Detection device for rotating speed of wafer
By setting notches on the wafer and using the light on and off time difference to detect the rotation speed, the inaccurate detection and driven wheel wear problems caused by thickness differences in the prior art are solved, and the effect of accurate detection and cost reduction is achieved.
Patent Information
- Application Number
- CN202323076706.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-14
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2033-11-14
AI Technical Summary
The existing wafer speed detection method causes inaccurate detection due to different wafer thicknesses, and the driven wheel is prone to wear, which increases practical cost.
A detection device including opening a notch on one side of the wafer is designed, which detects the wafer speed by emitting and receiving light, and calculates the speed by calculating the light on and off time difference, which is suitable for wafers and speeds of different thicknesses.
It realizes accurate detection of speed regardless of wafer thickness and speed, reducing wear of driven wheels and reducing detection costs.
Smart Images
Figure CN222299642U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer rotation speed detection device. Background Art
[0002] When cleaning the wafer, it is necessary to rotate the wafer at high speed to achieve a better cleaning effect. However, it is very important to detect the actual rotation speed of the wafer during the rotation process. Only by accurately detecting the actual rotation speed of the wafer can the rotation speed be accurately controlled to achieve a better cleaning effect.
[0003] The existing method of using a wafer to drive a driven wheel to detect the rotation speed of the wafer will result in inaccurate actual rotation speed detection due to different wafer thicknesses. Because the thickness of wafers from different processes is different, the friction between the wafer and the driven wheel will also be different. When the wafer is thicker, the contact surface between the wafer and the driven wheel is larger, and the friction is also greater, which can accurately feedback the rotation speed of the wafer. However, when the wafer is thinner, the contact surface between the wafer and the driven wheel is smaller, and the friction is also smaller. It is impossible to drive the driven wheel 100%, and the rotation speed of the wafer cannot be accurately detected. The method of using a wafer to drive a driven wheel to detect the rotation speed is to use the friction between the wafer and the driven wheel to drive the driven wheel to rotate to detect the rotation speed. The driven wheel will wear and needs to be replaced regularly, which increases the practical cost. Utility Model Content
[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of easy wear of wafer rotation speed detection in the prior art, thereby providing a wafer rotation speed detection device.
[0005] The utility model provides a wafer rotation speed detection device, which is characterized by comprising:
[0006] A wafer with a notch cut out on one side;
[0007] A detection device is arranged on one side of the wafer; the detection device is suitable for emitting light, and the light is located in the notch opened in the wafer.
[0008] As a preferred solution, the detection device includes a detection body and a first detection arm and a second detection arm located at two ends of the detection body.
[0009] As a preferred solution, the first detection arm and the second detection arm are extended toward the wafer.
[0010] As a preferred solution, the first detection arm is located at the top end of the detection body, and the second detection arm is located at the bottom end of the detection body.
[0011] As a preferred solution, the detection device further comprises: a transmitter and a receiver, wherein the transmitter and the receiver are respectively arranged on the first detection arm and the second detection arm; the transmitter is suitable for emitting light, and the receiver is suitable for receiving light.
[0012] As a preferred solution, the transmitter is arranged on the first detection arm.
[0013] As a preferred solution, the receiver is arranged on the second detection arm.
[0014] The technical solution of the utility model has the following advantages:
[0015] 1. The utility model provides a wafer rotation speed detection device, comprising: a wafer and a detection device, wherein a notch is provided on one side of the wafer, and the detection device is arranged on the side of the wafer; the detection device is suitable for emitting light, and the light is located in the notch provided on the wafer. When the wafer rotates, the notch will also rotate, and the propagation of the light will be cut off after the wafer rotates. After the wafer rotates one circle, the light will be connected again. The time difference between the on and off of the light is the time taken for the wafer to rotate one circle, and the rotation speed of the wafer can be calculated. In this way, the rotation speed of the wafer can be accurately detected regardless of the thickness and rotation speed of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 The utility model provides a schematic diagram of the overall structure of a wafer rotation speed detection device.
[0018] Description of reference numerals:
[0019] 1. Wafer; 11. Notch; 2. Detection device; 21. Detection body; 22. First detection arm; 23. Second detection arm. DETAILED DESCRIPTION
[0020] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.
