Silicon wafer production cleaning device

Abstract

The utility model relates to the technical field of silicon wafer production and processing, and discloses a silicon wafer production cleaning device which comprises a cleaning shell for cleaning by using ultrasonic waves, and a plurality of clamping assemblies capable of clamping silicon wafers with different specifications and sizes are arranged in the cleaning shell. Supporting assemblies for supporting and fixing the multiple clamping assemblies are arranged on the two sides of the multiple clamping assemblies. By arranging the clamping assembly, the supporting assembly, the fixing assembly and the drying assembly, when a plurality of silicon wafers with the same specification are cleaned, the clamping assembly can clamp the silicon wafers, the supporting assembly is matched with the fixing assembly to fix the positions of the silicon wafers, and after cleaning is completed, the drying assembly can move the supporting assembly upwards as a whole, so that the silicon wafers are cleaned conveniently. And the supporting assembly continuously vibrates, so that water on the silicon wafer is separated from the silicon wafer, and the effect of quickly drying the cleaned silicon wafer is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production and processing, in particular to a silicon wafer production cleaning device. Background Art

[0002] At present, photovoltaic silicon cells need to undergo a wet cleaning process, including cleaning and texturing, alkaline polishing, and de-winding plating to remove mechanical damage, organic oil stains, borosilicate layers, phosphorus silicon layers and other defects caused by previous processes to ensure the photoelectric conversion efficiency of the cells. Silicon wafers are a relatively important resource, so it is necessary to optimize the production of silicon wafers.

[0003] For example, a silicon wafer cleaning device is disclosed in a Chinese utility model patent with announcement number CN219785759U. Although the above-mentioned prior art fully reuses the cleaning water in the recovery tank to reduce the amount of pure water used and the discharge of wastewater, thereby reducing costs, a lot of moisture will remain on the surface of the silicon wafer after cleaning. If the moisture is not cleaned up before the silicon wafer moves to the next process, during the transportation of the silicon wafer, due to the long moving distance, impurity particles in the air will be adsorbed on the surface of the silicon wafer due to the residual moisture during the movement, and the residual moisture on the surface of the silicon wafer is not conducive to the processing and transportation of the silicon wafer. Therefore, it is necessary to design a silicon wafer production cleaning device that can accelerate the drying speed of the silicon wafer surface after cleaning. Utility Model Content

[0004] In order to solve the technical problem of accelerating the removal of residual moisture after silicon wafer cleaning, the utility model provides a silicon wafer production cleaning device.

[0005] The utility model is implemented by the following technical scheme: a silicon wafer production cleaning device, including a cleaning shell that uses ultrasonic cleaning, a plurality of clamping components that can clamp silicon wafers of different sizes are arranged inside the cleaning shell, support components that support and fix the plurality of clamping components are arranged on both sides of the plurality of clamping components, fixing components that fix the clamping components after the clamping components clamp the silicon wafers are arranged on both sides of the support components, and a drying component that drives the supporting component to move up and vibrate to dry the surface of the silicon wafer after the silicon wafer cleaning is completed is arranged on one side of the cleaning shell.

[0006] Through the above technical solution, when cleaning silicon wafers, the clamping assembly and the supporting assembly will clamp multiple silicon wafers for easy cleaning. After cleaning, the drying assembly will lift the silicon wafers out of the water and vibrate them to remove moisture from the surface of the silicon wafers.

[0007] As a further improvement of the above solution, the clamping assembly includes a first clamping bar arranged inside the cleaning shell and having a first clamping groove, and a second clamping bar arranged on one side of the first clamping bar and having a second clamping groove.

[0008] Through the above technical solution, the two clamping bars can clamp silicon wafers of different sizes.

[0009] As a further improvement of the above-mentioned scheme, a first mounting frame fixedly installed with multiple first clamping strips is provided inside the cleaning shell, and a second mounting frame fixedly installed with multiple second clamping strips is provided inside the cleaning shell. A bidirectional screw rod is provided between the first mounting frame and the second mounting frame, and both ends of the bidirectional screw rod are threaded through the first mounting frame and the second mounting frame, and a rotating block is fixedly installed at one end of the bidirectional screw rod.

