Carbon film circuit board

Abstract

The utility model relates to a carbon film circuit board, which comprises a substrate, a wire arranged on the substrate and a carbon film attached to the surface of the wire, the substrate is provided with a groove, the wire is arranged in the groove, the surface of the substrate is provided with a plurality of attachment grooves, the attachment grooves are respectively arranged at two sides of the groove, and the carbon film is embedded in the attachment grooves. The contact area between the carbon film and the substrate is increased by utilizing the attachment groove, so that the adhesive force between the carbon film and the substrate is enhanced, and the carbon film is not easy to fall off from the surface of the substrate.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a carbon film circuit board. Background Art

[0002] In the process of circuit board production, it is necessary to first coat a protective film around the pre-set circuit position on the substrate, then use an etching process to etch the circuit grooves on the circuit board, and then deposit copper ions in the etched grooves to form copper circuits in the grooves.

[0003] However, since corrosive etching liquid is used in the etching process, although cleaning is performed after the etching is completed, some etching liquid will still be attached. When the circuit board is used for a long time, it will still corrode the circuit board. Therefore, a layer of carbon film is currently printed on the surface of the position where the copper wires are close to each other on the circuit board. The carbon film is used to cover the copper circuit and the surrounding circuit board surface, thereby extending the service life of the circuit board. At the same time, the carbon film can also be used to prevent adjacent copper wires from contacting each other, thereby playing an isolation role.

[0004] However, since the carbon film is directly printed on the surface of the copper circuit and circuit board, and the width of the carbon film is only 0.4 to 0.6 mm wider than the conductor, the adhesion between the two is weak, which can easily cause the carbon film to fall off and affect the quality of the circuit board.

[0005] Therefore, it is necessary to propose a new technical solution to solve the above problems. Utility Model Content

[0006] In order to prevent the carbon film from falling off from the surface of the substrate after the carbon film is attached to the surface of the substrate and covers the wires, the present application provides a carbon film circuit board.

[0007] The present application provides a carbon film circuit board, which adopts the following technical solution:

[0008] A carbon film circuit board comprises a substrate, a wire arranged on the substrate and a carbon film attached to the surface of the wire. The substrate is provided with a groove, the wire is arranged in the groove, the surface of the substrate is provided with a plurality of attachment grooves, the attachment grooves are respectively arranged on both sides of the groove, and the carbon film is embedded in the attachment grooves.

[0009] By adopting the above technical solution, the contact area between the carbon film and the substrate is increased by utilizing the attachment groove, thereby enhancing the adhesion between the carbon film and the substrate, making it difficult for the carbon film to fall off from the surface of the substrate.

[0010] Optionally: a gap is left between the attachment groove and the groove.

[0011] By adopting the above technical solution, the attachment groove and the groove can be etched at the same time, and then the attachment groove can be filled with material after the processing is completed so that only the groove can be deposited, making the processing of the circuit board more convenient.

[0012] Optionally, the attachment grooves are arranged along the length direction of the wire, and gaps are left between adjacent attachment grooves on the same side of the wire.

[0013] By adopting the above technical solution, the attachment grooves are not directly connected, so that after the carbon film falls off from one attachment groove, the carbon films in the remaining attachment grooves will not be directly pulled out, thereby enhancing the connection strength between the carbon film and the substrate.

[0014] Optionally: a connecting groove is provided between the attachment grooves on the same side of the wire, the connecting groove connects adjacent attachment grooves, the width of the connecting groove is smaller than the width of the attachment groove, and the carbon film is embedded in the connecting groove.

[0015] By adopting the above technical solution, the connection area between the carbon film and the substrate is further increased, thereby enhancing the connection strength between the carbon film and the substrate. In addition, the widths between the attachment groove and the connection groove are different. When the carbon film is arranged in the attachment groove and the connection groove, the carbon film will form a step shape, making it difficult for the carbon film to detach from the attachment groove and the connection groove.

[0016] Optionally: an enlarged groove is further provided on the substrate below the carbon film, which is arranged along the length direction of the wire, the enlarged groove is connected to the groove, and the wire is embedded in the enlarged groove.

[0017] By adopting the above technical solution, the width of the wire is increased by expanding the groove, thereby increasing the contact area between the carbon film and the wire, increasing the connection strength between the carbon film and the wire, and making the carbon film less likely to fall off.

[0018] Optionally, the enlarged groove is arranged along the length direction of the groove, and the length of the enlarged groove is equal to the length of the wire under the carbon film.

[0019] By adopting the above technical solution, the overall area of ​​the wire located below the carbon film is increased, thereby increasing the connection strength between the carbon film and the wire, making the carbon film difficult to separate.

[0020] Optionally: the enlarged grooves are respectively arranged on both sides of the groove.

[0021] By adopting the above technical solution, the wire is expanded as a whole instead of just one position, so that the distance between adjacent wires is not too small to cause mutual interference.

[0022] Optionally: the ends of the wires below the carbon film are all provided with connection points, and the diameter of the connection points is greater than the width of the wires.

[0023] By adopting the above technical solution, the contact area between the wire and the carbon film is further increased by using the connection point, thereby enhancing the connection strength between the carbon film and the substrate.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. By setting the attachment groove, the connection area between the carbon film and the substrate is increased, thereby enhancing the connection strength between the substrate and the carbon film, making it difficult for the carbon film to fall off from the substrate;

[0026] 2. By providing connection grooves of different widths between the attachment grooves, the connection strength between the carbon film and the substrate is enhanced, and even if the carbon film at a certain position is detached, the entire carbon film will not be detached. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the structure of an embodiment of the present application;

[0028] Figure 2 This is a schematic diagram for illustrating the position of the attachment groove according to an embodiment of the present application.

