Laser cutting system
By using a refrigerator to adjust the coolant temperature in the laser cutting system, the damage problem of high-power lasers to cut substrates is solved, damage-free cutting and material adaptability are achieved, and cutting efficiency and battery performance are improved.
Patent Information
- Application Number
- CN202323441861.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-15
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2033-12-15
AI Technical Summary
The existing laser cutting system uses a fixed room temperature cooling water in the cooling process, resulting in cutting damage to the substrate to be cut by high-power lasers and the inability to adjust the coolant temperature to meet the cutting needs of different materials.
The spraying equipment including a refrigerator is adopted to adjust the coolant temperature to reduce the power of the laser, achieve appropriate cutting temperature difference, avoid damage to the cutting substrate by high-power lasers, and adjust the coolant temperature according to different materials.
Damage-free laser cutting is achieved, reducing the cutting damage of the substrate to be cut, improving the cutting efficiency and adaptability of different materials, and ensuring the electrical performance and mechanical strength of the battery after cutting.
Smart Images
Figure CN222269025U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser cutting technology, and more specifically, to a laser cutting system. Background Art
[0002] The technological innovation based on photovoltaic cell cutting has led to the development of many new photovoltaic module products, such as half-cell modules, 210mm three-cell modules, shingled modules, interconnected modules, and seamless welded multi-busbar modules. Laser splitting has become an indispensable process for the iterative upgrade of photovoltaic modules.
[0003] At present, lossless splitting technology has become the mainstream in the market. Its core principle is to control the fracture of the substrate to be cut by laser thermal stress. The laser is used to quickly heat the substrate to be cut locally. At the same time, through a matching cooling process, the substrate to be cut produces stress that causes the substrate to be cut to break along the preset cutting position.
[0004] In existing laser cutting systems, cooling water is generally used as a coolant in the cooling process, and the temperature of the coolant is fixed, generally at room temperature. Based on this, in order to produce a large temperature difference, the laser needs to have a higher power, and the cutting damage to the substrate to be cut is greater during the cutting process. Utility Model Content
[0005] In view of this, the present application provides a laser cutting system, the scheme is as follows:
[0006] A laser cutting system, comprising:
[0007] The laser cutting subsystem includes: a first laser, the first laser is used to form a groove on the top surface of the substrate to be cut; a second laser, the second laser is used to perform laser heating on the top surface of the substrate to be cut based on the groove, and form a laser heating path on the top surface;
[0008] The spraying subsystem includes: a first spraying device, which is used to spray a cooling liquid on the irradiation area of the second laser on the top surface while the second laser performs laser heating on the substrate to be cut, so that the substrate to be cut is fractured along the laser heating path based on the stress of temperature change;
[0009] The first spraying equipment includes: a first storage tank for storing coolant; and a refrigerator for controlling the coolant in the first storage tank to be at a set low temperature.
[0010] Preferably, in the above laser cutting system, the first spraying device comprises:
[0011] a first liquid taking pipeline, one end of which is connected to the first storage tank, and the other end of which is connected to a first nozzle, and the first nozzle is used to spray the cooling liquid to the irradiation area;
[0012] The first liquid taking pipeline has a first storage chamber at a portion close to the first nozzle for pre-storing the cooling liquid required for cutting a substrate to be cut.
[0013] Preferably, in the above laser cutting system, the substrate to be cut is a semiconductor material substrate;
[0014] The spraying subsystem also includes: a second spraying device, which is used to spray a passivation liquid on the cross section of the substrate to be cut after being cut, so as to form a passivation layer on the cross section.
[0015] Preferably, in the above laser cutting system, the second spraying device comprises:
[0016] A second storage tank, used for storing the passivation solution;
[0017] A second liquid taking pipe, one end of which is connected to the second storage tank, and the other end is connected to a second nozzle, which is used to spray the passivation liquid on the cross section; the part of the second liquid taking pipe close to the second nozzle has a second storage chamber, which is used to pre-store a certain volume of passivation liquid.
[0018] Preferably, in the above laser cutting system, the second spraying device is used to spray the passivation liquid on the cross sections one by one.
