Laser projection equipment

Abstract

The embodiment of the utility model belongs to the laser projection technology, and provides laser projection equipment which comprises a shell and a first radiator, the shell is provided with an air outlet structure and a first air inlet structure, the first radiator comprises a first substrate, a heat pipe and a fin module, and the first substrate and the heat pipe are oppositely arranged; the main shell is located between the first substrate and the fin module; the laser is arranged on the main shell and abuts against the first substrate; the digital micromirror device is arranged on the side, away from the laser, of the main shell, and the digital micromirror device is located on the side, away from the heat pipe, of the laser; the second radiator abuts against the digital micro-mirror device, and the second radiator is located on the side, facing the fin module, of the digital micro-mirror device; and the fan is configured to drive air outside the shell to flow to the outside through the first air inlet structure, the second radiator, the fin module and the air outlet structure. The heat dissipation efficiency is high.

Description

Technical Field

[0001] This application relates to laser projection technology. In particular, it relates to a laser projection device. Background Technology

[0002] The demand for consumer electronics is growing rapidly. On the one hand, consumers are demanding smaller electronic products. On the other hand, they are also demanding higher performance and greater intelligence from their electronic products. This leads to smaller product sizes, higher heat density, and increased difficulty in heat dissipation. For laser projection equipment, heat dissipation is a crucial factor. Overheating can cause performance degradation or even damage.

[0003] In related technologies, laser projection equipment uses air cooling for heat dissipation.

[0004] However, laser projection equipment has poor heat distribution and low heat dissipation efficiency. Utility Model Content

[0005] This application provides a laser projection device with high heat dissipation efficiency.

[0006] In a first aspect, embodiments of this application provide a laser projection device, including:

[0007] The outer shell has an inner cavity and an air outlet structure and a first air inlet structure, both of which are connected to the inner cavity.

[0008] The first heat sink is located in the inner cavity. The first heat sink includes a first substrate, a heat pipe and a fin module connected in sequence, and the first substrate and the heat pipe are arranged opposite to each other.

[0009] The main housing is located between the first substrate and the fin module;

[0010] A laser is mounted on the main housing and abuts against the first substrate;

[0011] The digital micromirror device is located on the side of the main housing away from the laser, and the digital micromirror device is located on the side of the laser away from the heat pipe.

[0012] The second heat sink is in contact with the digital micromirror device and is located on the side of the digital micromirror device facing the fin module.

[0013] The fan, located in the inner cavity, is configured to drive air from outside the housing through a first air intake structure, a second heat sink, a fin module, and an air outlet structure to the outside.

[0014] The heat generated by the laser is unevenly distributed across the finned module. In areas with shorter heat pipe paths, the finned module temperature is higher, while in areas with longer heat pipe paths, the temperature is lower. The heat generated by the digital micromirror device is channeled through the cooler areas of the finned module by the fan, increasing the heat distribution in those areas and improving the heat evenness across the finned module. The fan's cooling capacity is fully utilized, resulting in good overall cooling performance and high heat dissipation efficiency.

[0015] In some embodiments of this application, the fin module is close to and opposite to the air outlet structure.

[0016] In this way, there is no obstruction between the fin module and the air outlet structure, which helps to shorten the heat transfer path and improve heat dissipation efficiency.

[0017] In some embodiments of this application, the second heat sink includes a second substrate and a plurality of heat sink pillars. The second substrate abuts against the digital micromirror device, and the plurality of heat sink pillars are arranged in an array on the side of the second substrate facing the fin module.

[0018] In this way, compared to fins, heat dissipation columns have lower surface resistance, facilitating airflow. Furthermore, the total surface area of ​​the heat dissipation columns can be larger, resulting in stronger heat dissipation capacity.

[0019] In some embodiments of this application, the fan is located between the second heat sink and the fin module.

[0020] In this way, the fan can simultaneously cool both the second radiator and the fin module. Furthermore, it helps save space.

[0021] In some embodiments of this application, the number of fans is at least two, the at least two fans are arranged side by side, and the at least two fans are opposite to the fin module.

[0022] This can improve heat dissipation efficiency.

[0023] In some embodiments of this application, the housing further includes a second air inlet structure;

[0024] The air outlet structure is located on the opposite side of the first air inlet structure, the second air inlet structure is located on a different side from the first air inlet structure and on a different side from the air outlet structure, and the second air inlet structure is located on at least one outer wall of the housing.

