Semiconductor clamping device and semiconductor carrying equipment

Abstract

The utility model belongs to the technical field of semiconductor processing, and discloses a semiconductor clamping device and semiconductor carrying device.The semiconductor clamping device comprises an installation supporting assembly and a clamping assembly, one end of the installation supporting assembly is detachably connected to a mechanical arm, and the clamping assembly comprises a suction cup mechanism and a fork disc mechanism; an adsorption hole communicated with an external air source is formed in the suction cup mechanism to generate suction force, the suction cup mechanism can adsorb a wafer, the fork disc mechanism can lift the wafer, and one of the suction cup mechanism and the fork disc mechanism is selectively and detachably connected to the installation supporting assembly. The semiconductor clamping device can be selectively and detachably connected with the suction disc mechanism or the fork disc mechanism through the installation supporting assembly, is high in applicability and convenient to use, meets the process requirements of different process cavities, and reduces the equipment cost.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a semiconductor clamping device and a semiconductor handling equipment. Background Art

[0002] In semiconductor processing equipment, semiconductors need to go through multiple different process processes, and usually a robot is used to complete the transfer of wafers between various process chambers. The wafer states in different process chambers are different, and the internal environment of the process chambers is also different. For example, some wafers are suitable for the upper wafer method, and a robot structure with a suction cup is required to suck the wafer from above. The robot often uses a Bernoulli suction cup to adsorb the wafer. The Bernoulli suction cup is transported between the chambers with the robot, rotating, stretching, and lifting to transfer the wafer to the required position. High-speed gas is blown out from the bottom of the Bernoulli suction cup, which reduces the pressure between the suction cup and the wafer, forming a pressure above the wafer that is less than the pressure below the wafer, thereby generating suction and causing the wafer to be adsorbed by the suction cup. During the adsorption process, high-speed gas will enter the chamber, inevitably forming an airflow in the chamber, and bringing in impurities, affecting the stability of the chamber environment. Moreover, the wafer position or chamber space in some chambers is not suitable for the upper wafer method, and the lower wafer method needs to be used. For a robot equipped with only a Bernoulli suction cup, its applicability is poor, the cost of process equipment is increased, it is inconvenient to use, and the process time is prolonged. Utility Model Content

[0003] One purpose of the utility model is to provide a semiconductor clamping device, which can solve the problems that the existing manipulator is only equipped with a single wafer picking method, has poor applicability, high process equipment cost, is inconvenient to use, and has a long process processing time.

[0004] To achieve this purpose, the present invention adopts the following technical solutions:

[0005] A semiconductor clamping device is provided, comprising a mounting support component and a clamping component, wherein one end of the mounting support component is detachably connected to a robot arm, and the clamping component comprises a suction cup mechanism and a fork plate mechanism, wherein the suction cup mechanism is provided with a suction hole connected to an external air source to generate suction, the suction cup mechanism can adsorb a wafer, and the fork plate mechanism can lift the wafer, and one of the suction cup mechanism and the fork plate mechanism can be selectively detachably connected to the mounting support component.

[0006] In one embodiment, the mounting support assembly includes an extension arm mechanism and a clamping seat mechanism, the extension arm mechanism is extended in a horizontal direction, one end of the extension arm mechanism is used to connect to the manipulator, and the other end is detachably connected to the clamping seat mechanism, and the clamping seat mechanism is used to connect to the suction cup mechanism or the fork plate mechanism.

[0007] In one embodiment, the clamping seat mechanism includes a first clamping plate and a second clamping plate that are detachably connected, and a clamping groove with an opening is formed between the first clamping plate and the second clamping plate, and the suction cup mechanism or the fork plate mechanism can be clamped in the clamping groove through the opening.

[0008] In one of the embodiments, the suction cup mechanism is provided with a suction cup air duct and a suction cup air inlet, the two ends of the suction cup air duct are respectively connected to the suction cup air inlet and the adsorption hole, the clamping seat mechanism is provided with a clamping seat air duct connected to the clamping groove, one end of the clamping seat air duct is used to connect to the external air source, and when the suction cup mechanism is clamped in the clamping groove, the other end of the clamping seat air duct is connected to the suction cup air inlet.

