AME multi-layer plate lamination glue removing tool

Abstract

The utility model discloses an AME multi-layer plate lamination glue removing tool which comprises a base, a pressing plate and a pressure adjusting assembly. The pressing plate is arranged above the base in parallel, a space for horizontally placing the AME multi-layer plate is arranged between the base and the pressing plate, a first middle hole is formed in the base, a second middle hole is formed in the pressing plate, the first middle hole and the second middle hole are coaxially formed, and the space is located between the first middle hole and the second middle hole. The first middle hole and the second middle hole in the tool design are coaxially arranged, so that overflow can be effectively controlled and removed in the pressure applying process, and the tidiness of the AME multi-layer board and the stability of a circuit are kept. By means of the pressure adjusting assembly, pressure can be evenly applied to the AME multi-layer board, it is ensured that silver glue is evenly distributed and bonded between board layers, and therefore bonding quality and reliability are remarkably improved.

Description

Technical Field

[0001] The utility model belongs to the field of electronic manufacturing and relates to a tool for removing glue from AME multilayer boards. Background Art

[0002] In the field of electronic manufacturing, especially the development of Additively Manufactured Electronic (AME) technology, it has brought revolutionary changes to the design and manufacturing of electronic devices. AME technology can realize the rapid printing of complex electronic circuits by stacking layer by layer, greatly improving production efficiency and reducing costs.

[0003] However, in the manufacturing process of AME multilayer boards, the bonding between boards is a key technical link. The traditional bonding method usually uses silver glue as a conductive adhesive to tightly bond the multilayer boards together by applying pressure to ensure the stability and reliability of the electrical connection.

[0004] However, in the process of implementing the present invention, the inventors found that the prior art has at least one of the following technical problems:

[0005] 1) During the process of applying pressure, due to the certain fluidity of silver glue, it is easy to overflow from the inner hole gap of the multilayer board. This not only affects the appearance of the product, but also may have an adverse effect on the performance of the circuit.

[0006] 2) It is difficult to ensure the uniformity and consistency of pressure during manual operation, which leads to unstable bonding quality and increases the defective rate of products.

[0007] 3) Traditional bonding and debonding processes mostly rely on manual operations, which are inefficient and difficult to meet the needs of large-scale production.

[0008] 4) Since the silver glue has a certain viscosity before curing, the wiping action may generate unnecessary external force on the already placed AME multilayer board, causing the AME multilayer board to be misplaced or offset. This tiny movement may not be immediately noticeable, but in subsequent use, it may cause problems in the connection between AME multilayer boards. Utility Model Content

[0009] In view of the shortcomings of the prior art, the utility model aims to provide an AME multi-layer board lamination glue removal tooling with simple structure, convenient operation, low cost and effective solution to the problem of silver glue overflow. The tooling can realize uniform pressure on the multi-layer board and provide a simple glue removal mechanism to improve the bonding quality, reduce the defective rate and improve the operation efficiency.

[0010] The inventor has continuously reformed and innovated through long-term exploration and attempts, as well as multiple experiments and efforts, to solve the above technical problems. The technical solution provided by the utility model is to provide an AME multi-layer board lamination glue removal tool, including:

[0011] A base for supporting AME multilayer boards,

[0012] A pressing plate for pressing AME multilayer boards,

[0013] A pressure regulating assembly for adjusting the pressure applied to the AME multilayer board;

[0014] The pressing plate is arranged parallel to the base, and a space for placing the AME multilayer board flat is provided between the base and the pressing plate. A first center hole is provided on the base, and a second center hole is provided on the pressing plate. The first center hole and the second center hole are arranged coaxially, and the space is located between the first center hole and the second center hole.

[0015] According to an embodiment of the AME multi-layer board lamination glue removal tooling of the utility model, the pressure regulating assembly includes a screw rod and a nut used in conjunction with each other.

[0016] According to an embodiment of the AME multi-layer board lamination and glue removal tooling of the utility model, a plurality of seat arms for connecting screw rods are arranged on the base, each seat arm extends from the base and is arranged in a spoke shape, and each seat arm is connected to a screw rod.

[0017] According to an embodiment of the AME multi-layer board lamination and glue removal tooling of the utility model, a plurality of pressing arms for slidingly connecting screw rods are arranged on the pressing plate, each pressing arm extends from the pressing plate and is arranged in a spoke shape; each pressing arm is connected to a screw rod, and the nut is located above the pressing arm.

