Semiconductor constant temperature device for gaseous pollutant sampling tube
By using a combination of semiconductor refrigeration sheet and thermosensitive resistor in the gaseous pollutant sampling tube, the constant temperature control of the sampling tube is achieved, which solves the problem of the lack of constant temperature measures in the traditional sampling tube, and improves the accuracy and comparability of the sampling results. Provides reliable data support for environmental monitoring.
Patent Information
- Application Number
- CN202421181854.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The traditional gaseous pollutant sampling tube lacks constant temperature measures, resulting in local randomness of gaseous pollutants during the sampling process, affecting the sampling effect and data accuracy.
A semiconductor constant temperature device for sampling tubes of gaseous pollutants was designed, using semiconductor refrigeration sheets and temperature-sensitive resistors to combine temperature control sleeves and heat transfer plates to achieve uniform heat exchange within the sampling tubes through circuit control, maintain a constant temperature, and ensure sampling. Accuracy and comparable results.
Through constant temperature control, a stable temperature environment is provided, which reduces data errors, improves sampling accuracy and reliability, ensures the comparability of sampled data at different times and locations, and provides reliable analytical data for environmental monitoring.
Smart Images
Figure CN222319356U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of gas sampling and collection equipment, and specifically relates to a semiconductor constant temperature device for a gaseous pollutant sampling tube. Background Art
[0002] Gaseous pollutant sampling tubes are devices used to collect samples of gaseous pollutants in the air, usually made of materials with certain adsorption properties. During the sampling process, gaseous pollutants in the air will be adsorbed into the sampling tube, and then the pollutant content in the sample will be detected and measured through laboratory analysis techniques. The design and use of sampling tubes are crucial to ensure the accuracy and reliability of sampling, and can effectively monitor and evaluate the level of pollutants in the atmosphere, providing an important reference for environmental protection and management.
[0003] The advantage of the constant temperature gaseous pollutant sampling tube is that it can maintain a certain temperature stability, which can effectively avoid the risk of gaseous pollutants being affected by temperature changes during the sampling process. The constant temperature sampling tube can ensure the stability and consistency of gaseous pollutants during the sampling process, reduce data errors and uncertainty of results, and improve the accuracy and reliability of sampling. In addition, the constant temperature sampling tube also helps to improve the repeatability of the experiment, ensure the comparability of sampling data at different times and locations, and provide more reliable analytical data for environmental monitoring and research.
[0004] Semiconductor heat sinks are a thermal management solution for reducing device temperature and have been widely used in computers and automotive electronic equipment. Direct current is usually used in semiconductor heat sinks. Semiconductor heat sinks can effectively dissipate the generated heat to the surrounding environment through mechanisms such as heat conduction and heat dissipation surface design. The heat sink is always at a high temperature on one side and a low temperature on the other side through circuit activity and energy conservation. When the current is reversed, the corresponding heated or cooled surfaces have the opposite effect.
[0005] However, traditional sampling tubes do not have relevant constant temperature measures, and the sampling of gaseous pollutants is usually accompanied by local randomness, which is not conducive to the sampling effect of the surrounding environment. Utility Model Content
[0006] The purpose of the present application is to provide a semiconductor constant temperature device for a gaseous pollutant sampling tube in order to solve the above-mentioned problems.
[0007] The technical solution adopted in the present application is as follows: a semiconductor constant temperature device for a gaseous pollutant sampling tube comprises a main shell, the inner surface of the main shell is fixedly connected with a placement sleeve, the outer surface of the placement sleeve is fixedly connected with a temperature control sleeve, the outer surface of the temperature control sleeve is fixedly connected with a heat transfer plate, the inner surface of the heat transfer plate is fixedly connected with a heated metal wire, the outer surface of the heat transfer plate away from the heated metal wire is fixedly connected with a semiconductor refrigeration plate, the inner surface of the main shell is fixedly connected with a control circuit body, and the inner surface of the main shell is fixedly connected with an adjustment circuit.
