Electroplating hanger and electroplating device for two side edges of plate

Abstract

The utility model provides an electroplating hanger and an electroplating device for two side edges of a board, and relates to the technical field of electroplating process equipment, the hanger comprises a conducting layer for conducting current and a bearing layer for supporting the conducting layer; the hanger further comprises an upper section, a middle section and a lower section which are connected in sequence, the upper section is used for connecting a cathode bar, and the lower section is used for connecting a plate; and the connecting surface of the lower section and the plate is vertical to the central axis of the cathode bar. The upper section is connected with the cathode bar, the lower section is connected with the plate, the connecting face of the lower section and the plate is perpendicular to the central axis of the cathode bar by adjusting the direction of the lower section, the plate large face of the plate connected with the lower section is perpendicular to the central axis of the cathode bar, and the two side faces of the plate are further parallel to the central axis of the cathode bar. The electroplating hanger is arranged on the cathode bar, so that the two side surfaces of the plate connected with the hanger are respectively opposite to the two anode bars, and the technical problem of low electroplating efficiency caused by reworking due to insufficient thickness of a side electroplating layer in the electroplating process is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating process equipment, in particular to an electroplating device for both sides of a board. Background Art

[0002] The crystallizer copper plate is the core component of continuous casting. The crystallizer copper plate will produce wear during the continuous casting process, mainly on the working surface. However, with the application of online width adjustment technology, the two sides of the narrow copper plate of the crystallizer copper plate are also affected by wear and pressure. The two sides of the narrow copper plate must also be repaired. The repair mainly relies on electroplating. The previous electroplating method is to electroplate the working surface and the two sides at the same time. However, this electroplating method often results in: the working surface is plated to thickness, while the side coating thickness is insufficient, resulting in rework; or in order to make the side coating thick enough, the electroplating time has to be increased, and the electroplating time is too long, which not only sacrifices efficiency, but also causes the working surface to be electroplated too thick, resulting in a significant increase in cost.

[0003] In view of this, the present utility model is proposed. Utility Model Content

[0004] One of the purposes of the utility model is to provide a plating hanger for both sides of a board, so as to solve the technical problem that there is a lack of a hanger that can be used for plating both sides of a board in the prior art.

[0005] The second purpose of the utility model is to provide an electroplating device for both sides of a board to solve the technical problem in the prior art that the electroplating efficiency is low due to insufficient thickness of the electroplating layer on both sides of the board.

[0006] In order to achieve the above-mentioned purpose of the utility model, the following technical solutions are specially adopted:

[0007] In a first aspect, the utility model provides an electroplating rack for both sides of a board, the rack comprising a conductive layer for current conduction and a bearing layer for supporting the conductive layer;

[0008] The hanger also includes an upper section, a middle section and a lower section which are connected in sequence, the upper section is used to connect the cathode rod, and the lower section is used to connect the plate;

[0009] The connection surface of the lower section with the plate is perpendicular to the central axis of the cathode rod.

[0010] Furthermore, the conductive layer of the upper section is arranged opposite to the cathode rod, the conductive layer of the lower section is arranged opposite to the plate, and the conductive layers of the upper section, the middle section and the lower section are connected in sequence.

[0011] Furthermore, the middle section includes a longitudinal conductive support section for connecting to the upper section, a transverse conductive support section for connecting to the lower section, and a conductive support connecting section for connecting the longitudinal conductive support section and the transverse conductive support section.

[0012] Furthermore, the conductive layer of the longitudinal conductive support segment is arranged opposite to the conductive layer of the upper segment, the conductive layer of the transverse conductive support segment is arranged opposite to the conductive layer of the lower segment, and the conductive layer of the conductive support connecting segment is respectively connected to the conductive layers of the longitudinal conductive support segment and the transverse conductive support segment.

[0013] Furthermore, the plane where the conductive layer of the longitudinal conductive support segment is located is perpendicular to the plane where the conductive layer of the transverse conductive support segment is located.

[0014] Furthermore, the plane where the conductive layer of the conductive support connecting segment is located is perpendicular to the plane where the conductive layer of the longitudinal conductive support segment is located, and is parallel to the conductive layer of the transverse conductive support segment.

[0015] Furthermore, the transverse conductive support section is provided with long slot holes, the long slot holes are connected to the lower section by bolts, and the number of the long slot holes is the same as the number of the lower section;

[0016] The width of the long slot hole is greater than the height of the long slot hole;

[0017] The lower section is a vertically arranged long strip structure.

