Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of communication equipment. The electronic equipment comprises a shell, a circuit board, chips and a radiator, the shell comprises a first shell body and a second shell body, the first shell body and the second shell body are connected to form an installation cavity, the circuit board is fixed in the installation cavity, the multiple chips are all installed on the circuit board, one side of the radiator abuts against the first shell body, and a boss is arranged on the other side of the radiator; the bosses and the chips are arranged in a one-to-one correspondence mode, and the radiator is filled with cooling liquid. According to the electronic equipment provided by the utility model, the heat generated by the chip can be quickly conducted out through the radiator filled with the cooling liquid, the radiator is propped against the first shell, and the conducted heat is diffused into the air through the first shell, so that the reduction of processing performance or equipment damage caused by overheating of the chip is prevented, and the service life of the electronic equipment is prolonged. The performance and the stability of the electronic equipment are improved, the whole heat dissipation process is pure physical heat dissipation, no fan needs to be additionally arranged, and no extra power consumption needs to be consumed.

Description

Technical Field

[0001] The utility model relates to the technical field of communication equipment, in particular to an electronic device. Background Art

[0002] As a key device for data processing and storage, servers are widely used in high-intensity computing fields such as cloud computing and big data processing. The performance and stability of servers directly affect the speed and effect of data processing. The performance and stability of servers largely depend on the configuration and layout of their internal components.

[0003] In existing server designs, circuit boards, chips and other key components are usually installed in a detachable housing in order to improve space utilization and facilitate maintenance. However, chips generate a lot of heat when working. How to effectively remove heat from the inside of the server to prevent performance degradation or equipment damage due to overheating has always been an important issue in server design. The current heat dissipation method is mostly active heat dissipation with the help of fans, but fans generate noise, are costly and increase additional power consumption. Utility Model Content

[0004] The utility model provides an electronic device, which is used to solve the defects in the prior art that the heat dissipation method mostly relies on fans, which is high in cost and requires additional power consumption.

[0005] The utility model provides an electronic device, including a shell, a circuit board, a chip and a radiator, the shell including a first shell and a second shell, the first shell is connected to the second shell to form a mounting cavity, the circuit board is fixed in the mounting cavity, a plurality of chips are mounted on the circuit board, one side of the radiator is abutted against the first shell, the other side of the radiator is provided with a boss, the boss is arranged one-to-one with the chip, and the interior of the radiator is filled with coolant.

[0006] According to an electronic device provided by the utility model, a thermal conductive gel is provided between at least one chip and the corresponding boss.

[0007] According to an electronic device provided by the utility model, it also includes a thermally conductive pad, the circuit board is provided with a copper-plated area, and the thermally conductive pad is connected to the chip and the copper-plated area at the same time.

[0008] According to an electronic device provided by the utility model, at least one of the chips is provided with a heat sink correspondingly, and the heat sink penetrates the circuit board and is sandwiched between the chip and the second shell.

[0009] According to an electronic device provided by the utility model, a heat conducting member is arranged between the chip and the heat dissipation block.

[0010] According to an electronic device provided by the utility model, the heat dissipation block is an aluminum block or a copper block.

[0011] According to an electronic device provided by the utility model, the first shell is provided with a plurality of heat dissipation fins.

[0012] According to an electronic device provided by the utility model, a wire embedding groove is provided on the boss, and the wire embedding groove is used to pre-embed the thermocouple wire harness when the chip is subjected to a temperature rise test.

[0013] According to an electronic device provided by the utility model, the wire outlets of each of the buried wire grooves face the same side of the radiator.

[0014] According to an electronic device provided by the utility model, a side of the heat sink where the boss is arranged is provided with a recessed position, and the recessed position is located at a corner of the heat sink.