[0025] This reduces the back pressure on the fan, lowers noise, and improves cooling performance.

[0026] In some embodiments of this application, a lens is also included. The lens is disposed on the main housing, on the side of the main housing away from the digital micromirror device, and the lens is opposite to the digital micromirror device. The laser and the lens are located on the same side of the main housing.

[0027] The outer casing has a clearance opening to avoid the light-emitting end of the lens, and the first air intake structure is located on the same side as the clearance opening.

[0028] In this way, the higher-temperature second heat sink and the lens with increased flow resistance are arranged in the lower-temperature area of ​​the fin module, which is conducive to the even distribution of heat.

[0029] In some embodiments of this application, the first air inlet structure includes a first air inlet portion and a second air inlet portion, the outer casing includes a front wall, and a clearance opening is disposed on the front wall.

[0030] The first air inlet is arranged around the perimeter of the front wall and close to the edge of the front wall;

[0031] The second air intake and the avoidance opening are located within the area enclosed by the first air intake.

[0032] This increases the air intake area and improves airflow.

[0033] In some embodiments of this application, it further includes:

[0034] Engine mount, the engine mount is located in the inner cavity;

[0035] The heat sink is located in the inner cavity and is connected to the engine bracket. The heat sink and the engine bracket form a mounting cavity. The first radiator, the main housing, the laser, the digital micromirror device, and the second radiator are located in the mounting cavity.

[0036] The first electronic board is located on the side of the heat sink away from the engine mount and is in contact with the heat sink.

[0037] This improves overall strength and facilitates equipment integration, reducing size.

[0038] In some embodiments of this application, the spacing between the fan and the second substrate is 0.5-1 times the hub diameter of the fan.

[0039] This allows for more airflow space behind the fan, reducing back pressure and thus helping to lower fan noise. Attached Figure Description

[0040] To more clearly illustrate the implementation methods in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0041] Figure 1 This is a schematic diagram of the structure of a laser projection device at a first angle provided in an embodiment of this application;

[0042] Figure 2 This is a schematic diagram of the second angle of the laser projection device provided in the embodiments of this application;

[0043] Figure 3 This is a schematic diagram of the structure of the laser projection device after removing the outer casing, as provided in the embodiments of this application.

[0044] Figure 4 for Figure 3 Exploded view;

[0045] Figure 5 for Figure 3 A schematic diagram of the internal component layout of a laser projection device;

[0046] Figure 6 This is a schematic diagram of the structure of the optical engine in the laser projection device provided in the embodiments of this application;

[0047] Figure 7 for Figure 6 Another structural diagram;

[0048] Figure 8 This is a schematic diagram of the structure of the first heat sink in the laser projection device provided in the embodiments of this application;

[0049] Figure 9 A schematic diagram of the structure of the main housing, laser, digital micromirror device, and lens in the laser projection device provided in the embodiments of this application;

[0050] Figure 10 for Figure 9 Another structural diagram;

[0051] Figure 11 This is a schematic diagram of the structure of the second heat sink in the laser projection device provided in the embodiments of this application;

[0052] Figure 12 This is a structural schematic diagram of the second heat sink in the laser projection device provided in an embodiment of this application from another angle;

[0053] Figure 13 This is a schematic diagram of the third angle of the laser projection device provided in the embodiments of this application;

[0054] Figure 14 This is a schematic diagram of the fourth angle of the laser projection device provided in the embodiments of this application;

[0055] Figure 15 This is a schematic diagram of the structure of the front wall of the housing in the laser projection device provided in the embodiments of this application.

[0056] Figure label:

[0057] 100 - Outer shell; 110 - Air outlet structure; 120 - First air inlet structure; 121 - First air inlet section; 122 - Second air inlet section; 130 - Clearance opening; 140 - Second air inlet structure;

[0058] 200 - Optical engine; 210 - First heat sink; 211 - First substrate; 212 - Heat pipe; 213 - Fin module; 220 - Main housing; 230 - Laser; 240 - Digital micromirror device; 250 - Second heat sink; 251 - Second substrate; 252 - Heat dissipation column; 260 - Lens;

[0059] 300-fan;

[0060] 400-Engine Mount;

[0061] 500 - First Electronic Board;

[0062] 600 - Second electronic board;

[0063] 700-Heat Discharge Plate;

[0064] 800-speaker;

[0065] 900 - Support structure. Detailed Implementation

[0066] As described in the background section, when laser projection equipment is designed to be miniaturized, the internal heat sources are closer together, resulting in poor heat distribution across different locations. When the fan is used for air cooling, the efficiency is low, and the fan is prone to generating noise.

