Laser packaging structure
By using optical control of new heat sinks in laser packaging, including eutectic region, isolation region and barrier region, the problem of poor laser beam quality in the prior art is solved, and the beam quality improvement and device stability after packaging are achieved. improve.
Patent Information
- Application Number
- CN202421119648.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-22
AI Technical Summary
The heat sink in the existing laser packaging technology cannot effectively improve the laser beam quality, mainly due to the beam deterioration caused by the expansion of the laser spot area and light leakage.
The new heat sink is optically regulated, including eutectic region, isolation region and barrier region. Through etching or laser ablation processing, the thickness of the barrier region is smaller than the thickness of the laser chip, the barrier region is parallel to the length of the laser chip cavity, and the isolation region is concave. In slot form, suitable for TO, COB, C/F-Mount and plastic packaging.
Effectively block the light emission in the invalid area of the laser chip's light surface, reduce the laser spot, improve the beam quality, and avoid linear connection of the gold and tin solder layer through the isolation area, improving the stable performance of the device.
Smart Images
Figure CN222261728U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lasers, in particular to a laser packaging structure. Background Art
[0002] The packaging of semiconductor chips has the functions of protection, support, connection, heat dissipation and reliability. Only strict working environment control, good support and fixation to facilitate circuit connection and mechanical protection of the appearance and enhanced heat dissipation can ensure the stability and service life of the chip. Therefore, packaging plays an important role in semiconductor chips. Semiconductor chip packaging technology is mostly developed and evolved on the basis of discrete device packaging technology. Different chip types have great particularity. Semiconductor laser packaging is to complete the output electrical signal, protect the normal operation of the chip, and finally realize the laser output function. It has both electrical interconnection and chip protection, as well as optical output design and technical requirements. It is impossible to simply use discrete device packaging for semiconductor lasers.
[0003] The heat sinks used in existing packaging laser technologies are mainly designed for heat conduction and heat dissipation, and do not involve optical structure design. However, due to the expansion of the laser spot area caused by the waveguide limitation effect of the laser light output surface cavity mask and the light leakage phenomenon of the epitaxial structure, the laser beam quality is seriously degraded. The existing heat sinks cannot meet the demand for improving the laser beam quality after packaging. Utility Model Content
[0004] In view of the deficiencies of the prior art, the utility model provides a laser packaging structure, which solves the problem that the existing heat sink cannot meet the requirement of improving the laser beam quality after packaging.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a laser packaging structure, comprising a novel optically regulated heat sink and a bracket, wherein the novel optically regulated heat sink comprises a eutectic region, an isolation region and a blocking region, and a laser chip is fixedly mounted on the top of the eutectic region and on a side of the isolation region away from the blocking region;
[0006] The bracket includes a heat sink fixing platform and electrode pins.
[0007] Furthermore, the novel optically regulated heat sink comprises a eutectic region, an isolation region and a barrier region in the light emitting direction, and the eutectic region, the isolation region and the barrier region are processed by etching or laser ablation.
[0008] Furthermore, the thickness c of the blocking area is less than the thickness d of the laser chip, the thickness of the blocking area and the laser chip is 10-30 μm and the distance between the light emitting surface of the laser chip and the end point of the isolation area near the laser chip is ≤ (dc) / tanθ ⊥-ew, d is the thickness of the laser chip, c is the thickness of the blocking region, and θ ⊥ is the fast axis divergence half angle, and w is the bottom width of the blocking area.
[0009] Furthermore, the cross-sectional shape of the blocking area parallel to the length direction of the laser chip cavity is a geometric figure, and the light contact surface of the blocking area is a rough surface.
[0010] Furthermore, the isolation area is a strip-shaped groove.
[0011] Furthermore, the optically controlled novel heat sink is adapted to TO packaging, COB packaging, C / F-Mount packaging and plastic packaging.