[0015] The electronic device provided by the utility model can quickly dissipate the heat generated by the chip through a radiator filled with coolant. The radiator is arranged against the first shell, and the dissipated heat is diffused into the air through the first shell, thereby preventing the processing performance from being reduced or the equipment from being damaged due to overheating of the chip, thereby improving the performance and stability of the electronic device. The entire heat dissipation process is purely physical heat dissipation, and no additional fan is required, and no additional power consumption is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a top view of the electronic device provided by the utility model;

[0018] Figure 2 yes Figure 1 A cross-sectional view of the electronic device shown along AA;

[0019] Figure 3 yes Figure 1 an exploded view of the electronic device shown;

[0020] Figure 4 It is a three-dimensional diagram of the radiator provided by the utility model;

[0021] Figure 5 It is a schematic diagram of the cooperation between the circuit board and the chip provided by the utility model;

[0022] Figure 6 yes Figure 4 A top view of the heat sink is shown;

[0023] Figure 7 It is a top view of the circuit board provided by the utility model;

[0024] Figure 8 It is a bottom view of the circuit board provided by the utility model;

[0025] Fig. 9 It is a side view of the heat dissipation block provided by the utility model;

[0026] Fig.10 It is a top view of the heat dissipation block provided by the utility model;

[0027] Fig.11 It is a test schematic diagram of the electronic equipment provided by the utility model.

[0028] Reference numerals:

[0029] 10. Shell; 11. First shell; 12. Second shell; 13. Ear; 14. Mounting hole; 15. Heat sink; 20. Circuit board; 21. Chip; 22. Copper-plated area; 23. Through hole; 30. Radiator; 31. Boss; 32. Liquid injection pipe; 33. Cable burying groove; 34. Recessed position; 35. Avoidance position; 40. Thermal conductive gel; 50. Thermal conductive pad; 60. Heat sink; 61. Main body; 62. Connecting ear; 63. Connecting hole; 70. Thermal conductive part; 80. Card cover; 81. Decorative strip; 90. TF card cover; 100. Bracket. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] The term "first" or "second" in the specification and claims of the utility model may explicitly or implicitly include one or more of the features. In the description of the utility model, unless otherwise specified, "multiple" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the related objects are in an "or" relationship.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Combine the following Figure 1-Figure 11 The electronic device of the present invention is described.

[0035] like Figure 1 and Figure 2 As shown, the electronic device includes a housing 10, a circuit board 20, a chip 21 and a heat sink 30. Figure 2 As shown, the housing 10 includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 are connected to form a mounting cavity. Multiple chips 21 are mounted on a circuit board 20, and the circuit board 20 is fixed in the mounting cavity. One side of the heat sink 30 is against the first housing 11, and the other side of the heat sink 30 is provided with a boss 31, and the boss 31 is arranged one by one with the chip 21. The interior of the heat sink 30 is filled with coolant.

[0036] Electronic devices include computing devices such as servers, controllers, and tablet computers.

[0037] The first shell 11 and the second shell 12 may be detachably connected or fixedly connected. Figure 2 and Figure 3As shown, the first housing 11 is in the shape of a box, and the second housing 12 is in the shape of a sealing plate. The second housing 12 covers the first housing 11 and is fastened by screws. The circuit board 20 is fixed in the installation cavity. The size and shape of the installation cavity are adapted to the circuit board 20 to ensure that the circuit board 20 can be installed smoothly. The second housing 12 is provided with ears 13 on opposite sides, and the ears 13 are provided with mounting holes 14. The mounting holes 14 are used to provide a fixed position for the installation of the entire electronic device. Specifically, as shown in FIG. Figure 1 As shown, each ear 13 is provided with two mounting holes 14. Optionally, the mounting holes 14 are strip-shaped, which is convenient for installation and can be matched with reserved holes at different intervals.

[0038] The multiple chips 21 may include data processing and storage chips 21 such as CPU, GPU, memory, etc. These chips 21 are connected and fixed in the mounting cavity through the circuit board 20. The power consumption of each chip 21 is different, and the heat generation is also different.

