High-sensitivity light-transmitting pressure sensor, light-transmitting pressure sensing module and electronic equipment

Abstract

According to the high-sensitivity light-transmitting pressure sensor, the light-transmitting pressure sensing module and the electronic equipment provided by the embodiment of the invention, the first light-transmitting area is arranged in the central area of the substrate, so that the light-transmitting requirement of a user is met through backlight; the substrate is welded and fixed to the control circuit board through the first bonding pad to achieve electric connection, the sensor can be designed to be standardized unified packaging, a client designs and arranges the sensor according to the actual requirement of the client, and the position requirement of the key is met; actual design and production processes of the sensor are reduced, and the development period is shortened; the modular design of the sensor is realized, the sensor is standardized, batch production and stocking are facilitated, and the cost is reduced; the strain resistors are arranged in the maximum deformation area, the resistance change value between the strain resistors is increased, the reference resistors are arranged in the minimum deformation area, the resistance change value between the reference resistors is reduced, the strain resistors and the reference resistors form a Wheatstone bridge, the sensitivity of the sensor is better according to the bridge principle, and the product requirement for high sensitivity is met.

Description

Technical Field

[0001] The disclosed embodiments belong to the field of pressure sensing technology, and specifically relate to a high-sensitivity light-transmitting pressure sensor, a light-transmitting pressure sensing module, and an electronic device. Background Art

[0002] With the advancement of science and technology and social development, pressure sensing technology has been widely used in the consumer electronics industry (such as mobile phones, headphones, laptops and home appliances, etc.), and pressure sensors are used to realize applications such as pressure sensing and pressure function buttons. The common solution for pressure transparent buttons is to hollow out the sensor in the transparent area of ​​the button so that the backlight can pass through the sensor to the shell, achieving the transparent effect of the button.

[0003] At present, the translucent pressure sensor needs to be customized according to the structural characteristics and application scenarios of the pressure translucent button, which cannot be mass-produced and has high costs. In addition, the solution development and production cycle of customized sensors is long. In multi-button scenarios, the production yield of integrated customized sensors will also be reduced. In addition, the existing sensor sensing area is not in the center of the button, the sensitivity is weak, and the product structure requirements are high, which makes it difficult to meet the needs of products with high sensitivity requirements.

[0004] In view of the above problems, it is necessary to propose a high-sensitivity light-transmitting pressure sensor, a light-transmitting pressure sensing module and an electronic device that are reasonably designed and can effectively improve the above problems. Utility Model Content

[0005] The disclosed embodiments aim to solve at least one of the technical problems existing in the prior art, and provide a highly sensitive light-transmitting pressure sensor, a light-transmitting pressure sensing module, and an electronic device.

[0006] An aspect of an embodiment of the present disclosure provides a high-sensitivity light-transmitting pressure sensor, comprising:

[0007] A substrate, wherein a stress concentration area is provided in an edge area of ​​the substrate, a first hollow structure is provided in a central area of ​​the substrate to form a first light-transmitting area, and the stress concentration area includes a maximum deformation area and a minimum deformation area;

[0008] A pressure detection circuit is arranged on the first surface of the substrate along the thickness direction thereof and corresponds to the stress concentration area; wherein,

[0009] The pressure detection circuit includes at least one strain resistor disposed in the maximum deformation area and at least one reference resistor disposed in the minimum deformation area;

[0010] At least two first pads are arranged on the second surface of the substrate along the thickness direction thereof and are electrically connected to the strain resistor and the reference resistor so as to fix the substrate to the control circuit board by welding.

[0011] Optionally, the maximum deformation area is relatively distributed on both sides of the first light-transmitting area along the width direction of the substrate;

[0012] The minimum deformation regions are relatively distributed on two sides of the first light-transmitting region along the length direction of the substrate.

[0013] Optionally, the pressure detection circuit includes two strain resistors and two reference resistors;

[0014] The center lines of the two strain resistors are collinear with the center line of the first light-transmitting area along the width direction of the substrate;

[0015] Center lines of the two reference resistors are collinear with a center line of the first light-transmitting area along a length direction of the substrate.