[0008] By adopting the above technical solution, the main shell provides a location for the installation of equipment parts. At the lower end of the placement sleeve, the temperature difference of the thermistor causes the temperature difference to change the resistance, and then the electrode adjustment of the semiconductor refrigeration plate is completed by adjusting the circuit and controlling the circuit body. Through the operation of the semiconductor refrigeration plate, the contact between the temperature control sleeve and the heat transfer plate is used for heat exchange, and the uniform heat exchange inside the placement sleeve is completed, thereby completing the constant temperature control of the equipment. The chemical properties and concentrations of gaseous pollutants may change due to the influence of temperature. By sampling constant temperature, a constant temperature environment can be provided, thereby ensuring the accuracy and comparability of the sampling results.
[0009] In a preferred embodiment, a fan is disposed on the inner surface of the main housing, an isolation plate is welded to the inner surface of the main housing, and a battery is fixedly connected to the lower surface of the isolation plate.
[0010] By adopting the above technical solution, the fan can easily adjust the temperature inside the main shell to a relatively stable temperature through the airflow by quickly transferring the temperature difference generated by the semiconductor refrigeration plate, thereby ensuring the constant temperature effect inside the main shell. The isolation plate can ensure that the battery is isolated from the working space, thereby ensuring the overall stability of the equipment. The battery can conveniently provide power for the equipment outdoors.
[0011] In a preferred embodiment, the inner surface of the placement sleeve is movably connected to a first sampling tube, the inner surface of the placement sleeve is movably connected to a second sampling tube, and the inner surface of the placement sleeve is movably connected to a third sampling tube.
[0012] By adopting the above technical solution, the first sampling tube, the second sampling tube and the third sampling tube ensure the sampling of gaseous pollutants.
[0013] In a preferred embodiment, a 220V power interface is fixedly connected to the outer surface of the main shell, and a vehicle power interface is fixedly connected to the outer surface of the main shell.
[0014] By adopting the above technical solution, the 220V power interface facilitates external 220V charging of the device, and the vehicle power interface facilitates vehicle charging of the device.
[0015] In a preferred embodiment, a display screen is fixedly connected to the outer surface of the main shell, and buttons are arranged on the outer surface of the main shell.
[0016] By adopting the above technical solution, the display screen can conveniently provide users with relevant parameters such as device temperature, and the buttons can conveniently provide settings for the device.
[0017] In a preferred embodiment, an external interface is fixedly connected to the outer surface of the control circuit body, and a knob is provided on the outer surface of the adjustment circuit.
[0018] By adopting the above technical solution, the external interface is convenient for connecting the external device to adjust the control effect of the control circuit body, and the knob is convenient for connecting the internal thermistor of the device in series to adjust the temperature controlled by the device by rotating.
[0019] In a preferred embodiment, a dust cover is fixedly connected to the outer surface of the main shell corresponding to the fan, a pressure interface is fixedly connected to the outer surface of the main shell, and a handle is welded to the upper surface of the main shell.
[0020] By adopting the above technical solution, the dust cover ensures that impurities cannot enter the equipment during heat exchange inside the main shell, thereby ensuring the cleanliness of the internal environment of the equipment. The pressure interface facilitates the connection of the sampling equipment to complete the pumping adjustment, and the handle facilitates the removal of the main shell.
[0021] In a preferred embodiment, the lower surface of the main shell is movably connected to a bracket connector, the outer surface of the bracket connector is movably connected to the main bracket, the inner surface of the main bracket is movably connected to a second extension bracket, and the inner surface of the second extension bracket is movably connected to a third extension bracket.
[0022] By adopting the above technical solution, the bracket connector facilitates the rotation of the main bracket 27 and provides a larger support surface. The second extension bracket and the third extension bracket can be extended and retracted to complete the required height adjustment.
[0023] In a preferred embodiment, a hanging plate is fixedly connected to the side surface of the main shell, a fixing frame is movably connected to the inner surface of the hanging plate, and a drying tube is movably connected to the inner surface of the fixing frame.
[0024] By adopting the above technical solution, the fixing frame can be disassembled at the hanging plate by sliding upwards, and the drying tube assists the corresponding equipment in drying the sampling tube.
