Double-laser repairing equipment
Through the different energy power and divergence angle configurations of the dual laser repair equipment, the line short circuit problem caused by the laser repair equipment is solved, and the smoothing and safety after line repair is achieved.
Patent Information
- Application Number
- CN202420573994.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-03-22
AI Technical Summary
When existing laser repair equipment repairs circuit board lines, it is easy to cause the repaired lines to come into contact with adjacent lines to form short circuits or other defects.
Using dual laser repair equipment, the first laser part and the second laser part respectively emit laser beams of different energy power and/or different divergence angles, the first laser part is used to sinter the line defect part, and the second laser part is used to The injection member is used to trim the sintered side so that the sintered side is flush with the conductive side to avoid line contact.
It effectively avoids contact between the repaired lines and other lines, prevents short circuits, ensures that the side of the repaired lines is flat, and improves the repair quality.
Smart Images
Figure CN222321856U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a dual laser repair device and an operating method of the dual laser repair device, and in particular to a dual laser repair device and an operating method thereof which can sinter and trim circuits of a circuit board with open circuit defects and short circuit defects. Background Art
[0002] Generally speaking, laser repair equipment can be used to repair circuits of circuit boards with short circuit defects and open circuit defects. For example, laser repair equipment uses a laser head to emit a laser beam to the defective part of the circuit. However, when the laser repair equipment is repairing the circuit, the defective circuit is prone to contact with the adjacent circuit after repair due to the excessive concentration of the energy power of the laser beam or the excessive divergence angle of the laser beam, resulting in a short circuit or other defects. Utility Model Content
[0003] In order to solve the technical problems existing in the prior art, a dual laser repair device is provided, which can prevent the repaired circuit from easily contacting its adjacent circuits and causing a circuit short circuit.
[0004] According to one embodiment of the utility model, the technical solution is to provide a dual laser repair device. The dual laser repair device is used to repair a defective circuit on a circuit board. The defective circuit has two conductive parts and a defective part located between the two conductive parts. The dual laser repair device includes a dual laser repair module. The dual laser repair module includes a first laser component and a second laser component. The second laser component is arranged adjacent to the first laser component. The first laser component and the second laser component are configured to respectively emit two laser beams with different energy powers and / or different divergence angles to the circuit board. The first laser component is used to transform the defective part of the circuit into a sintered part. And after the defective part of the circuit is transformed into the sintered part, the second laser component is used to trim the sintered part so that the sintered side surface of the sintered part is flush with the two conductive side surfaces of the two conductive parts.
[0005] In one embodiment of the utility model, in the first direction, the first laser element is parallel to the second laser element, and the energy power of the laser beam emitted by the first laser element is greater than the energy power of the laser beam emitted by the second laser element, and / or the divergence angle of the laser beam emitted by the first laser element is greater than the divergence angle of the laser beam emitted by the second laser element.
[0006] In one embodiment of the utility model, the dual laser repair device further includes a first displacement module, a second displacement module and a third displacement module. The first displacement module is connected to the dual laser repair module and is used to move the dual laser repair module in a first direction. The second displacement module is connected to the first displacement module and is used to move the first displacement module in a second direction. The third displacement module has a carrier. The carrier is used to carry the circuit board. The third displacement module is used to move the carrier in a third direction. Each of the first direction, the second direction and the third direction is perpendicular to the other two.
[0007] In one embodiment of the present invention, the dual laser repair module has a detection lens. The detection lens is located on a side of the second laser component away from the first laser component. In the second direction, the second laser component is located between the first laser component and the detection lens.
[0008] In one embodiment of the present invention, the detection lens is directed toward the circuit board and is used to detect the current position of the circuit board to generate a moving drive signal according to the current position. The moving drive signal is used to drive the first displacement module, the second displacement module, and the third displacement module to move so that the dual laser repair module and the circuit board are positioned at a specific position.
[0009] In one embodiment of the utility model, the dual laser repair device further includes a detection module. The detection module is arranged on two opposite sides of the third displacement module. When the third displacement module moves to drive the carrier to pass through the detection module, the detection module is used to detect the thickness of the circuit in the circuit board.