[0016] Optionally, a clearance space is provided on a side of the stress concentration area facing the first light-transmitting area, and the reference resistor is provided in the clearance space.

[0017] Optionally, the strain resistor is in contact with the first light-transmitting area, and there is a gap between the reference resistor and the first light-transmitting area.

[0018] Optionally, the first pad includes two first sub-pads and two second sub-pads;

[0019] The two first sub-pads are arranged opposite to each other along the length direction of the substrate and are distributed at four corner ends of the substrate;

[0020] The two second sub-pads are arranged in the clearance space.

[0021] Optionally, there is a preset gap between two of the first sub-pads, and the preset gap corresponds to the strain resistor.

[0022] Another aspect of the disclosed embodiment provides a light-transmitting pressure sensing module, including a control circuit board and at least one high-sensitivity light-transmitting pressure sensor, wherein the high-sensitivity light-transmitting pressure sensor is the high-sensitivity light-transmitting pressure sensor described above;

[0023] The high-sensitivity light-transmitting pressure sensor is fixed to the control circuit board by welding through the first soldering pad;

[0024] The control circuit board is provided with a second hollow structure corresponding to the first hollow structure to form a second light-transmitting area.

[0025] Optionally, at least two second pads are provided on a side of the control circuit board facing the high-sensitivity light-transmitting pressure sensor, and the second pads correspond to and are electrically connected to the first pads.

[0026] Another aspect of the disclosed embodiment provides an electronic device, including a pressing panel and a light-transmitting pressure sensing module, wherein the light-transmitting pressure sensing module adopts the light-transmitting pressure sensing module described above;

[0027] The pressing panel has a pressing area, and the pressing area is provided with a light-transmitting portion corresponding to the second light-transmitting area;

[0028] The light-transmitting pressure sensing module is adhered and fixed to the pressing area.

[0029] The highly sensitive light-transmitting pressure sensor, light-transmitting pressure sensing module and electronic device of the disclosed embodiments are light-transmitting welded pressure sensors. A first light-transmitting area is provided in the central area of ​​the substrate to meet the light-transmitting needs of users through backlight. The first soldering pad solders the substrate to the control circuit board to achieve electrical connection with the control circuit board. The pressure sensor can be designed as a standardized unified package. Customers can design and arrange sensors according to their actual needs to meet the position requirements of buttons. The actual design and production process of the pressure sensor is reduced, and the development cycle is shortened. The modular design of the pressure sensor is realized, and the sensor is standardized to facilitate mass production, stocking, and cost reduction.

[0030] In the high-sensitivity light-transmitting pressure sensor of the disclosed embodiment, at least one strain resistor is arranged in the area of ​​maximum deformation, and the resistance change value between the strain resistors increases; at least one reference resistor is arranged in the area of ​​minimum deformation, and the resistance change value between the reference resistors decreases; the strain resistor and the reference resistor form a Wheatstone bridge. According to the bridge principle, the sensitivity of the sensor is better, meeting the product requirements of high sensitivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a front view of a high-sensitivity light-transmitting pressure sensor according to one embodiment of the present disclosure;

[0032] Figure 2 It is a rear view of a high-sensitivity light-transmitting pressure sensor according to one embodiment of the present disclosure;

[0033] Figure 3 It is a front view of a high-sensitivity light-transmitting pressure sensor according to another embodiment of the disclosed embodiments;

[0034] Figure 4 It is a rear view of a high-sensitivity light-transmitting pressure sensor according to another embodiment of the disclosed embodiments;

[0035] Figure 5 is a schematic diagram of the structure of a Wheatstone bridge in an embodiment of the present disclosure;

[0036] Figure 6 It is a front view of a light-transmitting pressure sensing module according to another embodiment of the disclosed embodiment;

[0037] Figure 7 is a cross-sectional view of a light-transmitting pressure sensing module according to another embodiment of the present disclosure;

[0038] Figure 8 This is a schematic diagram of the structure of an electronic device according to another embodiment of the disclosed embodiment;

[0039] Fig. 9 This is a cross-sectional view of an electronic device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0041] like Figures 1 to 4 As shown, one aspect of an embodiment of the present disclosure provides a high-sensitivity light-transmitting pressure sensor 100 , including a substrate 110 , a pressure detection circuit, and at least one first pad 120 .

