Stepped inverter shell

Abstract

In order to solve the problem of low heat dissipation efficiency of the existing inverter, the utility model provides the stepped inverter shell. The stepped inverter shell comprises a base frame, a concave cavity for accommodating electronic components is formed in the base frame, the interior of the concave cavity is divided into a first area and a second area, and the portions, corresponding to the first area and the second area, of the base frame are arranged in a stepped mode. A stepped structure is adopted, so that the size of the inverter is reduced on the whole; meanwhile, compared with the prior art, the stepped structure is larger in heat dissipation area and better in heat dissipation effect, and the heat dissipation efficiency of the inverter is further improved.

Description

Technical Field

[0001] The utility model relates to the field of industrial power electronic equipment, in particular to a stepped inverter housing. Background Art

[0002] Inverters are widely used in the industrial field. Inverters can convert AC and DC to each other, especially convert DC to AC, for use in various power-driven equipment and systems, such as motors, compressors, pumps, etc.

[0003] The inverter will generate a certain amount of power loss in the process of converting DC power into AC power, and this part of energy will be converted into heat energy. If the inverter cannot dissipate heat effectively, excessive temperature will lead to performance degradation, shortened lifespan and even failure of the device; an efficient heat dissipation system can transfer the generated heat to the surrounding environment in time, ensuring that the inverter works normally within a reasonable temperature range, thus maintaining stable performance of the inverter and extending its lifespan.

[0004] The commonly used inverter heat dissipation technology is to use heat sinks and improve the layout of components in the inverter to assist in heat dissipation. Chinese utility model patent CN202222880239.5 provides an inverter housing, which changes the installation position of the inverter capacitor and PCB board compared to the previous technology, reduces the overall volume of the inverter, and improves the heat dissipation effect of the inverter. However, this structure still has a relatively large volume in use, resulting in a relatively low average heat dissipation efficiency. Utility Model Content

[0005] The utility model aims to solve the technical problems existing in the prior art and provide a compact inverter with high heat dissipation efficiency. Specifically, a stepped inverter housing and an inverter arranged by the housing are provided.

[0006] Firstly, the utility model provides a stepped inverter housing, including a base frame, in which a cavity for accommodating electronic components is arranged, the cavity is divided into a first area and a second area, and the base frames corresponding to the first area and the second area are arranged in a stepped manner.

[0007] Furthermore, more than one accommodating cavity is provided in the second area, for example, a first accommodating cavity and a second accommodating cavity are provided.

[0008] Furthermore, an opening is provided between the first accommodating cavity and the second accommodating cavity.

[0009] Furthermore, an opening is provided at a position of the side wall of the base frame corresponding to the second area.

[0010] Furthermore, a first heat dissipation plate is arranged on the back side of the base frame, and a first heat dissipation rib is arranged on the first heat dissipation plate.

[0011] Furthermore, a second heat dissipation plate is arranged on the back side of the base frame, and a second heat dissipation rib is also arranged on the second heat dissipation plate.

[0012] Furthermore, a third heat dissipation plate is arranged on the back side of the base frame, and a third heat dissipation rib is also arranged on the third heat dissipation plate.

[0013] Furthermore, the side wall of the base frame is provided with more than one connecting portion.

[0014] The technical solution based on the above-mentioned stepped inverter housing has the advantage over the existing technology in that the stepped structure not only reduces the volume of the inverter as a whole, but also has a larger heat dissipation area and better heat dissipation effect than before, further improving the heat dissipation efficiency of the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of a first-viewing angle of a stepped inverter housing base frame of the utility model;

[0016] Figure 2 This is a schematic diagram of the second viewing angle of the stepped inverter housing base frame of the utility model;

[0017] Figure 3 This is a schematic diagram of the third viewing angle of the stepped inverter housing base frame of the utility model;

[0018] Figure 4 This is a schematic diagram of the first heat sink of the stepped inverter housing of the utility model from a first viewing angle;

[0019] Figure 5 This is a schematic diagram of the first heat sink of the stepped inverter housing of the utility model from a second viewing angle;

