Packaging glue filling and sealing device for preventing position deviation of LED (light-emitting diode) chip

Abstract

The utility model discloses a packaging glue potting device for preventing position offset of an LED chip, and relates to the technical field of LED packaging, the packaging glue potting device comprises a device main body, the surface of the device main body is provided with a chip main body, the outer wall of the device main body is rotatably connected with a first threaded rod, one end of the first threaded rod is fixedly connected with a first servo motor, and the other end of the first threaded rod is fixedly connected with a second servo motor. Through arrangement of a material pushing rod and a clamping rod, when packaging processing is carried out on an LED chip through packaging equipment, in order to improve the fixing effect of the LED chip during processing and the linkage performance of loosening and material pushing of the LED chip after processing is completed, a first servo motor can be started to drive a threaded sliding rod to slide along the outer wall of the device through rotation of a first threaded rod, so that the clamping rod is clamped in the clamping rod; the sliding of the threaded sliding rod drives the clamping rod to slide outwards along the inner wall of the sliding groove through the rotation of the rotating rod, meanwhile, the pushing rod is driven to do automatic telescopic motion along the back face of the LED chip, and the function of automatic feeding after the LED chip is machined is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a packaging glue potting device for preventing position deviation of an LED chip. Background Art

[0002] When LED lamps are produced, in order to improve the safety and service life of LED lamps, encapsulation glue is generally used to encapsulate the circuit components. The encapsulation generally adopts potting to seal and protect the circuit components, and a potting device is used for potting.

[0003] For example, announcement number CN214956940U discloses an LED packaging glue potting device, which relates to the field of packaging glue. In view of the poor flexibility of some existing LED packaging glue potting devices, the packaging glue is prone to condensation in the glue storage bin, and there is a problem that it cannot be dried and cured in time, the following scheme is proposed, which includes a mounting base, a drying box is arranged on the upper surface of the mounting base, a drying plate is arranged inside the drying box, an electric push rod is arranged inside the drying box, a first telescopic rod is arranged inside the drying box, a push plate is arranged on the top of the first telescopic rod, a workbench is arranged on the upper surface of the drying box, a placement plate is arranged on the upper surface of the workbench, a mounting plate is arranged on the upper surface of the workbench, and a second telescopic rod is arranged on the side of the mounting plate close to the placement plate. The utility model has a novel structure, can improve the flexibility of the device, and at the same time increase the practicability of the device, so that the packaging glue is not easy to condense, and the work efficiency is increased.

[0004] However, when using this packaging glue potting device for preventing the position shift of the LED chip, although it can perform better limited packaging of the LED chip, when packaging the LED chip, the linkage between the loosening and pushing of the LED chip on the surface of the device is not high, so that after the packaging process of the LED chip, a person needs to reach into the bottom of the glue outlet to take the LED chip, which may cause the user's hand to accidentally touch the glue outlet, causing the glue outlet surface to solidify, thereby reducing the efficiency of subsequent LED processing.

[0005] Therefore, in view of this, the shortcomings of the existing structure are studied and improved, and a packaging glue potting device for preventing the position of the LED chip from shifting is proposed. Utility Model Content

[0006] The utility model aims to provide a packaging glue potting device for preventing the position of LED chips from shifting, so as to solve the problem in the above background technology that the loose material and the pushing material linkage of the LED chips on the device surface are not high when packaging the LED chips.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a packaging glue potting device for preventing the position displacement of an LED chip, comprising a device body, a chip body placed on the surface of the device body, an outer wall of the device body being rotatably connected to a first threaded rod, one end of the first threaded rod being fixedly connected to a first servo motor, an outer wall of the first threaded rod being threadedly connected to a threaded sliding rod slidably connected to the outer wall of the device body, an outer wall of the threaded sliding rod being fixedly connected to a pushing rod that fits with the back of the chip body, an outer wall of the threaded sliding rod being rotatably connected to a rotating rod, one end of the rotating rod being rotatably connected to a clamping rod slidably connected to the outer wall of the device body, a sliding groove being provided at a connection portion between the outer wall of the device body and the clamping rod, a sliding frame being slidably connected to the outer wall of the device body, and a glue storage bin located above the chip body being slidably connected to the outer wall of the sliding frame.

