Heat dissipation type field effect transistor

Abstract

The utility model discloses a heat dissipation type field effect transistor, belongs to the field of electronic circuit components, and solves the problem of poor heat dissipation of a field effect transistor in the prior art. The packaging structure mainly comprises a plastic package body, a chip and a frame, the chip is fixed on the frame, the frame is a flat frame, the chip is connected with pins, the frame is fixed on a heat conduction assembly, the heat conduction assembly is fixedly connected with the plastic package body to form a closed space, and the frame and the chip are arranged in the closed space; the heat conduction assembly comprises a heat conduction bottom plate, the heat conduction bottom plate is provided with a heat conduction side plate and a pin side plate, the pin side plate is provided with a heat conduction hole, and the pin extends out of the closed space through the heat conduction hole; and radiating fins are arranged on the heat-conducting side plates. The temperature of the internal space of the field-effect tube can be effectively reduced, so that the power of a device can be further improved, and the power of the device can be fully exerted.

Description

Technical Field

[0001] The utility model relates to the field of electronic circuit components, and in particular to a heat dissipation field effect tube. Background Art

[0002] The frame used in the existing field effect tube products is a flat frame, which is easy to be delaminated during the molding process, affecting the reliability in high temperature environment. In high temperature environment, the product leads may be peeled off, and more seriously, a "popcorn effect" may be produced, destroying the product structure and causing permanent damage to the product. The application of the prior art with the publication number of CN212517182U discloses a fast heat dissipation type semiconductor MOS field effect tube, including a ceramic heat conductive body; a first strip groove, a second strip groove and a third groove are opened on one surface of the ceramic heat conductive body, and the first strip groove, the second strip groove and the third groove are respectively filled with a first conductive strip, a second conductive strip and a conductive block; the ceramic heat conductive body has a heat dissipation plate extending from the end face of the epoxy package, and the ceramic heat conductive body located in the epoxy package has at least one through hole; it reduces the thermal resistance of the power MOS, but the overall temperature cannot be controlled. At present, a field effect tube with better heat dissipation is needed. Summary of the invention

[0003] The purpose of the utility model is to provide a heat dissipation type field effect tube to solve the problem of poor heat dissipation of the field effect tube in the prior art.

[0004] The utility model is realized by the following technical solutions:

[0005] A heat dissipation field effect tube comprises a plastic package, a chip and a frame, wherein the chip is fixed on the frame, the frame adopts a flat frame, the chip is connected with pins, the frame is fixed on a heat conduction component, the heat conduction component is fixedly connected to the plastic package to form a closed space, the frame and the chip are arranged in the closed space; the heat conduction component comprises a heat conduction bottom plate, the heat conduction bottom plate is provided with a heat conduction side plate and a pin side plate, the pin side plate is provided with a heat conduction hole, the pin extends out of the closed space through the heat conduction hole; the heat conduction side plate is provided with a heat sink.

[0006] Furthermore, two heat-conducting side plates are symmetrically arranged on the heat-conducting bottom plate, a fixing plate is arranged on the upper part of the heat-conducting bottom plate, and fixing holes are opened on the fixing plate.

[0007] Furthermore, the pins include a source pin, a drain pin and a gate pin, and the source pin, the drain pin and the gate pin are respectively connected to the chip through conductive strips.

[0008] Furthermore, a locking hole is provided on the pin, and the pin is fixed to the frame through the locking hole.

[0009] Furthermore, the frame is provided with a waterproof groove to increase the tightness between the frame and the plastic packaging material, while preventing water or humidity from entering the interior of the components, thereby protecting the components from damage.

[0010] Furthermore, the frame is provided with a groove, in which the conductive strip is fixed.

[0011] Furthermore, the surface of the frame is provided with a grid-shaped roughened surface; the two sides and the central area of ​​the frame are provided with a grid-shaped roughened surface, which increases the contact area between the frame and the plastic package body, reduces the possibility of product delamination, and thus makes the device more reliable.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model adopts a plastic package body and a heat-conducting component to form a closed space, which can effectively reduce the temperature of the internal space of the field effect tube, thereby being beneficial to further improve the power of the device and giving full play to the power of the components; the utility model is provided with a pin side plate, which can further control the thermal resistance of the pin on the basis of adopting a conductive strip, thereby improving the diffusion of heat; at the same time, the delamination of the frame and the plastic package body is avoided, and water vapor is prevented from entering the interior of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a right view of the overall structure of the utility model;

[0016] Figure 3 It is a schematic diagram of the internal structure of the utility model;

[0017] Figure 4 It is a schematic diagram of the structure of the heat conduction component of the utility model.

[0018] In the figure: 1. fixing plate; 2. fixing hole; 3. plastic package; 4. pin; 5. pin side plate; 6. thermal conductive bottom plate; 7. thermal conductive side plate; 8. heat sink; 9. locking hole; 10. chip; 11. conductive strip; 12. waterproof groove. DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should all fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only referenced to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the creation of the present invention.