[0009] In one embodiment, the extension arm mechanism is provided with a first extension air channel, and the clamping seat mechanism is provided with a clamping seat air channel, one end of the first extension air channel is connected to the external air source, and the other end is connected to the clamping seat air channel, and the other end of the clamping seat air channel away from the first extension air channel is connected to the suction cup air channel of the suction cup mechanism.

[0010] In one embodiment, the extension arm mechanism includes a first extension plate and a second extension plate, the first extension plate and / or the second extension plate is provided with an extension slot, and the first extension plate and the second extension plate are detachably connected to close the extension slot to form the first extension airway.

[0011] In one of the embodiments, a first sealing member is disposed between the first extension plate and the second extension plate to seal the first extension air channel.

[0012] In one embodiment, the extension groove is opened in the first extension plate and extends along the length direction of the extension arm mechanism. The first sealing member is a first sealing ring to surround the extension groove. A second extension air channel is also opened inside the first extension plate. One end of the second extension air channel is connected to the extension groove, and the other end extends to the surface of the first extension plate. The second extension air channel passes through the first extension plate to connect to the clamping seat air channel.

[0013] In one embodiment, the first extension plate or the second extension plate is provided with an air inlet hole, the air inlet hole is used to connect to the external air source, the air inlet hole is connected to the extension groove, and is located on the inner side of the first sealing member; and / or,

[0014] The extension arm mechanism includes a plurality of first fasteners, the first fasteners are detachably connected to the first extension plate and the second extension plate, and the plurality of first fasteners are arranged around the outer peripheral side of the first sealing member.

[0015] Another object of the utility model is to provide semiconductor handling equipment, which has a semiconductor clamping device that can be selectively detachably connected to a suction cup mechanism or a fork plate mechanism to clamp wafers, has strong applicability, is easy to use, meets the process requirements of different process chambers, and reduces equipment costs.

[0016] To achieve this purpose, the utility model adopts the following technical solutions on the other hand:

[0017] A semiconductor handling device is provided, comprising the semiconductor gripping device as described above, the semiconductor handling device further comprising a robot arm, and the robot arm is detachably connected to the semiconductor gripping device.

[0018] Beneficial effects of the utility model:

[0019] The semiconductor clamping device provided by the utility model comprises a mounting support component and a clamping component. One end of the mounting support component is detachably connected to a manipulator, and the other end provides a mounting reference for the clamping component. The clamping component comprises a suction cup mechanism and a fork plate mechanism. The suction cup mechanism is provided with a suction hole connected to an external air source to generate suction. The suction cup mechanism can absorb the wafer from above the wafer by suction; and the fork plate mechanism can lift the wafer from below the wafer. One of the suction cup mechanism and the fork plate mechanism is selectively detachably connected to the mounting support component. For some process chambers suitable for using the upper wafer picking method, the suction cup mechanism is installed on the mounting support component, and driven by the manipulator to the required position, and the wafer is taken from top to bottom and transferred; for some process chambers suitable for using the lower wafer picking method, the suction cup mechanism is removed from the mounting support component and replaced with a fork plate mechanism installed on the mounting support component, and driven by the manipulator to the required position, and the fork plate mechanism completes the wafer taking from bottom to top and transfers it. The suction cup mechanism, fork plate mechanism and mounting support assembly are detachably connected, easy to use and can be replaced at any time to avoid extending the process time; the semiconductor clamping device has good applicability, meets the process requirements of different process chambers, and reduces equipment costs.

