Backboard assembly and display device
By designing a backplane assembly containing a heat dissipation device in the display device, using the air duct and air suction and exhaust port structure, the heat dissipation efficiency of the computer module is improved, the problem of low heat dissipation efficiency in the prior art is solved, the service life of the equipment is extended and the service life of the equipment is maintained. The thinness of the whole machine.
Patent Information
- Application Number
- CN202420328542.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-21
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-02-21
AI Technical Summary
In existing display devices, the heat dissipation efficiency of the computer module is low, causing the hot air to form an internal circulation between the back plate and the rear shell, causing the temperature of the computer module to rise, affecting performance.
Design a backplane assembly, including a heat dissipation device, through the air duct and the connected suction port and the exhaust port, drive the airflow from the air outlet through the air outlet and then flow into the air duct, and discharge it from the exhaust port, improving the discharge efficiency of hot air , reduce the internal circulation situation and connect it directly to the backplane body to avoid increasing the thickness of the whole machine.
It improves the heat dissipation efficiency of the computer module, reduces the temperature, extends the service life, and avoids the increase in the thickness of the entire machine caused by the direct superposition of the heat dissipation device and the rear case.
Smart Images

Figure CN222322012U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of display devices, and in particular to a back panel assembly and a display device. Background Art
[0002] In the related art, interactive tablets and touch-type multimedia display all-in-ones and other display devices are equipped with PC (Personal Computer) modules, i.e., computer modules, for interactive control. The PC module is usually installed between the back plate and the rear shell. When the PC module is in operation, it will discharge hot air for heat dissipation. The rear shell is provided with an air outlet corresponding to the PC module to discharge the hot air. However, due to the slow air outlet efficiency of the air outlet, the hot air discharged from the PC module cannot be quickly conducted to the outside of the rear shell, thus forming an internal circulation of hot air between the back plate and the rear shell, thereby causing the temperature of the PC module to rise, thereby affecting the performance of the PC module. Utility Model Content
[0003] The embodiments of the present application provide a backplane assembly and a display device, which can improve the heat dissipation efficiency of a computer module, thereby reducing the temperature of the computer module and ensuring the normal operation of the computer module.
[0004] In a first aspect, an embodiment of the present application provides a backplane assembly, the backplane assembly comprising:
[0005] Backplane body;
[0006] A rear shell, the rear shell comprising a bottom plate and a side plate connected to each other, the side plate being connected to the back plate body, the side plate cooperating with the bottom plate and the back plate body to define a mounting cavity, and the side plate being provided with an air outlet communicating with the mounting cavity;
[0007] a computer module, the computer module being received in the mounting cavity; and
[0008] A heat dissipation device, wherein the heat dissipation device is provided with an air duct and an air intake port and an air exhaust port connected to the air duct, the heat dissipation device is connected to the back panel body, and the air intake port is opposite to and connected to the air outlet, and the heat dissipation device is used to drive the airflow discharged from the heat dissipation device to flow into the air duct through the air outlet and the air intake port in sequence, and be discharged from the air exhaust port.
[0009] In some embodiments, the heat dissipation device includes a housing and a fan, the housing is provided with an air duct, and is provided with the air outlet and the air intake, the fan is connected to the housing and is located in the air duct, and the air outlet side of the fan is arranged toward the air outlet;
[0010] The shell is detachably connected to the back panel body, and a side of the shell provided with the air inlet abuts against a surface of the side panel provided with the air outlet.
[0011] In some embodiments, the shell is opened on one side facing the side panel to form the air suction port.
[0012] In some embodiments, the air outlet includes a plurality of sub-outlets arranged relative to the computer modules, and a flange is provided on the side of the shell facing the side panel, the flange is arranged along the circumference of the air intake port, the flange is attached to the side panel, and is located on the outside of the plurality of sub-outlets.
[0013] In some embodiments, the shell includes a connecting plate and a mounting plate that are arranged opposite to each other, and a side panel connected between the connecting plate and the mounting plate, and the connecting plate, the mounting plate and the side panel together form the air duct and the air intake port, the side panel is provided with the air outlet, and the surface of the connecting plate facing away from the mounting plate is detachably connected to the back panel body;
[0014] The fan is connected to the surface of the mounting plate facing the connecting plate, and the air inlet side of the fan is spaced apart from the connecting plate.