[0012] Compared with the prior art, the utility model provides a laser packaging structure, which has the following beneficial effects:
[0013] 1. The laser packaging structure processes a eutectic area, an isolation area and a blocking area on a heat sink. The laser chip is mounted on the eutectic area. There is a blocking area between the light-emitting cavity surface of the laser chip and the lens, which can effectively block the light emission of the invalid area of the light-emitting surface of the laser chip, thereby reducing the light emission of the invalid area of the cavity surface in the laser spot and improving the beam quality. By setting the height of the blocking area to be less than the thickness of the laser chip, the blocking area is slightly lower than the laser light emission center, which does not affect the laser emission, thereby achieving the purpose of improving the laser beam quality after packaging.
[0014] 2. The laser packaging structure provides an isolation area in the form of a groove, which can provide a storage space for excess gold-tin solder during laser eutectic, thereby preventing the gold-tin solder from linearly connecting the heat sink with the internal structure layer of the laser chip, thereby improving the stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a structural cross-sectional view of the optically controlled new heat sink of the utility model;
[0016] Figure 2 A top view of the optically controlled novel heat sink structure of the utility model;
[0017] Figure 3 This is a side view of the optically controlled novel heat sink structure of the utility model;
[0018] Figure 4 Schematic diagram of the fast axis divergence of the emitted light packaged by the utility model;
[0019] Figure 5 Schematic diagram of external light reflecting to the laser light-emitting film and then reflecting again;
[0020] Figure 6It is a schematic diagram of the structure of the utility model in which external light is reflected to the laser light-emitting surface film and then reflected again;
[0021] Figure 7 This is a schematic structural diagram of a laser TO packaging structure according to Embodiment 1 of the utility model;
[0022] Figure 8 This is a structural schematic diagram of the laser plastic packaging structure of Example 2 of the utility model.
[0023] In the figure: 1. Optically controlled new heat sink; 11. Eutectic region; 12. Isolation region; 13. Barrier region; 2. Laser chip; 3. Bracket; 4. Heat sink fixing platform; 5. Electrode pins. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] Embodiment 1:
[0026] TO package, please refer to Figure 1-3 and Figure 6 A laser packaging structure in this embodiment includes a novel optically regulated heat sink 1 and a bracket 3. The novel optically regulated heat sink 1 includes a eutectic region 11, an isolation region 12 and a barrier region 13. A laser chip 2 is fixedly mounted on the top of the eutectic region 11 and on a side of the isolation region 12 away from the barrier region 13.
[0027] The support 3 includes a heat sink fixing platform 4 and electrode pins 5 .
[0028] In this embodiment, the optically controlled novel heat sink 1 is composed of a eutectic region 11, an isolation region 12 and a barrier region 13 in the light emitting direction, and the eutectic region 11, the isolation region 12 and the barrier region 13 are processed by etching.
[0029] In this embodiment, the thickness c of the barrier region 13 is smaller than the thickness d of the laser chip 2 , d is 100 μm, c is 80 μm, and the bottom width w of the barrier region 13 is 20 μm.
[0030] In this embodiment, the cross-sectional shape of the blocking area 13 parallel to the cavity length direction of the laser chip 2 is a right-angled trapezoid, and the light contact surface of the blocking area 13 is a rough surface, which can increase absorption and reduce light reflection.
[0031] In this embodiment, the isolation region 12 is a rectangular groove, the groove width e of the isolation region 12 is 10 μm, the groove depth f of the isolation region 12 is 10 μm, and the fast axis divergence half angle θ ⊥ =10o, the distance between the light emitting surface of the laser chip 2 and the end of the isolation region 12 close to the chip is ≤83μm, ensuring that the emitted light beam is not blocked.
[0032] Embodiment 2:
[0033] Plastic package, please refer to Figure 1-3 and Figure 7 A laser packaging structure in this embodiment includes a novel optically regulated heat sink 1 and a bracket 3. The novel optically regulated heat sink 1 includes a eutectic region 11, an isolation region 12 and a barrier region 13. A laser chip 2 is fixedly mounted on the top of the eutectic region 11 and on a side of the isolation region 12 away from the barrier region 13.
[0034] The support 3 includes a heat sink fixing platform 4 and electrode pins 5 .