[0019] Preferably, in the above-mentioned laser cutting system, the second spraying device is used to simultaneously spray the passivation liquid onto two cross sections formed by the same substrate to be cut.
[0020] Preferably, in the above-mentioned laser cutting system, the spraying subsystem further comprises: a blowing device for blowing gas on the cross section of the substrate to be cut after cutting, so as to remove the coolant on the cross section.
[0021] Preferably, in the above laser cutting system, the refrigerator has a heat dissipation device, and the heat dissipation device is in thermal contact with the second spraying equipment.
[0022] Preferably, in the above-mentioned laser cutting system, the laser cutting system comprises:
[0023] The transmission system comprises: a conveyor belt; a plurality of fixed brackets fixed on the conveyor belt, used for fixing the substrate to be cut;
[0024] The fixed bracket has a bearing plate for adsorbing and fixing the bottom surface of the substrate to be cut; the bearing plate is also used to preheat the substrate to be cut before laser grooving the substrate to be cut.
[0025] Preferably, in the above laser cutting system, the transmission system comprises:
[0026] Two conveyor belts are arranged in parallel, the two conveyor belts are respectively a first conveyor belt and a second conveyor belt; the first conveyor belt and the second conveyor belt are both sequentially provided with a plurality of fixed brackets;
[0027] There is a gap between the first conveyor belt and the second conveyor belt, the first laser and the second laser are fixed above the gap; and a coolant recovery device is provided below the gap.
[0028] It can be seen from the above description that in the technical solution provided by the embodiment of the present application, the laser cutting system includes: a laser cutting subsystem, including: a first laser, the first laser is used to form a groove on the top surface of the substrate to be cut; a second laser, the second laser is used to perform laser heating on the top surface of the substrate to be cut based on the groove, and form a laser heating path on the top surface; a spraying subsystem, including: a first spraying device, which is used to spray coolant on the irradiation area of the second laser on the top surface while the second laser performs laser heating on the substrate to be cut, so that the substrate to be cut is broken along the laser heating path based on the stress of temperature change; wherein the first spraying device includes: a first storage tank for storing coolant; a refrigerator for controlling the coolant in the first storage tank to be at a set low temperature. It can be seen that the first spraying device of the technical solution of the present application can make the coolant at a set low temperature through the refrigerator, and the temperature of the coolant can be adjusted by the refrigerator. The power of the second laser can be reduced by appropriately reducing the temperature of the coolant to achieve the required cutting temperature difference, so as to avoid laser cutting damage to the substrate to be cut by high-power laser. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0030] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.
[0031] Figure 1 A schematic diagram of the working principle of a laser cutting system provided in an embodiment of the present application;
[0032] Figure 2 A schematic structural diagram of a first spraying device provided in an embodiment of the present application;
[0033] Figure 3A schematic diagram of the working principle of another laser cutting system provided in an embodiment of the present application;
[0034] Figure 4 A schematic diagram of the working principle of another laser cutting system provided in an embodiment of the present application;
[0035] Figure 5 A schematic diagram of the structure of a second spraying device provided in an embodiment of the present application;
[0036] Figure 6 A schematic diagram of the working principle of another laser cutting system provided in an embodiment of the present application;
[0037] Figure 7 A side view of a laser cutting system provided in an embodiment of the present application;
[0038] Figure 8 A top view of a laser cutting system provided in an embodiment of the present application;
[0039] Fig. 9 A top view of another laser cutting system provided in an embodiment of the present application. DETAILED DESCRIPTION
[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0041] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.
[0042] As described in the background technology, the key to laser cutting is to heat the substrate to be cut with a laser, and cool the laser heating area with a coolant, so that an uneven temperature field is generated in the laser heating area. This temperature field will generate a temperature gradient on the surface of the substrate to be cut, thereby inducing the generation of thermal stress. In this process, the heating laser spot is in a compressive stress state, and the front and rear positions of the laser spot on the laser irradiation path are in a tensile stress state. Since the substrate to be cut is generally a brittle material, the compressive stiffness of the brittle material is greater than the tensile stiffness. When the tensile stress reaches the fracture strength of the material, the material will break, and the fracture position will extend steadily along the moving trajectory of the laser irradiation and cooling position. Therefore, a groove can be formed in advance on the substrate to be cut, so that the fracture position can start based on the groove.