[0039] The radiator 30 is made of copper or other heat-conducting materials, one side of which is flat and connected to the first shell 11 by welding or other connection methods to ensure full contact with the inner surface of the first shell 11, so that heat can be transferred to the first shell 11. The radiator 30 is a sealed hollow shell structure filled with coolant. The coolant can be water or oil. Specifically, Figure 4 As shown, the radiator 30 has a liquid injection pipe 32 for injecting coolant into the radiator 30. After the liquid injection is completed, the port of the liquid injection pipe 32 is blocked. Alternatively, only a liquid injection port is reserved on the radiator 30, and the liquid injection port can be directly blocked after the liquid injection is completed.

[0040] The bosses 31 of the heat sink 30 are arranged in one-to-one correspondence with the chip 21, so that the surface of the bosses 31 fits the chip 21 to better conduct the heat generated by the chip 21. Figure 5 As shown, five chips 21 are mounted on the circuit board 20, and five bosses 31 are provided on one side of the heat sink 30. Figure 6 As shown, the heights of the bosses 31 may be different, which are specifically determined according to the installation height of the chip 21 , to ensure that the bosses 31 do not affect the normal operation of the chip 21 while playing a heat conduction role.

[0041] The electronic device provided by the embodiment of the utility model can quickly dissipate the heat generated by the chip 21 through the radiator 30 filled with coolant. The radiator 30 is arranged against the first housing 11, and the heat dissipated is diffused into the air through the first housing 11, thereby preventing the processing performance from being reduced or the device from being damaged due to overheating of the chip 21, thereby improving the performance and stability of the electronic device. The entire heat dissipation process is purely physical heat dissipation, and no additional fan is required, nor does it consume additional power.

[0042] like Figure 2 and Figure 3 As shown, in order to enhance the heat dissipation efficiency and ensure the stable operation of the electronic device, a thermal conductive gel 40 is arranged between at least one chip 21 and the corresponding boss 31 .

[0043] The thermally conductive gel 40 is a material with high thermal conductivity, which can fill the gap between the chip 21 and the boss 31, making the two in close contact, reducing thermal resistance, and facilitating the rapid conduction of heat generated by the chip 21 to the heat sink 30. Optionally, the thickness of the thermally conductive gel 40 is 0.15 mm to 0.5 mm.

[0044] Among them, only some chips 21 and bosses 31 are provided with thermal conductive gel 40. Of course, thermal conductive gel 40 can also be applied between each chip 21 and boss 31. In addition, thermal conductive silicone grease or other auxiliary heat conductive materials can also be provided according to the distance between the chip 21 and the boss 31.

[0045] To prevent the temperature of a local area on the circuit board 20 from being too high, the electronic device further includes a thermally conductive pad 50 . The circuit board 20 is provided with a copper-plated area 22 . The thermally conductive pad 50 is connected to both the chip 21 and the copper-plated area 22 .

[0046] The thickness of the thermal pad 50 is 1.0 to 5.0 mm, and it is set in the gap between the chip 21 and the copper-plated area 22. As the temperature of the chip 21 increases, the thermal pad 50 will soften, thereby increasing the contact area with the chip 21 and transferring the heat of the chip 21 to the copper-plated area 22. Then, through the large-area contact between the copper-plated area 22 and the air, the heat is quickly dissipated into the environment to avoid local heat accumulation. Among them, the number of copper-plated areas 22 can be the same as the number of chips 21 or less than the number of chips 21. For example, the thermal pad 50 and the copper-plated area 22 are only set at the chip 21 with relatively large heat generation. Optionally, the copper-plated area 22 is located next to the chip 21, or the projection of the chip 21 is located in the copper-plated area 22, and the gap between the copper-plated area 22 and the chip 21 is filled with the thermal pad 50 to ensure smooth heat transfer.

[0047] like Figure 7 As shown, three copper-plated areas 22 are provided on one side of the circuit board 20 where the chip 21 is mounted, for dissipating heat for the three chips 21 , and a thermal pad 50 is provided between each chip 21 and the copper-plated area 22 .

[0048] To further improve the heat dissipation efficiency, at least one chip 21 is provided with a heat dissipation block 60, which passes through the circuit board 20 and is sandwiched between the chip 21 and the inner wall of the second housing 12. For example, a heat dissipation block 60 is additionally provided for a chip 21 with high heat generation to improve its heat dissipation efficiency.

