Temperature control system and measuring equipment with same

Abstract

The utility model discloses a temperature control system and measuring equipment with the temperature control system, and the temperature control system comprises a housing which is provided with an air inlet and an air outlet, and the air inlet is communicated with the air outlet; the temperature control mechanism is located in the inner cavity of the shell and comprises a heating assembly and an air supply assembly, and air is sucked into the heating assembly from the air inlet to be processed and then blown out of the equipment through the air outlet through the air supply assembly; the induction adjusting mechanism is installed on the shell, the induction adjusting mechanism comprises a plurality of temperature sensors and a controller, the temperature sensors are electrically connected with the controller, and the temperature sensors are used for collecting the temperature of all positions and feeding back temperature data signals to the controller; the controller judges according to the set target temperature in combination with the fed-back temperature data, and the heating assembly is turned on or turned off; and the power supply is electrically connected with the temperature control mechanism and the induction adjusting mechanism. The temperature control device has the effects of accurately controlling the temperature value, maintaining the temperature stability and being high in cost performance.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing equipment, and more specifically, to a temperature control system and a measuring device having the same. Background Art

[0002] In semiconductor measurement equipment, the temperature value and temperature stability of the equipment process chamber have a crucial impact on the measurement. The equipment process chamber requires an auxiliary temperature control system to provide the chamber environment with a measurement temperature value suitable for semiconductor testing and a stable ambient temperature. The more stable the temperature of the equipment process chamber measurement value, the more stable the measurement result.

[0003] In actual testing, the operation of the equipment structure in the equipment process warehouse generates heat, making the temperature inside the warehouse higher than the ambient temperature. The closer the working temperature value in the equipment process warehouse is to the ambient temperature, and the smaller the temperature change during the transmission of the semiconductor from outside the equipment process warehouse to inside the equipment process warehouse, the smaller the adverse effect on the measurement. At present, the temperature control system uses refrigeration equipment to control the temperature regulation in the equipment process warehouse. The refrigeration equipment is located in the equipment chamber and controls the temperature in the warehouse to be close to the outdoor temperature through refrigeration to reduce the temperature difference between inside and outside the warehouse. The refrigeration equipment has the defects of narrow range of action, not easy to continuously and stably control the temperature in the warehouse, and high cost. Utility Model Content

[0004] The embodiments of the present application provide a temperature control system and a measuring device having the same, which can accurately control the temperature value, maintain the temperature stability, and have a high cost performance.

[0005] In a first aspect, the present application provides a temperature control system, which adopts the following technical solution:

[0006] A temperature control system, comprising:

[0007] A housing, wherein the housing is provided with an air inlet and an air outlet, and the air inlet is connected to the air outlet;

[0008] A temperature control mechanism is located in the inner cavity of the shell, and the temperature control mechanism includes a heating component and an air supply component. The heating component is located above the air supply component, and air is sucked from the air inlet to the heating component for processing and then blown out of the device through the air outlet via the air supply component;

[0009] An induction regulating mechanism is installed on the housing, and the induction regulating mechanism includes a plurality of temperature sensors and a controller. The plurality of temperature sensors are electrically connected to the controller, and the plurality of temperature sensors are used to collect temperatures at various locations and feed back these temperature data signals to the controller. The controller makes a judgment based on the set target temperature combined with the fed-back temperature data, and turns on or off the heating component;

[0010] A power supply is electrically connected to the temperature control mechanism and the induction adjustment mechanism.

[0011] Optionally, the inner cavity of the outer shell is provided with an inner mounting plate, the peripheral wall of the inner mounting plate is fixedly connected to the inner wall of the outer shell, and the inner mounting plate divides the inner cavity of the outer shell into a first chamber and a second chamber, and the first chamber and the second chamber are not connected; the heating component is installed on the upper end surface of the inner mounting plate and is located in the first chamber, and the air supply component is installed on the lower end surface of the inner mounting plate and is located in the second chamber.

[0012] Optionally, the multiple temperature sensors include a first sensor, a second sensor and a third sensor, the first sensor and the second sensor are both installed on the inner mounting plate, the first sensor is used to collect air temperature data in the first chamber, the second sensor is used to collect air temperature data in the heating assembly, and the third sensor is arranged corresponding to the air outlet to collect air temperature data at the air outlet.

[0013] Optionally, the heating assembly includes an inner shell fixedly connected to the inner mounting plate and multiple groups of heating modules, the multiple groups of heating modules are fixedly installed on the inner wall of the inner shell, the inner shell is provided with multiple first vents and second vents, the heating modules are arranged one by one corresponding to the first vents, and the air flowing into the first vents is heated by the heating modules and then flows out from the second vents.

