Chip receiving device for semiconductor chip

Abstract

The utility model provides a wafer splicing device for a semiconductor wafer. The wafer splicing device comprises a bearing mechanism, a driving mechanism, a horizontal state mechanism and an inclined state mechanism, the bearing mechanism comprises a movable material plate, the bearing mechanism comprises a first position and a second position, when the bearing mechanism is located at the first position, the material plate is in a horizontal state, and when the bearing mechanism is located at the second position, the material plate is in an inclined state; the driving mechanism is connected to the bearing mechanism and drives the bearing mechanism to move between a first position and a second position; the horizontal state mechanism is used for enabling the material plate to be in a horizontal state when the bearing mechanism is in the first position; the inclined state mechanism is used for enabling the material plate to be in an inclined state when the bearing mechanism is located at the second position. The horizontal state and the inclined state of the material plate are switched through position switching of the base, automatic alignment and arrangement of the semiconductor wafers are achieved, and meanwhile the grabbing convenience of the semiconductor wafers is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor wafer sorting equipment, and in particular to a wafer splicing device for semiconductor wafers. Background Art

[0002] In traditional silicon wafer sorting machines, after the silicon wafers complete the detection unit, they will be graded according to the results output by the program, and then transported to a material box of a specified grade. When the number of silicon wafers in the material box reaches the specified number, the robot will complete the collection and transportation of the stack of silicon wafers.

[0003] In the existing silicon wafer sorting machine, in order to avoid uneven silicon wafer dropping and sliding between the upper and lower silicon wafers, four retaining edges are arranged around the bottom plate of the material box to minimize the sliding range of the silicon wafers, so as to ensure that the stack of silicon wafers in each material box is neat on all sides and finally grabbed by the robot.

[0004] Although this material box structure can ensure that the silicon wafer is flush on all sides, the gap between the silicon wafer and the rib is small. When taking the material, the silicon wafer is easily scratched by the rib, thereby damaging the originally intact silicon wafer. Utility Model Content

[0005] In order to solve the above problems, the present application provides a wafer splicing device for semiconductor wafers, which can receive and organize semiconductor wafers and improve the convenience of picking up semiconductor wafers.

[0006] The present application provides a chip splicing device for semiconductor wafers, which includes a carrying mechanism, a driving mechanism, a horizontal state mechanism and an inclined state mechanism; the carrying mechanism includes a movable material plate, the carrying mechanism carries the semiconductor wafer through the material plate, the carrying mechanism includes a first position and a second position, when the carrying mechanism is in the first position, the material plate is in a horizontal state arranged horizontally, and when the carrying mechanism is in the second position, the material plate is in an inclined state arranged inclined relative to the horizontal plane; the driving mechanism is connected to the carrying mechanism, and the driving mechanism is used to drive the carrying mechanism to move between the first position and the second position; the horizontal state mechanism is used to make the material plate in a horizontal state when the carrying mechanism is in the first position, and the top of the horizontal state mechanism is arranged flush with the bottom of the material plate when it is in the horizontal state; when the material plate is in the horizontal state, at least part of the horizontal state mechanism abuts against the bottom of the material plate; the inclined state mechanism is used to make the material plate in an inclined state when the carrying mechanism is in the second position; at least part of the inclined state mechanism is arranged higher than the bottom of the material plate when it is in the horizontal state, and when the material plate is in the inclined state, at least part of the inclined state mechanism abuts against the bottom of the material plate.

[0007] Furthermore, the tilting state mechanism also includes a first support member and a second support member for supporting the material sheet when the material sheet is in a tilted state, the top of the first support member is set higher than the bottom of the material sheet when it is in a horizontal state, the top of the second support member is set in an inclined surface, and the first support member and the second support member are respectively arranged on both sides of the driving mechanism.