[0067] Specifically, the laser and the digital micromirror device (DMD) generate significant heat. Both the laser and the DMD are mounted on the main housing. The laser utilizes a first heat sink for cooling, while the DMD utilizes a second heat sink. The first heat sink is a heat pipe heat sink, comprising a first substrate, a heat pipe, and a finned module connected sequentially, with the first substrate and heat pipe positioned opposite each other. However, in areas with shorter heat pipe heat transfer paths, the finned module temperature is higher, requiring a larger cooling capacity from the fan. Conversely, in areas with longer heat pipe heat transfer paths, the finned module temperature is lower, requiring a smaller cooling capacity from the fan. In other words, the heat distribution on the finned module is uneven, and the required cooling capacity from the fan varies. When the DMD is located near the hotter side of the finned module, this heat imbalance is amplified. With a fixed fan cooling capacity, the fan is less effective at cooling the hotter areas of the finned module and more effective at cooling the cooler areas, resulting in low overall cooling efficiency. Furthermore, the fan is prone to noise when under heavy load.

[0068] To address the aforementioned technical issues, the laser projection device provided in this application places the main housing between the first heat sink substrate and the finned module. The digital micromirror device (DMM) is positioned on the side of the laser away from the heat pipe and opposite the finned module; that is, the DMM is close to the cooler area of ​​the finned module. The heat generated by the DMM is transferred to the second heat sink. With the help of a fan, the heat on the surface of the second heat sink is exhausted through the exhaust structure after passing through the cooler area of ​​the finned module. This increases the heat in the cooler areas of the finned module, resulting in better heat distribution across the finned module. The cooling capacity of the fan is fully utilized, leading to better overall cooling and higher heat dissipation efficiency. Furthermore, it is less prone to noise generation.

[0069] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only some embodiments of this application, and not all embodiments.

[0070] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0071] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclusively include, for example, a product or device that includes a series of components is not necessarily limited to those that are explicitly listed, but may include other components that are not explicitly listed or that are inherent to such product or device.

[0072] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or apparatus referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0073] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0074] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two devices. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0075] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0076] See Figure 1 and Figure 2 As shown in the figure, this application embodiment provides a laser projection device, including a housing 100. The housing 100 can protect the internal structure and improve aesthetics.

[0077] In some embodiments, the housing 100 is configured with an inner cavity.

[0078] In some embodiments, the outer casing 100 is configured with an air outlet structure 110 and a first air inlet structure 120, both of which are in communication with the inner cavity.

[0079] See Figure 3 and Figure 4 As shown, in some embodiments, the laser projection device includes an optical engine 200.

[0080] See Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the optical engine 200 includes a first heat sink 210.

[0081] In some embodiments, the first radiator 210 is located in the inner cavity.

[0082] See Figure 8As shown, in some embodiments, the first heat sink 210 includes a first substrate 211, a heat pipe 212, and a fin module 213 connected in sequence, with the first substrate 211 and the heat pipe 212 disposed opposite to each other. That is, the heat pipe 212 is in a bent state. It is understood that the bent state of the heat pipe 212 is beneficial for saving space. The extending plane of the first substrate 211 may be parallel to the extending plane of the fin module 213, or the extending plane of the first substrate 211 may have an angle with the extending plane of the fin module 213.

[0083] See Figures 5 to 7 , Figure 9 and Figure 10 As shown, in some embodiments, the optical engine 200 includes a main housing 220. The main housing 220 serves as a carrier for mounting the laser 230 and the digital micromirror device 240. It is understood that mounting the laser 230 and the digital micromirror device 240 on the same main housing 220 is beneficial for saving space.

[0084] In some embodiments, the main housing 220 is located between the first substrate 211 and the fin module 213.

[0085] In some embodiments, the optical engine 200 includes a laser 230. The laser 230 converts electrical energy into light energy to produce lasers of three primary colors: red, green, and blue.

[0086] In some embodiments, the laser 230 is disposed on the main housing 220 and abuts against the first substrate 211. Since the laser 230 cannot completely convert electrical energy into light energy, some electrical energy is converted into heat energy, causing the laser 230 temperature to rise and reducing its brightness, lifespan, and reliability. Therefore, the laser 230 abuts against the first substrate 211 to utilize the first heat sink 210 for heat dissipation.

