Wafer supporting assembly of etching machine

Abstract

The utility model discloses an etching machine wafer supporting assembly which comprises a base, a cylinder is installed on the base, an electrostatic chuck is installed on the inner side of the cylinder, an external thread cylinder is rotatably installed on the outer side of the cylinder, a gear ring is installed at the bottom of the outer side of the external thread cylinder, a rotating shaft is rotatably installed on the base, and a gear and a first bevel gear are installed on the rotating shaft. The gear is meshed with the gear ring, a motor is installed on the base, a second bevel gear is installed on an output shaft of the motor, and the first bevel gear is meshed with the second bevel gear; according to the supporting assembly, the motor is arranged to drive the gear on the rotating shaft to rotate, then the gear is meshed with the gear ring to control the outer threaded barrel to rotate, and therefore the inner threaded barrel and the outer threaded barrel are matched to control the placement disc to move up and down; the wafer is separated from the electrostatic chuck, then the wafer is jacked up by the ejector pin, and the contact area between the placing disc and the wafer is large, so that the wafer can be prevented from being broken.

Description

Technical Field

[0001] The utility model relates to the technical field of etching machines, in particular to an etching machine wafer support component. Background Art

[0002] The etcher is a common device in the semiconductor process, which is often used to complete the etching process on the wafer. The wafer support assembly is a structure for placing the wafer in the process chamber of the etcher. The traditional wafer support assembly has a simple structure, mainly consisting of a hollow disc and an electrostatic chuck. The disc is located on the working surface of the electrostatic chuck. Below the electrostatic chuck, more than three ejector pins that pass through the working surface of the electrostatic chuck and can be lifted up and down are arranged. Before the equipment works, the ejector pins will be higher than the working surface of the electrostatic chuck, and then the robotic arm will place the wafer on the ejector pins, and then the electrostatic chuck will rise to suck the wafer on its working surface, and finally the electrostatic chuck will descend together with the ejector pins. After the etching is completed, the ejector pins will lift up the wafer, and finally the robotic arm will take out the wafer. However, when taking out the wafer, there will often be residual electric charge on the wafer, and the phenomenon of wafer sticking may occur under the action of these residual charges, and the contact area between the ejector pin and the wafer is small, so it is easy to cause fragments when lifting the wafer.

[0003] For this purpose, we design an etcher wafer support assembly here. Utility Model Content

[0004] The utility model aims to provide an etching machine wafer support assembly to solve the problems raised in the background technology in view of the deficiencies in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an etcher wafer support assembly, comprising a base, a cylinder is installed on the base, an electrostatic suction cup is installed on the inner side of the cylinder, an externally threaded cylinder is rotatably installed on the outer side of the cylinder, a gear ring is installed on the outer bottom of the externally threaded cylinder, a rotating shaft is rotatably installed on the base, a gear and a first bevel gear are installed on the rotating shaft, the gear is meshed with the gear ring, a motor is installed on the base, a second bevel gear is installed on the output shaft of the motor, the first bevel gear is meshed with the second bevel gear, an internally threaded cylinder is connected to the externally threaded cylinder by threads, a placement plate is installed on the top of the internally threaded cylinder, and a guide structure is installed between the placement plate and the base.

[0006] Preferably, the guide structure includes a slide cylinder, a connecting block and a sliding rod. Two slide cylinders are symmetrically installed on the base. The two slide cylinders are respectively located on both sides of the cylinder. Sliding rods are slidably installed in the two slide cylinders. Connecting blocks are symmetrically installed on both sides of the placement plate, and the two sliding rods are respectively fixed at the bottom of the two connecting blocks.

[0007] Preferably, a protective cover is installed on the base, and the internal threaded tube and the guide structure both pass through the protective cover.

[0008] Preferably, a through hole is provided in the middle of the placement plate, and the working surface of the electrostatic suction cup is flush with the upper edge of the through hole on the placement plate.

[0009] Preferably, the surface of the protective cover is coated with a ceramic coating.