[0015] In some embodiments, the distance between the air inlet side of the fan and the connecting plate is d, and d is greater than or equal to 10 mm;
[0016] And / or, a surface of the mounting plate facing away from the back plate body is coplanar with a surface of the rear shell facing away from the back plate body.
[0017] In some embodiments, the back panel body includes a panel body and a reinforcing portion protruding above the panel body, and the side panel is connected to the reinforcing portion;
[0018] The connecting plate comprises an abutting section, an avoiding section and a fitting section which are connected in sequence, the abutting section abuts against the plate body, the fitting section abuts against the side plate at one end away from the avoiding section and is located above the reinforcing portion, and the avoiding section is spaced apart from the reinforcing portion;
[0019] The vertical distance between the fitting section and the mounting plate is smaller than the vertical distance between the abutting section and the mounting plate, and the fan is arranged opposite to the abutting section.
[0020] In some embodiments, the vertical distance between the side of the fan facing the side plate and the avoidance section is d1, and d1 is less than 10 mm;
[0021] And / or, the vertical distance between the abutting section and the fitting section is d2, and d2 is greater than 5 mm.
[0022] In some embodiments, the bottom plate is provided with heat dissipation holes, and the heat dissipation holes are located between the air outlet and the computer module.
[0023] In a second aspect, an embodiment of the present application provides a display device, which includes a display screen and a back panel assembly as described above, wherein the display screen is disposed on the back panel assembly.
[0024] Based on the back panel assembly and display device of the embodiment of the present application, a heat dissipation device is provided to drive the airflow discharged from the computer module to flow into the air duct after passing through the air outlet and the air inlet in sequence, and then be discharged from the air outlet. In this way, the hot air discharge efficiency in the installation cavity is improved, thereby reducing the occurrence of hot air internal circulation in the installation cavity, so as to reduce the thermal impact on the computer module and other components in the installation cavity, and at the same time reduce the temperature of the air entering the computer module, thereby improving the heat dissipation efficiency of the computer module in the installation cavity, ensuring the normal operation of the computer module, and extending its service life. In addition, the heat dissipation device is directly connected to the back panel body and connected to the air outlet located at the side panel, so that the other free space of the back panel body except the rear shell is fully utilized, and the situation that the heat dissipation device and the rear shell are directly superimposed, resulting in an increase in the thickness of the whole machine, is avoided, so as to facilitate the later installation. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0026] Figure 1 This is a schematic structural diagram of an embodiment of a backplane assembly of the present application;
[0027] Figure 2 This is a schematic diagram of the assembly structure of the back panel assembly of this application;
[0028] Figure 3 This is a schematic diagram of the structure of the rear shell of the backplane assembly of the present application;
[0029] Figure 4 This is a schematic cross-sectional structural diagram of the backplane assembly of the present application;
[0030] Figure 5 for Figure 4 A partial enlarged view of the middle A;
[0031] Figure 6 This is a schematic diagram of the structure of the heat dissipation device of the back panel assembly of the present application;
[0032] Figure 7 This is a schematic cross-sectional view of the heat dissipation device of the back panel assembly of the present application;
[0033] Figure 8 This is a schematic cross-sectional structure diagram of the backplane assembly of the present application from another perspective;
[0034] Fig. 9 for Figure 8 A partial enlarged view of point B in the middle.
[0035] Description of Figure Numbers:
[0036] 100, backplane assembly; 10, backplane body; 11, board body; 12, reinforcement; 20, rear shell; 21, bottom plate; 211, heat dissipation hole; 212, air inlet; 213, vent; 22, side plate; 221, air outlet; 2211, sub-outlet; 2212, sub-outlet; 10A, installation cavity; 30, computer module; 31, heat dissipation inlet; 32, heat dissipation outlet; 40, heat dissipation device; 41, shell; 41a, air duct; 41b, air intake; 41c, air exhaust; 411, connecting plate; 4111, abutment section; 4112, avoidance section; 4113, fitting section; 412, installation plate; 413, side panel; 414, flange; 42, fan; 50, board.
[0037] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0038] In order to make the objectives, technical solutions and advantages of the present application clearer, the following part will further describe the embodiments of the present application in detail in conjunction with the accompanying drawings.
[0039] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.
[0040] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.