[0018] According to an embodiment of the AME multi-layer board lamination glue removal tooling of the utility model, a sliding hole is provided on the pressing arm, and the sliding hole is slidably matched with the screw rod.

[0019] According to an embodiment of the AME multi-layer board lamination and glue removal tooling of the utility model, the distance between two adjacent screws is greater than the outer diameter of the AME multi-layer board.

[0020] According to an embodiment of the AME multilayer board lamination glue removal tooling of the utility model, the aperture of the first middle hole is not less than the aperture of the inner hole on the AME multilayer board.

[0021] According to an embodiment of the AME multilayer board lamination glue removal tooling of the utility model, the aperture of the second middle hole is not less than the aperture of the inner hole on the AME multilayer board.

[0022] According to an embodiment of the AME multi-layer board lamination glue removal tool of the utility model, it also includes a silver glue wiping tool.

[0023] According to an embodiment of the AME multi-layer board lamination glue cleaning tool of the utility model, the wiping tool is a dust-free cloth cotton swab.

[0024] Compared with the prior art, the AME multi-layer board lamination glue removal tooling of the utility model achieves the following significant technical effects through its unique design and structure:

[0025] a) The first and second center holes in the tooling design are coaxially arranged, so that when pressure is applied, overflow can be effectively controlled and cleared, maintaining the neatness of the AME multilayer board and the stability of the circuit.

[0026] b) Through the coordinated use of the pressure regulating assembly, including the screw and the nut, the utility model can evenly apply pressure to the AME multilayer board to ensure the uniform distribution and bonding of the silver glue between the board layers, thereby significantly improving the quality and reliability of the bonding.

[0027] c) The tooling structure of the utility model is simple and intuitive, and the operator can quickly master the use method to perform the lamination and glue removal work of the AME multilayer board, which greatly simplifies the operation process and reduces the difficulty of operation.

[0028] d) Compared with traditional manual operation, the tooling of the utility model significantly improves production efficiency and reduces production cycle through automated pressure adjustment and glue clearing mechanism, which helps to meet the needs of large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a front structural schematic diagram of a preferred embodiment of the AME multi-layer board lamination and glue removal tooling of the utility model.

[0031] Figure 2 yes Figure 1 Schematic diagram of the right view structure.

[0032] Figure 3 yes Figure 1 Schematic diagram of the rear view structure.

[0033] Figure 4 yes Figure 1 Schematic diagram of the top view structure.

[0034] Figure 5 yes Figure 1 Schematic diagram of the three-dimensional structure.

[0035] Figure 6 yes Figure 4 AA section diagram.

[0036] The marks in the figure are:

[0037] 100 bases,

[0038] 110 first middle hole,

[0039] 120 seat arm,

[0040] 200 pressure plates,

[0041] 210 Second Middle Hole,

[0042] 220 pressure arm,

[0043] 221 sliding hole,

[0044] 300 voltage regulator assembly,

[0045] 310 screw,

[0046] 320 nut,

[0047] 400AME multilayer board,

[0048] 410 inner hole. DETAILED DESCRIPTION

[0049] The following is a description with reference to the accompanying drawings and a specific embodiment.

[0050] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is claimed, but merely represents the selected embodiments of the utility model.

[0051] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, it may not be further defined or explained in the subsequent drawings.

[0052] See also Figures 1 to 6The AME multi-layer board lamination adhesive removal tool described in this embodiment includes: a base 100, a pressing plate 200 and a pressing device 300.

[0053] The base 100 is designed as a planar structure, and a support ring is provided on its upper surface for stably supporting the AME multilayer board 400. The material of the base 100 can be metal or engineering plastic, and appropriate strength and stability can be selected according to needs. When in use, the base 100 is placed on a horizontal workbench.

[0054] The pressing plate 200 is designed as a planar structure, and its size matches the base 100, and can cover the entire AME multilayer board 400. The material of the pressing plate 200 can also be selected from metal or engineering plastic to ensure sufficient rigidity when pressure is applied.

[0055] The main function of the pressure regulating assembly 300 is to adjust the pressure applied to the AME multilayer board 400 to ensure that the silver glue can be evenly distributed and form a stable bond. The pressure regulating assembly 300 can be any pressure applying device that can achieve precise pressure adjustment.

[0056] For example:

[0057] Hydraulic cylinder: The pressure regulating assembly 300 may be a hydraulic cylinder, which adjusts the pressure applied to the pressure plate 200 by controlling the liquid pressure in the hydraulic system. The hydraulic cylinder has the advantages of stable pressure output and good controllability, and is suitable for occasions requiring precise pressure control.

