Chip appearance defect detection equipment

Abstract

The utility model relates to the technical field of chip detection equipment, in particular to chip appearance defect detection equipment which comprises a base, a feeding device, a front face detection device, a bottom side face detection device, a material distributing device, a discharging device and a conveying system. The bottom side face detection device comprises second vertical lenses, side tilting lenses and a first suction cup, the first vertical lenses are higher than the second vertical lenses and the side tilting lenses in the height direction of the base, the first vertical lenses and the second vertical lenses are opposite in orientation, and the conveying system comprises three jacking clamping mechanisms and two transfer tables; according to the utility model, the first vertical lens provides conditions for detecting the upper surface of the chip, and the first sucker adsorbs the chip to provide conditions for the second vertical lens and the roll lens to collect the bottom surface and the side surface of the chip, thereby realizing automatic measurement of the upper surface, the lower surface and the side surface, and being suitable for large-scale detection application situations.

Description

Technical Field

[0001] The present application relates to the technical field of chip detection equipment, and more specifically to a chip appearance defect detection equipment. Background Art

[0002] A chip usually refers to a tiny semiconductor wafer with integrated circuits on its surface. After the chip is manufactured, it is necessary to inspect the upper and lower surfaces and sides of the chip for scratches, burrs or pits.

[0003] Our company currently has a chip appearance defect detection equipment, such as Figure 1 As shown, it includes a plurality of clamps 91 and a plurality of detection lenses 92. Each of the clamps 91 is provided with a detection lens 92 at the top and bottom. During detection, the side of the chip to be detected 93 is clamped by the clamps 91, and the upper and lower surfaces of the chip to be detected 93 are detected for defects through the detection lenses 92 at the top and bottom. However, since the clamps 91 clamp the side of the chip to be detected 93, the side defects of the chip to be detected 93 cannot be detected during the detection process, and the side defects of the chip need to be manually inspected later. In addition, the clamps 91 may cause new appearance defects on the side of the chip during the process of clamping the chip, which has the potential risk of increasing the defect rate.

[0004] Therefore, there is a need to provide a chip appearance defect detection device that can measure the upper and lower surfaces and sides in an automated manner and is suitable for large-scale detection application scenarios. Summary of the invention

[0005] The main purpose of the present application is to provide a chip appearance defect detection device, wherein the chip appearance defect detection device includes a base, a loading device, a front detection device, a bottom side detection device, a material dividing device for classifying defective products and qualified products, a feeding device and a conveying system, the front detection device includes a plurality of first vertical lenses, the bottom side detection device includes a plurality of second vertical lenses, a plurality of tilt lenses and a plurality of first suction cups, the first vertical lens is higher than each of the second vertical lens and the tilt lens in the height direction of the base, and the first vertical lens is opposite to the second vertical lens, the conveying system includes three lifting and clamping mechanisms and two transfer tables, one of the transfer tables is located between the front detection device and the bottom side detection device, and the other is located between the front detection device and the bottom side detection device. The turntable is located between the bottom and side detection devices and the material dividing device, one of the lifting and clamping mechanisms is slidably arranged on the base between the loading device and a turntable close to the front detection device, another of the lifting and clamping mechanisms is slidably arranged on the base between the two turntables, and the remaining one of the lifting and clamping mechanisms is slidably arranged on the base between a turntable close to the material dividing device and the unloading device. The first vertical lens is used to provide conditions for detecting the upper surface of the chip, and the first suction cup is used to adsorb the chip to provide conditions for the second vertical lens and the tilt lens to capture the bottom and side surfaces of the chip. It is obvious that compared with the prior art that can only capture images of the upper and lower surfaces of the chip, the embodiment of the present application has the advantages of measuring the upper and lower surfaces and sides in an automated manner and being suitable for large-scale detection application scenarios.