[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0042] The first aspect of the present application provides a display device, which can be an interactive tablet, a touch-type multimedia display all-in-one machine, a television or a computer monitor, etc. In the embodiment of the present application, the display device includes a display screen and a back panel assembly 100, and the display screen is arranged on the back panel assembly 100, and the display screen includes but is not limited to an LCD display, an LED display screen, etc.
[0043] Reference Figure 1 and Figure 2 In a second aspect of the present application, a backplane assembly 100 is proposed. The backplane assembly 100 includes a backplane body 10, a rear shell 20, a computer module 30 and a board 50.
[0044] The back panel body 10 is used as a supporting body and is arranged in a rectangular shape to facilitate later installation. The front of the back panel body 10 is used to support the display screen, and the back of the back panel body 10 is used to support other components of the back panel assembly 100. The back panel body 10 can be made of aluminum material, so that the thermal conductivity of the back panel body 10 is good. There is no need to add other thermal conductive materials to the back panel body 10, so that the back panel body 10 has a simple structure, low cost, light weight, and is easy to carry, which is conducive to the lightweight of the back panel body 10.
[0045] Back shell 20, combined with reference Figure 3The rear shell 20 includes a bottom plate 21 and a side plate 22 connected to each other. The side plate 22 is connected to the back plate body 10. The side plate 22 is located between the bottom plate 21 and the back plate body 10 and cooperates to define the installation cavity 10A. The side plate 22 is provided with an air outlet 221 connected to the installation cavity 10A. The bottom plate 21 and the side plate 22 can be integrally formed by injection molding or the like, so as to improve the overall structural strength of the rear shell 20, or the bottom plate 21 and the side plate 22 can also be connected by screws or buckles, so as to facilitate later maintenance and replacement. It should be noted that the side plate 22 can be arranged along the peripheral side of the bottom plate 21, which can not only increase the contact area between the side plate 22 and the back plate body 10, thereby improving the stability of the connection between the rear shell 20 and the back plate body 10, but also further improve the protection of the devices in the installation cavity 10A. In addition, the rear shell 20 is also provided with an air inlet 212 connected to the installation cavity 10A, so that the external air flow can enter the installation cavity 10A through the air inlet 212 and then be discharged from the air outlet 221, thereby forming air convection heat dissipation in the installation cavity 10A, so that other components in the installation cavity 10A can be cooled.
[0046] The computer module 30 is accommodated in the installation cavity 10A. The computer module 30 has a built-in fan, and the computer module 30 is provided with a heat dissipation inlet 31 and a heat dissipation outlet 32 connected to the inside, so that the fan drives the airflow in the installation cavity 10A to enter from the heat dissipation inlet 31 to cool the inside of the computer module 30, and then discharge from the heat dissipation outlet 32. The heat dissipation outlet 32 of the computer module 30 is arranged relative to at least part of the air outlet 221, so as to improve the efficiency of the airflow of the computer module 30 from the air outlet 221. It should be noted that a vent 213 is provided on the bottom plate 21 corresponding to the heat dissipation inlet 31, so that the airflow outside the installation cavity 10A can directly pass through the vent 213 to enter the heat dissipation inlet 31, thereby improving the heat dissipation efficiency of the computer module 30 itself.
[0047] The board 50 is electrically connected to the computer module 30, and the board 50 may include a power board and a control board. In some embodiments, one or more boards 50 may be provided. The board 50 may be provided in a suitable area of the backplane body 10 and located in the installation cavity 10A according to actual applications.
[0048] In the related art, the air outlet 221 of the rear shell 20 has a slow air outlet efficiency, which causes the hot air discharged from the computer module 30 to be unable to be quickly conducted to the outside of the rear shell 20. This causes the hot air to form an internal circulation between the back panel body 10 and the rear shell 20, thereby causing the temperature of the computer module 30 to rise, thereby affecting the performance of the computer module 30.
[0049] To solve the above problems, combined with Figure 1 , Figures 4 to 6 The back panel assembly 100 of the technical solution of the present application also includes a heat dissipation device 40, which is provided with an air duct 41a and an air intake port 41b and an air exhaust port 41c connecting the air duct 41a. The heat dissipation device 40 is connected to the back panel body 10, and the air intake port 41b is opposite to and connected to the air outlet 221.