[0043] In conventional laser cutting systems, room temperature water is generally used as the coolant. In order to meet the temperature difference of cutting, the thermal cracking laser needs to have a larger power to increase its heating temperature. However, high-power laser heating will increase the cutting damage to the cross section of the substrate to be cut. In addition, since the coolant temperature cannot be adjusted, the coolant temperature cannot be adjusted based on the cutting requirements for substrates of different materials to be cut.
[0044] In view of this, an embodiment of the present application provides a laser cutting system, in which the first spraying device can make the coolant at a set low temperature through a refrigerator, and the temperature of the coolant can be adjusted by the refrigerator. The power of the second laser can be reduced by appropriately reducing the temperature of the coolant to achieve the required cutting temperature difference, so as to avoid laser cutting damage to the substrate to be cut by the high-power laser. In addition, since the first spraying device can adjust the coolant temperature through the refrigerator, the appropriate coolant temperature can be adjusted according to the substrate to be cut of different materials, so that a temperature difference adapted to the material of the substrate to be cut is formed during the cutting process.
[0045] It should be noted that the embodiments of the present application are described by taking the substrate to be cut as a battery cell with a silicon substrate as an example. When the substrate to be cut is a battery cell, one side surface of the battery cell has a main grid line, and the cutting section is parallel to the main grid line. Obviously, the laser cutting system provided in the embodiments of the present application is not limited to cutting battery cells with a silicon substrate, but can also be used for cutting substrates of other materials, such as silicon carbide substrates, glass substrates, gallium arsenide substrates, gallium nitride substrates, etc.
[0046] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0047] refer to Figure 1 As shown, Figure 1 A schematic diagram of the working principle of a laser cutting system provided in an embodiment of the present application, wherein the laser cutting system comprises:
[0048] The laser cutting subsystem 10 includes: a first laser 101, the first laser 101 is used to form a groove 12 on the top surface of the substrate 11 to be cut; a second laser 102, the second laser 102 is used to perform laser heating on the top surface of the substrate 11 to be cut based on the groove 12, and form a laser heating path 13 on the top surface of the substrate 11 to be cut;
[0049] The spraying subsystem 20 includes: a first spraying device 21, which is used to spray a cooling liquid 14 on the irradiation area of the second laser 102 on the top surface of the substrate 11 to be cut while the second laser 102 performs laser heating on the substrate 11 to be cut, so that the substrate 11 to be cut is fractured along the laser heating path 13 due to the stress of temperature change;
[0050] The first spraying device 21 includes: a first storage tank 211, which is used to store the coolant 14; and a refrigerator 212, which is used to control the coolant 14 in the first storage tank 211 to be at a set low temperature.
[0051] The first laser 101 is a slotting laser. The second laser 102 is a thermal cracking laser, such as an infrared thermal cracking laser. The first laser 101 can perform laser burning on the top surface of the substrate 11 to be cut to form a slot 12 with a depth of 3 mm to 5 mm. Since the depth of the slot 12 is small, the damage to the substrate 11 to be cut by the first laser 101 during the process of forming the slot 12 can be ignored.
[0052] After the groove 12 is formed, a laser heating path 13 is formed along the groove 12 through the second laser 102 to pass through the top surface of the substrate 11 to be cut, and a coolant 14 is sprayed synchronously on the path irradiated by the second laser 102. The coolant can be cooling water. This process can form a temperature field on the surface of the substrate 11 to be cut, and the temperature field can produce a temperature gradient on the surface of the substrate 11 to be cut, thereby inducing the generation of thermal stress. In this process, the top surface of the substrate 11 to be cut is in a compressive stress state at the laser spot irradiation position of the second laser 102, so that the substrate 11 to be cut breaks at this position, and the fracture position will stably extend along the moving trajectory of the laser irradiation and cooling position. Based on the pre-formation of the groove 12 on the substrate 11 to be cut, the fracture position can be made to start based on the groove.