[0010] In one embodiment of the utility model, the two conductive parts are two metal wires or two polysilicon fuses, and the defect of the circuit is a short circuit defect. The defective part is sintered by the first laser element so that a part of the defective part diffuses outward and exposes a part of the substrate of the circuit board, thereby converting the defective part into a sintered part. The width of each of the two conductive parts is smaller than the width of the part of the substrate exposed by the defective part.
[0011] In one embodiment of the present invention, the two conductive parts are two metal wires or two polysilicon fused wires. The two opposite sides of the two conductive parts are sintered by the first laser element to diffusely cover the defective part, so that the defective part is transformed into a sintered part and the two conductive parts are conductive.
[0012] In one embodiment of the utility model, the two conductive parts are two metal wires or two polysilicon fused wires. The dual laser repair module has an inkjet head, which is used to spray the conductive glue on the defective part of the circuit, and the conductive glue partially covers the two conductive parts and the first laser element sinters the conductive glue located on the circuit to turn the defective part into a sintered part.
[0013] Compared with the prior art, the utility model has the following beneficial effects:
[0014] In the above-mentioned embodiment of the utility model, the dual laser repair device can be used to repair defective circuits of the circuit board, and the first laser element and the second laser element are configured to respectively emit two laser beams with different energy powers and / or different divergence angles to the circuit board. In addition, the first laser element can transform the defective part of the circuit into a sintered part, and the second laser element can trim the sintered part so that the sintered side of the sintered part is flush with the two conductive side surfaces of the two conductive parts. The configuration of the first laser element and the second laser element of the dual laser repair device allows the repaired side of the circuit to avoid contact with other circuits, thereby avoiding circuit short circuits. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional diagram of a dual laser repair device according to one embodiment of the present invention.
[0016] Figure 2 yes Figure 1 Front view of the dual laser repair module.
[0017] Figure 3 It is a flow chart of an operation method of a dual laser repair device according to one embodiment of the present invention.
[0018] Figures 4 to 6 The invention is a cross-sectional view of a circuit board with an open circuit defect in different states during repair.
[0019] Figure 7 and Figure 8 It is a top view of a circuit board with an open circuit defect in different states when being repaired according to an embodiment of the present invention.
[0020] Fig. 9 and Fig.10 It is a cross-sectional view of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present invention.
[0021] Fig.11 and Fig.12 It is a top view of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present invention.
[0022] Figures 13 to 15 It is a top view of a circuit board with a short circuit defect in different states when being repaired according to an embodiment of the present invention.
[0023] Description of the figure number:
[0024] 100: Dual laser repair equipment
[0025] 110: Dual Laser Repair Module
[0026] 112: The first laser
[0027] 114: Second laser element
[0028] 116: Detection Lens
[0029] 118: Inkjet head
[0030] 120: First displacement module
[0031] 130: Second displacement module
[0032] 140: Third displacement module
[0033] 142: Carrier
[0034] 150: Detection module
[0035] 200: Circuit board
[0036] 210: Line
[0037] 211: Sintered side
[0038] 212: Sintering department
[0039] 213: Conductive side
[0040] 214: Conductive part
[0041] 220: Substrate
[0042] 2121: Defect Department
[0043] C: Conductive glue
[0044] D1: First direction
[0045] D2: Second direction
[0046] D3: Third direction
[0047] S1 Step
[0048] S2: Steps
[0049] T: Thickness
[0050] W1: Width
[0051] W2: width. DETAILED DESCRIPTION
[0052] exist Figure 1 and Figure 2 middle, Figure 1 is a three-dimensional diagram of a dual laser repair device 100 according to an embodiment of the present invention. Figure 2 yes Figure 11 is a front view of a dual laser repair module 110. The dual laser repair device 100 can be used to repair a defective circuit 210 of a circuit board 200. For example, the defective circuit 210 has two conductive parts 214 and a defective part 2121 located between the two conductive parts 214. The defective part 2121 is usually a defect left during the circuit manufacturing process, such as a defect formed due to uneven electroplating, or other situations. The dual laser repair device 100 includes a dual laser repair module 110. The dual laser repair module 110 includes a first laser element 112 and a second laser element 114. The second laser element 114 is disposed adjacent to the first laser element 112. The first laser element 112 and the second laser element 114 are configured to respectively emit two laser beams with different energy powers and / or different divergence angles to the circuit board 200.