[0087] In some embodiments, the optical engine 200 includes a digital micromirror device 240.

[0088] In some embodiments, the digital micromirror device 240 is disposed on the main housing 220 and on the side away from the laser 230, with the digital micromirror device 240 located on the side of the laser 230 away from the heat pipe 212. It should be noted that the digital micromirror device 240 is located on the side with the longer heat transfer path of the heat pipe 212, that is, the digital micromirror device 240 is close to the area of ​​the fin module 213 with a lower temperature.

[0089] In some embodiments, the optical engine 200 includes a second heat sink 250. The second heat sink 250 is used to accelerate the heat dissipation of the digital micromirror device 240.

[0090] In some embodiments, the second heat sink 250 abuts against the digital micromirror device 240, and the second heat sink 250 is located on the side of the digital micromirror device 240 facing the fin module 213.

[0091] In some embodiments, the laser projection device includes a fan 300.

[0092] In some embodiments, the fan 300 is located in the inner cavity and is configured to drive air from outside the housing 100 to flow to the outside through the first air intake structure 120, the second heat sink 250, the fin module 213 and the air outlet structure 110.

[0093] Understandably, the heat generated by the laser 230 is transferred to the fin module 213 through the first substrate 211 and the heat pipe 212. The fan 300 blows air and forces convection with the surface of the fin module 213, carrying away the heat from the surface of the fin module 213, and finally exhausting it from the air outlet structure 110.

[0094] The heat generated by the digital micromirror device 240 is transferred to the second heat sink 250. Under the action of the fan 300, the heat on the surface of the second heat sink 250 is discharged from the air outlet structure 110 after passing through the area with a lower temperature of the fin module 213.

[0095] The heat generated by the laser 230 is unevenly distributed on the finned module 213. In areas with shorter heat transfer paths via the heat pipe 212, the temperature of the finned module 213 is higher. In areas with longer heat transfer paths via the heat pipe 212, the temperature of the finned module 213 is lower. The heat generated by the digital micromirror device 240, under the action of the fan 300, passes through the lower-temperature areas of the finned module 213, increasing the heat in those areas and improving the heat distribution evenness on the finned module 213. The cooling capacity of the fan 300 can be fully utilized, resulting in good overall cooling performance and high heat dissipation efficiency. Furthermore, the fan 300 is less prone to noise under heavy load.

[0096] Moreover, it is understood that in the embodiments of this application, the second heat sink 250 and the fin module 213 use the same air duct for heat dissipation, which is beneficial to improve the integration of the equipment and reduce the space occupation.

[0097] See Figure 5 , Figure 8 and Figure 9 As shown, in some embodiments of this application, the optical engine 200 further includes a lens 260.

[0098] In some embodiments, the lens 260 is disposed on the main housing 220, on the side of the main housing 220 opposite to the digital micromirror device 240, and opposite to the digital micromirror device 240. The laser 230 and the lens 260 are located on the same side of the main housing 220. The housing 100 is configured with a clearance opening 130 to avoid the light-emitting end of the lens 260, and the first air inlet structure 120 is located on the same side as the clearance opening 130.

[0099] Understandably, the airflow from the fan 300 can cool the lens 260. Furthermore, the lens 260 is positioned on the side of the main housing 220 away from the digital micromirror device 240, and is opposite to the digital micromirror device 240. This means that the higher-temperature second heat sink 250 and the lens 260, which increases flow resistance, are located in the lower-temperature area of ​​the fin module 213, which is beneficial for the even distribution of heat.

[0100] See Figure 5 As shown, in some embodiments of this application, the fin module 213 is close to and opposite to the air outlet structure 110. It is understood that there is no wind-blocking structure between the fin module 213 and the air outlet structure 110, which helps to shorten the heat transfer path and improve heat dissipation efficiency.

[0101] See Figure 11 and Figure 12 As shown, in some embodiments, the second heat sink 250 includes a second substrate 251 and a plurality of heat sink pillars 252. The second substrate 251 abuts against the digital micromirror device 240, and the plurality of heat sink pillars 252 are arranged in an array on the side of the second substrate 251 facing the fin module 213.

[0102] Understandably, compared to fins, the heat sink 252 has lower surface resistance, facilitating airflow. Furthermore, the total surface area of ​​the heat sink 252 can be larger, resulting in stronger heat dissipation capacity.

