Carrier for through hole reflow soldering equipment

Abstract

The utility model relates to the technical field of PCB reflow soldering, and discloses a carrier for through hole reflow soldering equipment, which comprises a carrier body, a heat insulation assembly and a mounting assembly, the carrier body is welded into a whole by metal, a ventilation hole penetrating through the carrier body is formed in the middle of the carrier body, and the heat insulation assembly is welded on a carrier body seat through a guide rail; and the mounting assembly is fixedly connected to the carrier body. The problems that the sliding fit clearance between the guide sleeve and the guide rod is not controlled in place due to machining size errors and assembly errors, the sliding friction resistance is increased, and opening and closing of the heat insulation assembly are not smooth are solved; and the problems that the carrier parts are prone to deformation due to thermal expansion and cold contraction, the gap between the guide sleeve and the guide rod is unstable, sliding fit is not smooth, and finally opening and closing of the heat insulation assembly are not smooth are solved.

Description

Technical Field

[0001] The present application relates to the technical field of PCB reflow soldering, and in particular to a carrier structure for through-hole reflow soldering equipment. Background Art

[0002] At present, electronic products are constantly developing in the direction of miniaturization, lightness and high density, and PCB assembly structures with double-sided mounting or mixed mounting of SMC and SMD have emerged. Double-sided mounting or mixed mounting PCB assemblies are generally soldered on the upper side (component side) by reflow soldering, and then soldered on the lower side (pin side) by wave soldering. With the gradual rise of through-hole reflow soldering, it can replace the process of reflow soldering first and then wave soldering, and become an important process in PCB mixed assembly technology.

[0003] The overall structure of the carrier for through-hole reflow soldering equipment currently available on the market is assembled from individual processed parts. There are a large number of processed parts, and the sizes of parts that need to be controlled are many, making processing and assembly difficult. Structurally, the opening and closing of the thermal insulation component is achieved by the relative sliding between the guide sleeve and the guide rod on the carrier (relative sliding between the inner hole surface of the guide sleeve and the outer surface of the guide rod). Processing size errors and assembly errors will cause the sliding fit clearance between the guide sleeve and the guide rod to be unable to be properly controlled, resulting in increased sliding friction resistance, which leads to poor opening and closing of the thermal insulation component. In addition, since the existing carrier is assembled from individual processed parts and is not an integrated molded carrier, it is subjected to high temperature shock during the furnace process and the temperature difference between the carrier after the furnace is very large. The carrier is easily deformed by thermal expansion and contraction, which leads to poor sliding fit between the guide sleeve and the guide rod, and ultimately to poor opening and closing of the thermal insulation component. The carrier assembled from processed parts has a complex structure, a large number of processed parts, and is difficult to produce. A single carrier is heavy, costly, and difficult to maintain. Using a carrier assembled from processed parts on through-hole reflow equipment is not competitive. Utility Model Content

[0004] In view of this, the purpose of the present application is to overcome the shortcomings of the above-mentioned prior art and to provide a carrier structure for a through-hole reflow soldering equipment, which not only solves the problems in the related technology of complex structure, great difficulty in processing and assembly, heavy weight of a single carrier, high cost, and difficult maintenance caused by a large number of processed parts and a large number of parts that need to be controlled in size, but also solves the problem that the sliding fit clearance between the guide sleeve and the guide rod cannot be properly controlled due to processing size errors and assembly errors, resulting in increased sliding friction resistance and resulting in uneven opening and closing of the insulation component; in addition, it also solves the problem that the carrier parts are easily deformed by thermal expansion and contraction, resulting in unstable gap between the guide sleeve and the guide rod, resulting in uneven sliding fit and ultimately resulting in uneven opening and closing of the insulation component.

[0005] The present application provides a carrier for a through-hole reflow soldering device, which is used to be installed on a transmission chain of the through-hole reflow soldering device. The carrier for the through-hole reflow soldering device includes:

[0006] The vehicle body is provided with ventilation holes extending therethrough;

[0007] The heat insulation component is installed on the carrier body through a ball guide rail. The heat insulation component has a closed position blocking the ventilation hole and an open position avoiding the ventilation hole.

[0008] Preferably, the carrier body includes two guide rail fixing seats, a bottom plate and two limit strips, the bottom plate is provided with ventilation holes, the two guide rail fixing seats are respectively arranged on the left and right sides of the bottom plate, and the two limit strips are arranged above the bottom plate and respectively connected to the two guide rail fixing seats.

