Heat dissipation device and heat dissipation mechanism
By designing the connection between the seal and the radiator in the electronic chip heat dissipation device, a closed storage tank is formed, which solves the problem of poor sealing of liquid metal, and improves the heat dissipation efficiency and the life of components.
Patent Information
- Application Number
- CN202323582476.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-26
AI Technical Summary
In the prior art, the sealing effect of liquid metal in electronic chip heat dissipation devices is poor, resulting in an increase in the risk of heat leakage and cannot meet the heat dissipation needs of high-power electronic components.
A heat dissipation device including a radiator, a heat dissipation coating and a seal is designed. The seal forms a receiving groove through connection with the target element and the radiator, limiting the flow of the heat dissipation coating, ensuring it is in a confined space and preventing heat leakage. .
It effectively improves the sealing effect of liquid metal coating, avoids heat leakage, enhances heat dissipation efficiency, and extends the service life of electronic components.
Smart Images
Figure CN222263405U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid metal heat dissipation, in particular to a heat dissipation device and a heat dissipation mechanism. Background Art
[0002] As electronic devices develop towards miniaturization, integration, and high frequency, the power consumption of electronic components is also increasing, which leads to an increase in the temperature of electronic components. Excessive temperature will reduce the service life of electronic components and even cause failure. In order to efficiently dissipate the heat generated by electronic chips, thermal interface materials are usually used to fill the heat exchange interface between the electronic chip and the heat sink to reduce the contact thermal resistance between the electronic chip and the heat sink.
[0003] At present, commonly used thermal interface materials include thermal grease and thermal pads, but their thermal conductivity is low and cannot meet the heat dissipation requirements of electronic components under high power. The thermal conductivity of liquid metal is ten or even dozens of times that of traditional thermal interface materials, which can efficiently complete the heat transfer between the chip and the heat sink. However, due to the strong fluidity of liquid metal, there is a risk of leakage caused by improper sealing.
[0004] In view of this, it is necessary to provide a new heat dissipation device and heat dissipation mechanism to solve or at least alleviate the above technical defects. Utility Model Content
[0005] The main purpose of the utility model is to provide a heat dissipation device and a heat dissipation mechanism, aiming to solve the technical problem of poor sealing effect of liquid metal on the surface of the chip in the prior art.
[0006] In order to achieve the above object, the utility model provides a heat dissipation device, which comprises:
[0007] heat sink;
[0008] Heat dissipation coating;
[0009] A sealing member, wherein the sealing member comprises a first side and a second side which are arranged opposite to each other, wherein the first side is used for sealingly connecting with the target element to form a receiving groove, the heat dissipation coating is arranged in the receiving groove, and the second side is used for connecting with the heat sink so that the heat sink can seal the notch of the receiving groove.
[0010] In one embodiment, the sealing member is provided with a through hole penetrating the first side and the second side, and the through hole is used to accommodate the heat dissipation coating.
[0011] In one embodiment, the sealing member is an annular sealing member, and the through hole is formed in the annular sealing member.
[0012] In one embodiment, the heat sink is provided with a contact side, the contact side is provided with a groove for accommodating the seal, and the bottom wall of the groove is used to connect with the second side so that the bottom wall of the groove can seal the notch of the accommodating groove.
[0013] In one embodiment, the sealing member further includes an inner side facing the through hole and an outer side facing away from the inner side, and the outer side and the side wall of the target element can both abut against the groove wall of the groove.
[0014] In one embodiment, the groove wall of the groove is used to fit with the side wall of the target element.
[0015] In one embodiment, the thickness of the sealing member is greater than the thickness of the heat dissipation coating.
[0016] In one embodiment, the seal is a thermally conductive seal.
[0017] In one embodiment, a side of the heat dissipation coating layer facing away from the target element is adapted to be attached to the heat sink.
[0018] In addition, the utility model also provides a heat dissipation mechanism, which includes a target element and the above-mentioned heat dissipation device, and the heat dissipation coating is provided on a side of the target element facing the heat sink.