[0053] In some embodiments, since the energy power of the laser beam emitted by the first laser element 112 is greater than the energy power of the laser beam emitted by the second laser element 114, and / or the divergence angle of the laser beam emitted by the first laser element 112 is greater than the divergence angle of the laser beam emitted by the second laser element 114, the first laser element 112 and the second laser element 114 can be used in different use processes in the process of circuit repair. For example, the laser beam emitted by the first laser element 112 with a larger energy power and divergence angle can be used in the sintering process, while the laser beam emitted by the second laser element 114 with a smaller energy power and divergence angle can be used in the process of circuit trimming. In addition, in the first direction D1, the first laser element 112 is parallel to the second laser element 114.
[0054] In some embodiments, the dual laser repair device 100 further includes a first displacement module 120, a second displacement module 130, and a third displacement module 140. The first displacement module 120 is connected to the dual laser repair module 110 and is used to move the dual laser repair module 110 in the first direction D1. The second displacement module 130 is connected to the first displacement module 120 and is used to move the first displacement module 120 in the second direction D2. The third displacement module 140 has a carrier 142. The carrier 142 is used to carry the circuit board 200. The third displacement module 140 is used to move the carrier 142 in the third direction D3. Each of the first direction D1, the second direction D2, and the third direction D3 is perpendicular to the other two.
[0055] In addition, the dual laser repair module 110 has a detection lens 116. The detection lens 116 is located on a side of the second laser element 114 away from the first laser element 112. In the second direction D2, the second laser element 114 is located between the first laser element 112 and the detection lens 116. The detection lens 116 faces the circuit board 200 and is used to detect the current position of the circuit board 200 to generate a moving driving signal according to the current position. The moving driving signal is used to drive the first displacement module 120, the second displacement module 130 and the third displacement module 140 to move so that the dual laser repair module 110 and the circuit board 200 are positioned at a specific position.
[0056] Please note that the configuration of the first displacement module 120, the second displacement module 130, and the third displacement module 140 is not intended to limit the present invention. The dual laser repair module 110 may be designed to move in a certain dimension and the movable stage 142 may be designed to move in a certain dimension according to actual needs. For example, the dual laser repair module 110 may not move at all, but the stage 142 may move in three dimensions, or the stage 142 may be designed to move in three dimensions and rotate in one axis, and the present invention is not limited thereto.
[0057] In addition, the dual laser repair device 100 further includes a detection module 150. The detection module 150 is disposed on two opposite sides of the third displacement module 140. When the third displacement module 140 moves to drive the carrier 142 to pass through the detection module 150, the detection module 150 is used to detect the thickness T of the circuit 210 in the circuit board 200.
[0058] In the following description, the operation method of the dual laser repair device will be explained.
[0059] exist Figure 3 middle, Figure 3 It is a flow chart of the operation method of the dual laser repair device according to one embodiment of the utility model. The operation method of the dual laser repair device includes the following steps. First, in step S1, a laser beam is emitted to the circuit board by the first laser component of the dual laser repair module, so that the defective part of the defective circuit is transformed into a sintered part. Then, in step S2, a laser beam having an energy power and / or a divergence angle different from that of the laser beam emitted by the first laser component is emitted to the sintered part by the second laser component of the dual laser repair module, so as to trim the sintered part so that the sintered side surface of the sintered part is flush with the two conductive side surfaces of the two conductive parts. In the following description, each of the above steps will be described in detail.
[0060] Figures 4 to 6 2 is a cross-sectional view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present invention. Figure 7 and Figure 81 is a top view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present invention. Figures 1 to 8 In the embodiment, first, the first displacement module 120, the second displacement module 130 and the third displacement module 140 can be driven to move along the first direction D1, the second direction D2 and the third direction D3 respectively, so that the dual laser repair module 110 connected to the first displacement module 120 and the circuit board 200 on the carrier 142 of the third displacement module 140 are moved to a specific position, wherein each of the first direction D1, the second direction D2 and the third direction D3 is perpendicular to the other two. During the movement of the first displacement module 120, the second displacement module 130 and the third displacement module 140, the current position of the circuit board 200 can be detected by the detection lens 116 of the dual laser repair module 110 to generate a moving driving signal according to the current position, wherein the moving driving signal is used to drive the first displacement module 120, the second displacement module 130 and the third displacement module 140 to move, so that the dual laser repair module 110 and the circuit board 200 are positioned at a specific position.