[0049] Specifically, Figure 7 and Figure 8As shown, the circuit board 20 is provided with a through hole 23. Figure 2 As shown, the heat sink 60 passes through the through hole 23 and contacts the chip 21. To prevent the heat sink 60 from shaking, the heat sink 60 can be fastened to the second housing 12 by screws. Fig. 9 As shown, the heat sink 60 includes a main body 61 and connecting ears 62 arranged on both sides of the main body 61. Fig.10 As shown, the connecting ear 62 is provided with a connecting hole 63, and a screw passes through the connecting hole 63 to fix the heat sink 60 to the second housing 12. The main body 61 passes through the circuit board 20 and contacts the chip 21, and the top of the main body 61 contacts the inner wall of the second housing 12.

[0050] Optionally, the heat sink 60 is an aluminum block or a copper block, which has good thermal properties. The second housing 12 is made of a galvanized steel plate, which can bear the role of heat distribution and heat dissipation. The heat generated during the operation of the chip 21 is transferred to the second housing 12 through the heat sink 60.

[0051] In order to increase the speed of heat transfer from the chip 21 to the heat sink 60, a heat conducting member 70 is provided between the chip 21 and the heat sink 60. The heat conducting member 70 is a heat-conducting structural member such as silica gel and a gasket. When the heat conducting member 70 is a gasket, the thickness of the gasket is 1.0 mm to 3.0 mm. Specifically, the thickness of the gasket is 1.0 mm, 1.2 mm, 1.5 mm, 2.5 mm, 3.0 mm, or any value between 1.0 mm and 3.0 mm.

[0052] like Figure 1 and Figure 2 As shown, the first housing 11 is provided with a plurality of heat dissipation fins 15. During operation of the electronic device, the chip 21 generates a large amount of heat, which is absorbed by the heat sink 30 and transferred to the first housing 11. The heat dissipation fins 15 provided on the first housing 11 increase the contact area with the external air, and can dissipate the heat to the external environment more quickly, which helps to reduce the temperature of the chip 21 and improve the stability and service life of the chip 21.

[0053] Optionally, the heat dissipation fins 15 may extend along the width direction of the first housing 11 or along the length direction of the first housing 11. Alternatively, the heat dissipation fins 15 are arc-shaped or bent, and a plurality of heat dissipation fins 15 are arranged in parallel. It should be noted that the heat dissipation fins 15 cover the entire outer surface of the first housing 11 or are only partially arranged on the outer wall of the first housing 11, which is specifically arranged according to the heat dissipation requirements.

[0054] like Figure 2 As shown, the first housing 11 is provided with a plurality of heat dissipation fins 15 extending along the width direction of the first housing 11. The heat dissipation fins 15 are fully distributed on the side walls and the bottom surface of the first housing 11 extending along the width direction.

[0055] The boss 31 is provided with a wire embedding groove 33 , which is used to embed the thermocouple wire harness when the chip 21 is subjected to a temperature rise test.

[0056] like Figure 4 As shown, five bosses 31 are provided for five chips 21, and each boss 31 is provided with at least one buried wire groove 33. The buried wire groove 33 is designed for convenient layout. Figure 4 As shown, the buried wire grooves 33 on four of the bosses 31 extend along the width direction of the heat sink 30, and the buried wire groove 33 on another boss 31 is set at an acute angle to the width direction of the heat sink 30, and is tilted toward the outside of the heat sink 30 to prevent interference with the buried wires on other bosses 31. The outlets of the five buried wire grooves 33 face the same side of the heat sink 30, so that each thermocouple harness extends from the same direction, which is convenient for connection with external testing equipment. To ensure the accuracy of temperature detection, the end of the buried wire groove 33 opposite to the outlet corresponds to the center of the corresponding chip 21.