[0008] Furthermore, the horizontal state component includes a third support member and a fourth support member for supporting the material sheet when the material sheet is in a horizontal state, the top of the third support member is arranged flush with the bottom of the material sheet when it is in a horizontal state, the top of the fourth support member is arranged flush with the bottom of the material sheet when it is in a horizontal state, and the third support member and the fourth support member are respectively arranged on both sides of the driving mechanism.

[0009] Furthermore, the supporting mechanism also includes a base, the driving mechanism is connected to the base, and the material plate is movably connected to the base; the tilting state mechanism includes a first support member and a fifth support member, the top of the first support member is higher than the bottom of the material plate when it is in a horizontal state, the fifth support member is connected to the base, the fifth support member is arranged between the base and the material plate, and the top of the fifth support member is arranged in an inclined surface.

[0010] Furthermore, the horizontal state mechanism includes a sixth support member and an elastic member, the top of the sixth support member is arranged flush with the bottom of the material plate when it is in a horizontal state, the sixth support member is connected to the base, the sixth support member is arranged between the base and the material plate, the top of the sixth support member is arranged horizontally, one end of the elastic member is connected to the bottom of the material plate, and the other end of the elastic member is connected to the first support member or the base.

[0011] Further, the supporting mechanism includes a baffle assembly capable of supporting the semiconductor wafer when the material plate is in a tilted state, the baffle assembly includes a first baffle and a second baffle, the material plate includes a first side edge and a second side edge adjacent to the first side edge, the first baffle is connected to the first side edge, and the second baffle is connected to the second side edge.

[0012] Furthermore, the baffle assembly consists of a first baffle and a second baffle.

[0013] Furthermore, a first adjustment portion is provided on the first side, and the first baffle is slidably connected to the first adjustment portion; a second adjustment portion is provided on the second side, and the second baffle is slidably connected to the second adjustment portion.

[0014] Furthermore, the material plate is also provided with a guide member, which is arranged on a side of the material plate close to the horizontal state mechanism and / or the inclined state mechanism.

[0015] Furthermore, the supporting mechanism also includes a base, which is movably connected to the material plate, and the driving mechanism includes a cylinder for driving the base and a guide rail for controlling the movement direction of the base, the cylinder is connected to the base, and the base is slidably connected to the guide rail.

[0016] The wafer splicing device of the present application is provided with a driving mechanism, an inclined state mechanism and a horizontal state mechanism, and can enable the supporting mechanism to switch between a horizontal state in a horizontal setting and an inclined state in an inclined position through position conversion under the action of the driving mechanism, thereby realizing automatic alignment and sorting of semiconductor wafers, and at the same time improving the convenience of picking up semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the splicing device in the first embodiment of the present application;

[0018] Figure 2 This is a schematic diagram of the side structure of a carrying mechanism in one embodiment of the present application;

[0019] Figure 3 This is a structural schematic diagram of the first embodiment of the present application in which the splicing device is in an inclined state;

[0020] Figure 4 This is a schematic structural diagram of a splicing device in a second embodiment of the present application;

[0021] Figure 5 This is a structural schematic diagram of a supporting mechanism in an inclined state in one embodiment of the present application;

[0022] Figure 6 This is a structural schematic diagram of a carrying mechanism in a horizontal state in one embodiment of the present application;

[0023] Figure 7 This is a schematic diagram of the structure of a material plate in one embodiment of the present application;

[0024] Figure 8 It is a schematic structural diagram of a splicing device in the third embodiment of the present application.