[0018] Furthermore, it also includes a hanging hook, which is arranged on the bearing layer of the upper section.

[0019] Furthermore, the conductive layer is a copper plate, and the bearing layer is a stainless steel plate.

[0020] In the second aspect, the utility model provides an electroplating device for both sides of a board, comprising an electroplating tank, a cathode rod arranged above the electroplating tank, two anode rods respectively arranged on both sides of the cathode rod, and a plurality of the above-mentioned electroplating hangers arranged on the cathode rod.

[0021] The utility model provides a plating hanger for both sides of a board. The hanger is divided into an upper section, a middle section and a lower section. The hanger can be connected to a cathode rod through the upper section and to a board through the lower section. The direction of the lower section is adjusted so that a connection surface of the lower section with the board is perpendicular to the central axis of the cathode rod, so that a large surface of the board connected to the lower section is perpendicular to the central axis of the cathode rod, and further two side surfaces of the board are parallel to the central axis of the cathode rod. Thus, a hanger that can be used for electroplating both sides of a board is provided.

[0022] On the other hand, a device for electroplating both sides of a board is provided. By arranging the above-mentioned electroplating hanger on the cathode rod, the two side surfaces of the board connected to the hanger can be respectively arranged opposite to the two anode rods, and the two side surfaces can be electroplated at the same time, thereby solving the technical problem of rework caused by insufficient thickness of the electroplating layer on the side during the electroplating process, resulting in low electroplating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the overall structure of an electroplating hanger on both sides of a board provided in Example 1 of the utility model;

[0025] Figure 2 for Figure 1 The enlarged structural diagram at A in the middle;

[0026] Figure 3 A schematic diagram of the longitudinal cross-sectional structure of an electroplating rack on both sides of a board provided in Example 1 of the utility model;

[0027] Figure 4 This is a schematic diagram of the overall structure of an electroplating device for both sides of a board provided in Example 2 of the utility model.

[0028] Icons: 1-Electroplating tank;

[0029] 10-board; 101-side of board; 102-large surface of board;

[0030] 2- cathode rod; 20- hanger; 201- conductive layer; 202- bearing layer; 21- upper section; 22- middle section; 221- longitudinal conductive support section; 222- conductive support connecting section; 223- transverse conductive support section; 2231- long slot hole; 23- lower section; 24- hanging hook;

[0031] 3- Anode rod. DETAILED DESCRIPTION

[0032] Unless otherwise defined herein, scientific and technical terms used in conjunction with the present invention shall have the meanings commonly understood by those of ordinary skill in the art. The meaning and scope of the terms should be clear, however, in the case of any potential ambiguity, the definitions provided herein take precedence over any dictionary or external definitions. In this application, unless otherwise stated, the use of "or" means "and / or". In addition, the use of the term "including" and other forms is non-limiting.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that the terms "proximal end", "distal end", "front end", "rear end", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] The terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0036] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a communication between the two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] On one hand, the utility model provides an electroplating rack for both sides of a board, wherein the rack 20 comprises a conductive layer 201 for current conduction and a bearing layer 202 for supporting the conductive layer 201;

[0038] The hanger 20 also includes an upper section 21, a middle section 22 and a lower section 23 which are connected in sequence, wherein the upper section 21 is used to connect the cathode rod 2, and the lower section 23 is used to connect the board 10;

[0039] The connection surface of the lower section 23 with the plate 10 is perpendicular to the central axis of the cathode rod 2 .

[0040] By dividing the hanger 20 into an upper section 21, a middle section 22 and a lower section 23, the hanger can be connected to the cathode rod 2 through the upper section 21 and to the board 10 through the lower section 23. By adjusting the direction of the lower section 23, the connection surface of the lower section 23 with the board 10 is perpendicular to the central axis of the cathode rod 2, and the large surface 102 of the board 10 connected to the lower section 23 is perpendicular to the central axis of the cathode rod 2. Further, the two side surfaces of the board are parallel to the central axis of the cathode rod, so that the two side surfaces of the board are respectively arranged opposite to the two anode rods, thereby providing a hanger that can be used for electroplating both sides of the board.

[0041] In some specific embodiments, the conductive layer 201 of the upper section 21 is disposed opposite to the cathode rod 2, the conductive layer 201 of the lower section 23 is disposed opposite to the plate 10, and the conductive layers 201 of the upper section 21, the middle section 22 and the lower section 23 are connected in sequence.