[0025] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:
[0026] In the present application, the main housing provides a location for the installation of equipment components. At the lower end of the placement sleeve, the temperature difference causes the temperature sensitive resistor to change the resistance, and then the electrode adjustment of the semiconductor refrigeration plate is completed by adjusting the circuit and controlling the circuit body. Through the operation of the semiconductor refrigeration plate, the temperature control sleeve and the contact of the heat transfer plate are used for heat exchange, and the uniform heat exchange inside the placement sleeve is completed, thereby completing the constant temperature control of the equipment. The chemical properties and concentrations of gaseous pollutants may change due to the influence of temperature. By sampling constant temperature, a constant temperature environment can be provided, thereby ensuring the accuracy and comparability of the sampling results. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 A schematic diagram of the device appearance of this application;
[0028] Figure 2 This is the front view of the main structure of the equipment in this application;
[0029] Figure 3 This is the back view of the main structure of the equipment in this application;
[0030] Figure 4 This is the internal diagram of the main structure of the equipment in this application;
[0031] Figure 5 This is a schematic diagram of the sampling tube in this application;
[0032] Figure 6 This is a schematic diagram of the support structure in this application;
[0033] Figure 7 This is a schematic diagram of the heat exchange structure in this application.
[0034] Markings in the figure: 1. Main shell; 2. Placement sleeve; 3. Temperature control sleeve; 4. Heat transfer plate; 5. Heated metal wire; 6. Semiconductor refrigeration plate; 7. Thermostatic resistor; 8. Adjustment circuit; 9. Control circuit body; 10. Fan; 11. Isolation plate; 12. Battery; 13. Hanging plate; 14. First sampling tube; 15. Second sampling tube; 16. Third sampling tube; 17. 220V power interface; 18. Vehicle power interface; 19. Display screen; 20. Button; 21. External interface; 22. Knob; 23. Dust cover; 24. Pressure interface; 25. Handle; 26. Bracket connector; 27. Main bracket; 28. Second extension bracket; 29. Third extension bracket; 30. Fixing bracket; 31. Drying tube. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0036] Example:
[0037] Reference Figure 1-4 7. A semiconductor constant temperature device for a gaseous pollutant sampling tube comprises a main shell 1, an inner surface of the main shell 1 is fixedly connected with a placement sleeve 2, an outer surface of the placement sleeve 2 is fixedly connected with a temperature control sleeve 3, an outer surface of the temperature control sleeve 3 is fixedly connected with a heat transfer plate 4, an inner surface of the heat transfer plate 4 is fixedly connected with a heated metal wire 5, an outer surface of the heat transfer plate 4 away from the heated metal wire 5 is fixedly connected with a semiconductor refrigeration sheet 6, an inner surface of the main shell 1 is fixedly connected with a control circuit body 9, and an inner surface of the main shell 1 is fixedly connected with an adjustment circuit 8.
[0038] The main housing 1 provides a location for the installation of equipment components. At the lower end of the placement sleeve 2, the temperature sensitive resistor 7 causes the temperature difference to change the resistance, and then the circuit is adjusted by adjusting the circuit 8 and the control circuit body 9 to complete the electrode adjustment of the semiconductor refrigeration plate 6. Through the operation of the semiconductor refrigeration plate 6, the temperature control sleeve 3 and the heat transfer plate 4 are in contact for heat exchange, and the uniform heat exchange inside the placement sleeve 2 is completed, thereby completing the constant temperature control of the equipment. The chemical properties and concentrations of gaseous pollutants may change due to the influence of temperature. Through sampling constant temperature, a constant temperature environment can be provided, thereby ensuring the accuracy and comparability of the sampling results.
[0039] Reference Figure 1-4 A fan 10 is arranged on the inner surface of the main shell 1 , an isolation plate 11 is welded on the inner surface of the main shell 1 , and a battery 12 is fixedly connected to the lower surface of the isolation plate 11 .