[0053] When the power of the thermal cracking laser is different, the temperature generated is different. For some materials of the substrate 11 to be cut, since they cannot withstand high temperatures, it is necessary to reduce the power of the thermal cracking laser to reduce the temperature during the laser cutting process. In conventional laser cutting systems, since the cooling water temperature cannot be adjusted, the cooling water temperature cannot be reduced after the thermal cracking laser reduces the power and the heating temperature, so the temperature difference required for the substrate 11 to be cut cannot be formed, which is not enough to cause thermal cracking of the substrate 11 to be cut. In the embodiment of the present application, the first spraying equipment 21 can adjust the coolant 14 to a set low temperature through the refrigerator 212, so as to provide more room for the heating temperature of the second laser 102 to decrease, so as to improve the success rate of thermal cracking of substrates 11 to be cut of different materials. Among them, the value range of the set low temperature can be 0℃~25℃.
[0054] In the embodiment of the present application, the laser cutting system can realize thermal decomposition and non-destructive cutting of the substrate 11 to be cut, and the cut section of the substrate 11 to be cut is clean without any damage points. When used for cutting cells of silicon substrates, the electrical performance parameters and mechanical strength of the cells after cutting can be guaranteed, and the photovoltaic modules prepared by using cells cut by the laser cutting system can obtain a significant power gain of about 5%.
[0055] It can be seen from the above description that the laser cutting system provided in the embodiment of the present application has added a temperature adjustment function for the coolant 14, and the temperature of the coolant 14 can be set according to different cutting requirements. Since the effect of thermal cracking is related to the temperature difference, within a certain power range, the power of the second laser 102 can be reduced by reducing the temperature of the coolant 14. Under the premise of ensuring the required temperature difference, the heating temperature of the second laser 102 can be reduced to avoid cutting damage to the substrate 11 to be cut, thereby achieving true damage-free cutting.
[0056] Moreover, the laser cutting system provided in the embodiment of the present application can also adjust the temperature of the coolant 14 based on the material of the substrate 11 to be cut, and can be used for damage-free cutting of substrates 11 to be cut of various different materials.
[0057] When the laser cutting system performs laser cutting on the substrate 11 to be cut, the position of the laser cutting system 10 can be set to be fixed, and the position of the first spraying device 21 can be fixed. The substrate 11 to be cut after position calibration is translated along the set direction, and the first laser 101 forms a groove 12 on its top surface, and then the second laser 102 heats its top surface based on the groove 12. While the second laser 102 performs laser heating, the first spraying device 21 synchronously sprays the cooling liquid 14 to the laser irradiation area. In this way, the substrate 11 to be cut can be moved by a conveyor belt as described in the following embodiment.
[0058] In other methods, the substrate 11 to be cut can also be placed on a fixed platform, and a movable laser system 10 and a movable first spraying device 21 are used. In this method, after the groove 12 is formed on the top surface of the substrate 11 to be cut by the movable first laser 101, the top surface of the substrate 11 to be cut is laser heated based on the groove 12 by the movable second laser 102, and while the second laser 102 is laser heating, the first spraying device 21 synchronously sprays the cooling liquid 14 to the laser irradiation area.
[0059] Based on the laser heating path 13, the substrate 11 to be cut can be split into two parts. In the embodiment of the present application, a vertically opposite groove 12 can be formed on two opposite sides of the substrate 11 to be cut, or the groove 12 can be formed on only one side, or the groove 12 can be formed throughout the top surface of the substrate 11 to be cut, which is not limited in the embodiment of the present application.
[0060] In the optical cutting system provided in the embodiment of the present application, the first spraying device 21 can make the coolant 14 at a set low temperature through the refrigerator 212, and the temperature of the coolant 14 can be adjusted through the refrigerator 212. The power of the second laser 102 can be reduced by appropriately reducing the temperature of the coolant 14 to achieve the required cutting temperature difference, so as to avoid laser cutting damage to the substrate 11 to be cut by the high-power laser. In addition, since the first spraying device 21 can adjust the temperature of the coolant 14 through the refrigerator 212, the temperature of the coolant 14 can be adjusted to match the substrate 11 to be cut of different materials, so that a temperature difference matching the material of the substrate 11 to be cut is formed during the cutting process.