[0025] In the figure: a splicing device 100, a carrying mechanism 11, a base 111, a material plate 112, a first side 1121, a second side 1122, a first adjusting portion 1123, a second adjusting portion 1124, a guide member 1125, a baffle assembly 113, a first baffle 1131, a second baffle 1132, a driving mechanism 12, a cylinder 121, a guide rail 122, a horizontal state mechanism 13, a third support member 131, a fourth support member 132, a sixth support member 133, an elastic member 134, a tilted state mechanism 14, a first support member 141, a second support member 142, a fifth support member 143, and a semiconductor chip 200. DETAILED DESCRIPTION

[0026] In order to make the technical scheme of the present application better understood by the personnel in the field, the following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical scheme in the specific embodiments of the present application. In the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0027] This application provides a Figure 1 , Figure 2 and Figure 3 The wafer splicing device 100 shown is mainly used for wafer storage, wafer arrangement and wafer transmission after the semiconductor wafers 200 are sorted. The wafer splicing device 100 includes a carrying mechanism 11, a driving mechanism 12, a horizontal state mechanism 13 and a tilting state mechanism 14. The carrying mechanism 11 is mainly used to receive the semiconductor wafers 200 transmitted by the equipment of the previous process and to transport the received semiconductor wafers 200 to the subsequent process.

[0028] The bearing mechanism 11 includes a base 111 and a material plate 112. The material plate 112 is used to receive the semiconductor wafer 200, and the base 111 is used to support the material plate 112. The material plate 112 and the base 111 are connected in a movable manner, and the material plate 112 and the base 111 can rotate relative to each other within a certain range. Specifically, the state of the base 111 remains basically unchanged, and the material plate 112 rotates relative to the base 111, so that the material plate 112 can switch between a horizontally set state and an inclined set state. Specifically, the material plate 112 and the base 111 are connected in a hinged manner.

[0029] The carrying mechanism 11 includes a first position and a second position, and the carrying mechanism 11 can be moved and switched between the first position and the second position. Figure 1 As shown, when the supporting mechanism 11 is in the first position, the material plate 112 and the horizontal state mechanism 13 are in contact with each other, and the material plate 112 is in a horizontal state. When the supporting mechanism 11 is in the second position, the material plate 112 and the inclined state mechanism 14 are in contact with each other, and the material plate 112 is in an inclined state relative to the horizontal plane. When the supporting mechanism 11 is in the first position and the material plate 112 is in a horizontal state, a robot or other mechanism can pick up the sorted semiconductor wafers 200 from the material plate 112. Figure 3 As shown, when the supporting mechanism 11 is in the second position and the material plate 112 is in an inclined state, the material plate 112 can receive the semiconductor wafer 200 transmitted from the previous process, and at the same time, the semiconductor wafer 200 is automatically arranged on the inclined material plate 112 under the action of gravity to achieve flush placement of the wafer.

[0030] The driving mechanism 12 is mainly used to drive the carrying mechanism 11 to move. Specifically, the driving mechanism 12 is connected to the base 111 of the carrying mechanism 11. The driving mechanism 12 drives the base 111 and drives the carrying mechanism 11 to move and switch between the first position and the second position. The driving mechanism 12 drives the carrying mechanism 11 to switch between the first position and the second position to switch the material plate 112 between the horizontal state and the inclined state.

[0031] The horizontal state mechanism 13 is mainly used to make the material sheet 112 in a horizontal state when the supporting mechanism 11 is in the first position, and the horizontal state mechanism 13 can also make the material sheet 112 switch from an inclined state to a horizontal state when the supporting mechanism 11 moves from the second position to the first position. The top of the horizontal state mechanism 13 is flush with the bottom of the material sheet 112 in the horizontal state; when the material sheet 112 is in the horizontal state, at least part of the horizontal state mechanism 13 abuts against the bottom of the material sheet 112.