[0035] In this embodiment, the optically controlled novel heat sink 1 is composed of a eutectic region 11, an isolation region 12 and a barrier region 13 in the light emitting direction, and the eutectic region 11, the isolation region 12 and the barrier region 13 are processed by etching.
[0036] In this embodiment, the thickness c of the blocking area 13 is smaller than the thickness d of the laser chip 2, d is 100 μm, c is 70 μm, the cross-sectional shape of the blocking area 13 parallel to the cavity length direction of the laser chip 2 is a right trapezoid, and the bottom width w of the blocking area 13 is 50 μm.
[0037] In this embodiment, the light contacting surface of the blocking area 13 is a rough surface, which can increase absorption and reduce light reflection.
[0038] In this embodiment, the isolation region 12 is a rectangular groove, the groove width e of the isolation region 12 is 10 μm, the groove depth f of the isolation region 12 is 10 μm, and the fast axis divergence half angle θ ⊥ =10o, the distance between the light-emitting surface of the laser chip 2 and the end point of the isolation area 12 close to the chip is ≤110μm, ensuring that the emitted light beam is not blocked.
[0039] The beneficial effects of the above embodiments are:
[0040] The laser packaging structure is achieved by processing a eutectic region 11, an isolation region 12 and a blocking region 13 on a novel optically controlled heat sink 1, and a laser chip 2 is mounted on the eutectic region 11. The blocking region 13 is blocked between the light-emitting cavity surface of the laser chip 2 and the lens, which can effectively block the light emission of the invalid region of the light-emitting surface of the laser chip 2, thereby reducing the light emission of the invalid region of the cavity surface in the laser light spot. By setting the thickness of the blocking region 13 to be smaller than the thickness of the laser chip 2, the blocking region 13 is slightly lower than the light emission center of the laser chip 2, which does not affect the laser emission, thereby achieving the purpose of improving the laser beam quality after packaging.
[0041] The laser packaging structure provides an isolation area 12 in the form of a groove, which can provide a storage space for excess gold-tin solder during laser eutectic formation, thereby preventing the gold-tin solder from linearly connecting the optically controlled novel heat sink 1 with the internal structure layer of the laser chip 2, thereby improving the stability of the device.
[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A laser packaging structure, comprising a novel optically controlled heat sink (1) and a bracket (3), characterized in that: The novel optically controlled heat sink (1) comprises a eutectic region (11), an isolation region (12) and a blocking region (13); a laser chip (2) is fixedly mounted on the top of the eutectic region (11) and on a side of the isolation region (12) away from the blocking region (13); The support (3) comprises a heat sink fixing platform (4) and electrode pins (5).
2. A laser packaging structure according to claim 1, characterized in that: The optically controlled novel heat sink (1) comprises a eutectic region (11), an isolation region (12) and a barrier region (13) in the light-emitting direction, and the eutectic region (11), the isolation region (12) and the barrier region (13) are processed by etching or laser ablation.
3. The laser packaging structure according to claim 1, characterized in that: The thickness of the blocking area (13) is less than the thickness of the laser chip (2), the thickness difference between the blocking area (13) and the laser chip (2) is 10-30 μm, and the distance between the light emitting surface of the laser chip (2) and the end point of the isolation area (12) close to the laser chip (2) is ≤ (dc) / tanθ ⊥ -ew, d is the thickness of the laser chip (2), c is the thickness of the blocking region (13), θ ⊥ is the fast axis divergence half angle, and w is the bottom width of the blocking area (13).
4. The laser packaging structure according to claim 1, characterized in that: The cross-sectional shape of the blocking area (13) parallel to the cavity length direction of the laser chip (2) is a geometric figure, and the light contact surface of the blocking area (13) is a rough surface.
5. The laser packaging structure according to claim 1, characterized in that: The isolation area (12) is a strip-shaped groove.
6. The laser packaging structure according to claim 1, characterized in that: The novel optically controlled heat sink (1) is suitable for TO packaging, COB packaging, C / F-Mount packaging and plastic packaging.