[0029] In the figure, 1, substrate; 11, groove; 12, attachment groove; 13, connection groove; 14, expansion groove; 15, connection point; 2, wire; 3, carbon film. DETAILED DESCRIPTION

[0030] The present application is further described in detail below in conjunction with the accompanying drawings.

[0031] The present application discloses a carbon film circuit board, such as Figure 1 and Figure 2As shown, it includes a substrate 1, a wire 2 arranged on the substrate 1, and a carbon film 3 attached to the surface of the wire 2. A groove 11 is opened on the surface of the substrate 1, and the wire 2 is embedded in the groove 11. The groove 11 is opened on the surface of the substrate 1 by etching, and the arrangement of the groove 11 conforms to the arrangement required by the circuit. The wire 2 is made of copper, which is arranged inside the groove 11 and fills the groove 11. The side wall of the wire 2 close to the opening of the groove 11 is flush with the surface of the substrate 1. The carbon film 3 is arranged on the substrate 1 by screen printing and covers part of the wire 2. The substrate 1 is also provided with a plurality of attachment grooves 12 for enhancing the connection strength between the carbon film 3 and the substrate 1. The attachment grooves 12 are arranged on both sides of the groove 11, and only the same attachment groove 12 is arranged between two grooves 11 close to each other. There is a gap between the attachment groove 12 and the groove 11, so that the wire 2 will not contact the attachment groove 12 during the deposition process. The carbon film 3 fills the attachment groove 12 , thereby increasing the contact area between the carbon film 3 and the substrate 1 , and increasing the connection strength between the carbon film 3 and the substrate 1 , making it difficult for the carbon film 3 to peel off from the surface of the substrate 1 .

[0032] There are a plurality of attachment grooves 12 located on the same side of the groove 11, and gaps are left between adjacent attachment grooves 12 located on the same side of the groove 11 and arranged along the length direction of the groove 11. Therefore, after the carbon film 3 is set in the attachment groove 12, when the carbon film 3 in one attachment groove 12 falls off, the carbon film 3 in the adjacent attachment groove 12 is not likely to fall off directly, thereby making the connection between the carbon film 3 and the substrate 1 more stable.

[0033] In order to further increase the connection strength between the carbon film 3 and the substrate 1, a plurality of connection grooves 13 are further provided on the substrate 1. The connection grooves 13 are provided between adjacent attachment grooves 12 on the same side, and the connection grooves 13 are connected to the attachment grooves 12. The width of the connection grooves 13 is smaller than the width of the attachment grooves 12. The connection grooves 13 further increase the contact area between the carbon film 3 and the substrate 1, thereby enhancing the connection strength between the carbon film 3 and the substrate 1, and making it difficult for the carbon film 3 to fall off the surface of the substrate 1.

[0034] The surface of the substrate 1 is also provided with an enlarged groove 14 for increasing the area of ​​the groove 11. The enlarged grooves 14 are respectively arranged on both sides of the groove 11, and the enlarged grooves 14 are arranged parallel to the length direction of the groove 11. The enlarged grooves 14 are connected to the groove 11, and the wire 2 is embedded in the enlarged groove 14. When the area of ​​the groove 11 is increased by the enlarged groove 14, the area of ​​the wire 2 is also increased, thereby increasing the contact area between the carbon film 3 and the wire 2 when the carbon film 3 is in contact with the wire 2, thereby enhancing the connection strength between the carbon film 3 and the wire 2, making it difficult for the carbon film 3 to detach.

[0035] The end faces of the wires 2 below the carbon film 3 are all provided with connection points 15, the diameter of the connection points 15 is larger than the width of the wires 2, and the carbon film 3 covers the connection points 15, thereby increasing the connection area and enhancing the connection strength between the carbon film 3 and the substrate 1.

[0036] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A carbon film circuit board, characterized in that: The invention comprises a substrate (1), a wire (2) arranged on the substrate (1), and a carbon film (3) attached to the surface of the wire (2); the substrate (1) is provided with a groove (11), the wire (2) is arranged in the groove (11), the surface of the substrate (1) is provided with a plurality of attachment grooves (12), the attachment grooves (12) are respectively arranged on both sides of the groove (11), and the carbon film (3) is embedded in the attachment grooves (12).

2. A carbon film circuit board according to claim 1, characterized in that: A gap is left between the attachment groove (12) and the groove (11).

3. The carbon film circuit board according to claim 1, characterized in that: The attachment grooves (12) are arranged along the length direction of the wire (2), and a gap is left between adjacent attachment grooves (12) located on the same side of the wire (2).

4. A carbon film circuit board according to claim 3, characterized in that: A connecting groove (13) is provided between the attachment grooves (12) on the same side of the conductive wire (2), the connecting groove (13) connects adjacent attachment grooves (12), the width of the connecting groove (13) is smaller than the width of the attachment groove (12), and the carbon film (3) is embedded in the connecting groove (13).

5. The carbon film circuit board according to claim 1, characterized in that: An enlarged groove (14) is also provided on the substrate (1) below the carbon film (3), and is arranged along the length direction of the wire (2). The enlarged groove (14) is connected to the groove (11), and the wire (2) is embedded in the enlarged groove (14).

6. The carbon film circuit board according to claim 5, characterized in that: The enlarged groove (14) is arranged along the length direction of the groove (11), and the length of the enlarged groove (14) is equal to the length of the wire (2) under the carbon film (3).

7. The carbon film circuit board according to claim 5, characterized in that: The enlarged grooves (14) are respectively arranged on both sides of the groove (11).

8. The carbon film circuit board according to claim 1, characterized in that: The ends of the wires (2) located below the carbon film (3) are all provided with connection points (15), and the diameter of the connection points (15) is greater than the width of the wires (2).

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