[0032] Specifically, in the process that the driving mechanism 12 drives the base 111 and the carrying mechanism 11 to move from the second position to the first position, the material sheet 112 also moves accordingly. As the material sheet 112 gradually moves away from the tilting state mechanism 14, the material sheet 112 in the tilted state is also converted to the horizontal state in the horizontal setting, and finally the material sheet 112 is in the horizontal state in the horizontal setting. The horizontal state mechanism 13 can be set on the side of the carrying mechanism 11 close to the tilting state mechanism 14, or the horizontal state mechanism 13 can be set on the side of the carrying mechanism 11 away from the tilting state mechanism 14. When the horizontal state mechanism 13 is set on the side close to the tilting state mechanism 14, the horizontal state mechanism 13 can provide support for the material sheet 112 when the material sheet 112 is in the horizontal state, so as to ensure that the material sheet 112 can be in the horizontal setting. When the horizontal state mechanism 13 is arranged on the side away from the inclined state mechanism 14, the material sheet 112 can not only support the material sheet 112, but also lift one end of the material sheet 112 away from the inclined state mechanism 14, thereby improving the stability of the material sheet 112 when it is restored from the inclined state to the horizontal state.

[0033] The tilting mechanism 14 is mainly used to make the material sheet 112 in a tilted state when the supporting mechanism 11 is in the second position. At the same time, when the supporting mechanism 11 moves from the first position to the second position, the tilting mechanism 14 can also make the material sheet 112 switch from the horizontal state to the tilted state. At least part of the tilting mechanism 14 is arranged higher than the bottom of the material sheet 112 in the horizontal state. When the material sheet 112 is in the tilted state, at least part of the tilting mechanism 14 abuts against the bottom of the material sheet 112.

[0034] Specifically, in the process that the driving mechanism 12 drives the supporting mechanism 11 to move from the first position to the second position, the material sheet 112 also moves therewith, and the material sheet 112 in a horizontal state is in contact with the tilting state mechanism 14. At the same time, since the top of the tilting state mechanism 14 is higher than the bottom of the material sheet 112, the side of the material sheet 112 in contact with the tilting state mechanism 14 is lifted up by the tilting state mechanism 14. With the further driving of the driving mechanism 12, the side of the material sheet 112 close to the tilting state mechanism 14 is completely lifted up, and the material sheet 112 is in a tilted state of a tilted setting.

[0035] When the material plate 112 is in an inclined state, the material plate 112 can receive the semiconductor wafer 200 transferred from the previous process, and because the material plate 112 is inclined, the semiconductor wafer 200 can slide under the action of gravity, thereby finally achieving wafer alignment and sorting.

[0036] In the embodiment of the present application, the semiconductor wafer 200 is substantially square, and the material plate 112 is also substantially square. When the material plate 112 is in an inclined state, the first support member 141 can be set at a position supporting a corner of the square material plate 112, or the first support member 141 can be set at a position supporting a side of the square material plate 112. Further, when the material plate 112 is in an inclined state, the first support member 141 pushes one corner upward, and the material plate 112 is inclined along the diagonal direction.

[0037] If necessary, corresponding guiding structures can be set on the horizontal state mechanism 13 and the inclined state mechanism 14. For example, the horizontal state mechanism 13 and part of the top area of ​​the horizontal state mechanism 13 can be set as an inclined surface or a curved surface to make the conversion process from the horizontal state to the inclined state or the conversion process from the inclined state to the horizontal state smoother, thereby improving the operation smoothness and stability of the splicing device 100.

[0038] As an implementation method, Figure 4As shown, the tilting mechanism 14 further includes a first support member 141 and a second support member 142. The top of the first support member 141 is higher than the bottom of the material plate 112 when it is in a horizontal state, and the top of the second support member 142 is arranged in an inclined surface. In the tilting mechanism 14, the first support member 141 is mainly used to lift the material plate 112 and support the material plate 112 when the material plate 112 is in a tilted state, and the second support frame is mainly used to support the material plate 112 when the material plate 112 is in a tilted state. The material plate 112 and the base 111 are arranged to be movably connected, and the flexibility of movement between the material plate 112 and the base 111 is relatively large. At the same time, under the action of the semiconductor wafer 200 falling on the material plate 112, the material plate 112 in a tilted state and tilted may be further tilted, and even the material plate 112 and the wafer falling on the material plate 112 may overturn. A second support member 142 is provided on a side of the material plate 112 away from the first support member 141, and the second support member 142 is used to support the material plate 112 in an inclined state, and the inclination angle of the material plate 112 in the inclined state is controlled to prevent the material plate 112 from tipping over, thereby improving the stability and safety of the material plate 112. Specifically, the first support member 141 and the second support member 142 are provided on both sides of the driving mechanism 12.