[0020] Figure 6 This is a schematic diagram of the inverter housing of the utility model from the first perspective;

[0021] Figure 7 This is a schematic diagram of the inverter housing of the utility model from a second viewing angle;

[0022] Reference numerals:

[0023] 100 shell, 110 base frame, 111 first area, 112 second area, 1121 first accommodating cavity, 1122 second accommodating cavity, 113 opening, 121 first heat dissipating rib, 122 second heat dissipating rib, 123 third heat dissipating rib, 130 connecting part, 131 first heat dissipating plate, 132 second heat dissipating plate, 133 third heat dissipating plate; 210 inductor module, 220 capacitor module, 221 capacitor body, 222 electrical adapter board, 230 PCB board, 231 inductor connecting part, 232 capacitor connecting part. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0026] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] like Figure 1-7As shown, the utility model first provides a stepped inverter housing 100, including a base frame 110, wherein a cavity for accommodating electronic components is arranged in the base frame 110, wherein the cavity is divided into a first area 111 and a second area 112, and the base frames 110 corresponding to the first area 111 and the second area 112 are arranged in a stepped manner.

[0029] In this embodiment, a base frame 110 is included. The base frame 110 is a cubic frame structure as a whole, including a shell 100 surrounded by four side panels. A cavity for accommodating electronic components is arranged in the base frame 110. In this embodiment, the cavity is divided into a first area 111 and a second area 112 by a partition or other existing methods, wherein the first area 111 is used to accommodate a circuit board, and the second area 112 is used to accommodate larger electronic components, such as an inductor or a capacitor; and the base frames 110 corresponding to the first area 111 and the second area 112 are arranged in a stepped manner. When viewed from the side of the base frame 110, the base frame 110 is a stepped structure, that is, the second area 112 is higher in height than the first area 111. On the one hand, it is convenient to accommodate larger electronic components in the second area 112, and on the other hand, the volume of the inverter is reduced compared to the whole; at the same time, the stepped structure has a larger heat dissipation area and a better heat dissipation effect than before, which further improves the heat dissipation efficiency of the inverter.

[0030] In other embodiments of the present application, more than one accommodating cavity is provided in the second area 112. For example, in the present embodiment, two accommodating cavities are provided, including a first accommodating cavity 1121 and a second accommodating cavity 1122. Figure 1-5 As shown, the second area 112 is further divided into two accommodating chambers by a partition or other prior art methods, which is convenient for installation on the one hand, and can reduce the electromagnetic interference between the two chambers by a partition or other partitioning components on the other hand, further improving the stability of the inverter in AC-DC conversion. In other embodiments, multiple accommodating chambers can be formed by partitioning with multiple partitions, such as three accommodating chambers, or four accommodating chambers.

[0031] In other embodiments of the present application, it can be seen from the accompanying drawings that a circular opening 113 is provided at a position corresponding to the side wall of the base frame 110 and the second area 112, which is specifically provided at the position of the side wall corresponding to the second accommodating cavity 1122, to prevent the electronic components from exploding due to electrical accidents such as overvoltage or overcurrent, and affecting other components. By providing the circular opening 113, when the electronic components explode, the explosive force will be released preferentially from the circular opening 113, thereby reducing the impact on other components of the inverter. In actual use, the circular opening 113 can be provided on the side wall of the base frame, including the side wall along the length direction of the inverter, or the side wall along the width direction of the inverter; or the circular opening 113 can also be provided on the partition between the first accommodating cavity 1121 and the second accommodating cavity 1122. In actual use, the circular opening 113 can be provided on multiple side walls of the base frame at the same time, and multiple circular openings 113 can also be provided on one side wall at the same time.