[0040] The fan 10 conveniently adjusts the temperature inside the main shell 1 to a relatively stable temperature through the airflow quickly by the temperature difference generated by the semiconductor refrigeration plate 6, thereby ensuring the constant temperature effect inside the main shell 1. The isolation plate 11 ensures that the battery 12 is isolated from the working space to ensure the overall stability of the equipment. The battery 12 conveniently provides power for the equipment outdoors.
[0041] Reference Figure 1-5 A first sampling tube 14 is movably connected to the inner surface of the placement sleeve 2, a second sampling tube 15 is movably connected to the inner surface of the placement sleeve 2, and a third sampling tube 16 is movably connected to the inner surface of the placement sleeve 2.
[0042] The first sampling tube 14 , the second sampling tube 15 , and the third sampling tube 16 ensure the sampling of gaseous pollutants.
[0043] Reference Figure 1-4 A 220V power interface 17 is fixedly connected to the outer surface of the main shell 1, and a vehicle power interface 18 is fixedly connected to the outer surface of the main shell 1.
[0044] The 220V power interface 17 facilitates external 220V charging of the device, and the vehicle power interface 18 facilitates vehicle charging of the device.
[0045] Reference Figure 1-4 A display screen 19 is fixedly connected to the outer surface of the main shell 1, and buttons 20 are arranged on the outer surface of the main shell 1.
[0046] The display screen 19 conveniently provides the user with relevant parameters such as device temperature, and the button 20 conveniently provides settings for the device.
[0047] Reference Figure 1-4 An external interface 21 is fixedly connected to the outer surface of the control circuit body 9 , and a knob 22 is provided on the outer surface of the adjustment circuit 8 .
[0048] The external interface 21 is convenient for connecting an external device to adjust the control effect of the control circuit body 9, and the knob 22 is convenient for connecting the internal temperature-sensitive resistor 7 of the device in series to adjust the temperature controlled by the device by rotating.
[0049] Reference Figure 1-4 A dust cover 23 is fixedly connected to the outer surface of the main shell 1 corresponding to the fan 10 , a pressure interface 24 is fixedly connected to the outer surface of the main shell 1 , and a handle 25 is welded on the upper surface of the main shell 1 .
[0050] The dust cover 23 prevents impurities from entering the device during heat exchange inside the main housing 1 , thereby ensuring the cleanliness of the internal environment of the device. The pressure interface 24 facilitates the connection of the sampling device to complete the pumping adjustment. The handle 25 facilitates the removal of the main housing 1 .
[0051] Reference Figure 1-4 The lower surface of the main shell 1 is movably connected with a bracket connector 26, the outer surface of the bracket connector 26 is movably connected with a main bracket 27, the inner surface of the main bracket 27 is movably connected with a second extension bracket 28, and the inner surface of the second extension bracket 28 is movably connected with a third extension bracket 29.
[0052] The bracket connector 26 facilitates the rotation of the main bracket 27 and provides a larger support surface. The second extension bracket 28 and the third extension bracket 29 can be extended and retracted to achieve the required height adjustment.
[0053] Reference Figure 1-4A hanging plate 13 is fixedly connected to the side surface of the main shell 1, a fixing frame 30 is movably connected to the inner surface of the hanging plate 13, and a drying pipe 31 is movably connected to the inner surface of the fixing frame 30.
[0054] The fixing frame 30 can be disassembled at the hanging plate 13 by sliding upward, and the drying tube 31 assists the corresponding equipment to dry the sampling tube.