[0020] The semiconductor handling equipment provided by the utility model includes the above-mentioned semiconductor clamping device, wherein one of the suction cup mechanism and the fork plate mechanism is selectively detachably connected to the installation support component, and the suction cup mechanism or the fork plate mechanism can be selected to pick up and place the wafer according to the working conditions of the process chamber. The suction cup mechanism can absorb the wafer from the top of the wafer by suction, and the fork plate mechanism can lift the wafer from the bottom of the wafer. The suction cup mechanism, the fork plate mechanism and the installation support component are detachably connected, which is convenient to use and can be replaced at any time to avoid extending the process processing time; the semiconductor handling equipment has good applicability, meets the process requirements of different process chambers, and reduces equipment costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a top view of the structure of a semiconductor clamping device with a suction cup mechanism provided by an embodiment of the utility model;

[0022] Figure 2 It is a top view of the structure of a semiconductor clamping device with a fork mechanism provided by an embodiment of the utility model;

[0023] Figure 3 It is a schematic diagram of the disassembly of the structure of the semiconductor clamping device provided by an embodiment of the utility model;

[0024] Figure 4 It is a structural perspective view of a semiconductor clamping device provided by an embodiment of the utility model;

[0025] Figure 5 It is a schematic diagram of the structural disassembly of the clamping seat mechanism provided in an embodiment of the utility model;

[0026] Figure 6 It is a structural cross-sectional view of a semiconductor clamping device provided by an embodiment of the utility model;

[0027] Figure 7 yes Figure 6 A partial enlarged schematic diagram of part A;

[0028] Figure 8 It is a schematic diagram of the structural disassembly of the extension arm mechanism provided by an embodiment of the utility model;

[0029] Fig. 9 It is a structural schematic diagram of a first extension plate with an extension groove provided in an embodiment of the utility model.

[0030] In the figure:

[0031] 1. Mounting support assembly; 11. Extension arm mechanism; 111. First extension airway; 112. First extension plate; 1121. Second extension airway; 113. Second extension plate; 1131. Sealing groove; 114. Extension groove; 115. First sealing member; 116. Air inlet; 117. First fastener; 12. Clamping seat mechanism; 121. First clamping plate; 122. Second clamping plate; 123. Clamping groove; 124. Clamping seat airway;

[0032] 2. Clamping assembly; 21. Suction cup mechanism; 211. Adsorption hole; 212. Suction cup airway; 213. Suction cup air inlet; 22. Fork plate mechanism. DETAILED DESCRIPTION

[0033] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0034] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0037] Embodiment 1

[0038] like Figures 1 to 9As shown, the embodiment of the utility model first provides a semiconductor clamping device, which includes a mounting support component 1 and a clamping component 2. One end of the mounting support component 1 is detachably connected to the manipulator, and the other end provides a mounting reference for the clamping component 2. The clamping component 2 includes a suction cup mechanism 21 and a fork plate mechanism 22. The suction cup mechanism 21 is provided with a suction hole 211 connected to an external air source to generate suction. The suction cup mechanism 21 can absorb the wafer from above the wafer by suction; the fork plate mechanism 22 can lift the wafer from below the wafer. One of the suction cup mechanism 21 and the fork plate mechanism 22 is selectively detachably connected to the mounting support assembly 1. For some process chambers suitable for using the upper wafer picking method, the suction cup mechanism 21 is installed on the mounting support assembly 1, and driven by a robot to the required position, and the wafer is picked up from the top to the bottom and transferred; for some process chambers suitable for using the lower wafer picking method, the suction cup mechanism 21 is removed from the mounting support assembly 1, and replaced with a fork plate mechanism 22 installed on the mounting support assembly 1, and driven by a robot to the required position, and the fork plate mechanism 22 completes the wafer from the bottom to the top and transfers it. The suction cup mechanism 21, the fork plate mechanism 22 and the mounting support assembly 1 are detachably connected, easy to use, and can be replaced at any time to avoid extending the process time; the semiconductor clamping device has good applicability, meets the process requirements of different process chambers, and reduces equipment costs.

[0039] It should be noted that the above-mentioned suction cup mechanism 21 includes but is not limited to a Bernoulli suction cup structure, and may also be a vacuum suction cup that generates suction through a vacuum generator. This embodiment does not limit the specific structures of the suction cup mechanism 21, the fork mechanism 22 and the manipulator. The fork mechanism 22 is made of quartz material to reduce mechanical collision damage to the wafer.