[0006] Another object of the present application is to provide a chip appearance defect detection device, wherein the material dividing device includes a plurality of second suction cups, a third mounting seat, a plurality of third lifting drive devices, a third linear module and a material rack seat, the third linear module is arranged in parallel with the second linear module, the third mounting seat is fixedly connected to the slider of the third linear module, each of the third lifting drive devices is arranged on the third mounting seat, the third lifting drive device corresponds to the second suction cup one by one, and each of the third lifting drive devices is connected to a corresponding second suction cup, the material rack seat is located on one side of the first slide slot, and the material rack seat has a plurality of shelf plate areas, and a plurality of shelf plate areas are provided to facilitate the classification and placement of various defective parts.

[0007] In order to achieve at least one of the above-mentioned invention purposes, the present application provides a chip appearance defect detection device, including a base, wherein the chip appearance defect detection device also includes:

[0008] a feeding device; and

[0009] A front detection device, the front detection device comprising a plurality of first vertical lenses; and

[0010] a bottom side detection device, the bottom side detection device comprising a plurality of second vertical lenses, a plurality of tilt lenses and a plurality of first suction cups, the first vertical lenses being higher than each of the second vertical lenses and the tilt lenses in the height direction of the base, and the first vertical lenses and the second vertical lenses are oriented in opposite directions; and

[0011] a material sorting device for sorting defective products and qualified products; and

[0012] a feeding device; and

[0013] A conveying system, the conveying system includes three lifting and clamping mechanisms and two transfer tables, one of the transfer tables is located between the front detection device and the bottom side detection device, the other of the transfer tables is located between the bottom side detection device and the material dividing device, one of the lifting and clamping mechanisms is slidably arranged on the base between the loading device and a transfer table close to the front detection device, another of the lifting and clamping mechanisms is slidably arranged on the base between the two transfer tables, and the remaining lifting and clamping mechanism is slidably arranged on the base between a transfer table close to the material dividing device and the unloading device.

[0014] In one or more embodiments of the present application, the base has a first slide groove in the length direction, and each of the lifting and clamping mechanisms is slidably disposed on the first slide groove.

[0015] In one or more embodiments of the present application, the front detection device also includes a first lifting drive device, a first linear module and a first mounting seat, each of the first vertical lenses is vertically mounted on the first mounting seat, the first mounting seat is fixedly connected to the push rod of the first lifting drive device, the first lifting drive device is fixedly mounted on the slider of the first linear module and moves with it, and the first linear module is arranged vertically with the first slide groove.

[0016] In one or more embodiments of the present application, the base has a second slide groove in the width direction, the second slide groove is arranged perpendicular to the first slide groove, the bottom side detection device also includes a second lifting drive device, a second linear module, and a second mounting seat, each of the second vertical lens and each of the tilting lens is arranged in the second slide groove, the second linear module is arranged parallel to the first linear module, the second lifting drive device is fixedly installed on the slider of the second linear module, the second mounting seat is fixedly connected to the push rod of the second lifting drive device, and each of the first suction cups is arranged side by side on the second mounting seat.

[0017] In one or more embodiments of the present application, the bottom and side detection device also includes an equally divided distance variable module, which is fixedly mounted on the second mounting seat, and each slider on the equally divided distance variable module is provided with one of the first suction cups.

[0018] In one or more embodiments of the present application, the material dividing device includes a plurality of second suction cups, a third mounting seat, a plurality of third lifting drive devices, a third linear module and a material rack seat, the third linear module is arranged in parallel with the second linear module, the third mounting seat is fixedly connected to the slider of the third linear module, each of the third lifting drive devices is arranged on the third mounting seat, the third lifting drive devices correspond to the second suction cups one by one, and each of the third lifting drive devices is connected to a corresponding second suction cup, the material rack seat is located on one side of the first slide groove, and the material rack seat has multiple rack areas.

[0019] In one or more embodiments of the present application, the unloading device includes a disc clamp and a linear drive device, and the linear drive device is fixedly mounted on a side of the third linear module away from the third mounting seat.

[0020] In one or more embodiments of the present application, the loading device and the unloading device both include a plate assembly, and the unloading device also includes a crooked material detection camera, which is arranged between the plate assembly and the third linear module of the unloading device.

