserted into the corresponding plug hole (452).

3. The wafer lifting mechanism according to claim 1 or 2, characterized in that: The wafer carrying module (4) comprises a connecting block (44) and a slider (45) arranged on the connecting block (44); the connecting block (44) is connected to the mounting block (3); the ejector mounting plate (43) is arranged on the slider (45) so as to move relative to the chuck (41) through the slider (45).

4. The wafer lifting mechanism according to claim 3, characterized in that: The ejector mounting plate (43) and the slider (45) are detachably connected via a first screw, wherein a first screw hole (431) is provided on the ejector mounting plate (43), and a first screw through hole (451) is provided on the slider (45), and the first screw is used to pass through the first screw through hole (451) on the slider (45) and be threadedly connected in the first screw hole (431).

5. The wafer lifting mechanism according to claim 3, characterized in that: The connecting block (44) and the mounting block (3) are detachably connected via a second screw; a second screw through hole (441) is provided on the connecting block (44); a second screw hole (61) is provided on the mounting block (3); and the second screw is used to pass through the second screw through hole (441) and be threadedly connected to the second screw hole (61).

6. The wafer lifting mechanism according to claim 5, characterized in that: The mounting block (3) is provided with a leveling piece (6), the number of the leveling pieces (6) being more than two and being evenly spaced and arranged in a circumferential direction of the mounting block (3); one end of each leveling piece (6) has a second external thread section (62), and each leveling piece (6) is threadedly connected to the mounting block (3) via its own second external thread section (62); The number of the second screw holes (61) is equal to the number of the leveling members (6), and each second screw hole (61) is arranged on a corresponding leveling member (6) in a one-to-one correspondence.

7. The wafer lifting mechanism according to claim 3, characterized in that: The chuck (41) is arranged on the connection block (44) so ​​as to be connected to the mounting block (3) via the connection block (44), wherein the chuck (41) is detachable relative to the connection block (44).

8. The wafer lifting mechanism according to any one of claims 1, 2, 4 to 7, characterized in that: The first driving mechanism comprises a first ball screw structure (2) and a driving cylinder (21), wherein the driving cylinder (21) is arranged on a nut seat of the first ball screw structure (2); the first driving mechanism drives the driving cylinder (21) to move via the nut seat of the first needle screw structure (2), so that the driving rod of the driving cylinder (21) pushes the ejector mounting plate (43) to move via the side.

9. The wafer lifting mechanism according to any one of claims 1, 2, 4 to 7, characterized in that: The mounting block (3) is a movable block, and the wafer lifting mechanism further comprises a second driving mechanism (8), wherein the second driving mechanism (8) is used to drive the mounting block (3) to move, so that the mounting block (3) drives the chuck (41) to move to a set unloading position.

10. A wafer inspection device, characterized in that: The invention comprises the wafer lifting mechanism as described in any one of claims 1 to 9.

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