[0010] Compared with the prior art, the utility model provides an etching machine wafer support assembly, which has the following beneficial effects:

[0011] The wafer support assembly of the etching machine can drive the gear on the rotating shaft to rotate by setting a motor, and then the external threaded barrel can be controlled to rotate through the engagement of the gear and the gear ring, so that the placement plate can be controlled to move up and down through the cooperation of the internal threaded barrel and the external threaded barrel. When taking the wafer, the placement plate is first controlled by the motor to move upward a short distance to separate the wafer from the electrostatic suction cup, and then the wafer is lifted up by the ejector pin. The contact surface between the placement plate and the wafer is large, thereby avoiding the formation of fragments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 This is a diagram showing the installation positions of the components on the base of the utility model;

[0014] Figure 3 This is a front cross-sectional view of the internal threaded cylinder and the placement plate of the utility model;

[0015] Figure 4 This is the installation position diagram of the protective cover of the utility model.

[0016] Figure numerals: 1. base; 2. cylinder; 3. external threaded cylinder; 4. gear ring; 5. rotating shaft; 6. gear; 7. first bevel gear; 8. motor; 9. second bevel gear; 10. internal threaded cylinder; 11. placement plate; 12. guide structure; 121. sliding cylinder; 122. connecting block; 123. sliding rod; 13. electrostatic suction cup; 14. protective cover. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-Figure 4 In this embodiment: an etching machine wafer support assembly includes a base 1, see Figure 2The base 1 is fixedly mounted on the lifting device in the process chamber of the etcher with screws, a cylinder 2 is mounted on the base 1, an electrostatic suction cup 13 is mounted on the inner side of the cylinder 2, three through holes are arranged on the electrostatic suction cup 13, which can be penetrated by the ejector in the etcher equipment, an externally threaded cylinder 3 is rotatably mounted on the outer side of the cylinder 2, a gear ring 4 is mounted on the outer bottom of the externally threaded cylinder 3, a rotating shaft 5 is rotatably mounted on the base 1, a gear 6 and a first bevel gear 7 are mounted on the rotating shaft 5, the gear 6 is meshed with the gear ring 4, a motor 8 is mounted on the base 1, a second bevel gear 9 is mounted on the output shaft of the motor 8, the first bevel gear 7 is meshed with the second bevel gear 9, the motor 8 can drive the gear 6 on the rotating shaft 5 to rotate through the meshing of the first bevel gear 7 and the second bevel gear 9, and then the externally threaded cylinder 3 can be driven to rotate through the meshing of the gear 6 and the gear ring 4, and the rotation direction of the externally threaded cylinder 3 can be controlled by controlling the rotation direction of the output shaft of the motor 8;

[0019] See also Figure 1 and Figure 3 The external threaded barrel 3 is connected to the internal threaded barrel 10 by threads, and a placement plate 11 is installed on the top of the internal threaded barrel 10. The placement plate 11 is used to place the wafer. A guide structure 12 is installed between the placement plate 11 and the base 1. The function of the guide structure 12 is to limit the rotation of the internal threaded barrel 10 and the placement plate 11. The internal threaded barrel 10 and the placement plate 11 can only move up and down. When the external threaded barrel 3 rotates forward or reversely, the placement plate 11 can be controlled to move up and down by the cooperation of the internal threaded barrel 10 and the external threaded barrel 3. The placement plate 11 can be made of quartz glass material. The main component of quartz glass is silicon dioxide, which has a certain chemical corrosion resistance, and its main component elements are the same as the wafer, and will not cause other pollution to the wafer. 1 is provided with a through hole in the middle, and the working surface of the electrostatic suction cup 13 is flush with the upper edge of the through hole on the placement plate 11. When the placement plate 11 moves upward, the placement plate 11 will be higher than the working surface of the electrostatic suction cup 13. When taking the wafer, the placement plate 11 is made higher than the working surface of the electrostatic suction cup 13, so that the wafer can be separated from the working surface of the electrostatic suction cup 13, and the contact surface between the placement plate 11 and the wafer is large, which can avoid the occurrence of fragments. A protective cover 14 is installed on the base 1, and the internal threaded cylinder 10 and the guide structure 12 both pass through the protective cover 14. The protective cover 14 is used to protect the gear ring 4, the rotating shaft 5, the gear 6, the first bevel gear 7, the motor 8 and the second bevel gear 9 to prevent them from being chemically corroded, and the surface of the protective cover 14 is coated with a ceramic coating.

