Test fixture for monitoring junction temperature of power semiconductor module

Abstract

The utility model relates to the junction temperature test technology, and discloses a test fixture for monitoring the junction temperature of a power semiconductor module, which comprises a test fixture body, the test fixture body comprises a test shell (1) and a test board (2), the test shell (1) is arranged on the test board (2) and forms a test cavity, the power semiconductor module (3) for testing is arranged in the test cavity, and the test board (2) is arranged on the test shell (1). The power semiconductor module (3) is connected with an NTC temperature sensor (4) used for testing the power semiconductor module (3). According to the power semiconductor module junction temperature test fixture, the NTC thermistor arranged in the power semiconductor module is utilized, the actual junction temperature in the module is accurately captured by connecting the pins of the NTC thermistor during normal-temperature and high-temperature tests, and the power semiconductor module junction temperature test fixture has the advantages of universality, simple operation, high reliability and high reliability. And only the test interface needs to be replaced according to the pin definition of the power semiconductor module.

Description

Technical Field

[0001] The utility model relates to a junction temperature testing technology, in particular to a testing fixture for monitoring the junction temperature of a power semiconductor module. Background Art

[0002] Power semiconductor modules, also known as power electronic modules or power electronic modules, are integrated and packaged from several or even dozens of IGBTs, diodes, SiC MOS, etc., and are one of the most core devices in the electronics industry chain. They can realize power conversion and circuit control, and mainly play the roles of power conversion, power amplification, power switching, line protection, inversion (DC to AC) and rectification (AC to DC) in the circuit.

[0003] Nowadays, with the development of the power electronics industry, high voltage and high current application scenarios have become popular. As one of the core components of the entire electric drive system, each finished product of the power semiconductor module needs to undergo very strict normal temperature and high temperature tests before leaving the factory. Only after passing the test can it be shipped smoothly.

[0004] The current power semiconductor module factory test platform uses a base heating and test fixture downward pressure method to perform tests, and simulates the power module working environment by controlling the temperature of the base heating platform.

[0005] As in prior art 1, CN202222056039.8, it discloses. The power module test fixture includes a clamp buckle, a test board assembly, an upper insulating plate, a left supporting aluminum plate, a right supporting aluminum plate, a cylinder mounting aluminum plate, a lower insulating plate, a module positioning plate and a driving cylinder; the test board assembly is mounted on the upper insulating plate, and the clamp buckle can buckle the test board assembly; the upper insulating plate, the left supporting aluminum plate, the right supporting aluminum plate and the cylinder mounting aluminum plate enclose a space; the module positioning plate and the lower insulating plate are both located in the space, and the module positioning plate is used to position the power module to be tested; the driving cylinder is connected to the lower insulating plate in a transmission manner so that the template positioning plate and the power module mounted on the template positioning plate move toward or away from the test board assembly, and the power module is docked with the test board assembly for testing.

[0006] Prior art 2, CN202223223701.0, discloses, including, a test circuit board, on which a plurality of test holes are provided; a plurality of needle sleeves, provided on the test circuit board, the needle sleeves comprising a needle-shaped fixing portion and a columnar connecting portion, the fixing portion being provided in the test hole, the connecting portion being provided with a pinhole matched with the pin of an external power module, the external power module being detachably connected to the test circuit board through the needle sleeves.

[0007] For existing technologies based on silicon-based platforms, emerging third-generation semiconductor products such as SiC have higher junction temperatures. The temperature sensor outside the base is separated from the power semiconductor chip by a heat sink, a ceramic substrate and a welding layer, so the measured temperature is inaccurate and distorted. Summary of the invention

[0008] The utility model aims at the existing technology based on silicon-based platform, while the emerging third-generation semiconductor products such as SiC have higher junction temperature, and the temperature sensor outside the base is separated from the power semiconductor chip by a heat sink, a ceramic substrate and a welding layer, so the measured temperature is inaccurate and distorted. A test fixture for monitoring the junction temperature of a power semiconductor module is provided.

[0009] In order to solve the above technical problems, the utility model is solved by the following technical solutions:

[0010] A test fixture for monitoring the junction temperature of a power semiconductor module comprises a test fixture body, wherein the test fixture body comprises a test shell and a test board, the test shell is placed on the test board to form a test cavity, a power semiconductor module for testing is placed in the test cavity, and the power semiconductor module is connected to an NTC temperature sensor for testing the power semiconductor module.

[0011] Through the designed test fixture, the NTC thermistor built into the power semiconductor module is used to accurately capture the actual junction temperature inside the module by connecting the pins of the NTC thermistor at the same time during normal temperature and high temperature testing. The test operation is simple and the junction temperature test is highly accurate.

[0012] Preferably, a heating platform for heating the test fixture body is placed parallel to the test plate; a support column is fixedly connected to the heating platform for supporting the test fixture body, and the support column passes through the test fixture body.

[0013] By providing a heating table, the power semiconductor module to be tested can be heated, and the test and heating designs are integrated to reduce the design cost.

[0014] Preferably, a positioning column is connected to the support column, and the spatial distance between the test fixture body and the heating platform is adjusted by the positioning column.

