Multi-temperature-zone heating device and temperature control equipment

Abstract

The utility model aims to provide the multi-temperature-zone heating device and the temperature control equipment, which can realize uniform temperature control and improve the temperature control precision, and are high in reliability and high in temperature regulation and control efficiency. The multi-temperature-zone heating device comprises a heating wire and a shell, the heating wire is arranged in the shell, semiconductor chilling plates are arranged on the two sides of the shell, one face of each semiconductor chilling plate is connected with a working zone of the shell through a heat conduction structure, and the other face of each semiconductor chilling plate is connected with a heat dissipation structure. Temperature acquisition units are arranged on the surfaces, close to the heating wire, of the heating wire and the two sets of semiconductor chilling plates, the three temperature acquisition units are connected with an acquisition control unit, and each temperature acquisition unit comprises at least one temperature sensor; the temperature control equipment comprises a working chamber and a plurality of multi-temperature-zone heating devices, wherein the plurality of multi-temperature-zone heating devices are uniformly distributed in the working chamber. The utility model is applied to the technical field of heating temperature control equipment.

Description

Technical Field

[0001] The utility model is applied to the technical field of heating and temperature control equipment, and particularly relates to a multi-temperature zone heating device and temperature control equipment. Background Art

[0002] A common method for industrial heating is heating wires, which offer advantages such as low cost, high efficiency, and long service life. Using a programmable constant current / voltage source to drive the heating wire, combined with a common temperature sensor and PID algorithm, model temperature control can be achieved, leading to their widespread use in various industrial settings. However, due to manufacturing limitations, the heating wires at both ends cannot be fully filled, leaving a gap between the ends. This results in uneven heating of the model, leading to uneven heat distribution between the center and the ends of the heat source. A significant temperature gradient exists between the ends and the center, resulting in uneven temperatures within the region. Heat also diffuses from the ends, leading to significant deviations in heat flux measurements. Therefore, a single heating wire configuration is unsuitable for high-precision temperature control. Furthermore, some environments require thermal insulation, but cooling from a high temperature to a low temperature typically occurs naturally, which takes a long time and cannot meet the efficiency requirements of industrial production. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a multi-temperature zone heating device and a temperature control device, which can achieve uniform temperature control, improve temperature control accuracy, have strong reliability and high temperature control efficiency.

[0004] The technical solution adopted by the present utility model is: the multi-temperature zone heating device includes a heating wire and a shell, the heating wire is arranged in the shell, semiconductor refrigeration plates are arranged on both sides of the shell, one side of the semiconductor refrigeration plate is connected to the working area of ​​the shell through a heat-conducting structure, and the other side of the semiconductor refrigeration plate is connected to the heat dissipation structure, the heating wire and the side of the two groups of semiconductor refrigeration plates close to the heating wire are provided with a temperature acquisition unit, the three temperature acquisition units are all connected to the acquisition control unit, and the temperature acquisition unit includes at least one temperature sensor.

[0005] As can be seen from the above scheme, by setting up two groups of semiconductor refrigeration plates, the principle of reverse power supply and front heat release is utilized to heat the two ends of the heating wire, thereby achieving the effect of multi-zone temperature control. The middle and both ends of the shell are provided with heat sources, wherein the semiconductor refrigeration plates at both ends are used for auxiliary heating and heat preservation, so that the middle and both ends of the shell are maintained at the same temperature, reducing the temperature gradient in the middle and reducing the heat loss from the middle to the two ends, thereby ensuring the uniformity of the overall temperature of the shell. And when heating up, the assistance of the two groups of semiconductor refrigeration plates makes the overall heating speed faster, saving time. In addition, when cooling down, the semiconductor refrigeration plates can also be used for auxiliary cooling, and more efficient heat dissipation can be achieved in conjunction with the heat dissipation structure.

[0006] A preferred solution is that the acquisition control unit includes a processing module and a communication module, the processing module communicates with the host computer through the communication module, and the three temperature acquisition units are all communicatively connected to the processing module.

[0007] A preferred solution is that the multi-temperature zone heating device also includes a temperature control unit, the temperature control unit includes three power supply output units, the output ends of the three power supply output units are respectively connected to the heating wire and the two groups of semiconductor refrigeration plates, the power supply output unit includes a PID control component and a power supply component, the PID control component communicates with the host computer, and the control end of the power supply component is connected to the output end of the PID control component.

[0008] It can be seen from the above scheme that the heating wire and the two groups of semiconductor refrigeration plates are controlled by independent power supply output units, thereby realizing independent control of each partition, and at the same time, temperature control is performed by the PID control component, thereby realizing automatic control when the temperatures of adjacent partitions affect each other, so that the temperature of each partition is stable.