[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0024] like Figure 1 As shown, this embodiment provides a detection device 2 for detecting the rotation speed of a wafer 1, comprising: a wafer 1 and a detection device 2, wherein a notch 11 is provided on one side of the wafer 1, and the detection device 2 is arranged on the side of the wafer 1; the detection device 2 is suitable for emitting light, and the light is located in the notch 11 provided on the wafer 1. When the wafer 1 rotates, the notch 11 will also rotate, and the propagation of the light will be cut off after the wafer 1 rotates. After the wafer 1 rotates one circle, the light will be connected again. The time difference between the on-off of the light is the time taken for the wafer 1 to rotate one circle, and the rotation speed of the wafer 1 can be calculated. In this way, the rotation speed of the wafer 1 can be accurately detected regardless of the thickness and rotation speed of the wafer 1.
[0025] It should be noted that the notch 11 in the present embodiment may also be directly replaced by a corner notch in the wafer 1. In order to ensure a uniform position of the wafer 1 during the inspection process of the wafer 1, a corner notch is generally provided on one side of the wafer 1. The corner notch serves a positioning function to ensure that the position of the wafer 1 is uniform during each inspection process.
[0026] It should be noted that the detection device 2 for the rotation speed of the wafer 1 in this embodiment is used synchronously with the cleaning unit. Existing cleaning units can generally be divided into two categories, namely vertical cleaning and horizontal cleaning. As the name implies, vertical cleaning means that the wafer 1 is upright, and the wafer 1 will jump during the rotation of the wafer 1, while horizontal cleaning means that the four driving rollers of the wafer 1 are locked, and the wafer 1 will be relatively stable during the rotation, which provides conditions for us to detect the rotation speed by detecting the notch 11 of the wafer 1 through light.
[0027] Furthermore, the detection device 2 includes a detection body 21 and a first detection arm 22 and a second detection arm 23 located at two ends of the detection body 21 .
[0028] It should be noted that the first detection arm 22 and the second detection arm 23 are both extended toward the wafer 1. The extension length of the first detection arm 22 and the second detection arm 23 is set according to the size of the notch 11 to ensure that the first detection arm 22 and the second detection arm 23 do not exceed the range of the notch 11.
[0029] Further, in this solution, the first detection arm 22 is located at the top of the detection body, and the second detection arm 23 is located at the bottom of the detection body 21. As an alternative embodiment, the first detection arm 22 can also be set at the bottom of the detection body 21, and the second detection arm 23 can be set at the top of the detection body 21.
[0030] Further, the detection device 2 also includes a transmitter and a receiver, which are respectively arranged on the first detection arm 22 and the second detection arm 23, the transmitter is suitable for emitting light, and the receiver is suitable for receiving light. In this embodiment, the transmitter is an infrared transmitter, and the receiver is an infrared receiver. Specifically, the transmitter is arranged on the first detection arm 22, and the receiver is arranged on the second detection arm 23. As an alternative embodiment, the transmitter is arranged on the second detection arm 23, and the receiver is arranged on the first detection arm 22.
[0031] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A device (2) for detecting a rotation speed of a wafer (1), characterized in that: include: A wafer (1) having a notch (11) formed on one side; A detection device (2) is arranged on one side of the wafer (1); the detection device (2) is suitable for emitting light, and the light is located in the notch (11) opened in the wafer (1); The detection device (2) comprises a detection body (21) and a first detection arm (22) and a second detection arm (23) located at two ends of the detection body (21); The first detection arm (22) and the second detection arm (23) are extended towards the wafer (1).
2. The device (2) for detecting the rotation speed of a wafer (1) according to claim 1, characterized in that: The first detection arm (22) is located at the top end of the detection body (21), and the second detection arm (23) is located at the bottom end of the detection body (21).
3. The device (2) for detecting the rotation speed of a wafer (1) according to claim 2, characterized in that: The detection device (2) further comprises: a transmitter and a receiver, wherein the transmitter and the receiver are respectively arranged on the first detection arm (22) and the second detection arm (23); the transmitter is suitable for emitting light, and the receiver is suitable for receiving light.
4. The device (2) for detecting the rotation speed of a wafer (1) according to claim 3, characterized in that: The transmitter is arranged on the first detection arm (22).
5. The device (2) for detecting the rotation speed of a wafer (1) according to claim 3, characterized in that: The receiver is arranged on the second detection arm (23).