[0015] The distance between the heating platform and the test fixture body can be adjusted by the positioning column, so as to facilitate heating to different temperatures.

[0016] Preferably, the test housing is a transparent touch-proof housing.

[0017] The touch-proof housing facilitates electrical isolation from the outside world, while the transparent design enables observation of the power semiconductor module test status.

[0018] Preferably, the NTC temperature sensor is located outside the test cavity.

[0019] Preferably, the power semiconductor module includes a plastic-encapsulated power semiconductor module and a shell-encapsulated power semiconductor module.

[0020] The utility model has significant technical effects due to the adoption of the above technical solutions:

[0021] The test fixture designed by the utility model utilizes the NTC thermistor built into the power semiconductor module, and simultaneously connects the pins of the NTC thermistor to accurately capture the actual junction temperature inside the module during normal temperature and high temperature testing. The test operation is simple, and the junction temperature test has high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural diagram of the utility model;

[0023] Figure 2 This is a structural diagram of the utility model without a test housing;

[0024] Figure 3 It is the front view of the utility model;

[0025] Figure 4 It is a structural diagram of embodiment 1 of the present utility model.

[0026] in,

[0027] 1—Test housing,

[0028] 2—Test board,

[0029] 3—Power semiconductor modules,

[0030] 4—NTC temperature sensor,

[0031] 5—Heating table,

[0032] 6—Support column,

[0033] 7—Positioning column. DETAILED DESCRIPTION

[0034] The utility model is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] Example 1

[0036] A test fixture for monitoring the junction temperature of a power semiconductor module, comprising a test fixture body, Figure 1 and Figure 4In the present invention, the test fixture body includes a test housing 1 and a test board 2. The test housing 1 is placed on the test board 2 to form a test cavity. A power semiconductor module 3 for testing is placed in the test cavity. The power semiconductor module 3 is connected to an NTC temperature sensor 4 for testing the power semiconductor module 3. The NTC temperature sensor 4 is located outside the test cavity.

[0037] Through the designed test fixture, the NTC thermistor built into the power semiconductor module 3 is used to accurately capture the actual junction temperature inside the module by simultaneously connecting the pins of the NTC thermistor during normal temperature and high temperature tests. The test operation is simple and the junction temperature test is highly accurate.

[0038] Example 2

[0039] Based on Example 1, Figure 2 In this embodiment, a heating table 5 for heating the test fixture body is placed parallel to the test board 2; a support column 6 is fixedly connected to the heating table 5 for supporting the test fixture body, and the support column 6 passes through the test fixture body.

[0040] By providing the heating platform 5, the power semiconductor module 3 to be tested can be heated, and the test and heating designs are integrated to reduce the design cost.

[0041] Example 3

[0042] Based on Example 2, in this embodiment, the support column 6 is connected with a positioning column 7, and the distance between the test fixture body and the heating platform 5 is adjusted by the positioning column 7. The distance between the heating platform 5 and the test fixture body can be adjusted by the positioning column 7, so as to facilitate compatibility with modules with different packaging shapes.

[0043] Example 4

[0044] Based on the above embodiment, the test housing 1 of this embodiment is a transparent touch-proof housing. The touch-proof housing is conducive to electrical isolation from the outside world, and the transparent design enables observation of the test status of the power semiconductor module 3.

[0045] Example 5

[0046] Based on the above embodiment, the power semiconductor module 3 of this embodiment includes a plastic-encapsulated power semiconductor module 3

[0047] Example 6

[0048] On the basis of the above-mentioned embodiment, the difference between this embodiment and the embodiment 5 is that the power semiconductor module 3 of this embodiment is a shell-encapsulated power semiconductor module 3 .

Claims

1. A test fixture for monitoring the junction temperature of a power semiconductor module, comprising a test fixture body, characterized in that: The test fixture body comprises a test housing (1) and a test board (2); the test housing (1) is placed on the test board (2) to form a test cavity; a power semiconductor module (3) for testing is placed in the test cavity; the power semiconductor module (3) is connected to an NTC temperature sensor (4) for testing the power semiconductor module (3).

2. A test fixture for monitoring the junction temperature of a power semiconductor module according to claim 1, characterized in that: A heating platform (5) for heating the test fixture body is placed parallel to the test plate (2); a support column (6) is fixedly connected to the heating platform (5) for supporting the test fixture body, and the support column (6) passes through the test fixture body.

3. A test fixture for monitoring the junction temperature of a power semiconductor module according to claim 1, characterized in that: A positioning column (7) is connected to the support column (6), and the distance between the test fixture body and the heating platform (5) is adjusted by the positioning column (7).

4. A test fixture for monitoring the junction temperature of a power semiconductor module according to claim 1, characterized in that: The test housing (1) is a transparent, touch-proof housing.

5. A test fixture for monitoring the junction temperature of a power semiconductor module according to claim 1, characterized in that: The NTC temperature sensor (4) is located outside the test chamber.

6. A test fixture for monitoring the junction temperature of a power semiconductor module according to claim 1, characterized in that: The power semiconductor module (3) comprises a plastic-sealed power semiconductor module (3) and a shell-sealed power semiconductor module (3).

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