[0014] Optionally, the air inlet, the first chamber, the first vent and the second vent form an air flow channel.

[0015] Optionally, the air supply assembly includes multiple groups of fan modules, the inner mounting plate is provided with multiple mounting holes, the multiple mounting holes all correspond to the second vents, and the fan modules are installed in the mounting holes one by one and fixedly connected to the inner mounting plate.

[0016] Optionally, the fan module includes a centrifugal fan, a fan mounting frame and a fan mounting plate, the centrifugal fan is fixedly mounted on the fan mounting frame, the fan mounting frame is fixedly connected to the fan mounting plate, the fan mounting plate blocks the mounting hole, and the fan mounting plate is provided with multiple filter holes, and the multiple filter holes are all set corresponding to the centrifugal fan.

[0017] Optionally, a vibration isolation rubber pad is provided between the fan mounting plate and the inner mounting plate.

[0018] Optionally, the shell is provided with a filter, the filter is fixedly mounted on the inner wall of the second chamber, and the filter is located below the air supply assembly.

[0019] In a second aspect, the present application provides a measuring device, which adopts the following technical solution:

[0020] A measuring device comprises a temperature control system and an equipment process chamber as described above, wherein the outer shell is fixedly mounted on the equipment process chamber, the equipment process chamber is provided with a connecting port, and the outer shell is connected to the equipment process chamber through the air outlet and the connecting port.

[0021] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0022] The air supply component draws in ambient air from the air inlet, heats it through the heating component, and then blows it out from the air outlet through the air supply component; at the same time, multiple temperature sensors are used to collect temperatures at various locations and feed back these temperature data to the controller. The controller will make a judgment based on the set target temperature and the feedback temperature of the temperature sensor, and turn the heating component on or off, thereby accurately controlling the temperature and maintaining temperature stability with high cost performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a measuring device disclosed in an embodiment of the present application;

[0024] Figure 2 An exploded diagram of the structure of a temperature control system disclosed in an embodiment of the present application;

[0025] Figure 3 A cross-sectional view of a temperature control system disclosed in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the structure of a temperature control system disclosed in an embodiment of the present application, showing a heating component with the upper end surface removed;

[0027] Figure 5 A structural disassembly diagram showing an air supply component of a temperature control system disclosed in an embodiment of the present application;

[0028] Figure 6 An internal top view of a temperature control system disclosed in an embodiment of the present application without a top cover;

[0029] Description of reference numerals:

[0030] 10. Temperature control system; 11. Shell; 110. End cover; 111. Air inlet; 112. Air outlet; 113. Inner mounting plate; 114. First chamber; 115. Second chamber; 116. Mounting hole; 117. Filter; 118. Upper shell; 119. Lower shell; 12. Temperature control mechanism; 121. Heating assembly; 1211. Inner shell; 1212. Heating module; 1213. First vent; 1214. Second Ventilation opening; 122, air supply assembly; 1221, fan module; 1222, centrifugal fan; 1223, fan mounting bracket; 1224, fan mounting plate; 1225, filter hole; 1226, vibration isolation rubber pad; 13, induction adjustment mechanism; 131, temperature sensor; 1311, first sensor; 1312, second sensor; 1313, third sensor; 132, controller; 14, power supply; 20, equipment process warehouse. DETAILED DESCRIPTION

[0031] The present application is further described in detail below in conjunction with the accompanying drawings.

[0032] The embodiments of the present application provide a temperature control system and a measuring device having the same.

[0033] See also Figure 1 A temperature control system 10 includes a housing 11, a temperature control mechanism 12, a sensing and adjusting mechanism 13, and a power supply 14. The temperature control mechanism 12, the sensing and adjusting mechanism 13, and the power supply 14 are all located in the housing 11. The power supply 14 is electrically connected to the temperature control mechanism 12 and the sensing and adjusting mechanism 13. The power supply 14 is fixedly connected to the inner wall of the housing 11 to supply power to the temperature control mechanism 12 and the sensing and adjusting mechanism 13. The air entering the housing 11 is processed into air of a target temperature by the temperature control mechanism 12 and supplied to the equipment to reduce the temperature difference between the inside and outside of the equipment. At the same time, the temperature control mechanism 12 is feedback-regulated by the sensing and adjusting mechanism 13 to accurately control the temperature value of the air processed by the temperature control mechanism 12 and maintain the temperature stability, thereby improving the accuracy of the equipment measurement results.