[0032] In other embodiments, a first heat dissipation plate 131 is disposed on the back of the base frame 110, and a first heat dissipation rib 121 is disposed on the first heat dissipation plate 131. Figure 4 , Figure 5 , a first heat sink 131 is connected to the bottom of the base frame 110 by bolts or other connection methods, and the first heat sink 131 covers the first area 111; a first heat sink rib 121 is arranged on the first heat sink 131, and the circuit structure in the inverter is cooled by the first heat sink rib 121. Since the height of the base frame 110 corresponding to the first area 111 is relatively small, when the total height of the inverter of the same power in the prior art remains unchanged, the height of the first heat sink rib 121 will be higher, further increasing the heat dissipation area of ​​the first heat sink rib 121 and improving the heat dissipation efficiency. Similarly, a second heat sink 132 is also connected to the bottom of the base frame 110 by bolts or other connection methods, and the second heat sink 132 covers the second area 112; a second heat sink rib 122 is arranged on the second heat sink 132, and by further increasing the second heat sink rib 122, the overall heat dissipation area of ​​the inverter is also increased, and the heat dissipation efficiency is improved. Similarly, at the step of the base frame, as shown in the attached drawings, a third heat sink 133 is connected by bolts or other connection methods, and a third heat sink rib 123 is arranged on the third heat sink 133. By further adding the third heat sink rib 123, the overall heat dissipation area of ​​the inverter is also increased, thereby improving the heat dissipation efficiency.

[0033] In actual use, the first heat sink 131, the second heat sink 132 and the third heat sink 133 can adopt a split assembly structure or an integrated structure. As shown in the attached figure, the integrated structure is adopted to make the inverter more stable. At the same time, the first heat dissipation rib 121, the second heat dissipation rib 122 or the third heat dissipation rib 123 are stretched as one piece, thereby improving the overall strength of the inverter and improving the stability of the inverter; and the integrated stretched structure has faster heat conduction and better heat dissipation effect.

[0034] In other embodiments, the side wall of the base frame 110 is provided with more than one connection part 130. As shown in the figure, four connection parts 130 can be provided for the installation or removal of the stepped inverter housing 100 or the inverter. Furthermore, a connection sleeve can be optionally provided in the connection part 130. The interior of the connection sleeve is a threaded structure to facilitate the use of the connection part 130 to install and remove the stepped inverter housing 100 and the inverter. Therefore, the connection sleeve needs to use a more wear-resistant and fatigue-resistant material so that the connection sleeve can be wear-resistant when the connection part 130 is used for a long time to install and remove the stepped inverter housing 100 and the inverter. To extend the service life of the connection part 130, for example, brass is used to make the connection sleeve in this embodiment.

[0035] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A stepped inverter housing, characterized in that: The invention comprises a base frame (110), wherein a cavity for accommodating electronic components is arranged in the base frame (110), wherein the cavity is divided into a first area (111) and a second area (112), and the base frames (110) corresponding to the first area (111) and the second area (112) are arranged in a stepped manner.

2. The stepped inverter housing according to claim 1, characterized in that: One or more accommodating cavities are provided in the second area (112).

3. The stepped inverter housing according to claim 2, characterized in that: An opening (113) is provided at a position on the side wall of the base frame (110) corresponding to the second area (112).

4. The stepped inverter housing according to claim 1, 2 or 3, characterized in that: A first heat dissipation plate (131) is arranged on the back of the base frame (110), and a first heat dissipation rib (121) is arranged on the first heat dissipation plate (131).

5. The stepped inverter housing according to claim 1, 2 or 3, characterized in that: A second heat dissipation plate (132) is provided on the back of the base frame (110), and a second heat dissipation rib (122) is provided on the second heat dissipation plate (132).

6. The stepped inverter housing according to claim 4, characterized in that: A second heat dissipation plate (132) is provided on the back of the base frame (110), and a second heat dissipation rib (122) is provided on the second heat dissipation plate (132).

7. The stepped inverter housing according to claim 4, characterized in that: A third heat dissipation plate (133) is provided on the back of the base frame (110), and a third heat dissipation rib (123) is provided on the third heat dissipation plate (133).

8. The stepped inverter housing according to claim 1, 2, 3 or 6, characterized in that: A third heat dissipation plate (133) is provided on the back of the base frame (110), and a third heat dissipation rib (123) is provided on the third heat dissipation plate (133).

9. The stepped inverter housing according to claim 1, 2, 3 or 5, characterized in that: The side wall of the base frame (110) is provided with more than one connecting portion (130).

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