[0042] In some specific embodiments, the middle section 22 includes a longitudinal conductive support section 221 for connecting to the upper section 21 , a transverse conductive support section 223 for connecting to the lower section 23 , and a conductive support connecting section 222 for connecting the longitudinal conductive support section 221 with the transverse conductive support section 223 .

[0043] The longitudinal conductive support segment 221 and the transverse conductive support segment 223 are connected by the conductive support connecting segment 222, so as to set the directions of the longitudinal conductive support segment 221 and the transverse conductive support segment 223 respectively to adapt to the upper segment 21 and the lower segment 23 respectively, and make the planes where the upper segment 21 and the lower segment 23 are located perpendicular to each other in the vertical direction.

[0044] In some specific embodiments, the conductive layer 201 of the longitudinal conductive support segment 221 is arranged opposite to the conductive layer 201 of the upper segment 21, the conductive layer 201 of the transverse conductive support segment 223 is arranged opposite to the conductive layer 201 of the lower segment 23, and the conductive layer 201 of the conductive support connecting segment 222 is connected to the conductive layers 201 of the longitudinal conductive support segment 221 and the transverse conductive support segment 223, respectively.

[0045] In some specific embodiments, the planes where the upper section 21 and the lower section 23 are located are vertically perpendicular to each other, so that the plane where the conductive layer 201 of the longitudinal conductive support section 221 is located is perpendicular to the plane where the conductive layer 201 of the transverse conductive support section 223 is located. This ensures that the connection surface of the lower section 23 with the plate 10 is perpendicular to the central axis of the cathode rod 2.

[0046] In some specific embodiments, the plane where the conductive layer 201 of the conductive support connecting segment is located is perpendicular to the plane where the conductive layer 201 of the longitudinal conductive support segment 221 is located, and is parallel to the conductive layer 201 of the transverse conductive support segment 223 .

[0047] In order to make the connection surface between the lower section 23 and the plate 10 perpendicular to the central axis of the cathode rod 2, when the conductive layer 201 of the longitudinal conductive support section 221 and the conductive layer 201 of the transverse conductive support section 223 cannot directly contact or the contact surface is small, the conductive support connecting section 222 is used to connect the conductive layer 201 of the longitudinal conductive support section 221 and the conductive layer 201 of the transverse conductive support section 223 respectively to ensure smooth current conduction.

[0048] In some specific embodiments, the transverse conductive support segment 223 is provided with long slot holes 2231 , and the long slot holes 2231 are connected to the lower segment 23 via bolts, and the number of the long slot holes 2231 is the same as the number of the lower segment 23 .

[0049] The width of the long slot hole 2231 is greater than the height of the long slot hole 2231;

[0050] The lower section 23 is a vertically arranged long strip structure.

[0051] Since the width of the long slot hole 2231 is greater than the height of the long slot hole 2231 , the lower section 23 can be moved along the width direction of the long slot hole 2231 according to the position of the fixing screw hole of the board 10 , and the fixing position of the lower section 23 can be adjusted by lateral movement.

[0052] In some specific embodiments, a hanging hook 24 is further included, and the hanging hook 24 is disposed on the bearing layer 202 of the upper section 21 .

[0053] The provision of the hanging hook 24 facilitates the lifting of the hanger 20 .

[0054] In some specific implementations, the conductive layer 201 is a copper plate, and the bearing layer 202 is a stainless steel plate.

[0055] Specifically, the copper plate can be configured as a copper plate strip structure, and the stainless steel plate can be configured as a stainless steel plate strip structure.

[0056] According to another aspect of the utility model, there is also provided an electroplating device for both sides of a board, comprising an electroplating tank 1, a cathode rod 2 arranged above the electroplating tank 1, and two anode rods 3 respectively arranged on both sides of the cathode rod 2. The boards 10 and the hangers 20 are first combined together accordingly, and a plurality of combined boards 10 and hangers 20 are evenly hung on the cathode rod 2 by hooks of the hangers.