[0039] As an implementation method, Figure 4 As shown, the horizontal state mechanism 13 also includes a third support member 131 and a fourth support member 132. The third support member 131 and the fourth support member 132 are used to support the material sheet 112 when the material sheet 112 is in a horizontal state. The top of the third support member 131 is flush with the bottom of the material sheet 112 when it is in a horizontal state, and the top of the fourth support member 132 is flush with the bottom of the material sheet 112 when it is in a horizontal state. The material plate 112 and the base 111 are hinged, and the material plate 112 and the base 111 have greater flexibility. At the same time, when the material plate 112 is in a horizontal state, the material plate 112 is unstable in gravity and may overturn due to the semiconductor wafer 200. The third support member 131 and the fourth support member 132 are provided in the horizontal state mechanism 13. The third support member 131 and the fourth support member 132 are used to support the material plate 112 in a horizontal state, so as to ensure that the material plate 112 can be in a horizontal state when in a horizontal state, avoid the material plate 112 from tilting, and improve the stability and safety of the material plate 112. In addition, when the bearing mechanism 11 moves from the second position to the first position, the third support member 131 and the fourth support member 132 can provide corresponding support and guidance for the material plate 112 to switch from an inclined state to a horizontal state. Specifically, the fourth support member 132 and the second support member 142 are provided on both sides of the driving mechanism 12.

[0040] As a special embodiment, the first support member 141 and the third support member 131 can extend to each other to form a continuous and smooth strip structure that can play a guiding role, and the second support member 142 and the fourth support member 132 can also extend to each other to form a continuous and smooth strip mechanism that can play a guiding role. During the movement of the supporting mechanism 11 between the first position and the second position, the above two strip mechanisms can play a role similar to a guide rail, so that the material plate 112 can switch between the horizontal state and the inclined state.

[0041] As an implementation method, Figure 5 As shown, the tilting state mechanism 14 includes a first support member 141 and a fifth support member 143. The top of the first support member 141 is higher than the bottom of the material plate 112 when it is in a horizontal state. The fifth support member 143 is connected to the base 111. The fifth support member 143 is arranged between the base 111 and the material plate 112. The top of the fifth support member 143 is arranged in an inclined surface. The material plate 112 and the base 111 are arranged to be hinged and movable. The material plate 112 and the base 111 have greater flexibility in movement. At the same time, under the action of the semiconductor wafer 200 falling on the material plate 112, the material plate 112 in an inclined state may be further tilted, and even the material plate 112 and the wafer falling on the material plate 112 may overturn. In the tilting state mechanism 14, the first support member 141 is mainly used to lift the material plate 112 and support the material plate 112 when the material plate 112 is in an inclined state, and the fifth support member 143 is used to support the material plate 112 when the material plate 112 is in an inclined state. The fifth support member 143 is connected to the base 111, and is disposed between the base 111 and the sheet 112. The fifth support member 143 is disposed on the base 111, so that the fifth support member 143 does not occupy extra space, and the compactness of the structure of the splicing device 100 is improved, and the space occupied by the entire splicing device 100 is reduced. The fifth support member 143 is disposed on the base 111, and can also well support the sheet 112, prevent the sheet 112 from tipping over, and improve the stability and safety of the sheet 112. Specifically, the fifth support member 143 is disposed on a side away from the first support member 141.