[0021] In one or more embodiments of the present application, the chip appearance defect detection equipment further includes an ion fan, and the ion fan is disposed on a side of the transfer table close to the front detection device.

[0022] In one or more embodiments of the present application, the loading device further includes a code scanning mechanism, and the code scanning mechanism is disposed on one side of the tray placement assembly of the loading device.

[0023] In an embodiment of the present application, a chip appearance defect detection device includes a base, a loading device, a front detection device, a bottom and side detection device, a material dividing device for classifying defective products and qualified products, a feeding device and a conveying system. The front detection device includes a plurality of first vertical lenses, and the bottom and side detection devices include a plurality of second vertical lenses, a plurality of tilt lenses and a plurality of first suction cups. The first vertical lens is higher than each second vertical lens and the tilt lens in the height direction of the base, and the first vertical lens is oriented opposite to the second vertical lens. The conveying system includes three lifting and clamping mechanisms and two turntables. The movement of the material tray with the chip is achieved through the lifting and clamping mechanism, and the temporary placement of the material tray is achieved through the turntable. The first vertical lens provides conditions for detecting the upper surface of the chip, and the first suction cup adsorbs the chip to provide conditions for the second vertical lens and the tilt lens to capture the bottom and side surfaces of the chip. The upper and lower surfaces and sides are measured in an automated manner and are suitable for large-scale detection application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] These and / or other aspects and advantages of the present application will become clearer and easier to understand from the following detailed description of the embodiments of the present application in conjunction with the accompanying drawings, in which:

[0025] Figure 1 The figure shows a schematic diagram of the structure of an existing chip appearance defect detection device;

[0026] Figure 2 The figure shows a schematic diagram of the structure of a chip appearance defect detection device of the utility model;

[0027] Figure 3 The figure shows a schematic diagram of the structure of the front detection device;

[0028] Figure 4 The figure shows a schematic diagram of the structure of the bottom and side surface detection device;

[0029] Figure 5 The figure shows a schematic diagram of the structure of the base and the conveying system at a certain viewing angle;

[0030] Figure 6 The figure shows a schematic diagram of the structure of the base and the conveying system from another perspective;

[0031] Figure 7 The figure shows a schematic diagram of the structure of the disk placement assembly;

[0032] Figure 8 The figure shows a structural schematic diagram of the material distribution device at a certain viewing angle;

[0033] Fig. 9 The figure shows a structural schematic diagram of the material dividing device from another perspective. DETAILED DESCRIPTION

[0034] The terms and words used in the following specification and claims are not limited to the literal meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present application is provided for illustrative purposes only and not for the purpose of limiting the present application as defined by the appended claims and their equivalents.

[0035] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0036] Although ordinals such as "first," "second," and the like will be used to describe various components, those components are not limited herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more associated listed items.

[0037] The terms used herein are only used for the purpose of describing various embodiments and are not intended to be limiting. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates an exception. In addition, it will be understood that the terms "including" and / or "having" when used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0038] Application Overview

[0039] There is an existing chip appearance defect detection device. Since the clamping claws clamp the side of the chip to be inspected, the side defects of the chip to be inspected cannot be detected during the detection process, and the side defects of the chip need to be manually inspected later. In addition, the clamping claws may cause new appearance defects on the side of the chip during the process of clamping the chip, which has the potential risk of increasing the defective rate.

[0040] Based on the above technical problems, the present application proposes a chip appearance defect detection device, wherein the chip appearance defect detection device has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the chip appearance defect detection equipment provided by the present application is easy to produce and low-cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0041] Schematic chip appearance defect detection equipment,

[0042] refer to Figures 2 to 9 According to a preferred embodiment of the utility model, a chip appearance defect detection device includes a base 10, a loading device 20, a front detection device 30, a bottom side detection device 40, a material separation device 50 for classifying defective products and qualified products, a unloading device 60 and a conveying system 70.