[0019] In the above technical solution of the utility model, the seal and the target element form a receiving groove, the heat dissipation coating is located in the receiving groove, and the receiving groove plays a limiting role on the heat dissipation coating, so that when the radiator presses down the heat dissipation coating, it is limited by the restriction of the receiving groove on the heat dissipation coating, and the heat dissipation coating is not easy to flow out of the target element; at the same time, because the first side of the seal is sealed and connected to the target element, the sealing of the heat dissipation coating located in the receiving groove is strengthened, and the phenomenon of the heat dissipation coating flowing out of the gap between the first side and the target element is avoided; and then by connecting the radiator to the second side, so that the radiator can seal the notch of the receiving groove, the heat dissipation coating is enclosed in a closed space, thereby effectively improving the sealing effect of the heat dissipation coating. Among them, the heat dissipation coating can be a liquid metal coating. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the implementation mode of the utility model or the technical solution in the prior art, the drawings required for use in the implementation mode or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the utility model. For ordinary technicians in this field, other drawings can be obtained by using the structures shown in these drawings without paying any creative work.
[0021] Figure 1 This is a schematic diagram of the structure of the heat dissipation mechanism of an embodiment of the utility model;
[0022] Figure 2 This is a schematic structural diagram of a radiator according to an embodiment of the utility model;
[0023] Figure 3 This is a schematic cross-sectional structure diagram of a heat dissipation mechanism according to an embodiment of the utility model;
[0024] Figure 4 for Figure 3 A local enlarged schematic diagram at point A.
[0025] Description of Figure Numbers:
[0026] 1 Heat dissipation device 11 heat sink 111 Grooves 1111 Bottom wall of the groove 1112 Groove wall 112 Contact side 12 Heat dissipation coating 12a Liquid metal layer 13 Seals 131 First side 132 Second side 133 Outside 134 Inside 135 Through Hole 14 Receiving slot 2 Heat dissipation mechanism 21 Target component 21a chip 211 Sidewall of target component 22 Core board
[0027] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0029] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the position of the user in a certain posture (such as the attached Figure 1 The relative position relationship, movement status, etc. between the various components under the specific posture are shown. If the specific posture changes, the directional indication will also change accordingly.
[0030] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" can explicitly or implicitly include at least one of the features.
[0031] Furthermore, the technical solutions between the various implementation modes of the present invention can be combined with each other, but this must be based on the fact that ordinary technicians in the field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0032] The utility model provides a heat dissipation device 1. In one embodiment, Figure 1 to Figure 4As shown, the heat dissipation device 1 includes a heat sink 11, a heat dissipation coating 12 and a seal 13. The seal 13 includes a first side 131 and a second side 132 that are arranged opposite to each other. The first side 131 is used to be sealed and connected with the target element 21 to form a receiving groove 14. The heat dissipation coating 12 is arranged in the receiving groove 14. The second side 132 is used to connect with the heat sink 11 so that the heat sink 11 can seal the notch of the receiving groove 14.
[0033] The seal 13 and the target element 21 enclose a receiving groove 14, and the heat dissipation coating 12 is located in the receiving groove 14. The receiving groove 14 limits the heat dissipation coating 12, so that when the heat sink 11 presses down the heat dissipation coating 12, it is limited by the receiving groove 14, and the heat dissipation coating 12 is not easy to flow out of the target element 21; at the same time, since the first side 131 of the seal 13 is sealed and connected with the target element 21, the sealing of the heat dissipation coating 12 located in the receiving groove 14 is strengthened, and the phenomenon of the heat dissipation coating 12 flowing out from the gap between the first side 131 and the target element 21 is avoided; and then by connecting the heat sink 11 with the second side 132, so that the heat sink 11 can seal the notch of the receiving groove 14, the heat dissipation coating 12 is enclosed in a closed space, thereby effectively improving the sealing effect of the heat dissipation coating 12. The heat dissipation coating 12 can be a liquid metal layer 12a. It should be noted that the seal 13 can be a long strip member forming an annular structure, so that the seal 13 and the target element 21 form a receiving groove 14; the seal 13 can also be an integrally formed annular structure, and its cross-sectional shape can be circular, square or other shapes, which are not limited here; the seal 13 can also be a plate-like structure with a through hole 135 opened on it, so that the plate-like structure can be connected to the target element 21 to form the receiving groove 14. It should also be noted that the target element 21 includes a chip 21a.
