Semiconductor silicon wafer detection device

Abstract

The utility model provides a semiconductor silicon wafer detection device, which relates to the technical field of semiconductor silicon wafers and comprises a detection device main body and a detection device driving body arranged at the upper end of the detection device main body. According to the semiconductor silicon wafer detection device, a bottom adjusting connecting column is arranged at the lower end of a detection device body, a shifting adjusting knob is arranged in the middle of the bottom adjusting connecting column, a middle connecting threaded column is arranged on the inner side face of the shifting adjusting knob, and a small level bar is arranged on the inner side, close to the top, of the middle connecting threaded column; the height of the corner where the bottom adjusting connecting column is located can be adjusted by rotating and shifting the adjusting knob according to the indication of the small level ruler, and the semiconductor silicon wafer detection device can be kept horizontal after adjustment; therefore, the phenomenon of inaccurate measurement structure caused by tiny displacement or rotation of the silicon wafer in the measurement process is effectively avoided, and the use practicability of the semiconductor silicon wafer detection device is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor silicon wafers, in particular to a semiconductor silicon wafer detection device. Background Art

[0002] Silicon wafers, also known as silicon wafers, are important materials for making integrated circuits. Integrated circuits and various semiconductor devices can be made by photolithography, ion implantation and other methods. Silicon wafers are sheet-like objects made of silicon, with diameters of 6 inches, 8 inches, 12 inches, 18 inches and other specifications. Monocrystalline silicon is a single crystal of silicon, which is a relatively active non-metallic element with a basically complete lattice structure. It has different properties in different directions and is a good semiconductor material. The semiconductor silicon wafer detection device is a device for detecting the thickness of semiconductor silicon wafers;

[0003] The existing application number is CN202022837853.4, which discloses a semiconductor silicon wafer detection device, including a detection device body, a mounting platform fixedly connected to the top of the detection device body, a groove is provided on the top of the mounting platform, a mounting shell is provided inside the groove, a silicon wafer body is movably connected inside the mounting shell, a top block is fixedly connected to the inner bottom wall of the groove, the top of the top block is movably connected to the bottom of the silicon wafer body, and two mounting frames are rotatably connected inside the mounting shell. The semiconductor silicon wafer detection device, by pushing two sets of plates to move relative to each other, causes the two sets of plates to squeeze the two connecting plates respectively, causes the two springs to be compressed, and the opposite ends of the two rubber fixing columns are respectively against the left and right sides of the silicon wafer body, and the top block of the inner bottom wall of the groove pushes the silicon wafer body to the inner top wall of the mounting shell, thereby fixing the silicon wafer body in the mounting shell, thereby preventing the silicon wafer body from shifting.

[0004] However, when the surface on which the semiconductor silicon wafer detection device is placed is relatively uneven, the silicon wafer may undergo slight displacement or rotation during the measurement process, which may lead to inaccurate measurement results. The utility model improves the above-mentioned problem and specifically relates to a semiconductor silicon wafer detection device that can detect whether the placement surface is flat and can be adjusted at the same time. Utility Model Content

[0005] Based on this, it is necessary to provide a semiconductor silicon wafer detection device to address the problem that when the surface on which the semiconductor silicon wafer detection device is placed is relatively uneven, the silicon wafer may undergo slight displacement or rotation during the measurement process, which may lead to inaccurate measurement results.

[0006] The utility model provides a semiconductor silicon wafer detection device, comprising: a detection device main body and a detection device driving body arranged on the upper end of the detection device main body.

[0007] A pressing probe is provided on the front side of the driving body of the detection device;

[0008] A testing table is arranged on the lower side of the pressing probe.

[0009] The above-mentioned semiconductor silicon wafer detection device, the lower end of the detection device body is provided with a bottom adjustment connecting column, the middle of the bottom adjustment connecting column is provided with a toggle adjustment knob, the inner side of the toggle adjustment knob is provided with a central connecting threaded column, the inner side of the central connecting threaded column near the top is provided with a small level ruler, the inner side of the small level ruler is provided with an extrusion connecting spring, the side of the small level ruler is provided with a limit connection block, the outer side of the upper limit connection block of the detection device body is in contact with a press button, and the outer side of the small level ruler on the detection device body is provided with a plug-in buckle groove, and the height of the corner where the bottom adjustment connecting column is located can be adjusted by rotating the toggle adjustment knob according to the indication of the small level ruler.

[0010] In one of the embodiments, the outer side surface of the toggle adjustment knob is provided with vertical lines, and the inner side surface of the toggle adjustment knob is provided with internal threads that match the central connecting threaded column.

[0011] In one of the embodiments, a bottom rubber surface is provided at the bottom of the bottom adjustable connecting column, and the bottom rubber surface is installed and connected to the bottom side surface of the bottom adjustable connecting column by adhesive.