[0057] By setting the above-mentioned electroplating hanger on the cathode rod 2, the hanger 20 makes the large plane of the board 10 and the cathode rod 3 perpendicular to each other, and further makes the two side surfaces of the board 10 connected to the hanger 20 respectively arranged opposite to the two anode rods 3, so that the two side surfaces can be electroplated at the same time, saving labor and materials, and by setting the number of hangers 20, multiple boards 10 can be hung in one electroplating tank 1, so that multiple boards 10 that need to be electroplated can be electroplated at one time, which greatly improves the electroplating efficiency. The technical problem of low electroplating efficiency caused by rework due to insufficient thickness of the side electroplating layer during the electroplating process is solved.

[0058] An anode rod 3 is arranged on both sides above the electroplating tank 1 and parallel to the cathode rod 2. Anode titanium blue is hung under the anode rod 3. Anode material is contained in the anode titanium blue. The side edges 101 of the plate are respectively facing the anode titanium blue.

[0059] Specifically, 3 to 20 hangers can be hung on the cathode rod 2 to electroplate the side edge 101 of the board at the same time; preferably, 8 to 16 hangers can be hung to electroplate the side edge 101 of the board at the same time.

[0060] The technical solution of the utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0061] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0062] Example 1

[0063] Combination Figure 1 to Figure 3 To illustrate, a plating hanger for both sides of a board, the hanger 20 is composed of a double-layer material composite of a bearing layer 202 made of a stainless steel plate and a conductive layer 201 made of a copper plate. This composite can be spot welded, fixed by bolts, or a composite plate; the copper plate strips mainly play a role in current conduction, and the stainless steel plate strips mainly play a role in bearing capacity.

[0064] The hanger is divided into three parts: an upper section 21, a middle section 22, and a lower section 23. The top of the upper section 21 is folded into a semicircular cathode hook that matches the cathode rod 2, so that the conductive layer 201 of the upper section 21 is in relative contact with the cathode rod 2 to facilitate current conduction.

[0065] The middle section 22 is further divided into three parts: a longitudinal conductive support section 221, a conductive support connecting section 222 and a transverse conductive support section 223. The longitudinal conductive support section 221, the conductive support connecting section 222 and the transverse conductive support section 223 are fixedly connected by bolts. The longitudinal conductive support section 221 and the lower part of the upper section 21 are fastened to the contacting plate surface by bolts; the longitudinal conductive support section 221 and the transverse conductive support section 223 are perpendicular to each other from a top view, and the transverse conductive support section 223 is provided with a long slot hole 2231, which is fastened to the lower section 23 by bolts; the conductive support connecting section 222 and the longitudinal conductive support section 221 are at a right angle of 90° from a top view;

[0066] The lower section 23 is composed of two vertically parallel conductive bars composed of a double-layer material of stainless steel strips and copper strips, wherein the lower part of the lower section 23 is fixedly connected to a large surface 102 of the board 10 by bolts, and the lower section 23 is fixedly connected to the long slot hole 2231 on the horizontal conductive support section 223 by bolts, and can be fixed in the corresponding position in the width direction of the long slot hole 2231 according to the width of the fixing screw hole of the board 10.

[0067] A hanging hook 24 is provided on the bearing layer 202 of the upper section 21 of the hanger 20. The hanging hook 24 is formed by folding a stainless steel round bar and welded with a stainless steel strip. The hanging hook 24 is mainly used to facilitate the lifting of the hanger and the workpiece.

[0068] Example 2

[0069] Combination Figure 4 To illustrate, a plating device for both sides of a board includes a plating tank 1, a cathode rod 2, an anode rod 3 and a plating solution. Three boards 10 are respectively arranged on the cathode rod 2 by hanging three hangers 20.

[0070] The hanger 20 makes the large plane of the board 10 and the cathode rod 2 perpendicular to each other, and the cathode rod 2 is located in the middle position above the electroplating tank 1. The board 10 is connected to the cathode rod 2 conductive rod through the hanger 20. An anode rod 3 conductive rod is arranged on both sides above the electroplating tank 1 and parallel to the cathode rod 2 conductive rod. Anode titanium blue is hung under the anode rod 3, and anode material is contained in the anode titanium blue. The two board sides 101 are respectively opposite to the anode titanium blue on both sides.

[0071] In order to verify the electroplating efficiency after adopting the electroplating device, the electroplating of the side of the narrow copper plate of the crystallizer with an effective size of 0.5 mm was taken as an example.

[0072] The electroplating device provided by Example 2 containing the electroplating rack of Example 1 and the electroplating device containing a conventional electroplating rack in the prior art were respectively selected to carry out electroplating.