[0009] Preferably, the ball guide rail includes a slide rail and a slider, wherein the slider is provided with a slider body and a ball disposed on the slider body, the slider is welded to the guide rail fixing seat through the slider body, the slide rail is fixed to the insulation assembly, and the slide rail is slidably mounted on the slider through the ball.

[0010] Preferably, the two base plates, the two guide rail fixing seats and the two limiting strips are formed into one body by welding.

[0011] Preferably, a jig bearing step and a jig limit block are provided on the upper portion of the guide rail fixing seat, and the area enclosed by the jig limit block and the limit bar is the jig bearing area of ​​the carrier.

[0012] Preferably, the heat insulation assembly is arranged between the bottom plate and the limiting strip.

[0013] Preferably, the thermal insulation assembly includes: a sliding plate, a magnet, an insulation layer, an insulation laminate and a windshield curtain; the slide rails are welded to the left and right sides of the sliding plate, and the sliding plate can slide along the slider through the slide rails; the sliding plate is provided with weight-reducing holes and a magnet mounting groove; the insulation layer is an insulation layer made of insulation material, the insulation layer is fixed to the sliding plate through the insulation laminate and covers the weight-reducing holes; the windshield curtain is installed on the sliding plate and is perpendicular to the slide rails; the magnet is installed in the magnet mounting groove of the sliding plate.

[0014] Preferably, there are two thermal insulation components. When the two thermal insulation components are in the open position, each thermal insulation component is adsorbed on the limit bar by a magnet to prevent the two thermal insulation components from closing; when the two thermal insulation components are in the closed position, the magnets on the two thermal insulation components attract each other to form a mutual adsorption relationship to prevent the thermal insulation components from opening.

[0015] Preferably, the sliding plate is provided with a base plate, a windshield mounting plate, a slide rail fixing plate, a windshield plate and a movable plate buckle; wherein, the base plate is provided with a weight-reducing hole and a magnet mounting groove, the windshield mounting plate is perpendicular to the slide rail fixing plate, the windshield mounting plate is opposite to the windshield plate, a movable plate buckle is provided behind the windshield plate, and the magnet mounting groove is arranged on the side close to the windshield mounting plate.

[0016] Preferably, ventilation holes are provided on the buckles of the wind shield and the movable plate.

[0017] Preferably, the bottom plate, the windscreen mounting plate, the slide rail fixing plate, the windscreen and the movable plate buckle are formed into one piece by welding.

[0018] Preferably, the carrier is also provided with an installation assembly, and the carrier is fixed on the transmission chain through the installation assembly. The installation assembly includes a first pin, a second pin, and a fixing seat. The first pin and the second pin are respectively installed on the fixing seat. The first pin is fixed on the carrier body, and the second pin is used to fix the carrier on the transmission chain of the through-hole reflow soldering equipment.

[0019] The working process of this application will be described in conjunction with specific embodiments, which will not be repeated here. The beneficial effects of this application are as follows:

[0020] (1) The thermal insulation component is installed on the carrier body through a ball guide rail. The thermal insulation component can be opened and closed through the ball guide rail. Since the sliding parts in the ball guide rail move by rolling balls, the friction resistance between the balls and the rails is small, making the opening and closing of the thermal insulation component smoother.

[0021] (2) The carrier has a small number of machined parts, a simple structure, low difficulty in processing and assembly, a single carrier is light in weight, low in cost, and easy to maintain.

[0022] (3) The heat insulation component is welded to the integrated carrier body through guide rails. The deformation caused by thermal expansion and contraction is small, and the heat insulation component opens and closes smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of the carrier (heat insulation component closed) used for the through-hole reflow soldering equipment in this application;

[0024] Figure 2 An exploded schematic diagram of a carrier for through-hole reflow soldering equipment of the present application;

[0025] Figure 3 This is a schematic diagram of the structure of the carrier body of the carrier used for the through-hole reflow soldering equipment of the present application;

[0026] Figure 4 A schematic diagram of a heat insulation component and a guide rail assembly of a carrier for through-hole reflow soldering equipment in the present application;

[0027] Figure 5 This is a schematic diagram of the structure of a sliding plate of a carrier used for through-hole reflow soldering equipment in the present application;