[0042] A stress concentration area 111 is disposed at the edge of the substrate 110 , and a first hollow structure is disposed at the central area of ​​the substrate 110 to form a first light-transmitting area 112 . The stress concentration area 111 includes a maximum deformation area 111 a and a minimum deformation area 111 b .

[0043] It should be further explained that the shape of the substrate 110 is not specifically limited in this embodiment. Figures 1 to 4 In addition to the rectangle shown, other shapes are also possible and can be selected according to the actual needs of the customer.

[0044] The pressure detection circuit is disposed on the first surface of the substrate 110 along the thickness direction thereof and corresponds to the stress concentration area 111. Specifically, in this embodiment, the first surface of the substrate 110 is the front surface of the substrate 110, and the second surface of the substrate 110 is the back surface of the substrate 110. In other words, the pressure detection circuit is disposed on the front surface of the substrate 110.

[0045] like Figure 1 and Figure 3 As shown, the pressure detection circuit includes at least one strain resistor 131 disposed in the maximum deformation area 111a and at least one reference resistor 132 disposed in the minimum deformation area 111b. The strain resistor 131 and the reference resistor 132 form a Wheatstone bridge.

[0046] like Figure 2 and Figure 4As shown, at least two first pads 120 are disposed on the second surface of the substrate 110 along the thickness direction thereof and are electrically connected to the strain resistor 131 and the reference resistor 132, so as to weld and fix the substrate 110 to the control circuit board 210. In other words, at least two first pads 120 are disposed on the back side of the substrate 110. In this embodiment, at least two first pads 120 are located at the edge area of ​​the substrate 110.

[0047] Specifically, the substrate 110 is soldered and fixed to the control circuit board 210 via the first solder pad 120 to achieve electrical connection between the high-sensitivity light-transmitting pressure sensor 100 and the control circuit board 210 to achieve the transmission of stress, deformation and electrical signals.

[0048] It should be noted that the number of the first pads 120 is not specifically limited in this embodiment and can be selected according to actual needs. It should be understood that the first pads 120 of this embodiment can be used as input terminals, output terminals, power supply or ground terminals, and form a conductive circuit with the strain resistor 131 and the reference resistor 132.

[0049] It should be further explained that the base material of the substrate 110 can be a PCB base material or a FPC base material, which can be selected according to actual needs and is not specifically limited in this embodiment.

[0050] The high-sensitivity light-transmitting pressure sensor of the disclosed embodiment is a light-transmitting welded pressure sensor. A first light-transmitting area is provided in the central area of ​​the substrate to meet the light-transmitting needs of the user through the backlight. The first solder pad solders the substrate to the control circuit board to achieve electrical connection with the control circuit board. The pressure sensor can be designed as a standardized unified package. Customers can design and arrange the sensors according to their actual needs to meet the position requirements of the buttons. The actual design and production process of the pressure sensor can be reduced to shorten the development cycle. The modular design of the pressure sensor and the standardized sensor can be achieved to facilitate mass production, stocking, and cost reduction. At least one strain resistor is set in the area with the maximum deformation, and the resistance change value between the strain resistors increases. At least one reference resistor is set in the area with the minimum deformation, and the resistance change value between the reference resistors decreases. The strain resistor and the reference resistor form a Wheatstone bridge. According to the bridge principle, the sensitivity of the sensor is better, meeting the product requirements of high sensitivity.

[0051] For example, Figure 1 and Figure 3 As shown in FIG. 1 , the maximum deformation region 111a is relatively distributed on both sides of the first light-transmitting region 112 along the width direction of the substrate 110. Specifically, as Figure 1 and Figure 3 As shown, the maximum deformation area 111 a is arranged on the upper and lower sides of the first light-transmitting area 112 .