[0008] Furthermore, the outer wall of the device body is rotatably connected to a second threaded rod threadedly connected to the outer wall of the sliding frame, one end of the second threaded rod is fixedly connected to a second servo motor, the top of the sliding frame is rotatably connected to a third threaded rod, one end of the third threaded rod is fixedly connected to a third servo motor, the outer wall of the third threaded rod is threadedly connected to a sliding block slidably connected to the top of the sliding frame, the top of the sliding block is fixedly connected to an electric push rod fixedly connected to the outer wall of a glue storage bin, the outer wall of the glue storage bin is fixedly connected to a glue inlet pipe, and a fixing groove is provided at the connection between the outer wall of the device body and the sliding frame.

[0009] Furthermore, a connecting groove is provided at a connecting portion between the outer wall of the device body and the push rod.

[0010] Furthermore, two groups of rotating rods are provided, and the positions of the two groups of rotating rods are distributed symmetrically with respect to the central axis of the threaded sliding rod.

[0011] Furthermore, the outer wall profile of the clamping rod is in a "U" shape.

[0012] Furthermore, a glue outlet located above the chip body is provided at the bottom of the glue storage bin.

[0013] Furthermore, the fixing grooves are symmetrically arranged on the outer wall of the device body.

[0014] Furthermore, the outer wall contour of the connecting portion between the motion track of the sliding frame and the motion track of the sliding block is in a "cross" shape.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The utility model provides a push rod and a clamping rod. When the LED chip is packaged by the packaging equipment, in order to improve the fixing effect of the LED chip during processing and the linkage of releasing and pushing the LED chip after the processing is completed, the first servo motor can be turned on to drive the threaded slide bar to slide along the outer wall of the device through the rotation of the first threaded rod. The sliding of the threaded slide bar drives the clamping rod to slide outward along the inner wall of the slide groove through the rotation of the rotating rod. At the same time, the push rod is driven to automatically extend and retract along the back of the LED chip, thereby playing the role of automatically feeding the LED chip after the processing is completed.

[0017] 2. The utility model provides a sliding frame and a sliding block. When the LED chip is produced and processed by the packaging equipment, in order to improve the convenience of packaging different positions on the surface of the LED chip, the second servo motor can be turned on according to the needs of the processing position. The second threaded rod is rotated to drive the sliding frame to slide along the inner wall of the fixed groove, and the third servo motor is turned on to drive the sliding block to perform horizontal telescopic movement along the top of the sliding frame through the rotation of the third threaded rod. At the same time, the electric push rod is turned on to drive the glue storage bin to perform height adjustment movement, thereby playing a role in adjusting the processing of different positions of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the structure of the packaging device;

[0019] Figure 2 is a schematic diagram of the three-dimensional structure of the packaging device in another direction;

[0020] Figure 3 It is a schematic diagram of the connection structure between the push rod and the clamping rod;

[0021] Figure 4 It is a schematic diagram of the connection structure between the sliding frame and the sliding block.

[0022] In the figure: 1. device body; 2. chip body; 3. first threaded rod; 4. first servo motor; 5. threaded sliding rod; 6. push rod; 7. rotating rod; 8. clamping rod; 9. slide groove; 10. second threaded rod; 11. second servo motor; 12. sliding frame; 13. third threaded rod; 14. third servo motor; 15. sliding block; 16. electric push rod; 17. glue storage bin; 18. glue inlet pipe; 19. fixing groove. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1: Figure 1-Figure 3 As shown, a packaging glue potting device for preventing the position of an LED chip from shifting comprises a device body 1, a chip body 2 is placed on the surface of the device body 1, a first threaded rod 3 is rotatably connected to the outer wall of the device body 1, one end of the first threaded rod 3 is fixedly connected to a first servo motor 4, the outer wall of the first threaded rod 3 is threadedly connected to a threaded slide rod 5 slidably connected to the outer wall of the device body 1, the outer wall of the threaded slide rod 5 is fixedly connected to a pushing rod 6 that fits the back of the chip body 2, the outer wall of the threaded slide rod 5 is rotatably connected to a rotating rod 7, one end of the rotating rod 7 is rotatably connected to a clamping rod 8 slidably connected to the outer wall of the device body 1, a sliding groove 9 is provided at the connection portion between the outer wall of the device body 1 and the clamping rod 8, the outer wall of the device body 1 is slidably connected to a sliding frame 12, and the outer wall of the sliding frame 12 is slidably connected to a glue storage bin 17 located above the chip body 2.