[0073] Among them, the electroplating device of the conventional electroplating rack in the prior art is different from that of Example 2 in that a conventional rack is used, and a copper plate is hung in the middle position of the cathode rod 2 by the conventional rack, and at this time, the large surface 102 of the copper plate to be electroplated faces one of the anode rods 3; the rack 20 of Example 2 is used to hang two copper plates on both sides of the copper plate hung by the conventional rack, and the two side edges 101 of the copper plate hung by the rack 20 face the anode rods 3 on both sides of the plating tank.

[0074] The results show that the electroplating time of the conventional electroplating rack in the prior art is 90 hours for electroplating the side edge 101 and the large surface 102 of the board, while the electroplating time of the electroplating device of Example 2 is only 60 hours.

[0075] The hanger 20 makes the two sides 101 of the plate to be electroplated face the anode rod 3 respectively, so that the electroplating speed of the side 101 of the plate becomes faster.

[0076] In order to improve the electroplating efficiency, the number of the racks 20 may be increased based on the second embodiment.

[0077] Specifically, for example, the number of the hangers 20 can be set to four, five, six, seven, eight, nine, ten, eleven or twelve, or any integer number of hangers 20 can be set according to actual electroplating requirements.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A plating rack for both sides of a board, characterized in that: The hanger (20) comprises a conductive layer (201) for current conduction and a bearing layer (202) for supporting the conductive layer (201); The hanger (20) further comprises an upper section (21), a middle section (22) and a lower section (23) which are connected in sequence, wherein the upper section (21) is used to connect the cathode rod (2), and the lower section (23) is used to connect the plate (10); The connection surface of the lower section (23) with the plate (10) is perpendicular to the central axis of the cathode rod (2).

2. The electroplating rack according to claim 1, characterized in that: The conductive layer (201) of the upper section (21) is arranged opposite to the cathode rod (2), the conductive layer (201) of the lower section (23) is arranged opposite to the plate (10), and the conductive layers (201) of the upper section (21), the middle section (22) and the lower section (23) are connected in sequence.

3. The electroplating rack according to claim 2, characterized in that: The middle section (22) comprises a longitudinal conductive support section (221) for connecting to the upper section (21), a transverse conductive support section (223) for connecting to the lower section (23), and a conductive support connecting section (222) for connecting the longitudinal conductive support section (221) and the transverse conductive support section (223).

4. The electroplating rack according to claim 3, characterized in that: The conductive layer (201) of the longitudinal conductive support segment (221) is arranged opposite to the conductive layer (201) of the upper segment (21), the conductive layer (201) of the transverse conductive support segment (223) is arranged opposite to the conductive layer (201) of the lower segment (23), and the conductive layer (201) of the conductive support connecting segment (222) is respectively connected to the conductive layers (201) of the longitudinal conductive support segment (221) and the transverse conductive support segment (223).

5. The electroplating rack according to claim 4, characterized in that: The plane where the conductive layer (201) of the longitudinal conductive support segment (221) is located is perpendicular to the plane where the conductive layer (201) of the transverse conductive support segment (223) is located.

6. The electroplating rack according to claim 5, characterized in that: The plane where the conductive layer (201) of the conductive support connecting section (222) is located is perpendicular to the plane where the conductive layer (201) of the longitudinal conductive support section (221) is located, and is parallel to the conductive layer (201) of the transverse conductive support section (223).

7. The electroplating rack according to claim 3, characterized in that: The transverse conductive support section (223) is provided with a long slot hole (2231), the long slot hole (2231) is connected to the lower section (23) by means of bolts, and the number of the long slot holes (2231) is the same as the number of the lower section (23); The width of the long slot hole (2231) is greater than the height of the slot hole (2231); The lower section (23) is a vertically arranged long strip structure.

8. The electroplating rack according to claim 1, characterized in that: It also comprises a hanging hook (24), wherein the hanging hook (24) is arranged on the bearing layer (202) of the upper section (21).

9. The electroplating rack according to any one of claims 1 to 8, characterized in that: The conducting layer (201) is a copper plate, and the bearing layer (202) is a stainless steel plate.

10. An electroplating device for both sides of a board, characterized in that: The invention comprises an electroplating tank (1), a cathode rod (2) arranged above the electroplating tank (1), two anode rods (3) respectively arranged on both sides of the cathode rod (2), and a plurality of electroplating racks according to any one of claims 1 to 9 arranged on the cathode rod (2).

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