[0052] like Figure 1 and Figure 3 As shown, the minimum deformation area 111b is relatively distributed on both sides of the first light-transmitting area 112 along the length direction of the substrate 110. Specifically, as Figure 1 and Figure 3 As shown, the minimum deformation area 111 b is arranged on the left and right sides of the first light-transmitting area 112 .

[0053] For example, Figure 1 and Figure 3 As shown, the pressure detection circuit includes two strain resistors 131 and two reference resistors 132 , and the two strain resistors 131 and the two reference resistors 132 form a Wheatstone bridge.

[0054] The center lines of the two strain resistors 131 are collinear with the center line of the first light-transmitting area 112 along the width direction of the substrate 110. That is, the two strain resistors 131 are respectively arranged directly above and directly below the first light-transmitting area 112. It is not difficult to understand that the maximum deformation area 111a is also distributed directly above and directly below the first light-transmitting area 112.

[0055] The center lines of the two reference resistors 132 are collinear with the center line of the first light-transmitting area 112 along the length direction of the substrate 110. That is, the two reference resistors 132 are respectively arranged on the left and right sides of the first light-transmitting area 112. It is not difficult to understand that the minimum deformation area 111b is also distributed on the left and right sides of the first light-transmitting area 112.

[0056] In this embodiment, two strain resistors are respectively arranged in the maximum deformation area, and two reference resistors are respectively arranged in the minimum deformation area, which can improve the sensitivity of the sensor and meet the requirements of high-sensitivity products.

[0057] Specifically, in this embodiment, the high-sensitivity light-transmitting pressure sensor 100 is a full-bridge pressure sensor, such as Figure 5 As shown, the four resistors in the bridge are all variable resistors. The two resistors at the position with the largest strain are defined as strain resistors, and the other two resistors are defined as reference resistors. In the Wheatstone bridge, the sensitivity is defined as follows: S = ΔU / (ΔR / R). When the bridge is in equilibrium, the resistors satisfy the relationship R1 = R2 = R3 = R4, and ΔR1 = -ΔR2 = ΔR4 = -ΔR3. The corresponding positionable strain resistors are R1 and R4, and the reference resistors are R2 and R3. Referring to the sensitivity definition formula, the strain resistor ΔR1 in the full-bridge circuit is positively correlated with the sensitivity. The larger ΔR1 is, the greater the sensitivity is. Similarly, the strain resistor ΔR2 in the full-bridge circuit is negatively correlated with the sensitivity. The larger ΔR1 is, the smaller the sensitivity is. Therefore, in the full-bridge circuit, the change values ​​of the strain resistors R1 and R4 increase, and the change values ​​of the reference resistors R2 and R3 decrease, and the sensitivity of the sensor can be improved.

[0058] The substrate 110 is provided with a strain resistor 131 and a reference resistor 132. The substrate 110 of the sensor is simulated and analyzed using simulation software. The maximum deformation area 111a is located directly above and directly below the first light-transmitting area 112. The strain value of the substrate 110 in the maximum deformation area 111a is about 4.6×10 -5 The minimum deformation area 111b is located to the left and right of the first light-transmitting area 112. The strain value of the substrate 110 in the minimum deformation area 111b is approximately -2.2×10 -5 .

[0059] Similarly, in another embodiment, simulation software is used to simulate and analyze the substrate 110 of the sensor. The maximum deformation area 111a is also located directly above and directly below the first light-transmitting area 112. The strain value of the substrate 110 in the maximum deformation area 111a is about 4.2×10 -5 , the minimum deformation area 111b is located to the left and right of the first light-transmitting area 112, and the strain value of the substrate 110 in the minimum deformation area 111b is about -2.4×10 -5 .

