Semi-open smart card reader for fault injection and side channel analysis

Abstract

The utility model provides a semi-open intelligent card reader for fault injection and side channel analysis, and an injection assembly is arranged on a mainboard and is exposed outside the semi-open intelligent card reader; the plurality of monitoring analysis interfaces are arranged on one side of the mainboard; the mainboard is integrally formed by a top layer device, a bottom layer device and a PCB, the top layer device and the PCB are respectively provided with a fault injection window, and the fault injection windows can expose an integrated circuit of the intelligent card. The method has the advantages that the fault injection window is arranged, so that the fault injection operation can be implemented under the condition of close proximity or contact with the integrated circuit of the intelligent card, and the efficiency of the evaluation process and the accuracy of the evaluation result are improved; various safety evaluation technologies, including laser, electromagnetic pulse, voltage glitch, clock fault injection and side channel analysis, are supported, and are transmitted through corresponding monitoring interfaces; card insertion ports are formed in the top layer device and the bottom layer device, so that the front face and the back face of an integrated circuit of the intelligent card can be attacked through laser fault injection and electromagnetic pulse fault injection.

Description

Technical Field

[0001] The utility model relates to the field of integrated circuits and information security, and in particular to a semi-open smart card reader for fault injection and side channel analysis. Background Art

[0002] As a carrier of information, semiconductor integrated circuits play a vital role in ensuring the security of information systems. Therefore, it is often necessary to use a variety of technical means to evaluate the security of integrated circuits, including static security assessment and dynamic security assessment. Dynamic security assessment refers to the assessment of the security of integrated circuits during their operation.

[0003] Smart cards are a common type of integrated circuits, such as bank cards, embedded systems, mobile terminals, etc., and are usually used as carriers of identity authentication and encryption and decryption functions in various application environments. In order to evaluate the dynamic security of smart cards, smart card readers can be used to interact with them, but traditional smart card readers have the following problems:

[0004] 1. It is difficult to get close to or touch the integrated circuit of the smart card, which makes it impossible to implement security assessment technical means or weakens the implementation effect.

[0005] 2. The functional structure is single. If you need to implement multiple security assessment technologies on the same card reader, such as laser fault injection, electromagnetic pulse fault injection, voltage glitch fault injection, clock fault injection, side channel analysis, etc., you need to replace different devices to implement different security assessments.

[0006] Therefore, it is necessary to design a new type of card reader for smart card security assessment to improve the efficiency and accuracy of security assessment. Utility Model Content

[0007] The utility model provides a semi-open smart card reader for fault injection and side channel analysis, which is used to simplify the steps of existing smart card security assessment and improve the efficiency and accuracy of security assessment.

[0008] In order to achieve the above-mentioned purpose, the technical solution of the utility model provides a semi-open smart card reader for fault injection and side channel analysis, which includes: a main board, an injection component, a monitoring and analysis interface and a fault injection window. The injection component is arranged on the main board and exposed outside the semi-open smart card reader; a plurality of monitoring and analysis interfaces are arranged on one side of the main board; the main board includes a top-layer device, a bottom-layer device and a PCB board, which are integrally formed, and a fault injection window is arranged on each of the top-layer device and the PCB board, and the fault injection window can expose the integrated circuit of the smart card to the outside.

[0009] As a preferred embodiment of the above technical solution, preferably, the top layer device and the bottom layer device are mirror-imaged on both sides of the PCB board.

[0010] As a preferred embodiment of the above technical solution, preferably, the top component and the bottom component each have a card insertion port.

[0011] As a preferred embodiment of the above technical solution, preferably, the injection assembly includes at least one pair of injection contacts and at least one injection needle seat.

[0012] As a preferred embodiment of the above technical solution, it is preferable to include an upper cover, which covers the communication interface, the card reader chip and the current detection circuit, so that the upper surface of the mainboard is half-enclosed and the injection component is exposed.

[0013] As a preferred embodiment of the above technical solution, it is preferable to include a lower cover corresponding to the upper cover, and the lower cover is provided with through holes matching the top layer device and the bottom layer device.

[0014] The technical solution of the utility model provides a semi-open smart card reader for fault injection and side channel analysis, wherein the injection component is arranged on a main board and exposed outside the semi-open smart card reader; a plurality of monitoring and analysis interfaces are arranged on one side of the main board; the main board is integrally formed by a top-layer device, a bottom-layer device and a PCB board, and a fault injection window is respectively arranged on the top-layer device and the PCB board, and the fault injection window can expose the integrated circuit of the smart card to the outside.