[0012] In one of the embodiments, a display screen is disposed in the middle of the front side of the detection device body, and a protective film is attached to the front side of the display screen.

[0013] In one of the embodiments, a control adjustment button is provided on the side of the display screen, and the control adjustment button is used to operate and control the main body of the detection device.

[0014] In one of the embodiments, a status display light is arranged in the middle of the control adjustment button, and the status display light has three status color lights of red, green and yellow.

[0015] In one of the embodiments, a breathable mesh is provided on the side of the detection device body, the breathable mesh and the detection device body are an integrated structure, and the breathable mesh is a through-hole strip structure formed by the detection device body structure.

[0016] Compared with the prior art, the present invention provides a semiconductor silicon wafer detection device having the following features:

[0017] Beneficial effects:

[0018] In a semiconductor silicon wafer detection device, a bottom adjustment connecting column is provided at the lower end of the detection device body, a toggle adjustment knob is provided in the middle of the bottom adjustment connecting column, a middle connection threaded column is provided on the inner side of the toggle adjustment knob, a small level is provided on the inner side of the middle connection threaded column near the top, an extrusion connection spring is provided on the inner side of the small level, a limit connection block is provided on the side of the small level, a press button is provided on the outer side of the upper limit connection block of the detection device body, and a plug-in buckle groove is provided on the outer side of the small level on the detection device body. The height of the corner where the bottom adjustment connecting column is located can be adjusted by turning the toggle adjustment knob according to the indication of the small level. After the adjustment, the semiconductor silicon wafer detection device can be kept level, thereby effectively avoiding the phenomenon that the silicon wafer may be slightly displaced or rotated during the measurement process, resulting in inaccurate measurement structure, thereby effectively improving the practicality of the semiconductor silicon wafer detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of the semiconductor silicon wafer detection device of the utility model;

[0020] Figure 2 This is a schematic diagram of the enlarged structure of the bottom-mounted adjustment connection column of the semiconductor silicon wafer detection device of the utility model;

[0021] Figure 3 The utility model is a schematic diagram of the cross-sectional structure of the bottom-mounted adjustment connection column of the semiconductor silicon wafer detection device.

[0022] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0023] 1. Detection device body; 2. Detection device driving body; 3. Press down probe; 4. Place the detection table; 5. Control adjustment button; 6. Status display light; 7. Display screen; 8. Breathable mesh; 9. Bottom adjustment connecting column; 10. Plug-in buckle slot; 11. Press button; 12. Turn the adjustment knob; 13. Bottom rubber surface; 14. Small level ruler; 15. Device body inside the ruler; 16. Limit connection block; 17. Extrusion connection spring; 18. Center connection thread column. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the specific details described below are only part of the embodiments of the utility model, and the utility model can also be implemented in many other embodiments different from those described here. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the protection scope of the utility model.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Please refer to Figure 1 The utility model provides a semiconductor silicon wafer detection device, including a detection device body 1 and a detection device driving body 2 arranged at the upper end of the detection device body 1. A pressing probe 3 is arranged on the front side of the detection device driving body 2; a detection table 4 is arranged on the lower side of the pressing probe 3; a bottom adjustment connecting column 9 is arranged at the lower end of the detection device body 1, a toggle adjustment knob 12 is arranged in the middle of the bottom adjustment connecting column 9, a middle connection threaded column 18 is arranged on the inner side of the toggle adjustment knob 12, a small level 14 is arranged on the inner side of the middle connection threaded column 18 near the top, a compression connection spring 17 is arranged on the inner side of the small level 14, and a limited position connection block 16 is arranged on the side of the small level 14. The outer side of the upper limit connection block 16 is in contact with a push button 11, and an inserting and buckling groove 10 is provided on the outer side of the small level 14 on the detection device body 1. The adjustment knob 12 can be turned according to the indication of the small level 14 to adjust the height of the corner where the bottom adjustment connection column 9 is located. After adjustment, the semiconductor silicon wafer detection device can be kept horizontal, thereby effectively avoiding the phenomenon that the measurement structure may be inaccurate due to slight displacement or rotation of the silicon wafer during the measurement process, thereby effectively improving the practicality of the semiconductor silicon wafer detection device.

[0027] like Figure 2 and Figure 3 As shown, the outer side surface of the toggle adjustment knob 12 is provided with vertical lines, and the inner side surface of the toggle adjustment knob 12 is provided with an internal thread that matches the central connecting threaded column 18. The vertical lines on the outer side of the toggle adjustment knob 12 can increase the friction between the user's hand and the toggle adjustment knob 12 to avoid relative sliding between the user's hand and the toggle adjustment knob 12, so that the user can smoothly turn the toggle adjustment knob 12.