[0061] refer to Figure 2 As shown, Figure 2 A schematic diagram of the structure of a first spraying device provided in an embodiment of the present application, wherein the first spraying device 21 includes:
[0062] A first liquid taking pipeline 212, one end of which is in communication with the first storage tank 211 so as to obtain the coolant 14 from the first storage tank 211, and the other end of which is connected to a first nozzle 213, the first nozzle 213 being used to spray the coolant 14 to the irradiation area of the second laser 102 on the top surface of the substrate 11 to be cut;
[0063] The first liquid taking pipeline 211 has a first storage chamber 214 at a portion close to the first nozzle 213 . The first storage chamber 214 is used to pre-store the cooling liquid 14 required for cutting a substrate 11 to be cut.
[0064] exist Figure 2In the first spraying device 21 shown, the first liquid extraction pipeline 211 has a first storage chamber 214, which can pre-store the coolant 14 required for cutting a substrate 11 to be cut. In this way, before the second laser 102 performs thermal cracking on the substrate 11 to be cut, the coolant 14 required for cutting a substrate 11 to be cut can be pre-extracted into the first storage chamber 214, so that when the second laser 102 starts to irradiate the substrate 11 to be cut, the coolant 14 can be sprayed on the upper surface of the substrate 11 to be cut in time. In this way, when the substrate 11 to be cut is transmitted through a conveyor belt and the substrates 11 to be cut on the conveyor belt are laser segmented in sequence, after the previous laser segmentation is completed and before the next laser segmentation is performed, the coolant 14 required for cutting a substrate 11 to be cut can be pre-extracted into the first storage chamber 214 by utilizing the time when the substrate 11 to be cut moves to the cutting position, thereby improving work efficiency.
[0065] refer to Figure 3 As shown, Figure 3 This is a schematic diagram of the working principle of another laser cutting system provided in an embodiment of the present application. Based on the above implementation, Figure 3 In the illustrated method, the substrate 11 to be cut is a semiconductor material substrate. The spraying subsystem further includes: a second spraying device 22, which is used to spray the passivation liquid 15 on the cut section 111 of the substrate 11 to be cut, so as to form a passivation layer on the section 111. In this method, the passivation layer can be formed on the cut section 111 by the second spraying device 22 to protect the section of the substrate 11 to be cut.
[0066] Among them, the semiconductor material substrate can be a silicon-based solar cell. Silicon-based solar cells can reduce electrical losses on solder joints by segmentation, thereby increasing the percentage of photovoltaic module output power to the total cell power. If there is no passivation layer on the cross section of the cell after cutting, surface recombination of carriers will occur at the cross section, affecting the performance of the cell. When the laser cutting system provided in the embodiment of the present application is used to cut silicon-based solar cells, passivation repair can be performed in time at the cross section after cutting.
[0067] In one implementation of the embodiment of the present application, it can be as follows Figure 3 As shown, the second spraying device 22 is used to simultaneously spray the passivation liquid 15 onto two sections 111 formed on the same substrate 11 to be cut. In this manner, after a substrate 11 to be cut is divided into two parts, each of the two parts has a section 111. At this time, the same second spraying device 22 can be used to simultaneously spray the passivation liquid 15 onto the two opposite sections 111.
[0068] When the two sections 111 of the same substrate 11 to be cut are sprayed with the passivation liquid 15 at the same time, the Figure 3As shown, the substrate 11 to be cut is divided into a first part B1 and a second part B2. The second spraying device 22 has a second spray head 223 for spraying the passivation liquid 15. The second spray head 223 has two opposite nozzles, one nozzle sprays the passivation liquid 15 to the section 111 of the first part B1, and the other nozzle sprays the passivation liquid 15 to the section 111 of the second part B2. At this time, the distance between the first part B1 and the second part B2 is greater than the distance between the two nozzles.
[0069] When the two sections 111 of the same substrate 11 to be cut are sprayed with the passivation liquid 15 at the same time, the Figure 4 Spraying method shown.