[0010] Through the above technical solution, the rotation of the bidirectional screw rod will cause the first mounting frame and the second mounting frame to drive the clamping bar to move, thereby clamping the silicon wafer.

[0011] As a further improvement of the above-mentioned scheme, the support assembly includes a first support plate slidably arranged on one side of the interior of the cleaning shell and a second support plate slidably arranged on the other side of the interior of the cleaning shell, and the opposite surfaces of the first support plate and the second support plate are provided with multiple movable grooves, and the multiple first clamping strips and the multiple second clamping strips are slidably matched with adjacent movable grooves.

[0012] Through the above technical solution, the two support plates can bring the clamping strips out of the water, making it easier to dry the silicon wafers.

[0013] As a further improvement of the above scheme, sliding grooves are provided on the opposite surfaces of the first support plate and the second support plate, and the fixing assembly includes a sliding block slidably arranged inside the sliding groove and fixedly installed on one side of the first support plate, and a threaded column arranged on one side of the sliding block, and one end of the threaded column is threadedly penetrated through the sliding block and fits against the inner wall of the sliding groove.

[0014] Through the above technical solution, the sliding block can be fixed by rotating the threaded column, and the sliding block will fix the first support plate, thereby preventing the bidirectional screw rod from rotating.

[0015] As a further improvement of the above scheme, the drying component includes a servo motor fixedly installed on one side of the cleaning shell and a driving screw fixedly installed on the output end of the servo motor, one side of the first support plate and one side of the second support plate are fixedly installed with a connecting plate, one side of the cleaning shell is fixedly installed with a fixing plate, one side of the fixing plate is fixedly installed with a support column, one of the connecting plates is threadedly matched with the driving screw, and the other connecting plate is slidingly matched with the support column, one end of the driving screw is fixedly installed with a limiting column, and one end of the limiting column is fixedly installed with a limiting plate.

[0016] Through the above technical solution, the driving screw rod rotates continuously, causing the two support plates to move upward continuously, and eventually disengage from the driving screw rod and the limit column. Each time the driving screw rod is disengaged, vibration is generated, thereby allowing moisture to be separated.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model provides a clamping component, a supporting component, a fixing component and a drying component, so that when cleaning a plurality of silicon wafers of the same size, the clamping component will clamp the silicon wafers, and the supporting component can fix the positions of the silicon wafers in cooperation with the fixing component. After the cleaning is completed, the drying component will move the supporting component upward as a whole, and make the supporting component vibrate continuously. The continuous vibration of the supporting component will separate the water on the silicon wafers, thereby achieving the effect of rapid drying of the silicon wafers after cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of the cleaning shell of the utility model;

[0021] Figure 3 It is a schematic diagram of the structure of the clamping assembly of the utility model.

[0022] Description of main symbols:

[0023] 1. Cleaning shell; 201. First clamping strip; 202. Second clamping strip; 301. First support plate; 302. Second support plate; 401. Sliding block; 402. Threaded column; 501. Servo motor; 502. Driving screw rod; 6. First mounting bracket; 7. Second mounting bracket; 8. Bidirectional screw rod; 9. Rotating block; 10. Sliding groove; 11. Connecting plate; 12. Support column; 13. Limiting column. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0025] Please combine Figure 1-Figure 3A silicon wafer production cleaning device of the present embodiment includes a cleaning shell 1 that uses ultrasonic cleaning. A plurality of clamping components that can clamp silicon wafers of different sizes are arranged inside the cleaning shell 1. Support components that support and fix the plurality of clamping components are arranged on both sides of the plurality of clamping components. Fixing components that fix the clamping components after the clamping components clamp the silicon wafers are arranged on both sides of the supporting components. A drying component that drives the supporting component to move upward and vibrate to dry the surface of the silicon wafer after the silicon wafer is cleaned is arranged on one side of the cleaning shell 1.