[0103] In some embodiments, the heat dissipation columns 252 can be rhomboid columns, rectangular columns, cylindrical columns, etc. This embodiment does not impose specific limitations on the number, size, and arrangement of the heat dissipation columns 252.

[0104] See Figure 5 As shown, in some embodiments of this application, the fan 300 is located between the second heat sink 250 and the fin module 213. In this way, the fan 300 can simultaneously cool both the second heat sink 250 and the fin module 213. Furthermore, this helps save space.

[0105] In some embodiments of this application, in order to improve heat dissipation efficiency, the number of fans 300 is at least two, the at least two fans 300 are arranged side by side, and the at least two fans 300 are opposite to the fin module 213.

[0106] In some embodiments, the extension plane of the fan 300 is parallel to the extension plane of the fin module 213.

[0107] In some embodiments of this application, in order to reduce noise, the distance between the fan 300 and the second heat sink 250 is 0.5-1 times the hub diameter of the fan 300.

[0108] It's understandable that a larger air intake space behind the fan 300 will better reduce the back pressure of the fan 300, thus helping to reduce the noise of the fan 300. On the other hand, a smaller air intake space behind the fan 300 will be more conducive to a compact structure and a smaller overall size.

[0109] In some embodiments, the distance d between the fan 300 and the second substrate 251 is 0.6-0.8 times the hub diameter of the fan 300, or the distance d between the fan 300 and the second substrate 251 is 0.5-0.7 times the hub diameter of the fan 300. For example, the distance d between the fan 300 and the second substrate 251 is 0.9 times the hub diameter of the fan 300.

[0110] In some embodiments, the hub diameter of the fan 300 is 36 mm, and the distance d between the fan 300 and the second substrate 251 is 18-36 mm. Alternatively, the distance d between the fan 300 and the second substrate 251 is 20-30 mm. Alternatively, the distance d between the fan 300 and the second substrate 251 is 22-35 mm. Alternatively, the distance d between the fan 300 and the second substrate 251 is 18 mm. Alternatively, the distance d between the fan 300 and the second substrate 251 is 25 mm.

[0111] In some embodiments, on the side closer to the digital micromirror device 240, the distance e between the fan 300 and the main housing 220 is greater than the distance d between the fan 300 and the second substrate 251.

[0112] In some embodiments, the distance e between the fan 300 and the main housing 220 is 20-40 mm. Alternatively, the distance e between the fan 300 and the main housing 220 is 25-60 mm. Alternatively, the distance e between the fan 300 and the main housing 220 is 25 mm. Alternatively, the distance e between the fan 300 and the main housing 220 is 30 mm.

[0113] See Figure 1 and Figure 2 As shown, in some embodiments, the housing 100 may be rectangular.

[0114] In some embodiments, the housing 100 includes a front wall. A first air inlet structure 120 is disposed on the front wall, and an air outlet structure 110 is located on the opposite side of the first air inlet structure 120, that is, the air outlet structure 110 is located on the rear wall. It should be noted that the front side is the light-emitting side of the laser projection device. Thus, under the action of the fan 300, air flows through the front side of the housing 100, the first air inlet structure 120, the interior of the housing 100, and the air outlet structure 110 to the rear side of the housing 100. The path is relatively long, allowing it to pass through more heat-generating devices, thereby dissipating heat from these devices.

[0115] See Figure 15 As shown in some embodiments of this application, in order to increase the air intake area and improve the airflow, the first air intake structure 120 includes a first air intake section 121 and a second air intake section 122.

[0116] In some embodiments, the first air inlet 121 is disposed around the periphery of the front wall and close to the edge of the front wall. In this way, the air inlet area is larger.

[0117] In some embodiments, the first air inlet 121 includes a plurality of air inlets arranged in an array. It should be noted that this embodiment does not specifically limit the size, number, or arrangement of the air inlets.

[0118] In some embodiments, the second air inlet 122 is located within the area enclosed by the first air inlet 121. It should be noted that the second air inlet 122 may be located near the bottom or top of the front wall, depending on the heat dissipation requirements; this embodiment does not impose any specific limitations on this.

[0119] In some embodiments, the clearance opening 130 is located within the area enclosed by the first air inlet 121.

[0120] See Figure 1 , Figure 2 , Figure 13 and Figure 14 As shown, in some embodiments, in order to reduce the back pressure of the fan 300, reduce noise, and improve the cooling effect, the housing 100 also includes a second air intake structure 140.