[0040] In one embodiment, the mounting support assembly 1 includes an extension arm mechanism 11 and a clamping seat mechanism 12 detachably connected to the extension arm mechanism 11. Figure 3 As shown. The clamping seat mechanism 12 is used to connect the suction cup mechanism 21 or the fork plate mechanism 22; the extension arm mechanism 11 is extended in the horizontal direction, one end of the extension arm mechanism 11 is used to connect the robot, and the other end is detachably connected to the clamping seat mechanism 12. The extension arm mechanism 11 increases the extension length of the clamping component 2 of the semiconductor clamping device relative to the robot, so that the clamping component 2 has a larger reach and can clamp wafers in a larger range.

[0041] Specifically, the clamping seat mechanism 12 includes a first clamping plate 121 and a second clamping plate 122 that are detachably connected. Figure 5As shown; a clamping groove 123 with an opening is formed between the first clamping plate 121 and the second clamping plate 122, and the suction cup mechanism 21 or the fork plate mechanism 22 can be clamped in the clamping groove 123 through the opening. The suction cup mechanism 21 or the fork plate mechanism 22 can be fixed by locking the connection between the first clamping plate 121 and the second clamping plate 122; when the clamping assembly 2 needs to be replaced, the connection between the first clamping plate 121 and the second clamping plate 122 can be loosened. This clamping structure has a relatively mild force on the clamping assembly 2, and is reliably fixed, preventing the clamping assembly 2 from loosening due to vibration, high temperature, etc.

[0042] In order to provide airflow to the suction cup mechanism 21, the suction cup mechanism 21 is provided with a suction cup airway 212 and a suction cup air inlet 213. Figure 4 As shown, the two ends of the suction cup air channel 212 are connected to the suction cup air inlet 213 and the adsorption hole 211 respectively, and the gas provided by the external gas source enters the suction cup air channel 212 through the suction cup air inlet 213 and flows out from the adsorption hole 211, thereby generating suction force on the wafer. Preferably, the suction cup air channel 212 forms a symmetrical branch structure, and the suction cup mechanism 21 has multiple adsorption holes 211, thereby generating a more balanced suction force on the wafer to prevent the wafer from slipping.

[0043] The clamping seat mechanism 12 is provided with a clamping seat air passage 124 connected to the clamping groove 123. One end of the clamping seat air passage 124 is connected to an external air source. The clamping seat mechanism 12 is used as an adapter to achieve the connection between the suction cup mechanism 21 and the external air source. When the suction cup mechanism 21 is clamped in the clamping groove 123, the other end of the clamping seat air passage 124 is connected to the suction cup air inlet 213 to meet the air demand of the suction cup mechanism 21. When the fork plate mechanism 22 is clamped in the clamping groove 123, the external air source can stop supplying air, which will not affect the clamping effect of the clamping groove 123.

[0044] The clamping seat mechanism 12 can be directly connected to an external air source. Of course, it can also be connected to an external air source through the first extension air channel 111 built into the extension arm mechanism 11, which is within the protection scope of the present application.

[0045] Specifically, the extension arm mechanism 11 is connected to the clamping seat mechanism 12, and the extension arm mechanism 11 is provided with a first extension air channel 111, one end of the first extension air channel 111 is connected to an external air source, and the other end is connected to a clamping seat air channel 124 of the clamping seat mechanism 12, and the other end of the clamping seat air channel 124 away from the first extension air channel 111 is connected to a suction cup air channel 212 of the suction cup mechanism 21. In this way, the first extension air channel 111 is connected to the suction cup mechanism 21 via the clamping seat air channel 124, providing an air source for the suction cup mechanism 21. This built-in air channel structure is stable and will not be affected by the movement of the manipulator.

[0046] The extension arm mechanism 11 can be realized by the following structure. The extension arm mechanism 11 includes a first extension plate 112 and a second extension plate 113. The first extension plate 112 and / or the second extension plate 113 are provided with an extension groove 114. The first extension plate 112 and the second extension plate 113 can be detachably connected to close the extension groove 114 to form a first extension airway 111. The extension groove 114 can be provided only on one of the first extension plate 112 and the second extension plate 113, or the first extension plate 112 and the second extension plate 113 are provided with the extension groove 114. The extension groove 114 is easy to process. The first extension airway 111 is formed by closing the extension groove 114. The processing technology is relatively simple, and the extension arm mechanism 11 can achieve any required length. One end of the first extension airway 111 is connected to an external gas source, and the other end is connected to the adsorption hole 211, so that the gas provided by the external gas source is provided to the suction cup mechanism 21. A first seal 115 is provided between the first extension plate 112 and the second extension plate 113 to seal the first extension air channel 111 to prevent air leakage due to loose sealing of the first extension air channel 111, thereby affecting the air outlet stability of the adsorption hole 211, thereby ensuring the reliability of the suction cup mechanism 21 in adsorbing the wafer.