[0070] refer to Figure 4 As shown, Figure 4 A schematic diagram of the working principle of another laser cutting system provided in an embodiment of the present application, Figure 3 The difference between the methods shown is that Figure 4 In the illustrated method, the distance between the cross-section 11 between the first part B1 and the second part B2 is small, and the distance between the two cross-sections 11 meets the capillary size. At this time, the second nozzle 223 provides the passivation liquid 15 between the two cross-sections 11 in a dripping manner. Based on the capillary action, the passivation liquid 15 can be quickly coated on the two cross-sections 11 based on the narrow gap between the two cross-sections 11 to complete the passivation of the cross-sections 11. In this method, the capillary action can be used to quickly realize the passivation of the cross-section 11, and the utilization rate of the passivation liquid 15 can be improved, and the passivation cost can be reduced.
[0071] for Figure 3 or Figure 4 In the manner shown, the substrate 11 to be cut can be fixed on the conveyor belt by a fixing bracket. After a substrate 11 to be cut is divided into a first part B1 and a second part B2, the distance between the cross sections 111 of the first part B1 and the second part B2 can be adjusted by the fixing bracket so that the distance meets the requirements of spraying the passivation liquid 15.
[0072] In other embodiments of the present application, a second spraying device 22 may be provided to spray the passivation liquid on the sections 11 one by one. In this manner, after a substrate 11 to be cut is divided into a first part B1 and a second part B2, the second spraying device 22 sprays the passivation liquid on the sections 11 of the first part B1 and the second part B2 in sequence.
[0073] refer to Figure 5 As shown, Figure 5 A schematic diagram of the structure of a second spraying device provided in an embodiment of the present application, wherein the second spraying device 22 includes:
[0074] A second storage tank 221, the second storage tank 221 is used to store the passivation solution 15;
[0075] A second liquid collection pipe 222, one end of which is connected to the second storage tank 221, and the other end is connected to a second nozzle 223, and the second nozzle 223 is used to spray the passivation liquid 15 on the section 111; the second liquid collection pipe 222 has a second storage chamber 224 near the second nozzle 223, and the second storage chamber 224 is used to pre-store a certain volume of passivation liquid 15.
[0076] exist Figure 5 In the second spraying device 222 shown, the second liquid taking pipe 222 has a second storage chamber 224, which can pre-store a certain volume of passivation liquid 15. In this way, a certain volume of passivation liquid 15 in the second storage tank 221 can be drawn into the second storage chamber 224 in advance when a substrate 11 to be cut is subjected to laser thermal cracking, so that when the substrate 11 to be cut that has been cut is moved to the passivation spraying position, the passivation liquid 15 can be sprayed on the cross section 11 in time. In this way, when the substrate 11 to be cut that has been cut is transmitted through a conveyor belt, and the substrates 11 to be cut that have been cut on the conveyor belt are passivated in turn, after the previous passivation liquid spraying is completed and before the next passivation liquid spraying is performed, a certain volume of passivation liquid 15 can be drawn into the second storage chamber 224 in advance by utilizing the time when the substrate 11 to be cut that has been cut is moved to the passivation spraying position, thereby improving work efficiency.
[0077] refer to Figure 6 As shown, Figure 6 A schematic diagram of the working principle of another laser cutting system provided in the embodiment of the present application is provided. Based on the above implementation mode, Figure 6 In the shown manner, the spraying subsystem 22 also includes: a blowing device 23, which is used to perform gas blowing on the section 111 after the substrate 11 is cut to remove the coolant on the section 111, so as to facilitate the subsequent process of spraying the passivation liquid 15 on the section 111, thereby avoiding the residual coolant 14 on the section 111 affecting the adhesion of the passivation liquid 15 to the section 111, thereby avoiding affecting the passivation effect of the section 111.