[0028] Figure 6 This is a schematic diagram of the mounting assembly structure of a carrier for through-hole reflow soldering equipment in the present application;

[0029] Figure 7This is a schematic diagram of the structure of a fixing seat of a carrier used for through-hole reflow soldering equipment in the present application;

[0030] Figure 8 This is a schematic diagram of the structure of a carrier (with the heat insulation component half-opened) used for through-hole reflow soldering equipment in the present application;

[0031] Fig. 9 This is a schematic diagram of a carrier used in the through-hole reflow soldering equipment of the present application carrying products through a furnace. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] like Figure 1-3 and Figure 6 As shown, an embodiment of the present application provides a carrier for a through-hole reflow soldering device, which is used to be installed on a transmission chain of the through-hole reflow soldering device. The carrier includes: a carrier body 1, two opposite thermal insulation components 2, a mounting component 3 and a ball guide rail 4.

[0034] The carrier body 1 is provided with a ventilation hole 14 which is arranged through the carrier body 1; the heat insulation component 2 is installed on the carrier body 1 through the ball guide rail 4, and the sliding plate component has a closed position which blocks the ventilation hole 14 and an open position which avoids the ventilation hole 14; the mounting component 3 is connected and fixed on the bottom plate 12 of the carrier body 1 through the first pin 31.

[0035] refer to Figures 3 to 5 , Figure 8The carrier body 1 includes two guide rail fixing seats 11, a bottom plate 12 and two limit bars 13, which are welded into one body. The two guide rail fixing seats 11 are respectively arranged on the left and right sides of the bottom plate 12, and the two limit bars 13 are arranged above the bottom plate 12 and are respectively connected to the two guide rail fixing seats 11. A jig bearing step 111 and a jig limit block 112 are provided on the upper part of the guide rail fixing seat 11. The area enclosed by the jig limit block 112 and the limit bar 13 is the jig bearing area of ​​the carrier; the bottom plate 12 is provided with a ventilation hole 14, and a fixing block 121 for connecting the mounting assembly 3 is provided on the bottom plate 12. The fixing block 121 is provided with a pin hole 121a for installing the first pin 31; the limit bar 13 is provided with a ventilation groove 131 and a guide rail avoidance groove 132. The ventilation groove 131 is used for exhausting gas after the heat exchange is completed (that is, after the welding is completed), and the guide rail avoidance groove 132 is used for passing the ball guide rail 4.

[0036] The two insulation components 2 are respectively arranged between the bottom plate 12 and the limit strip 13. The two insulation components 2 can be opened and closed by moving the slide rail 41 in the guide rail 4. When the two insulation components 2 are in the open position, the ventilation holes 14 in the middle of the carrier body 1 are ventilated. When the two insulation components 2 are in the closed position, the ventilation holes 14 in the middle of the carrier body 1 form a windbreak wall. The opening and closing of the two insulation components 2 can realize the wind control of the fixture bearing area of ​​the carrier.

[0037] refer to Figure 4 Each heat insulation assembly 2 includes a sliding plate 21, a high temperature resistant magnet 22, a heat insulation layer 23, a heat insulation laminate 24 and a wind screen 25. The slide rails 41 of the guide rail 4 are welded to the left and right sides of the sliding plate 21; the heat insulation layer 23 is made of heat insulation material and is fixed to the sliding plate 21 through the heat insulation laminate 24. The wind screen 25 is installed on the sliding plate 21 at a position perpendicular to the direction of the guide rail 4; the magnet 22 is installed in the magnet installation slot 212 of the sliding plate 21.

[0038] refer to Figure 5The sliding plate includes a bottom plate 210 with a weight-reducing hole 211 and a magnet mounting groove, a windshield mounting plate 213, a slide rail fixing plate 214, a windshield plate 215 and a movable plate buckle 216. The bottom plate 210 with the magnet mounting groove, the windshield mounting plate 213, the slide rail fixing plate 214, the windshield plate 215 and the movable plate buckle 216 are welded to form an integral body; the weight-reducing hole 211 is covered by a heat insulation layer 23; the magnet mounting groove 212 is arranged on a side close to the windshield mounting plate 213, and a magnet 22 is installed in the magnet mounting groove 212; the windshield mounting plate 213 and the slide rail fixing plate 214 are perpendicular, and the slide rail 41 in the guide rail 4 is fixed on the slide rail fixing plate 214 by welding. The windshield mounting plate 213 is opposite to the windshield plate 215, and a movable plate buckle 216 is arranged behind the windshield plate 215, and small ventilation holes are opened on the windshield plate 215 and the movable plate buckle 216.