[0043] Specifically, Figure 2 , Figure 3 and Figure 4 As shown, the front detection device 30 includes a plurality of first vertical lenses 301; in addition, the bottom side detection device 40 includes a plurality of second vertical lenses 401, a plurality of tilt lenses 402 and a plurality of first suction cups 403, the first vertical lens 301 is higher than each of the second vertical lens 401 and the tilt lens 402 in the height direction of the base 10, and the first vertical lens 301 and the second vertical lens 401 are oriented in opposite directions, and the first vertical lens 301, the second vertical lens 401 and the tilt lens 402 are all electrically connected to the external defect detection system; in addition, as Figure 5 As shown, the conveying system 70 includes three lifting and clamping mechanisms 701 and two turntables 702, one of the turntables 702 is located between the front detection device 30 and the bottom side detection device 40, the other turntable 702 is located between the bottom side detection device 40 and the material dividing device 50, one of the lifting and clamping mechanisms 701 is slidably set on the base 10 between the loading device 20 and a turntable 702 close to the front detection device 30, another of the lifting and clamping mechanisms 701 is slidably set on the base 10 between the two turntables 702, and the remaining lifting and clamping mechanism 701 is slidably set on the base 10 between a turntable 702 close to the material dividing device 50 and the unloading device 60.

[0044] It should be noted that the chips to be tested are arranged in a rectangular array on a tray. Before the test, the test personnel place a plurality of trays on the loading device 20 in a stacked arrangement in the height direction, take out a tray with the chips to be tested from the bottom of the loading device 20 through a lifting and clamping mechanism 701, and send the tray to the front detection device 30 through the lifting and clamping mechanism 701, and make the tray be located below the first vertical lens 301, and use the first vertical lens 301 to focus on the front detection device 30. The upper surface image of each chip to be inspected on the tray is collected. After comparison, analysis and classification by the external defect detection system, the lifting and clamping mechanism 701 close to the loading device 20 moves the tray after the front inspection to the transfer table 702 close to the loading device 20, and then the lifting and clamping mechanism 701 located between the two transfer tables 702 moves the tray to the bottom side inspection device 40, and the first suction cup 403 moves the chip to be inspected on the tray to the second vertical lens 401 and the The bottom and side images of each chip are collected by the second vertical lens 401 and the tilt lens 402 above the tilt lens 402. After comparison and classification by the external defect detection system, the inspected chip is put back on the tray by the first suction cup 403. The tray is placed on the transfer table 702 near the material distribution device 50 by the lifting and clamping mechanism 701. The tray is moved to the material distribution device 50 by the lifting and clamping mechanism 701 near the unloading device 60. The device 50 picks out the defective products and moves them to the defective product tray. After the defective products are selected and the qualified product tray is filled, the material tray is moved to the lifting and clamping mechanism 701 again by the material dividing device 50. The material tray with qualified products is moved to the unloading device 60 by the lifting and clamping mechanism 701 to complete the appearance defect detection of the chip. It is obvious that compared with the prior art that can only detect the upper and lower surfaces of the chip, the embodiment of the present application has the upper and lower surfaces and the side surfaces measured in an automated form, which is suitable for large-scale detection application scenarios. In addition, since the external defect detection system technology is mature and widely used in the market, the specific structure and model of the external defect detection system will not be repeated here. The external defect detection system includes but is not limited to the defect detection system disclosed in the patent document (CN111272766A) that detects surface defects by a camera.

[0045] Furthermore, if Figure 5 As shown, the base 10 has a first slide groove 101 in the length direction, and each of the lifting and clamping mechanisms 701 is slidably disposed on the first slide groove 101 .

[0046] More specifically, if Figure 6 As shown, three screw rods 7015 are rotatably installed on one side of the first slide groove 101, and one end of each of the screw rods 7015 is provided with a first rotating motor 7016. A sliding block (not marked in the figure) is threadedly connected to each of the screw rods 7015, and each of the lifting and clamping mechanisms 701 is fixedly connected to the sliding block. When the rotating shaft of the first rotating motor 7016 rotates, the screw rods 7015 rotate and make the lifting and clamping mechanism 701 slide along the first slide groove 101.