[0060] According to the simulation software, the maximum deformation area 111a and the minimum deformation area 111b of the sensor substrate 110 are obtained, and two strain resistors 131 are set in the maximum deformation area 111a in a targeted manner, and the resistance change of the strain resistor 131 is large. Two reference resistors 132 are set in the minimum deformation area 111b, and the resistance change of the reference resistor 132 is small. According to the Wheatstone bridge principle, the sensitivity of the sensor is increased.

[0061] For example, Figure 1 and Figure 3 As shown, a clearance space 111 c is disposed on one side of the stress concentration region 111 facing the first light-transmitting region 112 , and a reference resistor 132 is disposed in the clearance space 111 c .

[0062] Specifically, Figure 1 As shown, in one embodiment, due to the existence of the clearance space 111c, the first light-transmitting area 112 includes a main light-transmitting area and four sub-light-transmitting areas distributed on the left and right sides of the main light-transmitting area, wherein the shapes of the main light-transmitting area and the sub-light-transmitting areas are both approximately rectangular.

[0063] like Figure 3 As shown, in another embodiment, due to the existence of the clearance space 111c, the first light-transmitting area 112 includes a main light-transmitting area and four sub-light-transmitting areas located on the left and right sides of the main light-transmitting area. The main light-transmitting area is rectangular in shape, and the sub-light-transmitting areas are bent and extended from the main light-transmitting area toward the clearance space to form an "L" shape.

[0064] It should be noted that the shape of the first light-transmitting area 112 is not specifically limited. Figure 1 In addition to the shapes shown, other shapes are also possible and can be selected according to actual needs.

[0065] In this embodiment, a clearance space is provided on one side of the stress concentration area facing the first light-transmitting area, so as to reduce the deformation amount of both sides of the stress concentration area along the length direction of the substrate to form the minimum deformation area.

[0066] For example, Figure 1 and Figure 3 As shown, the strain resistor 131 is in contact with the first light-transmitting area 112 and can be preferably located close to the maximum deformation area 111 a.

[0067] like Figure 1 and Figure 3 As shown, there is a gap between the reference resistor 132 and the first light-transmitting area 112 , so that the reference resistor 132 is better located in the minimum deformation area 111 b .

[0068] For example, Figure 2 and Figure 4 As shown, the first pad 120 includes two first sub-pads 121 and two second sub-pads 122 .

[0069] The two first sub-pads 121 are arranged opposite to each other along the length direction of the substrate 110 and are distributed at the four corners of the substrate 110, so as to better fix the substrate 110 to the control circuit board 210. The two second sub-pads 122 are arranged in the clearance space 111c, which can better fix the substrate 110 to the control circuit board 210 and further reduce the deformation amount at the clearance space 111c.

[0070] For example, Figure 2 and Figure 4 As shown, there is a preset gap 123 between the two first sub-pads 121 , and the preset gap 123 corresponds to the strain resistor 131 .

[0071] In this embodiment, there is a preset gap between the two first sub-pads, which can make the substrate have a larger deformation at the preset gap. The preset gap corresponds to the strain resistor, which can make the resistance change of the strain resistor larger, thereby increasing the sensitivity of the sensor.

[0072] It should be noted that the number of the first pads 120 is not specifically limited, and may be two, four, six, etc. The position and shape of the first pads 120 are not specifically limited either, and may be selected according to actual needs.

[0073] like Figure 6 and Figure 7 As shown, another aspect of the embodiment of the present disclosure provides a light-transmitting pressure sensing module 200, including a control circuit board 210 and at least one high-sensitivity light-transmitting pressure sensor 100, wherein the high-sensitivity light-transmitting pressure sensor 100 adopts the high-sensitivity light-transmitting pressure sensor described above. The specific structure of the high-sensitivity light-transmitting pressure sensor 100 has been described in detail above, and will not be repeated here, and reference may be made to the above description.