[0121] In some embodiments, the second air inlet structure 140 is located on a different side from the first air inlet structure 120 and on a different side from the air outlet structure 110. The second air inlet structure 140 is located on at least one outer wall of the housing 100. For example, when the housing 100 is rectangular, the second air inlet structure 140 may be located on at least one of the top wall, bottom wall, left wall, and right wall.

[0122] In some embodiments, the second air inlet structure 140 includes a plurality of air inlets arranged in an array. It should be noted that this embodiment does not specifically limit the size, number, or arrangement of the air inlets.

[0123] In some embodiments, a second air inlet structure 140 is provided on the bottom wall, left wall, and right wall. This provides four cooling air ducts, improving heat dissipation efficiency, meeting the thermal management requirements of each module in the highly integrated laser smart projection product, and enhancing the performance, stability, and lifespan of each component. The four cooling air ducts are respectively from the first air inlet structure 120 on the front wall to the air outlet structure 110 on the rear wall, from the second air inlet structure 140 on the bottom wall to the air outlet structure 110 on the rear wall, from the second air inlet structure 140 on the left wall to the air outlet structure 110 on the rear wall, and from the second air inlet structure 140 on the right wall to the air outlet structure 110 on the rear wall.

[0124] See Figure 3 and Figure 4 As shown, in some embodiments, the laser projection device includes an engine mount 400 located inside the housing 100, the engine mount 400 being used to mount the optical engine 200.

[0125] See Figure 3 and Figure 4 As shown, in some embodiments, the laser projection device further includes a first electronic board 500 and a second electronic board 600, which are responsible for signal transmission.

[0126] In some embodiments, the second electronic board 600 is located on the side of the optical engine 200 away from the engine bracket 400, and the second electronic board 600 is cooled by a fan 300.

[0127] See Figure 3 and Figure 4 As shown, in some embodiments, the laser projection device further includes a heat sink 700 located within the inner cavity. The heat sink 700 is connected to the engine bracket 400, forming a mounting cavity with the engine bracket 400. The first heat sink 210, the main housing 220, the laser 230, the digital micromirror device 240, and the second heat sink 250 are located within the mounting cavity. Thus, the heat sink 700 and the engine bracket 400 cooperate to improve overall strength and enhance protection for the optical engine 200.

[0128] In some embodiments, in order to improve the heat dissipation of the optical engine 200, the rear opening of the engine bracket 400 is provided so that the mounting cavity is connected to the air outlet structure 110.

[0129] In some embodiments, the left side of the engine bracket 400 is provided with a communication port that communicates with the second air intake structure 140 on the left wall of the housing 100.

[0130] In some embodiments, the right side of the engine bracket 400 is provided with a communication port that communicates with the second air intake structure 140 on the right wall of the housing 100.

[0131] In some embodiments, the bottom side of the engine bracket 400 is provided with a communication port that communicates with the second air intake structure 140 on the bottom wall of the housing 100.

[0132] In some embodiments, the first electronic board 500 is located on the side of the heat sink 700 away from the engine mount 400 and abuts against the heat sink 700. In this way, the first electronic board 500 can dissipate heat through the heat sink 700. Compared to using a finned radiator, using a heat sink 700 increases the heat dissipation area and helps to reduce the dimensions of the housing 100 from the bottom wall to the top wall.

[0133] In some embodiments, a thermal pad may be provided between the first electronic board 500 and the heat sink 700, and the first electronic board 500 transfers heat to the heat sink 700 through the thermal pad.

[0134] In some embodiments, the laser projection device includes a camera mounted on the engine bracket 400. The camera is located near the front wall of the housing 100, which has a camera area for avoiding camera movement.

[0135] When air flows from the front to the back of the product, it cools the camera in the air duct.

[0136] In some embodiments, the laser projection device includes a three-dimensional ranging structure mounted on an engine bracket 400. The three-dimensional ranging structure is located near the front wall of the housing 100, and the front wall has a ranging area for avoiding the three-dimensional ranging structure.

[0137] For example, the three-dimensional ranging structure can be a three-dimensional time-of-flight (3D TOF) ranging structure.

[0138] When air flows from the front to the back of the product, it cools the three-dimensional ranging structure on the air duct.

[0139] In some embodiments, the laser projection device includes a wireless connection structure, which, exemplarily, may be a WIFI module (Wireless Fidelity).