[0034] In one embodiment, the sealing member 13 is provided with a through hole 135 penetrating the first side 131 and the second side 132, and the through hole 135 is used to accommodate the heat dissipation coating 12. By providing the through hole 135 on the sealing member 13, when the sealing member 13 is attached to the top surface of the chip 21a, the through hole 135 and the top surface of the chip 21a form a receiving groove 14, and the liquid metal layer 12a is located in the receiving groove 14.
[0035] In one embodiment, the seal 13 is an annular seal, and the annular seal is formed with a through hole 135. The seal 13 is an annular seal, and the cross-sectional shape of the annular seal can be circular, square or other shapes; according to one embodiment of the utility model, the cross-sectional shape of the annular seal is circular, and a through hole 135 is formed in the center of the annular seal.
[0036] In one embodiment, the heat sink 11 is provided with a contact side 112, and the contact side 112 is provided with a groove 111 for accommodating the seal 13, and the bottom wall 1111 of the groove is used to be connected with the second side 132, so that the bottom wall 1111 of the groove can seal the notch of the accommodating groove 14. The bottom wall 1111 of the groove is sealedly connected with the second side 132, and is sealedly connected with the top surface of the chip 21a in combination with the first side 131, so that the liquid metal layer 12a located in the accommodating groove 14 is in a sealed environment, thereby effectively improving the sealing effect of the liquid metal layer 12a. It should be noted that when the bottom wall 1111 of the groove is sealed and connected to the second side 132, if the part of the bottom wall 1111 of the groove that is not in contact with the second side 132 fails to abut against the liquid metal layer 12a, the heat sink 11 can be pressed down until the bottom wall 1111 of the groove is in contact with the liquid metal layer 12a. Since the liquid metal layer 12a is in a closed space, during the process of pressing down the heat sink 11, it can effectively prevent the liquid metal layer 12a from leaking out of the chip 21a and causing a short circuit in other electronic components.
[0037] In one embodiment, the seal 13 also includes an inner side 134 facing the through hole 135 and an outer side 133 facing away from the inner side 134, and the outer side 133 and the side wall of the target element 21 can abut against the groove wall 1112 of the groove. The outer side 133 abuts against the groove wall 1112 of the groove, thereby limiting the liquid metal layer 12a from flowing out of the gap between the groove wall 1112 of the groove and the outer side 133 to the outside of the chip 21a, thereby improving the sealing effect of the heat sink 1 on the liquid metal layer 12a. It should be noted that the outer side 133 abuts against the groove wall 1112 of the groove, so that the seal 13 can be first installed in the groove 111, and then move with the heat sink 11 until the first side 131 fits with the top surface of the chip 21a.
[0038] In one embodiment, the groove wall 1112 of the groove is used to fit with the side wall 211 of the target element. By fitting the groove wall 1112 of the groove with the side wall of the chip 21a, the liquid metal layer 12a is effectively restricted from flowing out of the chip 21a from the gap between the groove wall 1112 of the groove and the side wall of the chip 21a, thereby improving the sealing effect of the heat dissipation device 1 on the liquid metal layer 12a.
[0039] According to an embodiment of the utility model, the outer side 133 is used to abut against the groove wall 1112 of the groove, and the groove wall 1112 of the groove is also used to fit with the side wall of the chip 21a, wherein the groove wall 1112 of the groove fits with the side wall of the chip 21a, limiting the horizontal movement of the heat sink 11, and because the outer side 133 abuts against the groove wall 1112 of the groove, the movement of the seal 13 is further limited, so that the seal 13 in this state cannot move up and down relative to the chip 21a, nor can it move in the horizontal direction relative to the chip 21a, thereby avoiding the phenomenon of liquid metal leakage caused by the movement of the seal 13, and further improving the reliability of the heat sink 1 to seal the liquid metal layer 12a. It should be noted that when the height of the contact side 112 is lower than the height of the top surface of the chip 21a, the groove wall 1112 of the groove can abut against the outer side 133 and fit with the side wall of the chip 21a.