[0078] Optionally, the blowing device 23 has a heating device that can control the blowing gas to be at a set high temperature. Optionally, the set high temperature is greater than the first temperature and less than the second temperature. The first temperature is the upper limit of the active temperature range of the passivation liquid 15, and the second temperature is the lower limit of the active temperature of the passivation liquid 15. In this way, setting the blowing gas to a set high temperature can, on the one hand, improve the purging efficiency of the coolant 14 on the section 111, and on the other hand, can also utilize the purging process to heat the section 111 so that it is in a suitable temperature range required for the passivation of the passivation liquid 15, so as to improve the passivation efficiency and passivation quality of the passivation liquid on the section 111 in the subsequent process.
[0079] The refrigerator 212 has a heat dissipation device, which is used to release heat to the coolant 14 and dissipate the heat generated by the operation of the refrigerator when the refrigerator 212 cools the coolant 14. In one embodiment of the present application, the heat dissipation device of the refrigerator 212 is set to be in thermal contact with the second spraying device 22. Specifically, as mentioned above, the second spraying device 22 has a second storage tank 221, and the heat dissipation device of the refrigerator 212 is in thermal contact with the second storage tank 221. In this way, the passivation liquid 15 in the second spraying device 22 can be preheated at the heat dissipation temperature of the refrigerant 212 to improve the activity of the passivation liquid, so as to improve the passivation efficiency and passivation quality of the passivation liquid in the section 111 in the subsequent process.
[0080] As described above, in the embodiment of the present application, the position of the laser cutting system 10 can be fixed, and the position of the first spraying device 21 can be fixed, and the substrate 11 to be cut after position calibration is translated along the set direction. At this time, the structure of the laser cutting system can be as follows: Figure 7 shown.
[0081] refer to Figure 7 As shown, Figure 7 This is a side view of a laser cutting system provided in an embodiment of the present application. Based on the above implementation, Figure 7 The laser cutting system shown includes: a transmission system 30, the transmission system 30 includes: a conveyor belt 31; a plurality of fixed brackets 32 fixed on the conveyor belt 31, the fixed brackets 32 are used to fix the substrate 11 to be cut; wherein the fixed brackets 32 have a supporting plate 321, the supporting plate 321 is used to adsorb and fix the bottom surface of the substrate 11 to be cut; the supporting plate 321 is also used to preheat the substrate 11 to be cut before laser grooving the substrate 11 to be cut.
[0082] By using the supporting plate 321, the residual heat of the substrate 11 to be cut can be removed before the groove 12 is formed. On the one hand, it can prevent the surface temperature of the substrate 11 to be cut from rising rapidly in a short period of time and causing cracks during the process of forming the groove 12 by the first laser 101. On the other hand, it can also shorten the subsequent heating time of the substrate 11 to be cut by the first laser 101 and the second laser 102, thereby improving the laser cutting efficiency.
[0083] In the embodiment of the present application, the first spraying device 21 can use water as the coolant 14. In this case, the first spraying device 21 can include a water cooler, and the water cooler includes a refrigerator 212.
[0084] Optionally, a position sensor 41 may be provided above the loading position of the conveyor belt 31, and the sensor 41 is used to detect the position information of the substrate 11 to be cut on the conveyor belt 31, so that the control system can determine whether the substrate 11 to be cut is loaded in place based on the position information.
[0085] refer to Figure 8 As shown, Figure 8 A top view of a laser cutting system provided in an embodiment of the present application, combined with Figure 7 and Figure 8 As shown, the transmission system 30 includes: two transmission belts 31 arranged in parallel, the two transmission belts 31 are respectively a first transmission belt 311 and a second transmission belt 312; the first transmission belt 311 and the second transmission belt 312 are sequentially provided with a plurality of fixing brackets 32; wherein a gap 33 is provided between the first transmission belt 311 and the second transmission belt 312, the first laser 101 and the second laser 102 are fixed above the gap 33; and a coolant recovery device 34 is provided below the gap 33. The coolant recovery device 34 is located below the first nozzle 213.
[0086] refer to Fig. 9 As shown, Fig. 9 A top view of another laser cutting system provided in an embodiment of the present application, Figure 8 Based on the method shown, Fig. 9 In the illustrated embodiment, a second spraying device 22 is further included. The second spraying device 22 has a second spray head 223 disposed above the conveyor belt 31 . The second spray head 223 is used to spray the passivation liquid 15 on the section 111 . Specifically, the second spray head 223 is located above the gap 33 .