[0009] A preferred solution is that the temperature acquisition unit is connected to the power supply output unit through an over-temperature protection module, and the over-temperature protection module includes two groups of relays and a photoelectric coupler. The alarm port of the temperature acquisition unit is connected to the positive input end of the photoelectric coupler, and the positive control ends of the two groups of relays are connected to the power input through resistors. The negative control ends of the two groups of relays, the negative input end and the negative output end of the photoelectric coupler are grounded. The controlled ends of the two groups of relays are respectively connected in series on the positive and negative paths between the power supply output unit and the load, and the positive input end of the photoelectric coupler is connected between the resistor and the power input.

[0010] A preferred solution is that the alarm ports of the temperature sensors of the two temperature acquisition units connected to the semiconductor refrigeration plate are connected to the positive input terminal of the photoelectric coupler through an AND gate.

[0011] The temperature control device includes a working chamber and several multi-temperature zone heating devices, wherein the multi-temperature zone heating devices are evenly distributed in the working chamber, and the acquisition control unit communicates with several temperature sensors in each multi-temperature zone heating device through an I2C bus. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a connection block diagram of the utility model;

[0013] Figure 2 is a circuit schematic diagram of the processing module;

[0014] Figure 3 is a circuit schematic diagram of the first part of the communication module;

[0015] Figure 4 is a circuit schematic diagram of the second part of the communication module;

[0016] Figure 5 is a circuit schematic diagram of the power module;

[0017] Figure 6 4 is a circuit diagram of the over-temperature protection module. DETAILED DESCRIPTION

[0018] like Figures 1 to 6 As shown, in this embodiment, the multi-temperature zone heating device includes a heating wire 1 and a housing 2. The heating wire 1 is arranged in the housing 2. Semiconductor cooling fins 3 are provided on both sides of the housing 2. One side of the semiconductor cooling fins 3 is connected to the working area of ​​the housing 2 via a heat-conducting structure, and the other side of the semiconductor cooling fins 3 is connected to a heat dissipation structure 4. The heating wire 1 and the side of the two groups of semiconductor cooling fins 3 close to the heating wire 1 are each provided with a temperature acquisition unit. The three temperature acquisition units are all connected to an acquisition control unit. The temperature acquisition unit includes at least one temperature sensor 5. The temperature sensor 5 is a TMP117 sensor.

[0019] During heating adjustment, by controlling the direction of the current input into the semiconductor refrigeration plate 3, the side of the semiconductor refrigeration plate 3 close to the shell 2 is heated, thereby achieving temperature balance at both ends of the shell 2, so that the multi-temperature zone heating device provides a uniform temperature heating effect during heating or maintaining temperature, achieving better heating and heat preservation effects, and also enabling the multi-temperature zone heating device to avoid frequent heating due to uneven temperature; the other side of the semiconductor refrigeration plate 3 is cooled, and the heat dissipation structure 4 is started and forms an airflow that carries the low-temperature gas near the cooling surface of the semiconductor refrigeration plate 3 away from the shell 2, and the airflow is output through the heat-insulating conductive structure to avoid affecting the heating effect.

[0020] When performing temperature reduction regulation, the direction of the current input to the semiconductor refrigeration plate 3 is reversed, so that the side of the semiconductor refrigeration plate 3 close to the shell 2 is cooled, and the shell 2 and the heating wire 1 can be quickly cooled, so that the multi-temperature zone heating device can be quickly lowered to the specified temperature; the other side of the semiconductor refrigeration plate 3 is heated, and the heat dissipation structure 4 carries the gas heated by the heating surface of the semiconductor refrigeration plate 3 away from the shell 2 in this process, so that the semiconductor refrigeration plate 3 can work stably and continuously.

[0021] like Figures 2 to 4 As shown, in this embodiment, the acquisition control unit includes a processing module and a communication module. The processing module communicates with the host computer 7 through the communication module, and the three temperature acquisition units are all connected to the processing module. The processing module includes a microcontroller U801 of model STM32F103, and the communication module includes an embedded Ethernet controller U1201 of model W5500 and a conversion chip U605 of model FT232RL. The microcontroller U801 communicates with the host computer 7 through the embedded Ethernet controller U1201 or the conversion chip U605 to provide feedback on the acquisition signal and receive instructions. Figure 5 As shown, the acquisition control unit further includes a power supply module, which supplies power to the processing module, the communication module and the temperature acquisition unit. The power supply module includes a linear regulator U1202 with a model number of L13045EMSE4PBF.

[0022] In this embodiment, the multi-temperature zone heating device also includes a temperature control unit, which includes three power supply output units 6. The output ends of the three power supply output units 6 are respectively connected to the heating wire 1 and the two groups of semiconductor refrigeration plates 3. The power supply output unit 6 includes a PID control component 61 and a power supply component 62. The PID control component 61 communicates with the host computer 7. The control end of the power supply component 62 is connected to the output end of the PID control component 61. The power supply component 62 is an adjustable power supply.