[0040] In one embodiment, the thickness of the seal 13 is greater than the thickness of the heat dissipation coating 12. The thickness of the seal 13 is designed to be slightly greater than the thickness of the liquid metal layer 12a, mainly to prevent the bottom wall 1111 of the groove from contacting the liquid metal layer 12a before the notch of the receiving groove 14 is sealed. As the heat sink 11 is pressed down, the liquid metal layer 12a is squeezed and spreads around, thereby flowing out of the chip 21a over the seal 13. The thickness of the seal 13 is greater than the thickness of the liquid metal layer 12a, so that the bottom wall 1111 of the groove is first sealed and connected with the seal 13, thereby confining the liquid metal layer 12a in a closed space. Then, when the heat sink 11 is pressed down, the liquid metal layer 12a is not easy to leak out until the bottom wall 1111 of the groove abuts or fits with the top surface of the liquid metal layer 12a.
[0041] In one embodiment, the side of the heat dissipation coating 12 facing away from the target element 21 is used to fit with the heat sink 11 , thereby enhancing the heat conduction efficiency from the heat dissipation coating 12 to the heat sink 11 .
[0042] In one embodiment, the seal 13 is an elastic seal. If the seal 13 is an elastic seal, the elastic seal will undergo elastic deformation in the process of continuing to move downward after the bottom wall 1111 of the groove contacts the top surface of the elastic seal, which will cause the contact area between the elastic seal and the heat sink 11 to increase, and as the heat sink 11 is gradually pressed down, the contact area between the heat sink 11 and the liquid metal layer 12a will also gradually increase, so that part of the heat generated by the chip 21a is transferred to the heat sink 11 by the liquid metal layer 12a, and the heat transfer efficiency can be improved due to the increase in the contact area between the liquid metal layer 12a and the heat sink 11; another part of the heat generated by the chip 21a is transferred to the seal 13 through the liquid metal layer 12a, and then transferred to the heat sink 11 by the seal 13, and since the contact area between the seal 13 and the heat sink 11 is also increased, the heat transfer efficiency from the seal 13 to the heat sink 11 is also improved. It should be noted that, compared with plastic seals, elastic seals can be used multiple times due to their elastic deformation capability.
[0043] In one embodiment, the seal 13 is a heat-conducting seal. The seal 13 is a heat-conducting seal, so that part of the heat generated by the chip 21a can be transferred to the seal 13 through the liquid metal layer 12a, and then transferred to the heat sink 11 by the seal 13, thereby effectively improving the heat dissipation efficiency of the heat dissipation device 1. It should be noted that the seal 13 can be a heat-conducting silicone seal, a heat-conducting gel seal, or a seal made of other traditional thermal interface materials. In addition, the seal 13 can also be a Teflon seal ring, a polytetrafluoroethylene seal ring, etc.
[0044] In one embodiment, the side of the seal 13 away from the heat dissipation coating 12 in any direction is used to be arranged in the plane where the side wall of the target element 21 in the corresponding direction is located. Taking the cross-sectional shape of the annular seal as a circle as an example, the side of the seal 13 away from the heat dissipation coating 12 in any direction is tangent to the plane where the side wall of the chip 21a in the direction is located; this allows the groove wall 1112 of the groove to be able to fit with the side wall of the chip 21a while also being able to abut against the outer side 133 of the seal 13, thereby effectively improving the sealing effect of the heat dissipation device 1 on the liquid metal layer 12a. It should be noted that even if the liquid metal flows out of the receiving groove 14 from the gap between the sealing member 13 and the chip 21a, since the groove wall 1112 of the groove is in contact with the side wall of the chip 21a, the liquid metal is not easy to flow out of the chip 21a; even if the liquid metal flows out of the receiving groove 14 from the gap between the sealing member 13 and the bottom wall 1111 of the groove, since the groove wall 1112 of the groove is in contact with the outer side 133 and the groove wall 1112 of the groove is in contact with the side wall of the chip 21a, this part of the liquid metal is even more difficult to flow out of the chip 21a, so that the heat dissipation device 1 has a good sealing effect on the liquid metal layer 12a.