[0061] Next, after reaching a specific position, a portion of the circuit 210 may be removed, so that the circuit 210 has a defective portion 2121, wherein the two conductive portions 214 of the circuit 210 are two metal wires or two polysilicon fuses, such as Figure 4 Then, the inkjet head 118 of the dual laser repair module 110 can be used to spray the conductive adhesive C on the defective portion 2121 of the circuit 210, and the conductive adhesive C partially covers the two conductive portions 214, as shown in FIG. Figure 5 After spraying the conductive glue C, the conductive glue C located on the circuit 210 can be sintered by the first laser element 112, so that the defective portion 2121 is transformed into the sintered portion 212, as shown in FIG. Figure 6 shown.
[0062] In some embodiments, the carrier 142 can be moved on the third displacement module 140 so that the carrier 142 passes through the detection modules 150 disposed on both sides of the third displacement module 140 , and the detection modules 150 can detect the circuit 210 in the circuit board 200 to confirm the thickness T of the sintered portion 212 and the conductive portion 214 .
[0063] Next, after the defective portion 2121 is transformed into the sintered portion 212, the second laser element 114 can be used to trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214. Figure 8 The arrangement of the sintered side surface 211 flush with the conductive side surface 213 prevents the side surface of the repaired circuit 210 from contacting other circuits, thereby preventing the circuit from short-circuiting.
[0064] Fig. 9 and Fig.10 1 is a cross-sectional view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to another embodiment of the present invention. Fig. 9 and Fig.10 The embodiment shown is similar to Figure 5 and Figure 6 The difference between the illustrated embodiment is that the conductive glue C is not used to partially cover the circuit 210, and the first laser element 112 can directly sinter the two opposite sides of the two conductive parts 214 to diffusely cover the defective part 2121, so that the defective part 2121 is transformed into the sintered part 212 and the two conductive parts 214 are conductive, wherein the two conductive parts 214 can be two metal wires or two polysilicon fuses or other conductive materials.
[0065] exist Fig.11 and Fig.12 middle, Fig.11 and Fig.12 The figure is a top view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to another embodiment of the present invention. The conductive adhesive C does not cover the circuit 210, and the first laser element 112 directly sintered the two opposite sides of the two conductive parts 214 to diffusely cover the defective part 2121, so that the defective part 2121 is transformed into a sintered part 212 and the two conductive parts 214 are conductive. Back Figure 7 and Figure 8 After the defective portion 2121 is transformed into the sintered portion 212, the second laser element 114 can be used to trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214. The arrangement of the sintered side surface 211 flush with the conductive side surface 213 prevents the side surface of the repaired circuit 210 from contacting other circuits, thereby preventing the circuit from short-circuiting.
[0066] Figures 13 to 15 2 is a top view of a circuit 210 of a circuit board 200 with a short circuit defect in different states during repair according to an embodiment of the present invention. Figure 1 , Figures 13 to 15 In this embodiment, there are two lines 210, and the defect between the two lines 210 is a short circuit defect. First, the first laser element 112 can be used to sinter the defect portion 2121, so that a part of the defect portion 2121 diffuses outward and exposes a part of the substrate 220 of the circuit board 200, so that the defect portion 2121 is transformed into the sintered portion 212. Fig.14As shown, the width W1 of each of the two conductive portions 214 is smaller than the width W2 of a portion of the sintered portion 212 exposed from the substrate 220. After confirming that the width W2 of the sintered portion 212 exposed from the substrate 220 is larger than the width W1 of the conductive portion 214, the sintered portion 212 can be trimmed by the second laser element 114 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG. Fig.15 shown.
[0067] In summary, the dual laser repair device 100 can be used to repair the defective circuit 210 of the circuit board 200, and the first laser element 112 and the second laser element 114 are configured to respectively emit two laser beams with different energy powers and / or different divergence angles to the circuit board 200. In addition, the first laser element 112 can transform the defective portion 2121 of the circuit 210 into a sintered portion 212, and the second laser element 114 can trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214. The configuration of the first laser element 112 and the second laser element 114 of the dual laser repair device 100 prevents the repaired circuit side surface from contacting other circuits, thereby preventing a short circuit from occurring after the repair.