[0087] A passivation liquid recovery device 35 is provided below the conveyor belt 31 . The passivation liquid recovery device 35 is located below the gap 33 and below the second nozzle 223 .
[0088] From the above description, it can be seen that the embodiment of the present application adds a temperature adjustment function of the coolant 14 in the thermal cracking laser cutting system, which is simple to operate and low in cost. By adjusting the temperature of the coolant 14, a temperature that is more conducive to the cracking of the substrate 11 to be cut under the adapted physical stress can be selected. The coolant 14 with a lower temperature can provide more heating temperature drop space for the second laser 102 to achieve the minimum cutting damage to the cross section 111.
[0089] The various embodiments in this specification are described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.
[0090] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.
[0091] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.
[0092] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.
[0093] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A laser cutting system, characterized in that: include: The laser cutting subsystem includes: a first laser, the first laser is used to form a groove on the top surface of the substrate to be cut; a second laser, the second laser is used to perform laser heating on the top surface of the substrate to be cut based on the groove, and form a laser heating path on the top surface; The spraying subsystem includes: a first spraying device, which is used to spray a cooling liquid on the irradiation area of the top surface of the second laser while the second laser performs laser heating on the substrate to be cut, so that the substrate to be cut is broken along the laser heating path based on the stress of temperature change; Wherein, the first spraying equipment comprises: a first storage tank for storing the coolant; and a refrigerator for controlling the coolant in the first storage tank to be at a set low temperature.
2. The laser cutting system according to claim 1, characterized in that: The first spraying equipment comprises: a first liquid taking pipeline, one end of which is connected to the first storage tank, and the other end of which is connected to a first nozzle, and the first nozzle is used to spray coolant onto the irradiation area; The first liquid taking pipeline has a first storage chamber at a portion close to the first nozzle for pre-storing the cooling liquid required for cutting the substrate to be cut.
3. The laser cutting system according to claim 1, characterized in that: The substrate to be cut is a semiconductor material substrate; The spraying subsystem further includes: a second spraying device for spraying a passivation liquid on the cross section of the substrate to be cut after cutting, so as to form a passivation layer on the cross section.
4. The laser cutting system according to claim 3, characterized in that: The second spraying equipment comprises: A second storage tank, used to store the passivation solution; A second liquid taking pipe, one end of which is connected to the second storage tank, and the other end is connected to a second nozzle, and the second nozzle is used to spray the passivation liquid on the section; the second liquid taking pipe has a second storage chamber near the second nozzle for pre-storing a certain volume of the passivation liquid.
5. The laser cutting system according to claim 3, characterized in that: The second spraying device is used to spray the passivation liquid on the sections one by one.
6. The laser cutting system according to claim 3, characterized in that: The second spraying device is used to simultaneously spray the passivation liquid onto two cross sections formed by the same substrate to be cut.
7. The laser cutting system according to claim 3, characterized in that: The spraying subsystem further comprises: a blowing device for blowing gas to the cross section of the substrate to be cut after being cut, so as to remove the cooling liquid on the cross section.
8. The laser cutting system according to claim 3, characterized in that: The refrigerator has a heat dissipation device, and the heat dissipation device is in thermal contact with the second spraying equipment.
9. The laser cutting system according to any one of claims 1 to 8, characterized in that: The laser cutting system comprises: The transmission system comprises: a conveyor belt; a plurality of fixed brackets fixed on the conveyor belt, used for fixing the substrate to be cut; The fixing bracket has a bearing plate for adsorbing and fixing the bottom surface of the substrate to be cut; the bearing plate is also used for preheating the substrate to be cut before laser grooving the substrate to be cut.
10. The laser cutting system according to claim 9, wherein the transmission system comprises: Two conveyor belts arranged in parallel, the two conveyor belts are respectively a first conveyor belt and a second conveyor belt; the first conveyor belt and the second conveyor belt are both sequentially provided with a plurality of the fixing brackets; There is a gap between the first conveyor belt and the second conveyor belt, the first laser and the second laser are fixed above the gap; and a coolant recovery device is provided below the gap.