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Embodiment 1: A heat dissipation field effect tube, such as Figure 1-Figure 4 As shown, it includes a plastic package 3, a chip 10 and a frame. The chip 10 is fixed on the frame. The frame adopts a flat frame. The pads on the frame are square and smooth surfaces, which are beneficial to improving the quality and stability of the welding connection, and optimizing the heat transfer and heat dissipation effects, thereby ensuring that the components can work normally after welding and have good reliability. The chip 10 is connected with a pin 4, the frame is fixed on the heat-conducting component, the heat-conducting component is fixed and tightly connected with the plastic package body 3 to form a closed space, and the frame and the chip 10 are arranged in the closed space; the heat-conducting component includes a heat-conducting base plate 6, the heat-conducting base plate 6 is provided with a heat-conducting side plate 7 and a pin side plate 5, the heat-conducting side plate 7 is arranged on both sides of the heat-conducting base plate 6, the pin side plate 5 is arranged below the heat-conducting base plate 6, the pin side plate 5 is provided with a heat-conducting hole, and the pin 4 extends out of the closed space through the heat-conducting hole; the heat-conducting side plate 7 is provided with a heat sink 8, the heat-conducting side plate 7 and the heat-conducting base plate 6 transfer the internal heat to the heat sink 8, and the pin side plate 5 transfers the heat at the pin 4 to the heat sink 8, which is beneficial to further improve the power of the device and give full play to the power of the components.

[0022] Embodiment 2: A heat dissipation field effect tube, such as Figure 4 As shown, two heat-conducting side plates 7 are symmetrically arranged on the heat-conducting bottom plate 6, a fixing plate 1 is arranged on the upper part of the heat-conducting bottom plate 6, and a fixing hole 2 is opened on the fixing plate 1; the pins 4 include a source pin, a drain pin and a gate pin, and the source pin, the drain pin and the gate pin are respectively connected to the chip 10 through a conductive strip 11, which can effectively reduce the thermal resistance; Figure 3 As shown, the pin 4 is provided with a locking hole 9, and the pin 4 is fixed to the frame through the locking hole 9. The pin 4 is provided with a locking hole 9 to reduce the stress received by the pin 4 in the bonding area of ​​the product pin 4, thereby increasing the reliability of the product; the frame is provided with a waterproof groove 12 to increase the tightness between the frame and the plastic packaging material, while preventing moisture or humidity from entering the components, thereby protecting the components from damage; the frame is provided with a groove, and the conductive strip 11 is fixed in the groove; the surface of the frame is provided with a grid-shaped roughened surface; the two sides and the central area of ​​the frame are provided with a grid-shaped roughened surface to increase the contact area between the frame and the plastic packaging material, reduce the possibility of product stratification, and thus make the device more reliable. Others are the same as Example 1.

[0023] The utility model forms a sealed space inside the field effect tube by using the heat-conducting bottom plate 6, the heat-conducting side plate 7 and the pin side plate 5 in cooperation with the plastic package 3. The heat emitted by the chip 10 is transferred to the heat sink 8 of the heat-conducting side plate 7 through the heat-conducting plate for heat dissipation. The field effect tube can be fixed on the external radiator through the fixing hole 2. It only needs to make the heat dissipating bottom plate and the external radiator close together, which has good heat dissipation performance. The frame inside the field effect tube adopts a flat frame, and the two sides and the center area of ​​the frame are provided with a grid-shaped roughened surface, which increases the contact area between the frame and the plastic package material, reduces the possibility of product stratification, and thus makes the device more reliable; the flat frame is provided with a waterproof groove 12, which increases the tightness between the frame and the plastic package material, and prevents moisture or humidity from entering the components, thereby protecting the device from damage.

[0024] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. A heat dissipation field effect tube, comprising a plastic package (3), a chip (10) and a frame, wherein the chip (10) is fixed on the frame, and the chip (10) is connected to a pin (4), characterized in that: The frame is fixed on the heat-conducting component, and the heat-conducting component is fixedly connected to the plastic package (3) to form a closed space, and the frame and the chip (10) are arranged in the closed space; The heat-conducting component comprises a heat-conducting base plate (6), the heat-conducting base plate (6) is provided with a heat-conducting side plate (7) and a pin side plate (5), the pin side plate (5) is provided with a heat-conducting hole, and the pin (4) extends out of the enclosed space through the heat-conducting hole; the heat-conducting side plate (7) is provided with a heat sink (8).

2. The heat dissipation field effect transistor according to claim 1, characterized in that: Two heat-conducting side plates (7) are symmetrically arranged on the heat-conducting bottom plate (6), a fixing plate (1) is arranged on the upper part of the heat-conducting bottom plate (6), and a fixing hole (2) is opened on the fixing plate (1).

3. The heat dissipation field effect transistor according to claim 1, characterized in that: The pins (4) include a source pin, a drain pin and a gate pin, and the source pin, the drain pin and the gate pin are respectively connected to the chip (10) via conductive strips (11).

4. The heat dissipation field effect transistor according to claim 1, characterized in that: The pin (4) is provided with a locking hole (9), and the pin (4) is fixed to the frame via the locking hole (9).

5. The heat dissipation field effect transistor according to claim 1, characterized in that: The frame is provided with a waterproof groove (12).

6. The heat dissipation field effect transistor according to claim 1, characterized in that: The frame is provided with a groove, in which a conductive strip (11) is fixed.

7. The heat dissipation field effect transistor according to claim 1, characterized in that: The surface of the frame is provided with a grid-shaped roughened surface.

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