[0047] In addition, if Figure 5 and Figure 6 As shown, each of the lifting and clamping mechanisms 701 includes a sliding seat 7011, a supporting seat 7012, a fourth lifting drive device 7013 and a plurality of clamping claws 7014, one end of the sliding seat 7011 is fixedly connected to the sliding block, the supporting seat 7012 is liftably arranged on the sliding seat 7011, the fourth lifting drive device 7013 is fixedly installed on the sliding seat 7011, and the push rod of the fourth lifting drive device 7013 is fixedly connected to the supporting seat 7012, and the clamping claws 7014 are fixedly connected to the supporting seat 7012. 014 is arranged at both ends of the supporting seat 7012. When the lifting and clamping mechanism 701 supports the material tray, the bottom of the material tray is placed on the supporting seat 7012, and each of the clamping claws 7014 clamps or releases the material tray. When the rotating shaft of the first rotating motor 7016 rotates, the lifting and clamping mechanism 701 slides along the first slide groove 101 and drives the material tray to move in the length direction of the base 10. When the fourth lifting drive device 7013 is actuated, the supporting seat 7012 moves upward or downward.

[0048] Furthermore, if Figure 5 and Figure 7 As shown, the loading device 20 and the unloading device 60 both include a plate placing assembly 201, each of the plate placing assemblies 201 includes a lifting frame 2011, four guide columns 2012 and four telescopic tongues 2013, the lifting frame 2011 has a through groove 20111, the through groove 20111 is a rectangular groove, the four guide columns 2012 are respectively located at the four corners of the lifting frame 2011 and are arranged vertically, and the two sides of the through groove 20111 are respectively provided with two telescopic tongues 2013.

[0049] It should be noted that a plurality of the material trays pass through the through slot 20111 and are arranged in a stacked manner along the four guide columns 2012 in the height direction of the base 10, and the four telescopic tongues 2013 abut against the bottom of the material tray located at the bottom. When the support seat 7012 moves upward by a predetermined distance through the fourth lifting drive device 7013 and passes through the through slot 20111, and the support seat 7012 abuts against the bottom of the material tray located at the bottom, the four telescopic tongues 2013 shrink by a predetermined length and no longer support the material tray. At this time, the material tray and the material trays on it are supported by the support seat 7012. Then, the support seat 7012 moves downward by a predetermined distance. When the material tray moves downward by a material tray height, the four telescopic tongues 2013 extend and provide support for the new material tray located at the bottom, and the lifting and clamping mechanism 701 completes the loading at this time, and drives the material tray located on the support seat 7012 to move toward the front detection device 30.

[0050] Furthermore, if Figure 3 As shown, the front detection device 30 also includes a first lifting drive device (not marked in the figure), a first linear module 302 and a first mounting seat 303. Each of the first vertical lenses 301 is vertically mounted on the first mounting seat 303. The first mounting seat 303 is fixedly connected to the push rod of the first lifting drive device. The first lifting drive device is fixedly mounted on the slider of the first linear module 302 and moves with it. The first linear module 302 is arranged vertically with the first slide groove 101.

[0051] It should be noted that, by setting the first linear module 302 and the first lifting drive device, when the first lifting drive device is in operation, each of the first vertical lenses 301 can move up and down in the height direction of the base 10, and when the first linear module 302 is in operation, each of the first vertical lenses 301 can slide in the width direction of the base 10; further, when a row of chips to be inspected at one end of the tray close to the first linear module 302 is located below the first vertical lens 301, the first vertical lens 301 can be moved up and down to approach the chips to be inspected, and the first vertical lens 301 can be placed at one end in the width direction of the base 10 to capture images of each chip in a row. After all the chips to be inspected in this row are photographed, the lifting and clamping mechanism 701 is further moved toward the turntable 702 by a predetermined distance, and the above-mentioned actions are repeated until the front of each chip to be inspected is captured by the first vertical lens 301.