[0140] See Figure 3 and Figure 4 As shown, in some embodiments, the laser projection device includes a speaker 800, which may be mounted on the engine mount 400.

[0141] In some embodiments, the speaker 800 is disposed on the side of the engine mount 400 opposite to the optical engine 200, that is, the speaker can be disposed at the bottom of the engine mount 400. The speaker can emit sound from the left, right and front sides.

[0142] In some embodiments, in order to improve integration and reduce space occupation, the speaker 800 may be set on the side of the engine bracket 400 away from the optical engine 200.

[0143] See Figure 3 and Figure 4 As shown, in some embodiments, the laser projection device includes a support structure 900 connected to the engine mount 400. Alternatively, the support structure 900 is connected to the housing 100. The support structure 900 supports the laser projection device while ensuring efficient air intake through the second air intake structure 140 on the bottom wall of the housing 100.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0145] For ease of explanation, the above description has been provided in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Various modifications and variations can be obtained based on the above teachings. The selection and description of the above embodiments are for the purpose of better explaining the principles and practical applications, thereby enabling those skilled in the art to better utilize the described embodiments and various different variations of embodiments suitable for specific use considerations.

Claims

1. A laser projection device, characterized in that: include: A shell having an inner cavity, wherein the shell has an air outlet structure and a first air inlet structure, and the air outlet structure and the first air inlet structure are both connected to the inner cavity; A first heat sink, which is located in the inner cavity, comprises a first substrate, a heat pipe and a fin module connected in sequence, and the first substrate is arranged opposite to the heat pipe; A main housing, which is located between the first substrate and the fin module; A laser, which is disposed on the main housing and abuts against the first substrate; A digital micromirror device, which is arranged on a side of the main housing away from the laser, and the digital micromirror device is located on a side of the laser away from the heat pipe; A second heat sink abuts against the digital micromirror device, and the second heat sink is located on a side of the digital micromirror device facing the fin module; A fan is located in the inner cavity, and the fan is configured to drive the air outside the housing to flow to the outside through the first air inlet structure, the second heat sink, the fin module and the air outlet structure.

2. The laser projection device according to claim 1, characterized in that: The fin module is close to the air outlet structure and is opposite to the air outlet structure.

3. The laser projection device according to claim 1, characterized in that: The second heat sink includes a second substrate and a plurality of heat dissipation columns. The second substrate abuts against the digital micromirror device. The plurality of heat dissipation columns are arrayed on a side of the second substrate facing the fin module.

4. The laser projection device according to claim 3, characterized in that: The fan is located between the second heat sink and the fin module.

5. The laser projection device according to claim 4, characterized in that: The number of the fans is at least two, at least two of the fans are arranged side by side, and at least two of the fans are opposite to the fin module.

6. The laser projection device according to any one of claims 1 to 5, characterized in that: The housing further includes a second air inlet structure; The air outlet structure is located on a side opposite to the first air inlet structure, the second air inlet structure is located on a different side from the first air inlet structure and the air outlet structure, and the second air inlet structure is located on at least one outer wall of the housing.

7. The laser projection device according to claim 6, characterized in that: Also includes a lens, the lens is arranged on the main housing, the lens is arranged on a side of the main housing away from the digital micromirror device, and the lens is opposite to the digital micromirror device, and the laser and the lens are located on the same side of the main housing; The housing is structured with a avoidance opening for avoiding the light emitting end of the lens, and the first air inlet structure and the avoidance opening are located on the same side.

8. The laser projection device according to claim 7, characterized in that: The first air inlet structure includes a first air inlet portion and a second air inlet portion, the housing includes a front wall, and the avoidance opening is arranged on the front wall; The first air inlet portion is disposed around the circumference of the front wall and close to the edge of the front wall; The second air inlet and the avoidance opening are located in an area surrounded by the first air inlet.

9. The laser projection device according to any one of claims 1 to 5, characterized in that: Also includes an engine bracket, the engine bracket being located in the inner cavity; A heat sink, the heat sink is located in the inner cavity, the heat sink is connected to the engine bracket, the heat sink and the engine bracket form a mounting cavity, the first heat sink, the main housing, the laser, the digital micromirror device and the second heat sink are located in the mounting cavity; The first electronic board is located on a side of the heat sink facing away from the engine bracket and abuts against the heat sink.

10. The laser projection device according to claim 4, characterized in that: The distance between the fan and the second substrate is 0.5-1 times of the hub diameter of the fan.

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