[0045] It should be noted that the sealing process of the liquid metal layer 12a can be divided into two types. The first one is specifically: first, the liquid metal is applied to the coating area on the upper surface of the chip 21a to form the liquid metal layer 12a, wherein the coating area is a partial area on the upper surface of the chip 21a, and then the seal 13 is placed on the upper surface of the chip 21a where the liquid metal is not applied, so that the first side 131 is sealed and connected to the top surface of the chip 21a, and the liquid metal layer 12a is located in the receiving groove 14, and it is ensured that the side of the seal 13 away from the heat dissipation coating 12 in any direction is located at the side wall of the chip 21a in that direction. The heat sink 11 is then pressed down to seal the bottom wall 1111 of the groove with the second side 132, thereby enclosing the liquid metal layer 12a in a closed space. At this time, the seal 13 and the liquid metal layer 12a are both located in the groove 111, and the outer side 133 of the seal 13 abuts against the groove wall 1112 of the groove. The heat sink 11 is then pressed down to make the height of the contact side 112 of the heat sink 11 lower than the height of the top surface of the chip 21a, so that the groove wall 1112 of the groove fits with the side wall of the chip 21a, and at the same time, the top surface of the liquid metal layer 12a fits with the bottom wall 1111 of the groove. The second method is specifically as follows: first, liquid metal is applied to the coating area on the upper surface of the chip 21a to form a liquid metal layer 12a, and then the seal 13 is placed in the groove 111 so that the outer side 133 of the seal 13 abuts against the groove wall 1112 of the groove, and then the heat sink 11 is pressed down to drive the first side 131 of the seal 13 to fit with the top surface of the chip 21a, and the second side 132 to fit with the bottom wall 1111 of the groove, so that the bottom wall 1111 of the groove is sealed and connected with the second side 132, thereby enclosing the liquid metal layer 12a in an enclosed space, and then the heat sink 11 is pressed down so that the height of the contact side 112 of the heat sink 11 is lower than the height of the top surface of the chip 21a, so that the groove wall 1112 of the groove fits with the side wall of the chip 21a, and at the same time, the top surface of the liquid metal layer 12a fits with the bottom wall 1111 of the groove.
[0046] In addition, the utility model further provides a heat dissipation mechanism 2, which includes a target element 21 and the above-mentioned heat dissipation device 1, and a heat dissipation coating 12 is provided on the side of the target element 21 facing the heat sink 11. Since the heat dissipation mechanism 2 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.
[0047] According to an embodiment of the present invention, the heat dissipation mechanism 2 further includes a core board 22 , and the chip 21 a is disposed on the core board 22 .
[0048] The above are only preferred implementations of the utility model, and do not limit the patent scope of the utility model. All equivalent structural changes made based on the concept of the utility model and the contents of the description and drawings of the utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the utility model.
Claims
1. A heat dissipation device, the heat dissipation device is used to dissipate heat from a target element, characterized in that: include: heat sink; Heat dissipation coating; A sealing member, the sealing member comprising a first side and a second side arranged opposite to each other, the first side being used for sealingly connecting with the target element to form a receiving groove, the heat dissipation coating being arranged in the receiving groove, and the second side being used for connecting with the heat sink so that the heat sink can seal a notch of the receiving groove; The sealing member is provided with a through hole penetrating the first side and the second side, the through hole is used to accommodate the heat dissipation coating, and the through hole can enclose the accommodating groove with the top surface of the target element.
2. The heat dissipation device according to claim 1, characterized in that: The sealing member is an annular sealing member, and the through hole is formed in the annular sealing member.
3. The heat dissipation device according to claim 1, characterized in that: The heat sink is provided with a contact side, the contact side is provided with a groove for accommodating the sealing member, and the bottom wall of the groove is used to be connected with the second side so that the bottom wall of the groove can seal the notch of the accommodating groove.
4. The heat dissipation device according to claim 3, characterized in that: The sealing member further comprises an inner side facing the through hole and an outer side facing away from the inner side, and both the outer side and the side wall of the target element can abut against the groove wall of the groove.
5. The heat dissipation device according to claim 3, characterized in that: The groove wall of the groove is used to fit with the side wall of the target element.
6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The thickness of the sealing member is greater than the thickness of the heat dissipation coating layer.
7. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The seal is a thermally conductive seal.
8. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The side of the heat dissipation coating layer facing away from the target element is used to be attached to the heat sink.
9. A heat dissipation mechanism, characterized in that: The heat dissipation mechanism comprises a target element and the heat dissipation device according to any one of claims 1 to 8, and the heat dissipation coating is provided on a side of the target element facing the heat sink.