[0052] Furthermore, if Figure 5As shown, each of the transfer tables 702 includes two pallets 7021 and two telescopic cylinders 7022. One end of each of the pallets 7021 is fixedly connected to the push rod of the corresponding telescopic cylinder 7022. The two pallets 7021 are symmetrically arranged and spaced a predetermined distance apart. The pallet 7021 is located at one end of the telescopic cylinder 7022 close to the first slide groove 101. When the two telescopic cylinders 7022 are in motion, the two pallets 7021 move toward or away from each other.

[0053] It should be noted that after the front side of each chip to be inspected is collected, the lifting and clamping mechanism 701 drives the material tray to move to the bottom of the two pallets 7021 close to the first linear module 302, and the two pallets 7021 move opposite to each other, and the support seat 7012 moves upward by a predetermined distance, and the material tray is located above the two pallets 7021, and then the two pallets 7021 move toward each other to provide support for the material tray, and the support seat 7012 moves downward by a predetermined distance and moves toward the loading device 20, and takes material from the tray assembly 20 of the loading device 20 again.

[0054] Furthermore, if Figure 4 and Figure 5 As shown, the base 10 has a second slide groove 102 in the width direction, and the second slide groove 102 is arranged vertically with the first slide groove 101. The bottom side detection device 40 also includes a second lifting drive device 404, a second linear module 405, and a second mounting seat 406. Each of the second vertical lenses 401 and each of the tilting lenses 402 are arranged in the second slide groove 102. The second linear module 405 is arranged parallel to the first linear module 302. The second lifting drive device 404 is fixedly mounted on the slider of the second linear module 405. The second mounting seat 406 is fixedly connected to the push rod of the second lifting drive device 404. Each of the first suction cups 403 is arranged side by side on the second mounting seat 406.

[0055] It should be noted that the material tray placed on the tray assembly 201 is removed and moved to the bottom of the first suction cup 403 through the lifting and clamping mechanism 701 located between the two transfer tables 702. Subsequently, each of the first suction cups 403 moves downward by a predetermined distance through the second lifting drive device 404 and absorbs the chip to be inspected. Each of the first suction cups 403 is driven by the second linear module 405 to move toward the second vertical lens 401 and the tilt lens 402, so that the chip to be inspected is located between the second vertical lens 401 and the tilt lens The first suction cup 403 is placed above the front detection device 30, and the bottom and side images of the chip to be inspected are collected through the second vertical lens 401 and the tilt lens 402. After the images of the chips to be inspected on the first suction cup 403 are collected, the first suction cup 403 moves toward the tray, and the inspected chips are placed back on the tray. Then, the support platform is moved away from the front detection device 30 by a predetermined distance, so that the first suction cup 403 can absorb another row of chips to be inspected, and the above actions are repeated until the bottom and side images of each chip to be inspected are collected. It should also be noted that in the embodiment of the present application, the number of the second vertical lenses 401 is three, the number of the tilt lenses 402 is two, the three second vertical lenses 401 are arranged side by side, and the two tilt lenses 402 are arranged obliquely and are respectively located on both sides of the three second vertical lenses 401.

[0056] Furthermore, in order to facilitate the first suction cups 403 to absorb chips of different sizes, Figure 4 As shown, the bottom side detection device 40 also includes an equally divided distance variable module 407, and the equally divided distance variable module 407 is fixedly mounted on the second mounting seat 406. Each slider on the equally divided distance variable module 407 is provided with a first suction cup 403, and the inspector can adjust the distance between two adjacent first suction cups 403 through the equally divided distance variable module 407.

[0057] It should be noted that after the bottom and side surfaces of each chip to be inspected are collected, the material tray with the chips to be inspected is moved to the turntable 702 close to the material dividing device 50 by the lifting and clamping mechanism 701 located between the two turntables 702, and the material tray placed on the turntable 702 is moved to the material dividing device 50 by the lifting and clamping mechanism 701 close to the unloading device 60.