[0042] As an implementation method, Figure 6As shown, the horizontal state mechanism 13 includes a sixth support member 133 and an elastic member 134. The top of the sixth support member 133 is flush with the bottom of the material plate 112 when it is in a horizontal state. The sixth support member 133 is connected to the base 111. The sixth support member 133 is arranged between the base 111 and the material plate 112. The top of the sixth support member 133 is arranged horizontally. The material plate 112 and the base 111 are arranged to be hinged, and the flexibility of movement between the material plate 112 and the base 111 is relatively large. At the same time, when the material plate 112 is in a horizontal state, the material plate 112 has an unstable center of gravity and may overturn due to the semiconductor wafer 200 carried by the material plate 112. The sixth support member 133 is arranged in the horizontal state mechanism 13, and the sixth support member 133 is used to support the material plate 112 in a horizontal state, so as to ensure that the material plate 112 can be in a horizontal state when in a horizontal state, avoid the material plate 112 from tilting, and improve the stability and safety of the material plate 112. One end of the elastic member 134 is connected to the bottom of the sheet 112, and the other end of the elastic member 134 is connected to the first support member 141 or the base 111. Under the action of the elastic member 134, the sheet 112 has a tendency to be restored to a horizontal state in a horizontal position. When the supporting mechanism 11 moves from the second position to the first position, the sheet 112 is away from the tilting state mechanism 14, and the sheet 112 can be restored from the tilted state to the horizontal state under the action of the elastic member 134. Specifically, the elastic member 134 can be a spring. When the sheet 112 is in a horizontal state, the spring is in a relaxed state. When the sheet 112 is in a tilted state, the spring is in a stretched state, and at this time, the spring has a tendency to restore the sheet 112 to a horizontal state.

[0043] As an implementation method, Figure 7 As shown, the bearing mechanism 11 includes a baffle assembly 113, which is arranged on the side of the material plate 112. When the material plate 112 is in an inclined state, the baffle assembly 113 can prevent the semiconductor wafer 200 from sliding off the material plate 112, and the baffle assembly 113 can also play a guiding role. When the semiconductor wafer 200 slides on the material plate 112, the baffle assembly 113 can align the semiconductor wafers 200 with each other, ensuring that the semiconductor wafer 200 can be placed flush on all sides of the material plate 112, so as to facilitate the subsequent robot to obtain the semiconductor wafer 200. The material plate 112 assembly includes at least a first baffle 1131 and a second baffle 1132, and the material plate 112 includes a first side edge 1121 and a second side edge 1122 arranged adjacently, the first baffle 1131 is connected to the first side edge 1121, and the second baffle 1132 is connected to the second side edge 1122.

[0044] As an implementation method, Figure 7As shown, the baffle assembly 113 is composed of a first baffle 1131 and a second baffle 1132. Since the material plate 112 is tilted when it is in an inclined state, only the first baffle 1131 and the second baffle 1132 are provided to meet the purpose of preventing the semiconductor wafers 200 on the material plate 112 from sliding off and aligning the semiconductor wafers 200. At the same time, only the baffles provided on the two sides of the material plate 112 can also provide space for grabbing the arranged semiconductor wafers 200, making it easy to grab and transport the semiconductor wafers 200 from the material plate 112, and avoiding the situation where the semiconductor wafer 200 is damaged by the semiconductor wafer 200 rubbing against the baffle due to insufficient space between the semiconductor wafer 200 and the baffle.

[0045] As an implementation method, Figure 7 As shown, a first adjustment portion 1123 is provided on the first side 1121, and a first baffle 1131 is slidably connected to the first adjustment portion 1123. A second adjustment portion 1124 is provided on the second side 1122, and a second baffle 1132 is slidably connected to the second adjustment portion 1124. The first adjustment portion 1123 and the second adjustment portion 1124 are respectively provided on the first side 1121 and the second side 1122 of the material plate 112, and the first baffle 1131 and the second baffle 1132 are respectively slidably connected to the first adjustment portion 1123 and the second adjustment portion 1124, so that the first baffle 1131 and the second baffle 1132 can be given a certain degree of adjustment flexibility, and the positions of the first baffle 1131 and the second baffle 1132 can be adjusted according to the size of the semiconductor wafer 200, so that the wafer splicing device 100 can be applicable to semiconductor wafers 200 of various sizes.