[0025] Furthermore, a connecting groove is provided at the connecting portion between the outer wall of the device body 1 and the push rod 6. The push rod 6 forms a sliding structure with the device body 1 through the first threaded rod 3, which is conducive to the rotation of the first threaded rod 3, driving the push rod 6 to slide along the outer wall of the device body 1, thereby driving the rotating rod 7 to rotate effectively.

[0026] Furthermore, two groups of rotating rods 7 are provided, and the positions of the two groups of rotating rods 7 are symmetrical about the central axis of the threaded slide rod 5. This is beneficial for driving the two groups of clamping rods 8 to slide relative to each other by providing two groups of rotating rods 7 whose positions are symmetrical about the central axis of the threaded slide rod 5.

[0027] Furthermore, the outer wall profile of the clamping rod 8 is in a "U" shape, and the clamping rod 8 forms a sliding structure between the rotating rod 7 and the slide groove 9, which is conducive to the rotation of the rotating rod 7, driving the clamping rod 8 to slide along the inner wall of the slide groove 9, thereby playing a role in the positioning accuracy of the LED chip during packaging processing.

[0028] Embodiment 2: Figure 1 , Figure 2 and Figure 4As shown, the utility model proposes a packaging glue potting device for preventing the position displacement of the LED chip. Compared with the first embodiment, as another implementation mode of the utility model, the outer wall of the device body 1 is rotatably connected with the second threaded rod 10 threadedly connected with the outer wall of the sliding frame 12, one end of the second threaded rod 10 is fixedly connected with the second servo motor 11, the top of the sliding frame 12 is rotatably connected with the third threaded rod 13, one end of the third threaded rod 13 is fixedly connected with the third servo motor 14, the outer wall of the third threaded rod 13 is threadedly connected with the sliding block 15 slidably connected with the top of the sliding frame 12, the top of the sliding block 15 is fixedly connected with the electric push rod 16 fixedly connected with the outer wall of the glue storage bin 17, the outer wall of the glue storage bin 17 is fixedly connected with the glue inlet pipe 18, and the device A fixing groove 19 is provided at the connection portion between the outer wall of the main body 1 and the sliding frame 12. When working, by setting the sliding frame 12 and the sliding block 15, it is beneficial to produce and process the LED chip through the packaging equipment. In order to improve the convenience of packaging different positions on the surface of the LED chip, the second servo motor 11 can be turned on according to the needs of the processing position to drive the sliding frame 12 to slide along the inner wall of the fixing groove 19 through the rotation of the second threaded rod 10, and the third servo motor 14 can be turned on through the rotation of the third threaded rod 13 to drive the sliding block 15 to perform horizontal telescopic movement along the top of the sliding frame 12. At the same time, the electric push rod 16 is turned on to drive the glue storage bin 17 to perform height adjustment movement, thereby playing a role in adjusting and processing different positions of the LED chip.

[0029] Furthermore, a glue outlet located above the chip body 2 is opened at the bottom of the glue storage bin 17, which is beneficial for effectively processing the LED chip.

[0030] Furthermore, the fixed groove 19 is symmetrically arranged on the outer wall of the device body 1, and the sliding frame 12 forms a sliding structure between the second threaded rod 10 and the fixed groove 19, which is conducive to the rotation of the second threaded rod 10, driving the sliding frame 12 to slide along the inner wall of the fixed groove 19, thereby driving the glue storage bin 17 to effectively adjust the vertical direction.

[0031] Furthermore, the outer wall contour of the connection part between the movement trajectory of the sliding frame 12 and the movement trajectory of the sliding block 15 is in the shape of a "cross". The sliding block 15 forms a sliding structure with the sliding frame 12 through the third threaded rod 13, which is beneficial to the rotation of the third threaded rod 13, driving the sliding block 15 to move horizontally along the top of the sliding frame 12, thereby driving the glue storage bin 17 to effectively adjust the horizontal direction, thereby achieving the effect of adjusting the processing of different positions of the LED chips.