[0047] In one embodiment, the extension groove 114 is provided in the first extension plate 112, further reducing the difficulty of processing; the extension groove 114 is extended along the length direction of the extension arm mechanism 11, so as to guide the gas from one end of the extension arm mechanism 11 to the other end. The first sealing member 115 is a first sealing ring, which surrounds the extension groove 114. A second extension air channel 1121 is also provided inside the first extension plate 112. One end of the second extension air channel 1121 is connected to the extension groove 114, and the other end extends to the surface of the first extension plate 112. The second extension air channel 1121 passes through the first extension plate 112, so as to be connected to the clamping seat air channel 124. In this way, the first sealing member 115 can form a surrounding seal on the extension groove 114, and the connection point between the first extension air channel 111 and the second extension air channel 1121 is also located within the surrounding range of the first sealing member 115. The air tightness of the first extension air channel 111 and the second extension air channel 1121 is good.

[0048] It should be noted that the second extension air channel 1121 may extend obliquely from the inside of the first extension plate 112 to the surface, or may be formed by two mutually vertically connected channels to extend to the surface of the first extension plate 112 .

[0049] The first extension plate 112 is provided with an air inlet 116, which is used to connect to an external air source, and is connected to the extension groove 114 and is located within the surrounding range of the first sealing member 115, so that the air inlet 116 and the first extension air channel 111 can be sealed. Of course, the air inlet 116 can also be provided on the second extension plate 113.

[0050] The extension arm mechanism 11 includes a plurality of first fasteners 117, which are detachably connected to the first extension plate 112 and the second extension plate 113, and are disposed around the outer periphery of the first seal 115. The first fasteners 117 may be screws for easy assembly and disassembly; the plurality of first fasteners 117 are disposed around the outer periphery of the first seal 115 and are spaced apart so that the first extension plate 112 and the second extension plate 113 tightly clamp the first seal 115 to prevent the first seal 115 from moving and affecting the sealing performance of the first extension airway 111. Preferably, a sealing groove 1131 is provided on the second extension plate 113, and the first seal 115 is embedded in the sealing groove 1131 to further improve the position stability of the first seal 115.

[0051] Embodiment 2

[0052] The second embodiment of the present invention also provides a semiconductor handling equipment, and the semiconductor handling equipment includes the semiconductor clamping device in the above-mentioned first embodiment. The semiconductor handling equipment also includes a manipulator, which is detachably connected to the semiconductor clamping device. The clamping assembly 2 of the semiconductor clamping device includes a suction cup mechanism 21 and a fork plate mechanism 22. The suction cup mechanism 21 can absorb the wafer from the top of the wafer by suction, and the fork plate mechanism 22 can lift the wafer from the bottom of the wafer. One of the suction cup mechanism 21 and the fork plate mechanism 22 is selectively detachably connected to the mounting support assembly 1, and the suction cup mechanism 21 or the fork plate mechanism 22 can be selected to pick up and place the wafer according to the working conditions of the process chamber. The suction cup mechanism 21, the fork plate mechanism 22 and the mounting support assembly 1 are detachably connected, which is convenient to use and can be replaced at any time to avoid extending the process processing time; the semiconductor handling equipment has good applicability, meets the process requirements of different process chambers, and reduces equipment costs.