[0050] By setting a heat dissipation device 40 to drive the airflow discharged from the computer module 30, the airflow can flow into the air duct 41a after passing through the air outlet 221 and the air inlet 41b in sequence, and be discharged from the air outlet 41c. In this way, the hot air discharge efficiency in the installation cavity 10A is improved, thereby reducing the occurrence of hot air internal circulation in the installation cavity 10A, so as to reduce the thermal impact on the computer module 30 and other components in the installation cavity 10A, and at the same time reduce the air temperature entering the computer module 30, thereby improving the heat dissipation efficiency of the computer module 30 in the installation cavity 10A, ensuring the normal operation of the computer module 30 and extending its service life. In addition, the heat dissipation device 40 is directly connected to the back plate body 10 and connected to the air outlet 221 located at the side plate 22, so that the other free space of the back plate body 10 except the rear shell 20 is fully utilized, and the situation that the heat dissipation device 40 and the rear shell 20 are directly superimposed to increase the thickness of the whole machine is avoided, so as to facilitate the later installation.
[0051] In some structural forms, the bottom plate 21 is provided with a heat dissipation hole 211, and the heat dissipation hole 211 is located between the air outlet 221 and the computer module 30. This further improves the exhaust efficiency of hot air in the installation cavity 10A. It should be noted that the heat dissipation hole 211 can be provided in multiple numbers and arranged in an array.
[0052] In some structural forms, combined with reference Figures 5 to 7The heat dissipation device 40 includes a housing 41 and a fan 42, wherein the fan 42 can be a centrifugal fan 42, which has the advantages of high efficiency, high temperature resistance, excellent performance, novel and compact structure, small vibration, light weight, convenient installation and maintenance, and long service life. The housing 41 is provided with an air duct 41a, and is provided with an exhaust port 41c and an air inlet 41b. The fan 42 is connected to the housing 41 and is located in the air duct 41a, and the air outlet side of the fan 42 is arranged toward the exhaust port 41c. The housing 41 is detachably connected to the back plate body 10. The fan 42 is operated to make the air flow in the air duct 41a of the housing 41 flow, thereby driving the air flow discharged from the heat dissipation device 40 to flow into the air duct 41a through the air outlet 221 and the air inlet 41b in sequence. The housing 41 can be arranged in a flat shape, so that the installation space of the fan 42 can be guaranteed, while avoiding causing the overall thickness of the back plate assembly 100 to be too large. The shell 41 can be connected to the back panel body 10 in a detachable manner such as screws or buckles, so that the heat dissipation device 40 can be replaced at any time for maintenance or adaptation to computer modules 30 of different sizes. And because the side of the shell 41 with the air inlet 41b is in contact with the surface of the side panel 22 with the air outlet 221, the hot air flowing out of the air outlet can enter the air inlet more quickly to improve the hot air exhaust efficiency in the installation cavity 10A. It should be noted that the heat dissipation device 40 can also adopt the matching mode of the air pump and the shell 41, and the air pump can also be used to drive the airflow discharged from the heat dissipation device 40 to flow into the air duct 41a through the air outlet 221 and the air inlet 41b in sequence, and be discharged from the air outlet 41c.
[0053] Furthermore, the side of the housing 41 facing the side plate 22 is open to form an air inlet 41b. The air inlet 41b is open to increase the air intake area, thereby further improving the hot air exhaust efficiency in the installation cavity 10A.
[0054] Furthermore, the air outlet 221 includes a plurality of sub-outlets 2211 arranged relative to the corresponding computer modules 30, and a flange 414 is provided on the side of the shell 41 facing the side panel 22, and the flange 414 is arranged along the circumference of the air intake port 41b. The flange 414 is attached to the side panel 22 and is located on the outside of the plurality of sub-outlets 2211.
[0055] The flange 414 can be an integral structure with the shell 41, so as to ensure the overall structural strength. By setting the flange 414 to fit the side panel 22 and be located on the outside of the plurality of sub-outlets 2211, the sealing between the shell 41 and the side panel 22 can be enhanced, and the external airflow entering the air duct 41a from the air suction port 41b can be reduced, while avoiding blocking the sub-outlets 2211, ensuring the air suction efficiency of the air suction port 41b for the airflow in the installation cavity 10A, and increasing the contact area between the heat sink 40 and the rear shell 20, so as to improve the stability of the installation of the heat sink 40. It should be noted that the width of the flange 414 is not less than 1 mm, such as 2 mm, 3 mm and 4 mm, etc., which can be specifically selected by those skilled in the art. In addition, multiple sub-outlets 2211 are arranged in intervals. Of course, the side panel 22 is also provided with multiple sub-outlets 2212 staggered with the computer module 30. The sub-outlets 2212 are connected to the installation cavity 10A, thereby further improving the hot air exhaust efficiency in the installation cavity 10A.