[0015] The advantages of the utility model are:

[0016] 1. Setting a fault injection window enables the implementation of fault injection operations in close proximity or contact with the integrated circuit of the smart card, thereby improving the efficiency of the evaluation process and the accuracy of the evaluation results.

[0017] 2. Support multiple safety assessment technologies, including laser fault injection, electromagnetic pulse fault injection, voltage glitch fault injection, clock fault injection, side channel analysis and transmit through the corresponding monitoring interface.

[0018] 3. Card insertion ports are set on both the top-level device and the bottom-level device. There are circuits in the device that match the PCB device so that laser fault injection and electromagnetic pulse fault injection can attack the front and back of the integrated circuit of the smart card. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of a semi-open smart card reader for fault injection and side channel analysis provided by the utility model;

[0021] Figure 2 for Figure 1 A schematic diagram of the structure of the main board in the structure shown;

[0022] Figure 3 Based on Figure 1 and Figure 2 Module schematic of the structure shown. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] The technical solution of the semi-open smart card reader for fault injection and side channel analysis provided by the utility model is now described in combination with the structure. Figure 1 As shown, it includes: an injection component composed of an injection contact 212 and an injection needle seat 213, a main board composed of a bottom device 209, a top device 210 and a PCB board 214, a monitoring and analysis interface, a fault injection window (fault injection window 208 and fault injection window 211), an upper cover 201, and a lower cover 202.

[0025] The injection contact 212 and the injection needle holder 213 are adjacently arranged on the PCB board 214. When the upper cover 201 and the lower cover 202 are buckled, the injection point and the injection needle holder 213 are exposed outside the cover body, which is convenient for connecting with an external fault injection probe. The injection contact 212 is a pair of gold-plated contacts, connected to the voltage glitch fault injector in a top pin manner, and is used to inject voltage glitch into the integrated circuit of the smart card inserted into the top device 210 or the bottom device 209. The injection needle holder 213 is a group of gold-plated needle holders, connected to the voltage glitch fault injector in a plug-in manner, and is used to inject voltage glitch into the integrated circuit of the smart card.

[0026] Several monitoring and analysis interfaces are provided on one side of the PCB board 214 for plugging in monitoring peripherals, and the monitoring and analysis interfaces at least include: an SMB interface 203 for transmitting and monitoring RST signals, an SMB interface 204 for transmitting and monitoring VCC signals, an SMB interface 205 for transmitting and monitoring CLK signals, and an SMB interface 206 for transmitting and monitoring IO signals, and real-time monitoring of each signal. The SMB interface 207 for user transmission side channel power consumption analysis can output the power consumption waveform of the integrated circuit of the currently tested smart card for side channel analysis.

[0027] The bottom device 209 and the top device 210 are arranged on the other side of the PCB board 214, and the circuits matching the PCB devices are pre-arranged in the two. The fault injection window 211 of the top device 210 is opened in the upper surface PCB of the top device 210, and the fault injection window 208 of the bottom device 209 is opened on the PCB board 214. The position of the fault injection window corresponds to the position of the integrated circuit of the smart card after the bottom device 209 and / or the top device 210 are inserted, so that the integrated circuit of the smart card is exposed.

[0028] like Figure 1 As shown, the top component 210 and the bottom component 209 are mirror-imaged on the front and back of the PCB board 214, respectively. They have corresponding fault injection windows 208 and fault injection windows 211. The fault injection windows 208 and the fault injection windows 211 can expose the front of the integrated circuit of the smart card inserted into the bottom component 209 and the top component 210 to the outside, thereby achieving the purpose of performing fault injection operation by approaching or contacting the smart card integrated circuit at a close distance, thereby improving the efficiency and accuracy of laser fault injection and electromagnetic pulse fault injection.

[0029] like Figure 1 As shown, the technical solution is composed of an upper cover 201 and a lower cover 202 to form a semi-open configuration, exposing the injection assembly, top-layer device 210, part of the bottom-layer device 209, fault injection window 208 and fault injection window 211 on the PCB board 214 to the outside, and protecting the remaining electronic components and circuits from external interference such as electromagnetic pulses. Specifically, the electronic components and circuits at least include communication interfaces (USB, RS232, Ethernet interfaces), card reader chips, and current detection circuits protected in the upper cover 201.