[0074] The high-sensitivity light-transmitting pressure sensor 100 is fixed to the control circuit board 210 by welding through the first solder pad 120. Specifically, the substrate 110 is fixed to the control circuit board 210 by welding to achieve the transmission of stress, deformation and electrical signals. In this way, the high-sensitivity light-transmitting pressure sensor 100 and the control circuit board 210 form a whole, that is, a light-transmitting pressure sensing module 200. Customers can arrange the position and quantity of the light-transmitting pressure sensor 100 according to their actual needs to reduce the cycle of customers developing pressure sensor module applications, facilitate production, and reduce costs; and can meet the needs of high-sensitivity products.

[0075] The control circuit board 210 is provided with a second hollow structure corresponding to the first hollow structure to form a second light-transmitting area (not shown in the figure) to achieve light transmission of the keys.

[0076] At least two second pads are disposed on a side of the control circuit board 210 facing the high-sensitivity light-transmitting pressure sensor 100 , and the second pads correspond to and are electrically connected to the first pads 120 .

[0077] It should be noted that, in this embodiment, three high-sensitivity light-transmitting pressure sensors 100 are welded and fixed on the control circuit board 210. The number of the high-sensitivity light-transmitting pressure sensors 100 is not specifically limited in this embodiment and can be selected according to actual needs.

[0078] It should be further explained that, in this embodiment, the number of the second solder pads is not specifically limited, and may be two second solder pads, or may be four, six, or other multiple second solder pads. As long as there is a one-to-one correspondence with the first solder pads 120 and the number is the same, the electrical connection between the high-sensitivity light-transmitting sensor 100 and the control circuit board 210 can be achieved.

[0079] The light-transmitting pressure sensing module of the disclosed embodiment can achieve light transmission of the buttons by providing a second light-transmitting area on the control circuit board. The pressure sensor is fixed to the control circuit board by welding with the first pad. Since the light-transmitting pressure sensor can be designed as a standardized unified package, customers can design and arrange the light-transmitting pressure sensing module according to their actual needs, without the need to customize the sensor, which reduces the customer's development cycle of the light-transmitting pressure sensor module application, facilitates production, and reduces costs; the pressure sensing module has a simple structure, is easy to design and improve, and the standardized packaged pressure sensing module can achieve rapid verification of pressure sensing applications. The sensor used has high sensitivity, so the light-transmitting pressure sensing module also has high sensitivity, which can meet the requirements of high-sensitivity products.

[0080] For example, Figure 8 and Fig. 9 As shown, another aspect of the embodiment of the present disclosure provides an electronic device 300, including a pressing panel 310 and a light-transmitting pressure sensing module 200, wherein the light-transmitting pressure sensing module 200 adopts the light-transmitting pressure sensing module 200 described above. The specific structure of the light-transmitting pressure sensing module 200 has been described in detail above, and will not be repeated here, and reference may be made to the above description.

[0081] The pressing panel 310 has a pressing area, and the pressing area is provided with a light-transmitting portion corresponding to the second light-transmitting area. The key backlight is sequentially transmitted to the light-transmitting portion of the pressing panel 310 through the first light-transmitting area and the second light-transmitting area, so as to achieve the light-transmitting effect of the key. The light-transmitting portion can be a hollow structure or a light-transmitting portion formed of a transparent material, which can be limited according to actual needs.

[0082] The light-transmitting pressure sensing module 200 is fixed to the pressing area. Fig. 9 As shown, the electronic device 300 further includes an adhesive layer 320, which is sandwiched between the control circuit board 210 and the pressing area. That is, the control circuit board 210 is directly attached to the pressing area of ​​the pressing panel 310 through the adhesive layer 320 to transfer stress and deformation. When the pressing panel 310 is directly pressed, the stress is transferred to the control circuit board 210 and then to the light-transmitting pressure sensor 100.

[0083] It should be noted that the present embodiment does not specifically limit the specific material of the adhesive layer 320, and a double-sided adhesive layer, an acrylic foam adhesive layer, an AB adhesive layer, an epoxy resin adhesive layer, a silicone adhesive layer or other similar adhesive layers may also be used for bonding.

[0084] It should be further explained that the present embodiment does not specifically limit the electronic device. For example, the electronic device may be a laptop computer, a mobile phone, a washing machine, etc.

