Air guide module, board card device and electronic equipment

Abstract

The utility model discloses an air guide module, a board card device and electronic equipment. The air guide module comprises a board card used for being inserted into an empty slot position of a case. And the air guide mechanism is mounted on the board card and is used for guiding air to the adjacent slot positions. In the embodiment of the invention, after the board card is inserted into the empty slot position adjacent to the function module, the air can be guided to the adjacent slot position through the air guide mechanism, the heat of the adjacent slot position is rapidly taken away, the air quantity flowing through the empty slot position is reduced, the air quantity of the adjacent slot position is enhanced, and the heat dissipation effect of the adjacent slot position is improved.

Description

Technical Field

[0001] The present application relates to the field of chassis heat dissipation, and in particular to an air guide module, a board device and an electronic device. Background Art

[0002] With the development of measurement and control technology, in many test scenarios, the demand for the number of channels of instruments and equipment is increasing, and a combination of various functional modules is required to form a test system. Therefore, many test and measurement instruments and equipment have begun to adopt modular functional modules with plug-in chassis.

[0003] This type of chassis has many slots arranged side by side, but in actual applications, due to the different numbers of functional modules required in different application scenarios, the functional modules are often not fully inserted, and there are vacant slots in the chassis. Since the empty slots have lower wind resistance, the air flow generated by the chassis's cooling fan will tend to flow through the empty slots, resulting in poor heat dissipation of the functional modules in the chassis, which at the very least affects the precision performance indicators of the functional modules, the working stability and service life of the functional modules, and under certain extreme conditions may even cause the functional modules to overheat and be damaged, or even have a risk of fire. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an air guide module, a board device and an electronic device, which can improve the heat dissipation effect of the functional modules in the chassis.

[0005] The air guide module according to the first aspect of the present application is installed in a chassis, comprising: a board for inserting into an empty slot of the chassis; an air guide mechanism, the air guide mechanism being installed on the board for guiding air to an adjacent slot;

[0006] The air guide mechanism comprises a first air guide plate arranged obliquely, the first air guide plate being mounted on a side of the board away from an adjacent slot, and a first vent matching the first air guide plate is provided on the side of the board so as to allow the air guided by the first air guide plate to enter the adjacent slot through the first vent;

[0007] The air guide mechanism also includes a second air guide plate, which is installed on the side of the board away from the adjacent slot and is located at the rear end of the first air guide plate. The second air guide plate is inclined in the opposite direction to the first air guide plate, and a second ventilation port matching the second air guide plate is opened on the side of the board.

[0008] According to some embodiments of the present application, the air guide mechanism also includes a connecting plate, which is fixed on the side of the board between the first vent and the second vent, and the end of the first air guide plate is connected to the front end of the second air guide plate through the connecting plate.

[0009] According to some embodiments of the present application, a temperature sensor is provided on the air guide mechanism, a backplane connector is provided at the front end of the board, and the temperature sensor is electrically connected to the backplane connector for outputting a temperature detection signal.

[0010] According to some embodiments of the present application, a baffle is provided at the end of the board, and mesh heat dissipation holes are provided on the baffle.

[0011] According to the second aspect of the present application, the board device includes a chassis, in which slots in the chassis are alternately arranged with functional modules and the above-mentioned air guide modules.

[0012] An electronic device according to an embodiment of the third aspect of the present application includes the above-mentioned board device.

[0013] The air guide module, the board device, and the electronic device according to the embodiments of the present application have at least the following beneficial effects:

[0014] In the implementation mode of the present application, after inserting the board into the empty slot adjacent to the functional module, the air can be guided to the adjacent slot by the air guide mechanism, quickly taking away the heat of the adjacent slot, reducing the air volume flowing through the empty slot and increasing the air volume of the adjacent slot, thereby improving the heat dissipation effect of the adjacent slot. In addition, by arranging a second air guide plate with an opposite inclination direction at the rear end of the first air guide plate, after the air enters the adjacent slot through the first air guide plate, it can flow out through the second vent and the guidance of the second air guide plate. Such a design can guide the air from the adjacent slot back to the air outlet of the air duct where the board is located, so as to provide a larger effective area of ​​the air outlet, reduce the wind resistance of the air outlet of the adjacent slot to allow more air flow to pass through, and thus further improve the heat dissipation effect.