[0046] In addition, the positions of the first baffle 1131 and the second baffle 1132 can also be adjusted according to the actual falling position of the semiconductor wafer 200 to ensure that the supporting mechanism 11 can accurately receive the semiconductor wafer 200. On the first adjusting portion 1123, the adjustment direction of the first baffle 1131 can be along the direction in which the first baffle 1131 extends, or along the direction perpendicular to the direction in which the first baffle 1131 extends; the adjustment direction of the second baffle 1132 is also the same.

[0047] As an implementation method, Figure 7As shown, the material plate 112 is also provided with a guide member 1125, which is provided on one side of the material plate 112 close to the first support member 141. During the movement of the carrying mechanism 11, the material plate 112 needs to contact and slide relative to the first support member 141 and / or the second support member 142. The provision of the guide member 1125 can make the relative sliding between the material plate 112 and the first support member 141 and / or the second support member 142 smoother, reduce the impact when the material plate 112 contacts the first support member 141 and / or the second support member 142, and improve the stability of the splicing device 100 during the movement. Specifically, the guide member 1125 can be a guide roller provided at the edge of the material plate 112.

[0048] As an implementation method, Figure 8 As shown, the driving mechanism 12 includes a cylinder 121 and a guide rail 122, the cylinder 121 is connected to the base 111, the base 111 is slidably connected to the guide rail 122, the cylinder 121 is used to drive the base 111, and the guide rail 122 is used to control the movement direction of the base 111. The combination of the cylinder 121 and the guide rail 122 is used as the driving mechanism 12, which can more accurately drive the supporting mechanism 11 to switch positions. In the embodiment of the present application, the driving mechanism 12 may also be not limited to the cylinder 121 and the guide rail 122, and may also be other driving mechanisms 12 that can drive the base 111 in the supporting mechanism 11 to switch between the first position and the second position. For example, the driving mechanism 12 may include a combination of a screw and a guide rail 122, and the driving mechanism 12 may also include a combination of a screw and a slider.

[0049] In summary, in the embodiment of the present application, by setting a driving mechanism 12, a tilting state mechanism 14 and a horizontal state mechanism 13 in the wafer splicing device 100, the supporting mechanism 11 can be converted between a horizontal state in a horizontal setting and a tilted state in an inclined position through position conversion under the action of the driving mechanism 12, thereby realizing automatic alignment and sorting of the semiconductor chip 200, and at the same time improving the convenience of picking up the semiconductor chip 200.

[0050] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A wafer bonding device (100) for a semiconductor wafer (200), characterized in that: include: A carrying mechanism (11), the carrying mechanism (11) comprising a movable material plate (112), the carrying mechanism (11) carrying the semiconductor wafer (200) via the material plate (112), the carrying mechanism (11) comprising a first position and a second position, when the carrying mechanism (11) is in the first position, the material plate (112) is in a horizontal state, and when the carrying mechanism (11) is in the second position, the material plate (112) is in an inclined state inclined relative to a horizontal plane; a driving mechanism (12), the driving mechanism (12) being connected to the carrying mechanism (11), and the driving mechanism (12) being used to drive the carrying mechanism (11) to move between the first position and the second position; a horizontal state mechanism (13), the horizontal state mechanism (13) being used to make the material plate (112) be in a horizontal state when the supporting mechanism (11) is in the first position, the top of the horizontal state mechanism (13) being arranged flush with the bottom of the material plate (112) when in the horizontal state; when the material plate (112) is in a horizontal state, at least a portion of the horizontal state mechanism (13) abuts against the bottom of the material plate (112); A tilting state mechanism (14), wherein the tilting state mechanism (14) is used to place the material plate (112) in the tilting state when the supporting mechanism (11) is in the second position; at least a portion of the tilting state mechanism (14) is arranged higher than the bottom of the material plate (112) when it is in the horizontal state; when the material plate (112) is in the tilting state, at least a portion of the tilting state mechanism (14) abuts against the bottom of the material plate (112).