[0085] For the electronic device of the disclosed embodiment, the customer can fit the translucent pressure sensing module to the pressing panel of the key according to the specific structure of the key of the electronic device, and the customer can arrange the position and quantity of the translucent pressure sensor according to their actual needs to reduce the customer's development cycle of the pressure sensor module application, facilitate production, and reduce costs; and can meet the needs of high-sensitivity electronic equipment.

[0086] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of the present disclosure.

Claims

1. A high-sensitivity light-transmitting pressure sensor, characterized in that: include: A substrate, wherein a stress concentration area is provided in an edge area of ​​the substrate, a first hollow structure is provided in a central area of ​​the substrate to form a first light-transmitting area, and the stress concentration area includes a maximum deformation area and a minimum deformation area; A pressure detection circuit is arranged on the first surface of the substrate along the thickness direction thereof and corresponds to the stress concentration area; wherein, The pressure detection circuit includes at least one strain resistor disposed in the maximum deformation area and at least one reference resistor disposed in the minimum deformation area; At least two first pads are arranged on the second surface of the substrate along the thickness direction thereof and are electrically connected to the strain resistor and the reference resistor so as to weld and fix the substrate to the control circuit board.

2. The high-sensitivity light-transmitting pressure sensor according to claim 1, characterized in that: The maximum deformation area is relatively distributed on both sides of the first light-transmitting area along the width direction of the substrate; The minimum deformation regions are relatively distributed on two sides of the first light-transmitting region along the length direction of the substrate.

3. The high-sensitivity light-transmitting pressure sensor according to claim 2, characterized in that: The pressure detection circuit includes two strain resistors and two reference resistors; The center lines of the two strain resistors are collinear with the center line of the first light-transmitting area along the width direction of the substrate; Center lines of the two reference resistors are collinear with a center line of the first light-transmitting area along a length direction of the substrate.

4. The high-sensitivity light-transmitting pressure sensor according to claim 3, characterized in that: A clearance space is arranged on a side of the stress concentration area facing the first light-transmitting area, and the reference resistor is arranged in the clearance space.

5. The high-sensitivity light-transmitting pressure sensor according to claim 4, characterized in that: The strain resistor is in contact with the first light-transmitting area, and a gap is provided between the reference resistor and the first light-transmitting area.

6. The high-sensitivity light-transmitting pressure sensor according to claim 4, characterized in that: The first pad includes two first sub-pads and two second sub-pads; The two first sub-pads are arranged opposite to each other along the length direction of the substrate and are distributed at four corner ends of the substrate; The two second sub-pads are arranged in the clearance space.

7. The high-sensitivity light-transmitting pressure sensor according to claim 6, characterized in that: There is a preset gap between the two first sub-pads, and the preset gap corresponds to the strain resistor.

8. A light-transmitting pressure sensing module, characterized in that: It comprises a control circuit board and at least one high-sensitivity light-transmitting pressure sensor, wherein the high-sensitivity light-transmitting pressure sensor is the high-sensitivity light-transmitting pressure sensor according to any one of claims 1 to 7; The high-sensitivity light-transmitting pressure sensor is fixed to the control circuit board by welding through the first soldering pad; The control circuit board is provided with a second hollow structure corresponding to the first hollow structure to form a second light-transmitting area.

9. The light-transmitting pressure sensing module according to claim 8, characterized in that: At least two second pads are disposed on a side of the control circuit board facing the high-sensitivity light-transmitting pressure sensor, and the second pads correspond to and are electrically connected to the first pads.

10. An electronic device, characterized in that: It comprises a pressing panel and a light-transmitting pressure sensing module, wherein the light-transmitting pressure sensing module adopts the light-transmitting pressure sensing module according to claim 8; The pressing panel has a pressing area, and the pressing area is provided with a light-transmitting portion corresponding to the second light-transmitting area; The light-transmitting pressure sensing module is adhered and fixed to the pressing area.

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