[0015] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1 A top view of the air guide module in an embodiment of the present application;

[0018] Figure 2 An exploded view of the air guide module in the embodiment of the present application;

[0019] Figure 3 This is a structural diagram of the air guide module and the functional module in the embodiment of the present application;

[0020] Figure 4 Schematic diagram of the air flow direction in the chassis in the embodiment of the present application.

[0021] Figure Number:

[0022] The board 100 , the first vent 110 , the second vent 120 , the baffle 130 , the air guide mechanism 200 , the first air guide plate 210 , the second air guide plate 220 , the connecting plate 230 , the temperature sensor 300 , the backplane connector 400 , and the functional module 500 . DETAILED DESCRIPTION

[0023] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0024] In the description of the present application, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0025] In the description of this application, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0027] Reference Figure 1 As shown, an air guide module is installed in a chassis, comprising: a board 100 and an air guide mechanism 200. The board 100 is used to be inserted into an empty slot of the chassis; the air guide mechanism 200 is installed on the board 100 to guide air to adjacent slots.

[0028] In the implementation mode of the present application, after the board 100 is inserted into an empty slot adjacent to the functional module, the air can be guided to the adjacent slot through the air guide mechanism 200 to quickly take away the heat of the adjacent slot, reduce the air volume flowing through the empty slot and increase the air volume of the adjacent slot, thereby improving the heat dissipation effect of the adjacent slot.

[0029] In this embodiment, the card 100 is composed of a base and a vertical mounting plate, the base is inserted into the card slot, and the air guide mechanism 200 is fixedly connected to the mounting plate. The air guide mechanism 200 can be in the form of one or more air guide plates to guide air to adjacent slots, or can be in the form of an arc-shaped or other shaped air guide block.

[0030] In some embodiments, reference Figure 2 As shown, the air guide mechanism 200 includes a first air guide plate 210 that is tilted, and the first air guide plate 210 is installed on the side of the board 100 away from the adjacent slot. The side of the board 100 is provided with a first ventilation hole 110 that matches the first air guide plate 210 so that the air guided by the first air guide plate 210 can pass through the first ventilation hole 110 into the adjacent slot.

[0031] In this embodiment, the first air guide plate 210 is set on the side of the board 100 away from the adjacent slot, and the air is guided by opening the first ventilation hole 110 on the side of the board 100, which can further increase the air flow of the adjacent slot and further improve the heat dissipation effect.

[0032] When the air guide plate is set on the side of the board 100 facing the adjacent slot, although air can be guided, the air guide plate itself will occupy the space of the adjacent slot, reducing the air flow of the adjacent slot. In the present application, the first air guide plate 210 is set on the side of the board 100 away from the adjacent slot, and the end of the first air guide plate 210 is fixed on the side of the board 100, and the first air guide plate 210 gradually tilts outward from the end to the front end. It should be noted that in the present application, the front end of the first air guide plate 210 refers to the end facing the air inlet of the chassis, and the end refers to the end away from the air inlet.

[0033] In some embodiments, reference Figure 2 As shown, the air guide mechanism 200 also includes a second air guide plate 220, which is installed on the side of the board 100 away from the adjacent slot and is located at the rear end of the first air guide plate 210. The second air guide plate 220 is inclined in the opposite direction to the first air guide plate 210, and a second ventilation port 120 matching the second air guide plate 220 is opened on the side of the board 100.

[0034] In this embodiment, a second air guide plate 220 with an opposite inclination direction is provided at the rear end of the first air guide plate 210. After the air enters the adjacent slot through the first air guide plate 210, it can flow out through the second vent 120 and the second air guide plate 220. Such a design can guide the air from the adjacent slot back to the air outlet of the air duct where the board 100 is located, so as to provide a larger effective area of ​​the air outlet, reduce the wind resistance of the air outlet of the adjacent slot to allow more airflow to pass through, and thus further improve the heat dissipation effect.

[0035] It should be noted that, in this embodiment, the first air guide plate 210 can be one piece or multiple pieces, can be a flat thin piece with uniform thickness, or can be a structure with a certain thickness gradient or a certain curvature, and the same is true for the second air guide plate 220.

[0036] In some embodiments, reference Figure 2 As shown, the air guide mechanism 200 also includes a connecting plate 230 , which is fixed on the side of the board 100 between the first vent 110 and the second vent 120 , and the end of the first air guide plate 210 is connected to the front end of the second air guide plate 220 through the connecting plate 230 .