[0020] See also Figure 3The guide structure 12 includes a slide cylinder 121, a connecting block 122 and a sliding rod 123. Two slide cylinders 121 are symmetrically installed on the base 1. The two slide cylinders 121 are respectively located on both sides of the cylinder 2. Sliding rods 123 are slidably installed in the two slide cylinders 121. Connecting blocks 122 are symmetrically installed on both sides of the placement plate 11. The two sliding rods 123 are respectively fixed at the bottom of the two connecting blocks 122.

[0021] The working principle and use process of the utility model are as follows: when in use, before etching the wafer, the working surface of the electrostatic chuck 13 is flush with the upper edge of the through hole on the placement plate 11, the top of the ejector pin of the etcher equipment passes through and is higher than the electrostatic chuck 13, the robot arm sends the wafer into the process chamber of the etcher equipment and places it on the ejector pin, the lifting device in the process chamber drives the wafer support assembly to move upward as a whole, so that the placement plate 11 and the electrostatic chuck 13 hold up the wafer, and then the electrostatic chuck 13 is started to suck the wafer, and then the wafer support assembly and the ejector pin are lowered together, and after the etching is completed, the motor 8 is started, and the wafer is lowered through the first A bevel gear 7 meshes with a second bevel gear 9, and a motor 8 drives the gear 6 on the rotating shaft 5 to rotate. Then, through the meshing of the gear 6 and the gear ring 4, the external threaded barrel 3 is driven to rotate. Through the cooperation of the internal threaded barrel 10 and the external threaded barrel 3, the placement plate 11 is controlled to move upward by one end distance, so that the placement plate 11 is higher than the working surface of the electrostatic suction cup 13, thereby separating the chip from the working surface of the electrostatic suction cup 13. The contact surface between the placement plate 11 and the chip is large, which can prevent chip fragments. The ejector pin moves up to lift the chip, and the output shaft of the motor 8 is reversed to control the placement plate 11 to reset, and finally the robot arm takes out the chip.

[0022] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An etching machine wafer support assembly, comprising a base (1), characterized in that: A cylinder (2) is mounted on the base (1), an electrostatic suction cup (13) is mounted on the inner side of the cylinder (2), an externally threaded cylinder (3) is rotatably mounted on the outer side of the cylinder (2), a gear ring (4) is mounted on the outer bottom of the externally threaded cylinder (3), a rotating shaft (5) is rotatably mounted on the base (1), a gear (6) and a first bevel gear (7) are mounted on the rotating shaft (5), the gear (6) meshes with the gear ring (4), a motor (8) is mounted on the base (1), a second bevel gear (9) is mounted on the output shaft of the motor (8), the first bevel gear (7) meshes with the second bevel gear (9), an internally threaded cylinder (10) is threadedly connected to the externally threaded cylinder (3), a placement plate (11) is mounted on the top of the internally threaded cylinder (10), and a guide structure (12) is mounted between the placement plate (11) and the base (1).

2. The wafer support assembly for an etcher according to claim 1, characterized in that: The guide structure (12) comprises a slide cylinder (121), a connecting block (122) and a sliding rod (123); two slide cylinders (121) are symmetrically mounted on the base (1); the two slide cylinders (121) are respectively located on both sides of the cylinder (2); a sliding rod (123) is slidably mounted in the two slide cylinders (121); connecting blocks (122) are symmetrically mounted on both sides of the placement plate (11); and the two sliding rods (123) are respectively fixed at the bottom of the two connecting blocks (122).

3. The etcher wafer support assembly according to claim 1, characterized in that: A protective cover (14) is installed on the base (1), and the internal threaded barrel (10) and the guide structure (12) both pass through the protective cover (14).

4. The wafer support assembly for an etcher according to claim 1, characterized in that: A through hole is provided in the middle of the placement plate (11), and the working surface of the electrostatic suction cup (13) is flush with the upper edge of the through hole on the placement plate (11).

5. The etcher wafer support assembly according to claim 3, characterized in that: The surface of the protective cover (14) is coated with a ceramic coating.

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