[0058] Furthermore, if Figure 8As shown, the material dividing device 50 includes a plurality of second suction cups 501, a third mounting seat 502, a plurality of third lifting drive devices 503, a third linear module 504 and a material rack seat 505, the third linear module 504 is arranged in parallel with the second linear module 405, the third mounting seat 502 is fixedly connected to the slider of the third linear module 504, each of the third lifting drive devices 503 is arranged on the third mounting seat 502, the third lifting drive devices 503 correspond to the second suction cups 501 one by one, and each of the third lifting drive devices 503 is connected to a corresponding second suction cup 501, the material rack seat 505 is located on one side of the first slide groove 101, and the material rack seat 505 has a plurality of rack areas 5051.

[0059] It should be noted that the number of the shelf tray areas 5051 is not less than three, and the number of the shelf tray areas 5051 is preferably five. When the number of the shelf tray areas 5051 is three, the three shelf tray areas 5051 are respectively used to place front defective part trays, bottom defective part trays and side defective part trays. When the number of the shelf tray areas 5051 is five, the remaining two shelf tray areas 5051 are used to place qualified product trays.

[0060] It should be noted that, when the material tray moves to the material dividing device 50, the second suction cup 501 is moved up and down by the third lifting drive device 503, and the second suction cup 501 is driven to move in the width direction of the base 10 by the third linear module 504, and the defective chips are adsorbed one by one by the second suction cup 501, and the defective parts are placed in the corresponding defective parts tray or the bottom defective parts tray or the side defective parts tray by the second suction cup 501, and then the material tray with qualified chips is moved to the tray placement assembly 201 of the unloading device 60 for stacking.

[0061] Further, when the number of the rack area 5051 is five, as Fig. 9 As shown, the unloading device 60 includes a plate clamp 601 and a linear drive device 602 . The linear drive device 602 is fixedly mounted on a side of the third linear module 504 away from the third mounting seat 502 .

[0062] It should be noted that when there are defective products on the tray, the tray moved to the material distribution device 50 is placed on a rack area 5051 by the tray clamp 601, and after the defective products are placed on the corresponding tray by the second suction cup 501, the chip slot on the tray with qualified products is vacant, and then the tray clamp 601 is used to place another tray moved to the material distribution device 50 on another rack area 5051, and the previous tray is filled with qualified products by the second suction cup 501, and then the tray filled with qualified products is moved back to the lifting and clamping mechanism 701 by the tray clamp 601, and then the tray is moved to the tray placement assembly 201 of the unloading device 60 by the lifting and clamping mechanism 701, and the chips on the tray at the tray placement assembly 201 are full.

[0063] Furthermore, if Figure 8 As shown, the material unloading device 60 further includes a crooked material detection camera 603 , and the crooked material detection camera 603 is disposed between the plate placement assembly 201 and the third linear module 504 of the material unloading device 60 .

[0064] It should be noted that, in the process of the lifting and clamping mechanism 701 moving the material tray to the tray placement assembly 201, the position image of the qualified chip is collected by setting the deflection detection camera 603. If the position of the qualified chip is skewed, the external defect detection system will send out an alarm signal to facilitate the inspector to adjust the position of the chip in time.

[0065] Furthermore, to eliminate static electricity, Figure 5 As shown, the chip appearance defect detection equipment further includes an ion fan 80 , and the ion fan 80 is disposed on one side of the transfer table 702 close to the front detection device 30 .

[0066] Furthermore, if Figure 7 As shown, the loading device 20 also includes a code scanning mechanism 202, which is arranged on one side of the disk assembly 201 of the loading device 20, and the code scanning mechanism 202 is electrically connected to an external defect detection system to facilitate the external defect detection system to number the chips.

[0067] In summary, the chip appearance defect detection device based on the embodiment of the present application is explained, which provides the chip appearance defect detection device with advantages such as measuring the upper and lower surfaces and sides in an automated manner and being suitable for large-scale detection application scenarios.