[0037] In this embodiment, the first air guide plate 210 and the second air guide plate 220 are fixed to the board 100 by the connecting plate 230, so as to improve the stability of the overall structure.

[0038] In some embodiments, reference Figure 1 and Figure 2 As shown, a temperature sensor 300 is disposed on the air guide mechanism 200 , a backplane connector 400 is disposed at the front end of the board 100 , and the temperature sensor 300 is electrically connected to the backplane connector 400 for outputting a temperature detection signal.

[0039] In this embodiment, there can be one or more temperature sensors 300. In this embodiment, there are two temperature sensors 300, which are respectively arranged on the first air guide plate 210 and the second air guide plate 220, so that the inlet temperature and the outlet temperature can be obtained in real time. The temperature sensor 300 is electrically connected to the backplane connector 400. The function of the backplane connector 400 is to connect the temperature sensor 300 and the control module inside the chassis. The control module can judge the heat dissipation effect by identifying the inlet temperature and the outlet temperature, and control the speed of the cooling fan of the chassis according to the heat dissipation effect to achieve a dynamic balance between heat dissipation and energy saving and quietness.

[0040] In some implementations, a baffle 130 is disposed at the end of the board 100 , and mesh heat dissipation holes are disposed on the baffle 130 .

[0041] In this embodiment, by providing a baffle 130 with mesh heat dissipation holes at the end of the board 100, air can flow through, thereby enhancing the heat dissipation effect and preventing larger debris and insects from entering the chassis.

[0042] The present application also relates to a board device, including a chassis, wherein the slots in the chassis are alternately provided with functional modules 500 and the air guide modules of the above-mentioned embodiment, with reference to Figure 3 As shown, in this embodiment, the functional module 500 and the air guide module use the same type of board, and the air guide module is located in an adjacent slot of the functional module 500.

[0043] refer to Figure 4 As shown, when the functional module 500 and the air guide module are respectively installed in adjacent slots, the flowing air in the slot where the air guide module is located is blown toward the heat sink of the functional module 500 through the first air guide plate 210, and then flows out through the second vent 120 and the second air guide plate 220. The air can be guided to the heat sink of the functional module 500 through the air guide module to improve the heat dissipation effect.

[0044] The present application also relates to an electronic device, comprising the board device of the above embodiment.

[0045] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. An air guide module installed in a chassis, characterized in that: include: A board (100) is used to be inserted into an empty slot of a chassis; An air guide mechanism (200), the air guide mechanism (200) being mounted on the board (100) and used for guiding air to adjacent slots; The air guide mechanism (200) comprises a first air guide plate (210) arranged obliquely, the first air guide plate (210) being mounted on a side of the board (100) away from an adjacent slot, and a first vent (110) matching the first air guide plate (210) is provided on the side of the board (100) so as to allow air guided by the first air guide plate (210) to pass through the first vent (110) and enter the adjacent slot; The air guide mechanism (200) further comprises a second air guide plate (220), the second air guide plate (220) being mounted on a side of the board (100) away from an adjacent slot and located at a rear end of the first air guide plate (210), the second air guide plate (220) being inclined in an opposite direction to the first air guide plate (210), and a second ventilation opening (120) matching the second air guide plate (220) being provided on a side of the board (100).

2. The air guide module according to claim 1, characterized in that: The air guide mechanism (200) further comprises a connecting plate (230), wherein the connecting plate (230) is fixed on a side surface of the board (100) between the first vent (110) and the second vent (120), and the end of the first air guide plate (210) is connected to the front end of the second air guide plate (220) via the connecting plate (230).

3. The air guide module according to claim 1, characterized in that: A temperature sensor (300) is provided on the air guide mechanism (200), a backplane connector (400) is provided at the front end of the board (100), and the temperature sensor (300) is electrically connected to the backplane connector (400) for outputting a temperature detection signal.

4. The air guide module according to claim 1, characterized in that: A baffle (130) is provided at the end of the board (100), and mesh heat dissipation holes are provided on the baffle (130).

5. A board device, characterized in that: It comprises a chassis, wherein slots in the chassis are alternately provided with functional modules (500) and the air guide module according to any one of claims 1 to 4.

6. An electronic device, characterized in that: Includes the board device as claimed in claim 5.

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