[0057] In order to ensure the stability and reliability of each chip 21 in the electronic device, a temperature rise test is required. Usually, the ambient temperature of the temperature rise test is about 25°C. The thermocouple harness is fixed in the buried wire groove 33, and the thermocouple is placed at the end of the buried wire groove 33 opposite to the wire outlet. Fig.11 As shown, during the temperature rise test, the electronic device is directly fixed on the bracket 100 through the mounting hole 14, and the height of the bracket 100 from the ground is greater than 20 mm. The test program of each chip 21 is run, and each chip 21 is continuously operated at a load of 75% to 85%. The test results of each thermocouple are read with the help of an external terminal device, and the temperature rise information of each chip 21 is recorded in real time and a temperature curve is drawn.

[0058] like Figure 4 As shown, a recessed position 34 is provided on one side of the radiator 30 where the boss 31 is provided, and the recessed position 34 is located at a corner of the radiator 30 .

[0059] Specifically, the heat sink 30 includes a bottom plate and a box body, wherein the bottom plate is a flat plate and seals the open end of the box body. Optionally, the bottom plate and the box body are an integral structure. The bottom of the box body is convex outward to form a convex block, and the opposite corners of the box body are respectively concave into the box body to form a notch, which is used as a concave position 34 to facilitate the transportation of the heat sink 30 and help the user identify the direction of the heat sink 30 to avoid the mismatch between the bosses 31 and the chips 21 due to the wrong installation direction.

[0060] There are two recessed positions 34, and the two recessed positions 34 are arranged at opposite corners of the heat sink 30. Figure 4 As shown, the heat sink 30 is generally square, and recessed positions 34 are respectively provided at opposite corners of the heat sink 30 .

[0061] In addition, Figure 4 As shown, the heat sink 30 is also provided with an avoidance position 35 , which is arranged on the side of the heat sink 30 in the length direction and is used to avoid the electronic components on the circuit board 20 .

[0062] like Figure 3 As shown, a card cover 80 is installed on both sides of the housing 10 along the length direction, and a decorative strip 81 is covered on the outer side of the card cover 80. Specifically, the card cover 80 is fixed to the first housing 11 and the second housing 12 by screws. An interface hole and a screw through hole are provided in each card cover 80 corresponding to the interface. A TF card cover 90 can also be detachably installed on one of the card covers 80 for use when debugging the entire electronic device.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. An electronic device, characterized in that: It includes a shell, a circuit board, a chip and a heat sink. The shell includes a first shell and a second shell. The first shell is connected to the second shell to form an installation cavity. The circuit board is fixed in the installation cavity. Multiple chips are installed on the circuit board. One side of the heat sink is abutted against the first shell. The other side of the heat sink is provided with a boss. The boss is arranged one-to-one with the chip. The interior of the heat sink is filled with coolant.

2. The electronic device according to claim 1, characterized in that: A heat-conducting gel is provided between at least one of the chips and the corresponding boss.

3. The electronic device according to claim 1 or 2, characterized in that: It also includes a thermally conductive pad. The circuit board is provided with a copper-plated area. The thermally conductive pad is connected to the chip and the copper-plated area at the same time.

4. The electronic device according to claim 1, characterized in that: At least one of the chips is correspondingly provided with a heat dissipation block, and the heat dissipation block penetrates the circuit board and is sandwiched between the chip and the second shell.

5. The electronic device according to claim 4, characterized in that: A heat conducting member is arranged between the chip and the heat dissipation block.

6. The electronic device according to claim 4, characterized in that: The heat sink block is an aluminum block or a copper block.

7. The electronic device according to claim 1, characterized in that: The first shell is provided with a plurality of heat dissipation fins.

8. The electronic device according to claim 1, characterized in that: The boss is provided with a wire embedding groove, and the wire embedding groove is used for pre-embedding a thermocouple wire harness when the chip is subjected to a temperature rise test.

9. The electronic device according to claim 8, characterized in that: The wire outlets of each buried wire groove face the same side of the radiator.

10. The electronic device according to claim 1, characterized in that: A recessed position is provided on one side of the radiator where the boss is arranged, and the recessed position is located at a corner of the radiator.

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