[0058] Cylinder: In some applications, the pressure regulating assembly 300 may also be a cylinder, which uses compressed air as a power source to push the pressing plate 200. The cylinder has the characteristics of simple structure and fast response speed, and is suitable for production lines with certain speed requirements.

[0059] Mechanical pressure regulating device: The pressure regulating assembly 300 may also use a mechanical pressure regulating device, such as a coil spring, a weight, etc., to mechanically regulate and maintain the pressure applied to the AME multilayer board 400.

[0060] Servo motor drive system: In order to realize automated and intelligent production, the pressure regulating component 300 can be a servo motor drive system, which adjusts the pressure by precisely controlling the speed and torque of the motor to realize automated control and data recording.

[0061] In the preferred embodiment of the present invention, in order to simplify the result and reduce the tooling manufacturing cost, the pressure regulating assembly 300 includes a screw rod 310 and a nut 320. The screw rod 310 is vertically fixed on the base 100, and the nut 320 is installed above the pressing plate 200. By rotating the nut 320, the pressing plate 200 moves up and down along the screw rod 310, so as to adjust the pressure applied to the AME multilayer board 400.

[0062] In the preferred embodiment of the present invention, a combination of a screw and a nut is used, but any of the above-mentioned pressure-applying devices can be replaced or integrated into the tooling of the present invention according to specific production conditions and requirements without departing from the protection scope of the present invention. The pressing plate 200 is arranged parallel to the base 100, and a space for laying the AME multilayer board 400 is provided between the base 100 and the pressing plate 200. The base 100 is provided with a first central hole 110, and the pressing plate 200 is provided with a second central hole 210. The first central hole 110 and the second central hole 210 are arranged coaxially, and the space is located between the first central hole 110 and the second central hole 210.

[0063] In a further embodiment, a plurality of seat arms 120 are provided on the base 100, and the seat arms 120 extend outward from the base 100 and are arranged in a spoke shape. One end of each seat arm 120 is fixed to the base 100, and the other end is connected to a screw rod 310. The design of the seat arms 120 not only enhances the structural strength of the base, but also provides multiple connection points through the spoke-shaped layout, so that the pressure applied to the pressure plate 200 is more uniform.

[0064] The base 100 is provided with a plurality of base arms 120, which extend outward from the base 100 and are arranged in a spoke shape. One end of each base arm 120 is fixed to the base 100, and the other end is connected to a screw rod 310. The design of the base arm 120 not only enhances the structural strength of the base, but also provides multiple connection points through the spoke-shaped layout, so that the pressure applied to the pressure plate 200 is more uniform.

[0065] In order to achieve the smooth movement of the pressing plate 200, each pressing arm 220 is provided with a sliding hole 221. The sliding hole 221 is slidably matched with the screw rod 310 to ensure that the pressing plate 200 can apply pressure smoothly and stably, and the size of the pressure is conveniently adjusted.

[0066] The spacing between two adjacent screw rods 310 is designed to be larger than the outer diameter of the AME multilayer board 400. Such a layout ensures that no matter where the AME multilayer board 400 is placed on the tooling, the screw rods 310 will not cause interference. At the same time, it also provides the operator with sufficient space to operate, making it convenient to put / remove the AME multilayer board 400 into / from the space between the base 100 and the pressure plate 200 where the AME multilayer board 400 is placed flat.

[0067] In order to facilitate the glue cleaning operation, the diameters of the first middle hole 110 on the base 100 and the second middle hole 210 on the pressing plate 200 are designed to be no less than the diameter of the inner hole 410 on the AME multilayer board 400. In this way, the glue cleaning tool can easily pass through these middle holes to reach the inner hole of the AME multilayer board 400 for effective glue cleaning. Figure 4 and Figure 6The diagram shows a situation where the diameters of the first middle hole 110 and the second middle hole 210 are equal and are significantly larger than the diameter of the inner hole 410 .