2. The splicing device (100) according to claim 1, characterized in that: The tilting state mechanism (14) further comprises a first support member (141) and a second support member (142) for supporting the material plate (112) when the material plate (112) is in the tilted state, the top of the first support member (141) being arranged higher than the bottom of the material plate (112) when in the horizontal state, the top of the second support member (142) being arranged in an inclined surface, and the first support member (141) and the second support member (142) being arranged on both sides of the driving mechanism (12), respectively.

3. The splicing device (100) according to claim 1 or 2, characterized in that: The horizontal state component comprises a third support member (131) and a fourth support member (132) for supporting the material plate (112) when the material plate (112) is in the horizontal state; the top of the third support member (131) is arranged flush with the bottom of the material plate (112) when it is in the horizontal state; the top of the fourth support member (132) is arranged flush with the bottom of the material plate (112) when it is in the horizontal state; the third support member (131) and the fourth support member (132) are respectively arranged on both sides of the driving mechanism (12).

4. The splicing device (100) according to claim 1, characterized in that: The carrying mechanism (11) further comprises a base (111), the driving mechanism (12) is connected to the base (111), and the material plate (112) is movably connected to the base (111); The tilting state mechanism (14) comprises a first support member (141) and a fifth support member (143); the top of the first support member (141) is arranged higher than the bottom of the material plate (112) when in the horizontal state; the fifth support member (143) is connected to the base (111); the fifth support member (143) is arranged between the base (111) and the material plate (112); and the top of the fifth support member (143) is arranged in an inclined surface.

5. The splicing device (100) according to claim 4, characterized in that: The horizontal state mechanism (13) comprises a sixth support member (133) and an elastic member (134); the top of the sixth support member (133) is arranged flush with the bottom of the material plate (112) when the material plate (112) is in the horizontal state; the sixth support member (133) is connected to the base (111); the sixth support member (133) is arranged between the base (111) and the material plate (112); the top of the sixth support member (133) is arranged horizontally; one end of the elastic member (134) is connected to the bottom of the material plate (112); and the other end of the elastic member (134) is connected to the first support member (141) or the base (111).

6. The splicing device (100) according to claim 1, characterized in that: The supporting mechanism (11) includes a baffle assembly (113) capable of supporting the semiconductor wafer (200) when the material plate (112) is in the inclined state, the baffle assembly (113) including a first baffle (1131) and a second baffle (1132), the material plate (112) including a first side edge (1121) and a second side edge (1122) adjacent to the first side edge (1121), the first baffle (1131) being connected to the first side edge (1121), and the second baffle (1132) being connected to the second side edge (1122).

7. The splicing device (100) according to claim 6, characterized in that: The baffle assembly (113) consists of the first baffle (1131) and the second baffle (1132).

8. The splicing device (100) according to claim 6 or 7, characterized in that: A first adjustment portion (1123) is provided on the first side edge (1121), and the first baffle plate (1131) is slidably connected to the first adjustment portion (1123); a second adjustment portion (1124) is provided on the second side edge (1122), and the second baffle plate (1132) is slidably connected to the second adjustment portion (1124).

9. The splicing device (100) according to claim 1, characterized in that: The material plate (112) is further provided with a guide member (1125), and the guide member (1125) is arranged on a side of the material plate (112) close to the horizontal state mechanism (13) and / or the inclined state mechanism (14).

10. The sheet splicing device (100) according to claim 1, characterized in that: The supporting mechanism (11) further comprises a base (111), the base being movably connected to the material plate; the driving mechanism (12) comprises a cylinder (121) for driving the base (111) and a guide rail (122) for controlling the movement direction of the base (111); the cylinder (121) is connected to the base (111), and the base (111) is slidably connected to the guide rail (122).

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