[0028] like Figure 2 and Figure 3As shown, a bottom rubber surface 13 is provided at the bottom of the bottom adjusting connecting column 9. The bottom rubber surface 13 is installed and connected to the bottom side surface of the bottom adjusting connecting column 9 by adhesive. The bottom rubber surface 13 can increase the friction between the bottom adjusting connecting column 9 and the placement surface, thereby making the placement of the bottom adjusting connecting column 9 more stable.

[0029] like Figure 1 As shown, a display screen 7 is arranged in the middle of the front side of the detection device body 1, and a protective film is attached to the front side of the display screen 7. The display screen 7 can display the data more intuitively, so as to facilitate the user to observe the experimental data.

[0030] like Figure 1 As shown, a control adjustment button 5 is provided on the side of the display screen 7, and the control adjustment button 5 is used to operate and control the detection device body 1. A status display light 6 is provided in the middle of the control adjustment button 5. The status display light 6 has three status color lights of red, green and yellow respectively. The control adjustment button 5 is used to operate and control the detection device body 1. The status display light 6 can enable the user to know the working status of the detection device body 1 more clearly, so that adjustments can be made quickly.

[0031] like Figure 1 As shown, a breathable mesh 8 is provided on the side of the detection device body 1. The breathable mesh 8 and the detection device body 1 are an integrated structure. The breathable mesh 8 is a through-hole strip structure formed by the structure of the detection device body 1. The breathable mesh 8 can accelerate the replacement of air inside and outside the detection device body 1, thereby achieving better heat dissipation inside the detection device body 1 and avoiding the phenomenon of accelerated aging of internal components of the detection device body 1 due to excessive heat.

[0032] During operation, the semiconductor silicon wafer is placed on the detection table 4, and the pressure probe 3 is lowered by controlling the adjustment button 5, and the pressure probe 3 lands on the sample; the thickness of the material is measured by the pressure generated by the two contact surfaces and the values ​​measured by the sensor of the two contact areas.

[0033] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several deformations, substitutions and improvements can be made without departing from the concept of the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be based on the claims.

Claims

1. A semiconductor silicon wafer detection device, characterized in that: include: A detection device body (1) and a detection device driving body (2) arranged at the upper end of the detection device body (1); a pressing probe (3) is arranged on the front side of the detection device driving body (2); and a detection table (4) is arranged on the lower side of the pressing probe (3); The lower end of the detection device body (1) is provided with a bottom adjustment connecting column (9), the middle of the bottom adjustment connecting column (9) is provided with a toggle adjustment knob (12), the inner side of the toggle adjustment knob (12) is provided with a central connection threaded column (18), the inner side of the central connection threaded column (18) near the top is provided with a small level (14), the inner side of the small level (14) is provided with a compression connection spring (17), the side of the small level (14) is provided with a limit connection block (16), the outer side of the upper limit connection block (16) of the detection device body (1) contacts with a pressing button (11), and the outer side of the small level (14) on the detection device body (1) is provided with a plug-in buckle groove (10), and the toggle adjustment knob (12) is rotated according to the instruction of the small level (14) to adjust the height of the corner where the bottom adjustment connecting column (9) is located.

2. The semiconductor silicon wafer detection device according to claim 1, characterized in that: The outer side surface of the toggle adjustment knob (12) is provided with vertical lines, and the inner side surface of the toggle adjustment knob (12) is provided with internal threads that match the centrally located connecting threaded column (18).

3. The semiconductor silicon wafer detection device according to claim 1, characterized in that: A bottom rubber surface (13) is provided at the bottom of the bottom adjustable connecting column (9), and the bottom rubber surface (13) is installed and connected to the bottom side surface of the bottom adjustable connecting column (9) by means of adhesive.

4. The semiconductor silicon wafer detection device according to claim 1, characterized in that: The detection device body (1) is provided with a display screen (7), and a protective film is attached to the front side of the display screen (7).

5. The semiconductor silicon wafer detection device according to claim 1, characterized in that: A control adjustment button (5) is arranged on the side of the display screen (7), and the control adjustment button (5) is used to operate and control the detection device body (1).

6. The semiconductor silicon wafer detection device according to claim 5, characterized in that: A status display light (6) is arranged in the middle of the control adjustment button (5), and the status display light (6) has three status color lights: red, green and yellow.

7. The semiconductor silicon wafer detection device according to claim 1, characterized in that: A breathable mesh (8) is provided on the side of the detection device body (1); the breathable mesh (8) and the detection device body (1) are an integrated structure; the breathable mesh (8) is a through-hole strip structure formed by the detection device body (1) structure.

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