[0068] In a further embodiment, a silver glue wiping tool is also included, and the wiping tool is a dust-free cotton swab (not shown in the figure). The silver glue wiping tool is used to clean the silver glue overflowing from the inner hole 410 of the AME multilayer board 400 after the bonding and pressing process. The dust-free cotton swab is made of dust-free paper or non-woven fabric, the head of the cotton swab is a fluffy cotton ball, and the tail is a slender rod handle. The design of the dust-free cotton swab ensures that no additional dust or impurities are introduced during the wiping process, ensuring the cleanliness requirements of the electronic manufacturing process. When in use, the operator can hold the dust-free cotton swab and insert it into the inner hole 410 of the AME multilayer board 400 through the first middle hole 110 on the base 100 or the second middle hole 210 on the pressing plate 200. Since the aperture of the first middle hole 110 and the second middle hole 210 is designed to be not less than the aperture of the inner hole 410, the dust-free cotton swab can easily reach the part that needs to be cleaned. The fluffy cotton ball of the dust-free cotton swab can effectively absorb and remove the overflowed silver glue, and the length of the handle prevents the operator from directly contacting the silver glue, which not only protects the operator's safety but also avoids secondary contamination of the silver glue.

[0069] The utility model tool is used to accurately apply pressure to silver glue and clean up the overflowed silver glue during the multilayer lamination process of additive manufacturing electronic circuit (AME) to ensure the firm bonding and electrical connection between the multilayer boards. The specific use steps are as follows:

[0070] Use alcohol or other cleaning agents to clean the base 100, the pressing plate 200 and related parts of the tooling to ensure that they are free of dust and impurities.

[0071] Place the AME multilayer board 400 on the base 100 to ensure accurate positioning. Use a glue dispenser to evenly apply a proper amount of silver glue on the designated position of the AME multilayer board 400.

[0072] Align another AME multilayer board 400 and place it on the glue-dispensed multilayer board, and press it lightly to allow the silver glue to initially adhere.

[0073] The pressure regulating assembly 300 is adjusted to control the descent of the pressing plate 200 through the screw rod 310 and the nut 320 , so as to evenly apply pressure to the AME multilayer board 400 .

[0074] If silver glue overflows from the inner hole 410 under pressure, use a dust-free cotton swab to wipe and clean it through the first middle hole 110 to the middle hole 410 .

[0075] Maintaining a certain pressure, the tooling together with the multilayer board 400 is placed in an oven for high-temperature curing.

[0076] After curing is completed, the screw rod 310 is rotated in the opposite direction to raise the pressure plate 200 and release the pressure. The AME multilayer board 400 is taken out to check the bonding quality and the adhesive removal effect to ensure that there is no residual silver adhesive and the bonding is firm.

[0077] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0078] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0079] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0080] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0081] The above are only preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention. The protection scope of the present invention should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An AME multi-layer board lamination glue removal tool, characterized in that: include: A base for supporting AME multilayer boards, A pressing plate for pressing AME multilayer boards, A pressure regulating assembly for adjusting the pressure applied to the AME multilayer board; The pressing plate is arranged parallel to the base, and a space for placing the AME multilayer board flat is provided between the base and the pressing plate. A first center hole is provided on the base, and a second center hole is provided on the pressing plate. The first center hole and the second center hole are arranged coaxially, and the space is located between the first center hole and the second center hole.

2. The AME multi-layer board lamination glue removal tool according to claim 1, characterized in that: The pressure regulating assembly comprises a screw rod and a nut which are used together.

3. The AME multi-layer board lamination glue removal tool according to claim 2, characterized in that: The base is provided with a plurality of seat arms for connecting the screw rods, each seat arm extends from the base and is arranged in a spoke shape, and each seat arm is connected to a screw rod.

4. The AME multi-layer board lamination glue removal tool according to claim 2, characterized in that: The pressure plate is provided with a plurality of pressure arms for slidingly connecting the screw rods, each of which extends from the pressure plate and is arranged in a spoke shape; each pressure arm is connected to a screw rod, and the nut is located above the pressure arm.

5. The AME multi-layer board lamination glue removal tool according to claim 4, characterized in that: The pressure arm is provided with a sliding hole, and the sliding hole is slidably matched with the screw rod.

6. The AME multi-layer board lamination glue removal tool according to claim 3, characterized in that: The distance between two adjacent screws is greater than the outer diameter of the AME multilayer board.

7. The AME multi-layer board lamination glue removal tool according to claim 1, characterized in that: The aperture of the first mesopore is not less than the aperture of the inner hole on the AME multilayer board.

8. The AME multi-layer board lamination glue removal tool according to claim 1, characterized in that: The aperture of the second mesopore is not less than the aperture of the inner hole on the AME multilayer board.

9. The AME multi-layer board lamination glue removal tool according to claim 1, characterized in that: Also includes a silver glue wiping tool.

10. The AME multi-layer board lamination glue removal tool according to claim 9, characterized in that: The wiping tool is a dust-free cotton swab.

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