[0039] refer to Figure 6 , Figure 7 The mounting assembly 3 structurally includes a first pin 31, a second pin 32, a fixing seat 33, and a split pin 34. The fixing seat 33 serves to connect the first pin 31 and the second pin 32. The fixing seat 33 is provided with a first mounting hole 331 for mounting the first pin 31, a second mounting hole 332 for mounting the second pin 32, and a chain ear limiting step 333; the first pin 31 is mounted in the first mounting hole 331, and at the same time, the first pin 31 is mounted in the pin hole 121a of the carrier body 1, and the first pin 31 is used for connecting and fixing the mounting assembly 3 and the carrier body 1; the second pin 32 is mounted in the second mounting hole 332, and at the same time, the second pin 32 is mounted on the transmission chain of the through-hole reflow soldering equipment, and is used for connecting and fixing the carrier and the transmission chain of the through-hole reflow soldering equipment, and the split pin 34 is used for positioning the first pin 31 and the second pin 32.

[0040] refer to Figure 8 The ball guide rail 4 includes a slide rail 41 and a slider 42, wherein the slider 42 has a long slider body 421 and a ball 422 arranged on the slider body 421, the slider 42 is welded on the side of the guide rail fixing seat 11 close to the ventilation hole 14 and extends to the guide rail avoidance groove 132, the slide rail 41 is fixed to the slide rail fixing plate 214 in the insulation component 2, and the slide rail 41 is slidably installed on the slider 42 through the ball 422.

[0041] The working principle of the carrier in this embodiment is as follows: Figure 1 , Figure 8 , Fig. 9When the through-hole reflow soldering equipment is soldering the product 5, external force is simultaneously applied to the movable plate buckle positions 216 of the two heat insulation components 2, so that the two heat insulation components 2 move away from each other along the slider 42, and then the two heat insulation components 2 move to the open position. When the two heat insulation components 2 are in the open position, the magnets 22 on the heat insulation components 2 adsorb the heat insulation components 2 on the limit strips 13, preventing welding quality problems caused by the closing of the heat insulation components 2 during the welding process.

[0042] When the through-hole reflow soldering device is not soldering, external force is simultaneously applied to the movable plate buckle positions 216 of the two heat insulation components 2, so that the two heat insulation components 2 move toward each other along the slider 42, thereby making the two heat insulation components 2 in a closed position. When the two heat insulation components 2 are in the closed position, the magnets 22 on the two heat insulation components 2 attract each other, forming a mutual adsorption relationship, thereby preventing the temperature from flowing between the upper and lower furnace chambers of the through-hole reflow soldering device due to the opening of the heat insulation components 2 during the non-soldering process.

[0043] The carrier for through-hole reflow soldering equipment of the present application has the following beneficial effects:

[0044] 1. The carrier has a small number of processed parts, a simple structure, low difficulty in processing and assembly, a single carrier is light in weight, low in cost, and easy to maintain.

[0045] 2. The heat insulation components in the vehicle are welded to the integrated vehicle body through guide rails. The deformation caused by thermal expansion and contraction is small, and the heat insulation components open and close smoothly.

[0046] 3. The heat insulation component adopts guide rails to achieve opening and closing. The ball rolling of the guide rails has small friction resistance, and the heat insulation component opens and closes smoothly.

[0047] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0048] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0049] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0050] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0051] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0052] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A carrier for a through-hole reflow soldering device, used to be installed on a transmission chain of the through-hole reflow soldering device, characterized in that: The through-hole reflow soldering equipment carrier comprises: A carrier body (1), wherein the carrier body (1) is provided with a ventilation hole (14) extending therethrough; A heat insulation component (2) is mounted on the carrier body (1) via a ball guide rail (4), and the heat insulation component (2) has a closed position blocking the ventilation hole (14) and an open position avoiding the ventilation hole (14).

2. The carrier for through-hole reflow soldering equipment according to claim 1, characterized in that: The carrier body comprises two guide rail fixing seats (11), a bottom plate (12) and two limit strips (13); the bottom plate is provided with the ventilation holes (14); the two guide rail fixing seats (11) are respectively arranged on the left and right sides of the bottom plate (12); and the two limit strips (13) are arranged above the bottom plate (12) and are respectively connected to the two guide rail fixing seats (11).