[0034] See also Figure 2 and Figure 3The housing 11 is composed of an upper housing 118, a lower housing 119 and an end cover 110. The end cover 110 is located at the upper end of the upper housing 118. The end cover 110 is fixedly connected to the upper housing 118 by screws, and the upper housing 118 is fixedly connected to the lower housing 119. The end cover 110 is provided with a handle to facilitate the overall removal of the temperature control system 10. The upper housing 118 is provided with a maintenance window for convenient maintenance of the internal temperature control system 10. A window cover is installed at the maintenance window, and the window cover is installed on the upper housing 118 by screws. The housing 11 is provided with an air inlet 111 and an air outlet 112. The air inlet 111 is connected with the air outlet 112. The air inlet 111 is located at the upper end surface of the housing 11, that is, the air inlet 111 is located at the end cover 110, which is obtained by removing part of the end cover 110; the air outlet 112 is located at one end of the lower shell 119 away from the upper shell 118, which is obtained by removing the lower end surface of the lower shell 119. Air is sucked in from the air inlet 111 and flows out from the air outlet 112. In this embodiment, two air inlets 111 are provided, and the end cover 110 is provided with two mesh plates. The two mesh plates are arranged one-to-one corresponding to the two air inlets 111, and the mesh plates are fixedly installed at the air inlet 111 and shield the air inlet 111. The mesh plates are used to shield larger solid objects from entering the housing 11 through the air inlet 111.

[0035] The inner cavity of the outer shell 11 is provided with an inner mounting plate 113, and the peripheral wall of the inner mounting plate 113 is fixedly connected to the inner wall of the outer shell 11. The inner mounting plate 113 divides the inner cavity of the outer shell 11 into a first chamber 114 and a second chamber 115. The first chamber 114 and the second chamber 115 are not connected to each other. The first chamber 114 is connected to the external environment through the air inlet 111. The air temperature in the first chamber 114 is the same as that in the external environment. The air enters the first chamber 114 from the air inlet 111; the second chamber 115 is connected to the equipment through the air outlet 112. The air temperature in the second chamber 115 is the same as that in the equipment. The inner mounting plate 113 divides the inner cavity of the outer shell 11 to reduce the interference between the air in the first chamber 114 and the air in the second chamber 115.

[0036] See also Figure 3The temperature control mechanism 12 includes a heating component 121 and an air supply component 122. The heating component 121 is located above the air supply component 122. The heating component 121 is installed on the upper end surface of the inner mounting plate 113 and is located in the first chamber 114. The air supply component 122 is installed on the lower end surface of the inner mounting plate 113 and is located in the second chamber 115. The heating component 121 and the air supply component 122 are both located on the central axis of the housing 11. In this embodiment, the target set temperature is between the temperature inside the device and the ambient temperature. The air in the first chamber 114 enters the heating component 121 for heating. The heated air is blown into the device through the air outlet 112 by the air supply component 122. Since the temperature of the heated air is lower than the temperature inside the device, the temperature value inside the device is cooled and regulated, and the temperature difference between the inside and outside of the device is reduced. The temperature change during the transmission process of the semiconductor from outside the device to inside the device is reduced, and the corresponding adverse effect on the measurement is also smaller.

[0037] See also Figure 3 and Figure 4 The heating assembly 121 includes an inner shell 1211 and multiple groups of heating modules 1212. The cross section of the inner shell 1211 parallel to the horizontal plane is rectangular. The inner shell 1211 is located on the upper end surface of the inner mounting plate 113 and is fixedly connected to the inner mounting plate 113. The multiple groups of heating modules 1212 are located in the inner shell 1211, and the multiple groups of heating modules 1212 are fixedly installed on the inner wall of the inner shell 1211. In this embodiment, the heating module 1212 is composed of a fixed plate and a plurality of heating plates. There are four groups of multiple heating modules 1212. The four groups of heating modules 1212 are respectively parallel and fixedly installed on the inner wall of the inner shell 1211. The inner shell 1211 is provided with multiple first vents 1213 and second vents 1214. The first vents 1213 are arranged on the side wall of the inner shell 1211. The heating modules 1212 correspond to the first vents 1213 one by one. The second vents 1214 are obtained by removing the lower end surface of the inner shell 1211. The inner mounting plate 113 is provided with a plurality of mounting holes 116. The chamber of the inner shell 1211 is connected with the second chamber 115 through the plurality of mounting holes 116. The plurality of mounting holes 116 correspond to the second vent 1214. The air flowing into the first vent 1213 from the first chamber 114 flows out from the second vent 1214 after being heated by the heating module 1212. The air inlet 111 and the first chamber 114, the first vent 1213 and the second vent 1214 form an air flow channel. The air supply component 122 accelerates the speed of gas flow. Under the action of the air supply component 122, air is sucked in from the air inlet 111, passes through the air flow channel through the plurality of mounting holes 116, and enters the air supply component 122, and is blown out from the air outlet 112 via the air supply component 122.