[0055] The implementation principle of the semiconductor constant temperature device for gaseous pollutant sampling tube of the present application is as follows:
[0056] The working principle of the semiconductor refrigeration sheet 6 is based on the Peltier effect. The principle of this effect is that when the current passes through the PN junction composed of P-type and N-type semiconductor materials, the charge carriers such as electrons move between the two materials, causing heat to be transferred from the hot end to the cold end, that is, when the direct current passes through the galvanic couple composed of two different semiconductor materials, the two ends of the galvanic couple will absorb heat and release heat respectively, thereby achieving the purpose of cooling or heating. The effect of the semiconductor refrigeration sheet 6 depends on the energy level difference of the two materials where the charge carrier moves, that is, the thermoelectric potential difference. By changing the polarity of the direct current, that is, the reverse connection of the positive and negative poles of the direct current, cooling or heating can be achieved on the same refrigeration sheet. The operation of the semiconductor refrigeration sheet 6 is to exchange heat inside the main shell 1 through the action of the heat transfer plate 4. At the same time, the heated metal wire 5 with better heat transfer efficiency transfers energy to the temperature control sleeve 3 earlier, so that the temperature control range inside the temperature control sleeve 3 is better. The temperature sensitive resistor 7 makes the temperature difference complete the change of resistance, and then adjusts the circuit by adjusting the circuit 8 and the control circuit body 9 to complete the electrode adjustment of the semiconductor refrigeration sheet 6.
[0057] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A semiconductor thermostat for a gaseous pollutant sampling tube, comprising a main housing (1), characterized in that: The inner surface of the main shell (1) is fixedly connected with a placement sleeve (2), the outer surface of the placement sleeve (2) is fixedly connected with a temperature control sleeve (3), the outer surface of the temperature control sleeve (3) is fixedly connected with a heat transfer plate (4), the inner surface of the heat transfer plate (4) is fixedly connected with a heated metal wire (5), the outer surface of the heat transfer plate (4) away from the heated metal wire (5) is fixedly connected with a semiconductor refrigeration plate (6), the inner surface of the main shell (1) is fixedly connected with a control circuit body (9), and the inner surface of the main shell (1) is fixedly connected with an adjustment circuit (8).
2. The semiconductor constant temperature device for gaseous pollutant sampling tube according to claim 1, characterized in that: A fan (10) is arranged on the inner surface of the main housing (1), an isolation plate (11) is welded to the inner surface of the main housing (1), and a storage battery (12) is fixedly connected to the lower surface of the isolation plate (11).
3. The semiconductor constant temperature device for gaseous pollutant sampling tube according to claim 1, characterized in that: The inner surface of the placement sleeve (2) is movably connected to a first sampling tube (14), the inner surface of the placement sleeve (2) is movably connected to a second sampling tube (15), and the inner surface of the placement sleeve (2) is movably connected to a third sampling tube (16).
4. The semiconductor constant temperature device for gaseous pollutant sampling tube according to claim 1, characterized in that: The outer surface of the main housing (1) is fixedly connected to a 220V power interface (17), and the outer surface of the main housing (1) is fixedly connected to a vehicle-mounted power interface (18).
5. The semiconductor constant temperature device for gaseous pollutant sampling tube according to claim 1, characterized in that: A display screen (19) is fixedly connected to the outer surface of the main housing (1), and buttons (20) are arranged on the outer surface of the main housing (1).
6. The semiconductor constant temperature device for a gaseous pollutant sampling tube as claimed in claim 1, characterized in that: An external interface (21) is fixedly connected to the outer surface of the control circuit body (9), and a knob (22) is provided on the outer surface of the adjustment circuit (8).
7. The semiconductor constant temperature device for a gaseous pollutant sampling tube as claimed in claim 1, characterized in that: A dust cover (23) is fixedly connected to the outer surface of the main housing (1) corresponding to the fan (10), a pressure interface (24) is fixedly connected to the outer surface of the main housing (1), and a handle (25) is welded to the upper surface of the main housing (1).
8. The semiconductor constant temperature device for a gaseous pollutant sampling tube as claimed in claim 1, characterized in that: The lower surface of the main housing (1) is movably connected to a bracket connector (26), the outer surface of the bracket connector (26) is movably connected to a main bracket (27), the inner surface of the main bracket (27) is movably connected to a second extension bracket (28), and the inner surface of the second extension bracket (28) is movably connected to a third extension bracket (29).
9. The semiconductor constant temperature device for a gaseous pollutant sampling tube as claimed in claim 1, characterized in that: A hanging plate (13) is fixedly connected to the side surface of the main housing (1), a fixing frame (30) is movably connected to the inner surface of the hanging plate (13), and a drying pipe (31) is movably connected to the inner surface of the fixing frame (30).