3. The carrier for through-hole reflow soldering equipment according to claim 2, characterized in that: The ball guide rail (4) comprises a slide rail (41) and a slider (42), wherein the slider (42) is provided with a slider body (421) and a ball (422) arranged on the slider body (421), the slider (42) is welded to the guide rail fixing seat (11) through the slider body (421), the slide rail (41) is fixed to the heat insulation component (2), and the slide rail (41) is slidably mounted on the slider (42) through the ball (422).

4. The carrier for through-hole reflow soldering equipment according to claim 2, characterized in that: The two bottom plates (12), the two guide rail fixing seats (11) and the two limiting strips (13) are formed into one body by welding.

5. The carrier for through-hole reflow soldering equipment according to claim 2, characterized in that: A jig bearing step (111) and a jig limiting block (112) are provided on the upper portion of the guide rail fixing seat (11); an area enclosed by the jig limiting block (112) and the limiting strip (13) is a jig bearing area of ​​the carrier.

6. The carrier for through-hole reflow soldering equipment according to claim 2, characterized in that: The heat insulation component (2) is arranged between the bottom plate (12) and the limiting strip (13).

7. The carrier for through-hole reflow soldering equipment according to claim 3, characterized in that: The heat insulation component (2) comprises: a sliding plate (21), a magnet (22), a heat insulation layer (23), a heat insulation laminate (24) and a wind shield (25); the slide rail (41) is welded to the left and right sides of the sliding plate (21), and the sliding plate (21) can slide along the slider (42) through the slide rail (41); the sliding plate (21) is provided with a weight reduction hole (211) and a magnet installation groove (212); the heat insulation layer (23) is a heat insulation layer (23) made of a heat insulation material, and the heat insulation layer (23) is fixed on the sliding plate (21) through the heat insulation laminate (24) and covers the weight reduction hole (211); the wind shield (25) is installed on the sliding plate (21) and the wind shield (25) is perpendicular to the slide rail (41); the magnet (22) is installed in the magnet installation groove (212) of the sliding plate (21).

8. The carrier for through-hole reflow soldering equipment according to claim 7, characterized in that: There are two thermal insulation components (2). When the two thermal insulation components (2) are in the open position, each thermal insulation component (2) is adsorbed on the limit strip (13) through the magnet (22) to prevent the two thermal insulation components (2) from being closed. When the two thermal insulation components (2) are in the closed position, the magnets (22) on the two thermal insulation components (2) attract each other to form a mutual adsorption relationship to prevent the thermal insulation components (2) from being opened.

9. The carrier for through-hole reflow soldering equipment according to claim 7, characterized in that: The sliding plate (21) is provided with a magnet mounting groove bottom plate (210), a windshield mounting plate (213), a slide rail fixing plate (214), a windshield plate (215) and a movable plate buckle position (216); wherein the magnet mounting groove bottom plate (210) is provided with the weight reduction hole (211) and the magnet mounting groove (212), the windshield mounting plate (213) is perpendicular to the slide rail fixing plate (214), the windshield mounting plate (213) is opposite to the windshield plate (215), a movable plate buckle position (216) is provided at the rear of the windshield plate, and the magnet mounting groove (212) is arranged on a side close to the windshield mounting plate (213).

10. The carrier for through-hole reflow soldering equipment according to claim 9, characterized in that: The wind shield (215) and the movable plate buckle (216) are both provided with ventilation holes.

11. The carrier for through-hole reflow soldering equipment according to claim 9, characterized in that: The magnet installation groove bottom plate (210), the wind screen installation plate (213), the slide rail fixing plate (214), the wind screen plate (215) and the movable plate buckle (216) are integrated by welding.

12. The carrier for through-hole reflow soldering equipment according to claim 1, characterized in that: A mounting assembly (3) is also provided, and the carrier is fixed on the transmission chain through the mounting assembly (3), and the mounting assembly (3) comprises a first pin (31), a second pin (32), and a fixing seat (33), and the first pin (31) and the second pin (32) are respectively mounted on the fixing seat (33), the first pin (31) is fixed on the carrier body (1), and the second pin (32) is used to fix the carrier on the transmission chain of the through-hole reflow soldering equipment.

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