[0068] It is worth mentioning that in the embodiment of the present application, the chip appearance defect detection device has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the chip appearance defect detection device provided by the present application is easy to produce and has low cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0069] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A chip appearance defect detection device, comprising a base, characterized in that: The chip appearance defect detection device also includes a feeding device; and A front detection device, the front detection device comprising a plurality of first vertical lenses; and a bottom side detection device, the bottom side detection device comprising a plurality of second vertical lenses, a plurality of tilt lenses and a plurality of first suction cups, the first vertical lenses being higher than each of the second vertical lenses and the tilt lenses in the height direction of the base, and the first vertical lenses and the second vertical lenses are oriented in opposite directions; and - a material separation device for classifying defective products and qualified products; as well as a feeding device; and A conveying system, the conveying system includes three lifting and clamping mechanisms and two transfer tables, one of the transfer tables is located between the front detection device and the bottom side detection device, the other of the transfer tables is located between the bottom side detection device and the material dividing device, one of the lifting and clamping mechanisms is slidably arranged on the base between the loading device and a transfer table close to the front detection device, another of the lifting and clamping mechanisms is slidably arranged on the base between the two transfer tables, and the remaining lifting and clamping mechanism is slidably arranged on the base between a transfer table close to the material dividing device and the unloading device.

2. The chip appearance defect detection device according to claim 1, characterized in that: The base has a first slide groove in the length direction, and each of the lifting and clamping mechanisms is slidably disposed on the first slide groove.

3. The chip appearance defect detection device according to claim 2, characterized in that: The front detection device also includes a first lifting drive device, a first linear module and a first mounting seat. Each of the first vertical lenses is vertically mounted on the first mounting seat. The first mounting seat is fixedly connected to the push rod of the first lifting drive device. The first lifting drive device is fixedly mounted on the slider of the first linear module and moves with it. The first linear module is arranged vertically with the first slide groove.

4. The chip appearance defect detection device according to claim 3, characterized in that: The base has a second slide groove in the width direction, and the second slide groove is arranged perpendicular to the first slide groove. The bottom side detection device also includes a second lifting drive device, a second linear module, and a second mounting seat. Each of the second vertical lenses and each of the tilting lenses are arranged in the second slide groove. The second linear module is arranged parallel to the first linear module. The second lifting drive device is fixedly installed on the slider of the second linear module. The second mounting seat is fixedly connected to the push rod of the second lifting drive device. Each of the first suction cups is arranged side by side on the second mounting seat.

5. The chip appearance defect detection device according to claim 4, characterized in that: The bottom and side surface detection device further comprises an equally divided distance variable module, the equally divided distance variable module is fixedly mounted on the second mounting seat, and each slider on the equally divided distance variable module is provided with one of the first suction cups.

6. The chip appearance defect detection device according to claim 5, characterized in that: The material dividing device includes a plurality of second suction cups, a third mounting seat, a plurality of third lifting drive devices, a third linear module and a material rack seat. The third linear module is arranged in parallel with the second linear module. The third mounting seat is fixedly connected to the slider of the third linear module. Each of the third lifting drive devices is arranged on the third mounting seat. The third lifting drive devices correspond to the second suction cups one by one, and each of the third lifting drive devices is connected to a corresponding second suction cup. The material rack seat is located on one side of the first slide groove, and the material rack seat has a plurality of rack plate areas.

7. The chip appearance defect detection device according to claim 6, characterized in that: The unloading device includes a plate clamp and a linear drive device, and the linear drive device is fixedly mounted on a side of the third linear module away from the third mounting seat.

8. The chip appearance defect detection device according to claim 7, characterized in that: The loading device and the unloading device both include a tray assembly, and the unloading device also includes a crooked material detection camera, which is arranged between the tray assembly and the third linear module of the unloading device.

9. The chip appearance defect detection device according to any one of claims 1 to 8, characterized in that: The chip appearance defect detection equipment also includes an ion fan, which is arranged on one side of the transfer table close to the front detection device.

10. The chip appearance defect detection device according to claim 8, characterized in that: The feeding device further comprises a code scanning mechanism, and the code scanning mechanism is arranged on one side of the tray placing component of the feeding device.

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