[0030] The lower cover 202 is provided with through holes matching the top component 210 and the bottom component 209, and is used to insert the smart card into the top component 210 and the bottom component 209. The lower cover 202 matches the upper cover 201, and the two can be buckled together to form a smart card. Figure 1 Sample shown.

[0031] The utility model is now described in conjunction with specific usage:

[0032] Communication interface 101 ( Figure 2 ) is an interface for the utility model to communicate with the application end, and its function is to provide an interactive channel between the application end and the card reader chipset 102. The communication interface 101 can be implemented by USB, RS232, Ethernet interface, etc.

[0033] Insert the smart card to be tested into the top device 104 or the bottom device 105. The top device 104 and the bottom device 105 are two identical electronic devices with card reader functions but with mirror images of the front and back. Both the top device 104 and the bottom device 105 have circuits matching the PCB device. The card reader chipset 102 can insert the smart card into one of them to establish communication that complies with the ISO7816 electrical specification and protocol specification, thereby performing identity authentication and encryption and decryption operations, etc. The mirrored top device and bottom device enable laser fault injection and electromagnetic pulse fault injection to attack the front and back of the integrated circuit of the smart card.

[0034] The card reader chipset 102 provides ISO7816 protocol conversion and physical layer electrical signal driving functions, converting the data and instructions of the application end into data packets and commands that comply with ISO7816 electrical specifications and protocol specifications. The ISO7816 signals generated by the card reader chipset 102 (using MH1903S or TDA8024, etc.) include VCC, RST, IO, CLK, and are connected to the monitoring interface 103, the top device 104, the bottom device 105, and the injection contact 106 ( Figure 1 212, 213), and the current detection circuit 107 are connected.

[0035] Monitoring interface 103 ( Figure 1 The SMB interfaces 203-206) are connected to ISO7816 signals (VCC, RST, IO, CLK), and provide dedicated monitoring interfaces for VCC, RST, IO, and CLK to facilitate observation of signal waveforms.

[0036] The injection contact 106 consists of a positive contact and a negative contact, and is used to inject a voltage spike into the integrated circuit of the smart card.

[0037] The current detection circuit 107 (which may use an operational amplifier) ​​is used to detect the operating current of the integrated circuit of the smart card, and convert it into a voltage signal, and output it to the side channel power consumption analysis interface 108 .

[0038] Side channel power consumption analysis interface 108 ( Figure 1 The SMB interface 207 is used to provide the power consumption waveform to the oscilloscope. After being collected by the oscilloscope, it can be used for subsequent side channel power consumption analysis, so that the staff can evaluate the integrated circuit's ability to resist side channel attacks.

[0039] Based on the above structure and implementation process, the utility model reasonably designs the arrangement of electronic components so that the semi-open smart card reader can support a variety of security assessment technologies, including laser fault injection, electromagnetic pulse fault injection, voltage glitch fault injection, clock fault injection, side channel analysis, etc., and can approach or contact the integrated circuit of the smart card at close range, thereby improving the efficiency of the assessment process and the accuracy of the assessment results.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A semi-open smart card reader for fault injection and side-channel analysis, characterized in that It includes: mainboard, injection components, monitoring and analysis interface and fault injection window. The injection assembly is arranged on the main board and exposed outside the semi-open smart card reader; A plurality of monitoring and analysis interfaces are arranged on one side of the main board; The main board includes a top-layer device, a bottom-layer device and a PCB board, which are integrally formed. The top-layer device and the PCB board are each provided with a fault injection window, and the fault injection window can expose the integrated circuit of the smart card to the outside.

2. The semi-open smart card reader according to claim 1, characterized in that: The top layer device and the bottom layer device are mirror-imaged and arranged on two sides of the PCB board.

3. The semi-open smart card reader according to claim 2, characterized in that: The top layer device and the bottom layer device each have a card insertion port.

4. The semi-open smart card reader according to claim 1, characterized in that: The injection assembly includes at least one pair of injection contacts and at least one injection needle seat.

5. The semi-open smart card reader according to claim 1, characterized in that: It comprises an upper cover, which covers the communication interface, the card reader chip and the current detection circuit, so that the upper surface of the mainboard is half-surrounded and the injection component is exposed.

6. The semi-open smart card reader according to claim 5, characterized in that: It comprises a lower cover corresponding to the upper cover, wherein the lower cover is provided with through holes matching the top layer device and the bottom layer device.

Images