[0056] Reference Figure 6 and Figure 7 Optionally, the housing 41 includes a connecting plate 411 and a mounting plate 412 that are arranged opposite to each other, and a side panel 413 connected between the connecting plate 411 and the mounting plate 412, and the connecting plate 411, the mounting plate 412 and the side panel 413 enclose an air duct 41a and an air inlet 41b, and the side panel 413 is provided with an air outlet 41c, and the surface of the connecting plate 411 that is away from the mounting plate 412 is detachably connected to the back plate body 10. The fan 42 is connected to the surface of the mounting plate 412 that faces the connecting plate 411, and the air inlet side of the fan 42 is spaced apart from the connecting plate 411.
[0057] It should be noted that the connecting plate 411, the mounting plate 412 and the side panels 413 can be an integrated structure, so as to ensure the structural strength of the shell 41, and then ensure the stability of the air duct 41a. Of course, the connecting plate 411, the mounting plate 412 and the side panels 413 can also be fixed by means of snap-fit or screw connection, so as to facilitate later replacement. The connecting plate 411 is attached to the back plate body 10 and is fixed by snap-fit, so as to further improve the stability of the connection. The fan 42 is connected to the mounting plate 412. Since the mounting plate 412 is arranged away from the shell 41 of the air duct 41a, the fan 42 is also arranged away from the back plate body 10, so as to reduce the vibration effect of the fan 42 on the back plate body 10 when the fan 42 is in operation.
[0058] Furthermore, the distance between the air inlet side of the fan 42 and the connecting plate 411 is d, and d is greater than or equal to 10 mm. In this way, by limiting the size between the air inlet side of the fan 42 and the connecting plate 411, the air inlet side of the fan 42 has enough space for the air flow, reducing the resistance of the air duct 41a and improving the efficiency of the air flow.
[0059] Reference Figure 8 and Fig. 9 Optionally, the surface of the mounting plate 412 facing away from the backplane body 10 is coplanar with the surface of the rear shell 20 facing away from the backplane body 10. That is, the mounting plate 412 will not be higher than the surface of the rear shell 20 facing away from the backplane body 10, thereby avoiding increasing the overall thickness of the backplane assembly 100. At the same time, when the backplane assembly 100 is installed on the wall, the heat dissipation device 40 will not cause interference, so as to facilitate subsequent installation.
[0060] In some structural forms, combined with reference Figure 5 and Figure 7 The back plate body 10 includes a plate body 11 and a reinforcement portion 12 protruding from the plate body 11, and the side plate 22 is connected to the reinforcement portion 12. The connecting plate 411 includes an abutting section 4111, an avoidance section 4112 and a fitting section 4113 connected in sequence, the abutting section 4111 abuts against the plate body 11, and one end of the fitting section 4113 away from the avoidance section 4112 abuts against the side plate 22, and the avoidance section 4112 is spaced apart from the reinforcement portion 12. The vertical distance between the fitting section 4113 and the mounting plate 412 is smaller than the vertical distance between the abutting section 4111 and the mounting plate 412, and the fan 42 is arranged opposite to the abutting section 4111.
[0061] It is understandable that the reinforcing portion 12 is provided on the plate body 11 to improve the structural strength of the back plate body 10 itself and to improve the stability of the connection with the rear shell 20. In order to adapt to the reinforcing portion 12, the connecting plate 411 including the abutting section 4111, the avoiding section 4112 and the fitting section 4113 are adapted thereto to improve the stability of the connection of the connecting plate 411, thereby improving the stability of the overall installation of the heat dissipation device 40. At the same time, since the vertical distance between the fitting section 4113 and the mounting plate 412 is smaller than the vertical distance between the abutting section 4111 and the mounting plate 412, the fan 42 is arranged at a position opposite to the abutting section 4111 to ensure space on the air inlet side of the fan 42 and reduce resistance.