[0053] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A semiconductor gripping device, characterized in that: The invention comprises a mounting support component (1) and a clamping component (2), wherein one end of the mounting support component (1) is detachably connected to a robot, and the clamping component (2) comprises a suction cup mechanism (21) and a fork plate mechanism (22), wherein the suction cup mechanism (21) is provided with a suction hole (211) connected to an external air source to generate suction, the suction cup mechanism (21) is capable of sucking a wafer, and the fork plate mechanism (22) is capable of lifting the wafer, and one of the suction cup mechanism (21) and the fork plate mechanism (22) is selectively detachably connected to the mounting support component (1).

2. The semiconductor gripping device according to claim 1, characterized in that: The mounting support assembly (1) comprises an extension arm mechanism (11) and a clamping seat mechanism (12); the extension arm mechanism (11) is extended in a horizontal direction; one end of the extension arm mechanism (11) is used for connecting to the manipulator, and the other end is detachably connected to the clamping seat mechanism (12); and the clamping seat mechanism (12) is used for connecting to the suction cup mechanism (21) or the fork plate mechanism (22).

3. The semiconductor clamping device according to claim 2, characterized in that: The clamping seat mechanism (12) comprises a first clamping plate (121) and a second clamping plate (122) which are detachably connected, and a clamping groove (123) having an opening is formed between the first clamping plate (121) and the second clamping plate (122), and the suction cup mechanism (21) or the fork plate mechanism (22) can be clamped in the clamping groove (123) via the opening.

4. The semiconductor clamping device according to claim 3, characterized in that: The suction cup mechanism (21) is provided with a suction cup air passage (212) and a suction cup air inlet (213), and the two ends of the suction cup air passage (212) are respectively connected to the suction cup air inlet (213) and the adsorption hole (211); the clamping seat mechanism (12) is provided with a clamping seat air passage (124) connected to the clamping groove (123), and one end of the clamping seat air passage (124) is used to connect to the external air source; when the suction cup mechanism (21) is clamped in the clamping groove (123), the other end of the clamping seat air passage (124) is connected to the suction cup air inlet (213).

5. The semiconductor gripping device according to claim 2, characterized in that: The extension arm mechanism (11) is provided with a first extension air channel (111), and the clamping seat mechanism (12) is provided with a clamping seat air channel (124); one end of the first extension air channel (111) is connected to the external air source, and the other end is connected to the clamping seat air channel (124); the other end of the clamping seat air channel (124) away from the first extension air channel (111) is connected to the suction cup air channel (212) of the suction cup mechanism (21).

6. The semiconductor gripping device according to claim 5, characterized in that: The extension arm mechanism (11) comprises a first extension plate (112) and a second extension plate (113); the first extension plate (112) and / or the second extension plate (113) are provided with an extension groove (114); the first extension plate (112) and the second extension plate (113) are detachably connected to close the extension groove (114) to form the first extension airway (111).

7. The semiconductor gripping device according to claim 6, characterized in that: A first sealing member (115) is provided between the first extension plate (112) and the second extension plate (113) to seal the first extension air passage (111).

8. The semiconductor gripping device according to claim 7, characterized in that: The extension groove (114) is opened on the first extension plate (112) and extends along the length direction of the extension arm mechanism (11); the first sealing member (115) is a first sealing ring to surround the extension groove (114); a second extension air channel (1121) is also opened inside the first extension plate (112); one end of the second extension air channel (1121) is connected to the extension groove (114), and the other end extends to the surface of the first extension plate (112); the second extension air channel (1121) passes through the first extension plate (112) to be connected to the clamping seat air channel (124).

9. The semiconductor gripping device according to claim 7, characterized in that: The first extension plate (112) or the second extension plate (113) is provided with an air inlet hole (116), the air inlet hole (116) is used to connect to the external air source, the air inlet hole (116) is connected to the extension groove (114), and is located on the inner side of the first sealing member (115); and / or, The extension arm mechanism (11) comprises a plurality of first fasteners (117), wherein the first fasteners (117) are detachably connected to the first extension plate (112) and the second extension plate (113), and the plurality of first fasteners (117) are arranged around the outer peripheral side of the first sealing member (115).

10. Semiconductor handling equipment, characterized in that It comprises the semiconductor clamping device as described in any one of claims 1 to 9, and the semiconductor handling equipment also includes a manipulator, and the manipulator is detachably connected to the semiconductor clamping device.

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