[0023] like Figure 6As shown, in this embodiment, the temperature acquisition unit is connected to the power output unit 6 via an over-temperature protection module 8. The over-temperature protection module 8 includes two sets of relays and a photoelectric coupler. The alarm port of the temperature acquisition unit is connected to the positive input of the photoelectric coupler. The positive control terminals of the two sets of relays are connected to the power input via resistors. The negative control terminals of the two sets of relays, the negative input terminal of the photoelectric coupler, and the negative output terminal of the photoelectric coupler are grounded. The controlled terminals of the two sets of relays are respectively connected in series to the positive and negative paths between the power output unit 6 and the resistor 1. The positive input terminal of the photoelectric coupler is connected between the resistor and the power input. The provision of the over-temperature protection module 8 prevents excessive temperatures from damaging the semiconductor cooling plate 3, thereby achieving reliable heating and ensuring the service life of the multi-temperature zone heating device. The TMP117 temperature sensor can be set to an alarm value. When the temperature exceeds the alarm value, the alarm port of the temperature sensor outputs a high level, turning on the photoelectric coupler, thereby grounding the power input, switching the control terminal of the relay to a low level, and disconnecting the controlled terminal of the relay, thus achieving automatic over-temperature protection and preventing damage to components.

[0024] In this embodiment, the alarm ports of the temperature sensors 5 of the two temperature acquisition units connected to the semiconductor refrigeration chip 3 are connected to the positive input terminal of the photoelectric coupler via an AND gate. The overtemperature protection module is controlled by the two temperature sensors connected to the semiconductor refrigeration chip 3. When the temperature at one end of the resistance wire 1 is too high, the power supply to the resistance wire 1 is promptly cut off to cool the device and protect the device.

[0025] The temperature control device includes a working chamber and several multi-zone heating devices evenly distributed within the working chamber. The acquisition control unit communicates with the temperature sensors 5 within each multi-zone heating device via an I2C bus. The multiple evenly distributed multi-zone heating devices regulate the temperature within the working chamber, thereby providing accurate temperature control for the product under test. Channel expansion via the I2C bus and an I2C expansion chip provides the processing module with sufficient communication channels for data acquisition from the temperature sensors 5 within each multi-zone heating device. The I2C expansion chip, model PCA9546ADWR, is capable of four-channel expansion, enabling communication with multiple groups of temperature sensors 5.

[0026] Although the embodiments of the present invention are described with practical solutions, they do not limit the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A multi-temperature zone heating device, comprising a heating wire (1) and a housing (2), characterized in that: The heating wire (1) is arranged in the shell (2), and semiconductor cooling sheets (3) are arranged on both sides of the shell (2), one side of the semiconductor cooling sheet (3) is connected to the working area of ​​the shell (2) through a heat conduction structure, and the other side of the semiconductor cooling sheet (3) is connected to the heat dissipation structure (4), and the heating wire (1) and the two groups of semiconductor cooling sheets (3) are provided with temperature collection units on their sides close to the heating wire (1), and the three temperature collection units are connected to a collection control unit, and the temperature collection unit includes at least one temperature sensor (5).

2. A multi-temperature zone heating device according to claim 1, characterized in that: The acquisition control unit comprises a processing module and a communication module. The processing module communicates with the host computer (7) via the communication module. The three temperature acquisition units are all in communication connection with the processing module.

3. A multi-temperature zone heating device according to claim 1, characterized in that: The multi-temperature zone heating device further comprises a temperature control unit, the temperature control unit comprising three power supply output units (6), the output ends of the three power supply output units (6) being respectively connected to the heating wire (1) and the two groups of semiconductor cooling sheets (3), the power supply output unit (6) comprising a PID control component (61) and a power supply component (62), the PID control component (61) communicating with a host computer (7), and the control end of the power supply component (62) being connected to the output end of the PID control component (61).

4. A multi-temperature zone heating device according to claim 3, characterized in that: The temperature acquisition unit is connected to the power supply output unit (6) via an over-temperature protection module (8); the over-temperature protection module (8) comprises two groups of relays and a photoelectric coupler; an alarm port of the temperature acquisition unit is connected to a positive input end of the photoelectric coupler; positive control ends of the two groups of relays are connected to a power supply input via a resistor; negative control ends of the two groups of relays, a negative input end and a negative output end of the photoelectric coupler are grounded; controlled ends of the two groups of relays are respectively connected in series to a positive and negative path between the power supply output unit (6) and a load; and the positive input end of the photoelectric coupler is connected between the resistor and the power supply input.

5. A multi-temperature zone heating device according to claim 4, characterized in that: The alarm ports of the temperature sensors (5) of the two temperature acquisition units connected to the semiconductor refrigeration sheet (3) are connected to the positive input end of the photoelectric coupler via an AND gate.

6. A temperature control device, characterized in that: It comprises a working chamber and a plurality of multi-temperature zone heating devices as claimed in any one of claims 1 to 5, wherein the plurality of multi-temperature zone heating devices are evenly distributed in the working chamber, and the acquisition control unit communicates with a plurality of temperature sensors (5) in each of the multi-temperature zone heating devices via an I2C bus.

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