[0062] Combined with reference Figure 8 and Fig. 9 Furthermore, the vertical distance between the side of the fan 42 facing the side plate 22 and the avoidance section 4112 is d1, and d1 is less than 10 mm. In this way, the length of the air duct 41a is limited, the system resistance is reduced, and the air outlet efficiency is improved.
[0063] Optionally, the vertical distance between the abutting section 4111 and the fitting section 4113 is d2, and d2 is greater than 5 mm. In this way, the length of the avoiding section 4113 is extended, so that when the airflow passes through, the deflection angle is relatively gentle, thereby reducing system resistance and improving air outlet efficiency.
[0064] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0065] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A back panel assembly, applied to a display device, characterized in that: The back panel assembly comprises: Backplane body; A rear shell, the rear shell comprising a bottom plate and a side plate connected to each other, the side plate being connected to the back plate body, the side plate cooperating with the bottom plate and the back plate body to define a mounting cavity, and the side plate being provided with an air outlet communicating with the mounting cavity; a computer module, the computer module being received in the mounting cavity; and A heat dissipation device, wherein the heat dissipation device is provided with an air duct and an air intake port and an air exhaust port connected to the air duct, the heat dissipation device is connected to the back panel body, and the air intake port is opposite to and connected to the air outlet, and the heat dissipation device is used to drive the airflow discharged from the heat dissipation device to flow into the air duct through the air outlet and the air intake port in sequence, and be discharged from the air exhaust port.
2. The back plate assembly according to claim 1, characterized in that: The heat dissipation device comprises a housing and a fan, the housing is provided with an air duct, and is provided with the air outlet and the air intake, the fan is connected to the housing and is located in the air duct, and the air outlet side of the fan is arranged toward the air outlet; The shell is detachably connected to the back panel body, and a side of the shell provided with the air inlet abuts against a surface of the side panel provided with the air outlet.
3. The back plate assembly according to claim 2, characterized in that: The shell is opened on one side facing the side plate to form the air inlet.
4. The back plate assembly according to claim 3, characterized in that: The air outlet includes a plurality of sub-outlets arranged relatively to the computer modules. The shell is provided with a flange on the side facing the side panel. The flange is arranged along the circumference of the air intake port. The flange is attached to the side panel and is located on the outside of the plurality of sub-outlets.
5. The back plate assembly according to claim 2, characterized in that: The shell includes a connecting plate and a mounting plate arranged opposite to each other, and a side panel connected between the connecting plate and the mounting plate, and the connecting plate, the mounting plate and the side panel together form the air duct and the air inlet, the side panel is provided with the air outlet, and the surface of the connecting plate facing away from the mounting plate is detachably connected to the back panel body; The fan is connected to the surface of the mounting plate facing the connecting plate, and the air inlet side of the fan is spaced apart from the connecting plate.
6. The back plate assembly according to claim 5, characterized in that: The distance between the air inlet side of the fan and the connecting plate is d, and d is greater than or equal to 10 mm; And / or, a surface of the mounting plate facing away from the back plate body is coplanar with a surface of the rear shell facing away from the back plate body.
7. The back plate assembly according to claim 5, characterized in that: The back plate body comprises a plate body and a reinforcing portion convexly arranged above the plate body, and the side plate is connected to the reinforcing portion; The connecting plate comprises an abutting section, an avoiding section and a fitting section which are connected in sequence, the abutting section abuts against the plate body, the fitting section abuts against the side plate at one end away from the avoiding section and is located above the reinforcing portion, and the avoiding section is spaced apart from the reinforcing portion; The vertical distance between the fitting section and the mounting plate is smaller than the vertical distance between the abutting section and the mounting plate, and the fan is arranged opposite to the abutting section.
8. The back plate assembly according to claim 7, characterized in that: The vertical distance between the side of the fan facing the side plate and the avoidance section is d1, and d1 is less than 10 mm; And / or, the vertical distance between the abutting section and the fitting section is d2, and d2 is greater than 5 mm.
9. The back plate assembly according to any one of claims 1 to 8, characterized in that: The bottom plate is provided with heat dissipation holes, and the heat dissipation holes are located between the air outlet and the computer module.
10. A display device, characterized in that: It comprises a display screen and a back panel assembly as claimed in any one of claims 1 to 9, wherein the display screen is arranged on the back panel assembly.