[0032] Working principle: When using this packaging glue potting device for preventing the position of the LED chip from shifting, first, when the LED chip is packaged and processed by the packaging equipment, in order to improve the fixing effect of the LED chip during processing, and the linkage of loosening and pushing the LED chip after the processing is completed, the first servo motor 4 can be turned on to drive the threaded slide rod 5 to slide along the outer wall of the device through the rotation of the first threaded rod 3. The sliding of the threaded slide rod 5 drives the clamping rod 8 to slide outward along the inner wall of the slide groove 9 through the rotation of the rotating rod 7. At the same time, it drives the pushing rod 6 to perform automatic telescopic movement along the back side of the LED chip, thereby playing the role of automatic feeding after the LED chip processing is completed.

[0033] Finally, when the LED chips are produced and processed by the packaging equipment, in order to improve the convenience of packaging different positions on the surface of the LED chip, the second servo motor 11 can be turned on according to the needs of the processing position, and the second threaded rod 10 is rotated to drive the sliding frame 12 to slide along the inner wall of the fixed groove 19, and the third servo motor 14 is turned on to drive the sliding block 15 to perform horizontal telescopic movement along the top of the sliding frame 12 through the rotation of the third threaded rod 13. At the same time, the electric push rod 16 is turned on to drive the glue storage bin 17 to perform height adjustment movement, thereby playing a role in adjusting the processing of different positions of the LED chips.

[0034] This is the working principle of the encapsulation glue potting device that prevents the position of the LED chip from shifting.

[0035] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A packaging glue potting device for preventing position deviation of an LED chip, comprising a device body (1), characterized in that: A chip body (2) is placed on the surface of the device body (1); a first threaded rod (3) is rotatably connected to the outer wall of the device body (1); one end of the first threaded rod (3) is fixedly connected to a first servo motor (4); the outer wall of the first threaded rod (3) is threadedly connected to a threaded slide rod (5) slidably connected to the outer wall of the device body (1); the outer wall of the threaded slide rod (5) is fixedly connected to a push rod (6) that fits the back of the chip body (2); the outer wall of the threaded slide rod (5) is rotatably connected to a rotating rod (7); one end of the rotating rod (7) is rotatably connected to a clamping rod (8) slidably connected to the outer wall of the device body (1); a sliding groove (9) is provided at the connection portion between the outer wall of the device body (1) and the clamping rod (8); the outer wall of the device body (1) is slidably connected to a sliding frame (12); the outer wall of the sliding frame (12) is slidably connected to a glue storage bin (17) located above the chip body (2).

2. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 1, characterized in that: The outer wall of the device body (1) is rotatably connected to a second threaded rod (10) threadedly connected to the outer wall of the sliding frame (12); one end of the second threaded rod (10) is fixedly connected to a second servo motor (11); the top of the sliding frame (12) is rotatably connected to a third threaded rod (13); one end of the third threaded rod (13) is fixedly connected to a third servo motor (14); the outer wall of the third threaded rod (13) is threadedly connected to a sliding block (15) slidably connected to the top of the sliding frame (12); the top of the sliding block (15) is fixedly connected to an electric push rod (16) fixedly connected to the outer wall of a glue storage bin (17); the outer wall of the glue storage bin (17) is fixedly connected to a glue feed pipe (18); a fixing groove (19) is provided at the connection portion between the outer wall of the device body (1) and the sliding frame (12).

3. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 1, characterized in that: A connecting groove is provided at the connecting portion between the outer wall of the device body (1) and the push rod (6).

4. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 1, characterized in that: Two groups of rotating rods (7) are provided, and the positions of the two groups of rotating rods (7) are distributed symmetrically with respect to the central axis of the threaded sliding rod (5).

5. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 1, characterized in that: The outer wall profile of the clamping rod (8) is in a "U" shape.

6. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 2, characterized in that: The bottom of the glue storage bin (17) is provided with a glue outlet located above the chip body (2).

7. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 2, characterized in that: The fixing grooves (19) are symmetrically arranged on the outer wall of the device body (1).

8. The encapsulation glue potting device for preventing position deviation of LED chips according to claim 2, characterized in that: The outer wall profile of the connection portion between the motion track of the sliding frame (12) and the motion track of the sliding block (15) is in the shape of a cross.

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