[0038] See also Figure 3 and Figure 5The air supply assembly 122 includes a plurality of fan modules 1221, which are mounted in the mounting holes 116 one by one and fixedly connected to the inner mounting plate 113, and the mounting holes 116 correspond to the second vents 1214 one by one. The fan module 1221 includes a centrifugal fan 1222, a fan mounting frame 1223, and a fan mounting plate 1224, the centrifugal fan 1222 is fixedly mounted on the fan mounting frame 1223, one end of the fan mounting frame 1223 is fixedly connected to the fan mounting plate 1224, the fan mounting plate 1224 blocks the mounting holes 116, and the fan mounting plate 1224 is provided with a plurality of filter holes 1225, and the plurality of filter holes 1225 are provided corresponding to the centrifugal fan 1222. In this embodiment, the size of the fan mounting plate 1224 is larger than the size of the mounting hole 116. The fan mounting plate 1224 is located on the upper end surface of the inner mounting plate 113. The fan mounting plate 1224 is installed on the inner mounting plate 113 by screws to fix the fan module 1221. The air passing through the heating component 121 is transported by the centrifugal fan 1222 through the filter hole 1225 and blown out from the air outlet 112. Compared with the refrigeration system, this process requires low cost, has a wide range of applications, and is cost-effective.

[0039] Furthermore, the housing 11 is provided with a filter 117, which is fixedly mounted on the inner wall of the second chamber 115, and the filter 117 is located below the air supply assembly 122. The filter 117 is used to block larger solid objects from entering the device through the air outlet 112, thereby reducing the factors affecting semiconductor measurement as much as possible. In order to reduce the impact of the vibration generated when the fan module 1221 is running on the device, a vibration isolation rubber pad 1226 is provided between the fan mounting plate 1224 and the inner mounting plate 113. The vibration generated when the fan module 1221 is running is buffered by the vibration isolation rubber pad 1226, reducing the vibration of the fan module 1221 from being transmitted to the housing 11, thereby reducing the impact on the device measurement.

[0040] See also Figure 3 and Figure 6The sensing and regulating mechanism 13 includes a plurality of temperature sensors 131 and a controller 132. The plurality of temperature sensors 131 are electrically connected to the controller 132. The plurality of temperature sensors 131 are used to collect temperatures at various locations and feed back these temperature data signals to the controller 132. The controller 132 makes a judgment based on the set target temperature combined with the fed-back temperature data to turn on or off the heating component 121. Specifically, the plurality of temperature sensors 131 include a first sensor 1311, a second sensor 1312, and a third sensor 1313. The first sensor 1311 and the second sensor 1312 are both fixedly mounted on the inner mounting plate 113. The first sensor 1311 is used to collect air temperature data in the first chamber 114, i.e., ambient temperature data; the second sensor 1312 is used to collect air temperature data in the heating component 121, and the third sensor 1313 is set corresponding to the air outlet 112 to collect air temperature data at the air outlet 112. The first sensor 1311, the second sensor 1312 and the third sensor 1313 collect temperature data signals at corresponding positions and transmit the temperature signals to the controller 132. The controller 132 makes a judgment based on the target temperature and the feedback temperature, thereby controlling the power supply 14 to turn on or off the heating component 121, so that the temperature of the air blown out from the air outlet 112 is accurately and stably maintained at the target temperature.

[0041] See also Figure 1 In the embodiment of the present application, a measuring device includes a temperature control system 10 and an equipment process chamber 20. The temperature control system 10 is installed on the upper end surface of the equipment process chamber 20, and the housing 11 is fixedly connected to the equipment process chamber 20 by bolts. The end surface of the equipment process chamber 20 facing the temperature control system 10 is provided with a connecting port, and the second chamber 115 is connected to the equipment process chamber 20 through the connecting port. The temperature control system 10 is used to adjust the temperature value in the equipment process chamber 20, so that the temperature in the equipment process chamber 20 is reduced and the temperature difference between the inside and outside of the equipment is reduced, the temperature value in the equipment process chamber 20 is controlled, and the stability of the temperature in the equipment process chamber 20 is maintained, thereby reducing the adverse effects on semiconductor measurement.