Claims
1. A dual laser repair device, characterized in that: Used to repair a circuit (210) with a defect on a circuit board (200), wherein the circuit (210) with the defect has two conductive parts (214) and a defective part (2121) located between the two conductive parts (214), and the dual laser repair device comprises: A pair of laser repair modules (110), comprising: a first laser element (112); and A second laser element (114) is disposed adjacent to the first laser element (112), wherein the first laser element (112) and the second laser element (114) are configured to respectively emit two laser beams having different energy powers and / or different divergence angles to the circuit board (200), the first laser element (112) being used to transform the defective portion (2121) of the circuit (210) into a sintered portion (212), and after the defective portion (2121) of the circuit (210) is transformed into the sintered portion (212), the second laser element (114) is used to trim the sintered portion (212) so that a sintered side surface (211) of the sintered portion (212) is flush with two conductive side surfaces (213) of the two conductive portions (214).
2. The dual laser repair device as claimed in claim 1, characterized in that: In a first direction (D1), the first laser element (112) is parallel to the second laser element (114), and the energy power of the laser beam emitted by the first laser element (112) is greater than the energy power of the laser beam emitted by the second laser element (114), and / or the divergence angle of the laser beam emitted by the first laser element (112) is greater than the divergence angle of the laser beam emitted by the second laser element (114).
3. The dual laser repair device as claimed in claim 2, characterized in that: Also includes: a first displacement module (120), connected to the dual laser repair module (110) and used for moving the dual laser repair module (110) in the first direction (D1); a second displacement module (130), connected to the first displacement module (120) and used to move the first displacement module (120) in a second direction (D2); as well as A third displacement module (140) has a carrier (142), wherein the carrier (142) is used to carry the circuit board (200), and the third displacement module (140) is used to move the carrier (142) in a third direction (D3), and each of the first direction (D1), the second direction (D2) and the third direction (D3) is perpendicular to the other two.
4. The dual laser repair device as claimed in claim 3, characterized in that: The dual laser repair module (110) has a detection lens (116), which is located on a side of the second laser component (114) away from the first laser component (112), and in the second direction (D2), the second laser component (114) is located between the first laser component (112) and the detection lens (116).
5. The dual laser repair device as claimed in claim 4, characterized in that: The detection lens (116) faces the circuit board (200) and is used to detect a current position of the circuit board (200) to generate a moving drive signal according to the current position, wherein the moving drive signal is used to drive the first displacement module (120), the second displacement module (130) and the third displacement module (140) to move so that the dual laser repair module (110) and the circuit board (200) are positioned at a specific position.
6. The dual laser repair device as claimed in claim 3, characterized in that: Also includes: A detection module (150) is arranged on two opposite sides of the third displacement module (140), wherein when the third displacement module (140) moves to drive the carrier (142) to pass through the detection module (150), the detection module (150) is used to detect a thickness (T) of the circuit (210) in the circuit board (200).
7. The dual laser repair device as claimed in claim 1, characterized in that: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is a short circuit defect. The defect part (2121) is sintered by the first laser element (112) so that a part of the defect part (2121) diffuses outward and exposes a part of a substrate (220) of the circuit board (200), thereby transforming the defect part (2121) into the sintered part (212), wherein a width (W1) of each of the two conductive parts (214) is smaller than a width (W2) of the part of the defect part (2121) exposed on the substrate (220).
8. The dual laser repair device as claimed in claim 1, characterized in that: The two conductive parts (214) are two metal wires or two polysilicon fused wires, and the two sides of the two conductive parts (214) opposite to each other are sintered by the first laser element (112) to diffusely cover the defective part (2121), so that the defective part (2121) is transformed into the sintered part (212) and the two conductive parts (214) are conductive.
9. The dual laser repair device as claimed in claim 1, characterized in that: The two conductive parts (214) are two metal wires or two polysilicon fuses. The dual laser repair module (110) has an inkjet head (118). The inkjet head (118) is used to spray a conductive adhesive (C) on the defective part (2121) of the circuit (210). The conductive adhesive (C) partially covers the two conductive parts (214). The first laser element (112) sinters the conductive adhesive (C) located on the circuit (210) so that the defective part (2121) becomes the sintered part (212).