[0042] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. The same parts are represented by the same figure marks. It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the above description refer to the directions in the drawings, and the words "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively. Therefore: all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A temperature control system (10), characterized in that: include: A housing (11), the housing (11) being provided with an air inlet (111) and an air outlet (112), the air inlet (111) being in communication with the air outlet (112); A temperature control mechanism (12) is located in the inner cavity of the housing (11), the temperature control mechanism (12) comprises a heating component (121) and an air supply component (122), the heating component (121) is located above the air supply component (122), and air is sucked from the air inlet (111) into the heating component (121), and then processed by the air supply component (122) and blown into the device through the air outlet (112); A sensing and regulating mechanism (13) is installed on the housing (11), the sensing and regulating mechanism (13) comprising a plurality of temperature sensors (131) and a controller (132), the plurality of temperature sensors (131) being electrically connected to the controller (132), the plurality of temperature sensors (131) being used to collect temperatures at various locations and feed back these temperature data signals to the controller (132), the controller (132) making a judgment based on a set target temperature combined with the fed-back temperature data, and turning on or off the heating component (121); A power source (14), wherein the power source (14) is electrically connected to the temperature control mechanism (12) and the induction adjustment mechanism (13).

2. A temperature control system (10) according to claim 1, characterized in that: The inner cavity of the outer shell (11) is provided with an inner mounting plate (113), the peripheral wall of the inner mounting plate (113) is fixedly connected to the inner wall of the outer shell (11), and the inner mounting plate (113) divides the inner cavity of the outer shell (11) into a first chamber (114) and a second chamber (115), and the first chamber (114) and the second chamber (115) are not connected; the heating component (121) is installed on the upper end surface of the inner mounting plate (113) and is located in the first chamber (114), and the air supply component (122) is installed on the lower end surface of the inner mounting plate (113) and is located in the second chamber (115).

3. A temperature control system (10) according to claim 2, characterized in that: The multiple temperature sensors (131) are respectively a first sensor (1311), a second sensor (1312) and a third sensor (1313); the first sensor (1311) and the second sensor (1312) are both installed on the inner mounting plate (113); the first sensor (1311) is used to collect air temperature data in the first chamber (114); the second sensor (1312) is used to collect air temperature data in the heating component (121); and the third sensor (1313) is arranged corresponding to the air outlet (112) and is used to collect air temperature data at the air outlet (112).

4. A temperature control system (10) according to claim 2, characterized in that: The heating component (121) comprises an inner shell (1211) fixedly connected to the inner mounting plate (113) and a plurality of heating modules (1212); the plurality of heating modules (1212) are fixedly mounted on the inner wall of the inner shell (1211); the inner shell (1211) is provided with a plurality of first vents (1213) and second vents (1214); the heating modules (1212) are arranged one by one corresponding to the first vents (1213); and the air flowing into the first vents (1213) is heated by the heating modules (1212) and then flows out from the second vents (1214).

5. A temperature control system (10) according to claim 4, characterized in that: The air inlet (111), the first chamber (114), the first vent (1213) and the second vent (1214) form an air flow channel.

6. A temperature control system (10) according to claim 4, characterized in that: The air supply assembly (122) includes a plurality of fan modules (1221), the inner mounting plate (113) is provided with a plurality of mounting holes (116), the plurality of mounting holes (116) all correspond to the second vents (1214), and the fan modules (1221) are mounted one by one in the mounting holes (116) and fixedly connected to the inner mounting plate (113).

7. A temperature control system (10) according to claim 6, characterized in that: The fan module (1221) comprises a centrifugal fan (1222), a fan mounting frame (1223) and a fan mounting plate (1224); the centrifugal fan (1222) is fixedly mounted on the fan mounting frame (1223); the fan mounting frame (1223) is fixedly connected to the fan mounting plate (1224); the fan mounting plate (1224) blocks the mounting hole (116); the fan mounting plate (1224) is provided with a plurality of filter holes (1225); and the plurality of filter holes (1225) are all provided corresponding to the centrifugal fan (1222).

8. A temperature control system (10) according to claim 7, characterized in that: A vibration isolation rubber pad (1226) is provided between the fan mounting plate (1224) and the inner mounting plate (113).

9. A temperature control system (10) according to claim 2, characterized in that: The housing (11) is provided with a filter (117), the filter (117) is fixedly mounted on the inner wall of the second chamber (115), and the filter (117) is located below the air supply component (122).

10. A measuring device, characterized in that: It comprises a temperature control system (10) and an equipment process chamber (20) as described in any one of claims 1 to 9, wherein the outer shell (11) is fixedly installed on the equipment process chamber (20), the equipment process chamber (20) is provided with a connecting port, and the outer shell (11) is connected to the equipment process chamber (20) through an air outlet (112) and the connecting port.

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