[0026] Combination Figure 2 and Figure 3 The clamping assembly includes a first clamping bar 201 which is arranged inside the cleaning shell 1 and has a first clamping groove, and a second clamping bar 202 which is arranged on one side of the first clamping bar 201 and has a second clamping groove. A first mounting frame 6 which is fixedly installed with multiple first clamping bars 201 is provided inside the cleaning shell 1, and a second mounting frame 7 which is fixedly installed with multiple second clamping bars 202 is provided inside the cleaning shell 1. A bidirectional screw rod 8 is provided between the first mounting frame 6 and the second mounting frame 7. Both ends of the bidirectional screw rod 8 are threadedly penetrated through the first mounting frame 6 and the second mounting frame 7. A rotating block 9 is fixedly installed at one end of the bidirectional screw rod 8. The two clamping bars can clamp silicon wafers of different sizes. The rotation of the bidirectional screw rod 8 will allow the first mounting frame 6 and the second mounting frame 7 to drive the clamping bars to move, thereby clamping the silicon wafers.

[0027] Combination Figure 1 and Figure 2 The supporting assembly includes a first supporting plate 301 slidably arranged on one side of the interior of the cleaning shell 1 and a second supporting plate 302 slidably arranged on the other side of the interior of the cleaning shell 1. The first supporting plate 301 and the second supporting plate 302 have a plurality of movable grooves on their opposing surfaces. The plurality of first clamping strips 201 and the plurality of second clamping strips 202 are slidably matched with adjacent movable grooves. The first supporting plate 301 and the second supporting plate 302 have a sliding groove 10 on their opposing surfaces. The fixing assembly includes a sliding block 401 slidably arranged in the sliding groove 10 and fixedly installed on one side of the first supporting plate 301 and a threaded column 402 arranged on one side of the sliding block 401. One end of the threaded column 402 is threadedly penetrates the sliding block 401 and fits against the inner wall of the sliding groove 10. The two supporting plates can bring the clamping strips out of the water to facilitate drying of the silicon wafer. The threaded column 402 can be rotated to fix the sliding block 401, and the sliding block 401 will fix the first supporting plate 301, thereby preventing the bidirectional screw rod 8 from rotating.

[0028] Combination Figure 1The drying component includes a servo motor 501 fixedly mounted on one side of the cleaning shell 1 and a driving screw 502 fixedly mounted on the output end of the servo motor 501. A connecting plate 11 is fixedly mounted on one side of the first support plate 301 and one side of the second support plate 302. A fixing plate is fixedly mounted on one side of the cleaning shell 1. A supporting column 12 is fixedly mounted on one side of the fixing plate. One of the connecting plates 11 is threadedly matched with the driving screw 502, and the other connecting plate 11 is slidingly matched with the supporting column 12. A limiting column 13 is fixedly mounted on one end of the driving screw 502, and a limiting plate is fixedly mounted on one end of the limiting column 13. When the driving screw 502 rotates continuously, the two support plates will move up continuously, and finally disengage from the driving screw 502 and cooperate with the limiting column 13. Each time the driving screw 502 is disengaged, vibration will be generated, thereby allowing moisture to be separated.

[0029] The implementation principle of a silicon wafer production cleaning device in the embodiment of the present application is as follows: when cleaning multiple silicon wafers of the same size, the silicon wafers are vertically inserted into the second clamping groove of the second clamping bar 202, and the bidirectional screw rod 8 is rotated, so that the first mounting frame 6 with the first clamping bar 201 and the second mounting frame 7 with the second clamping bar 202 can move closer to each other, and the first clamping groove of the first clamping bar 201 is used to clamp all the silicon wafers. After clamping, the threaded column 402 is rotated, so that the first mounting frame 6 can be fixed and cannot move, so that the bidirectional screw rod 8 will also be fixed and cannot rotate, so as to avoid the separation of the two clamping bars and the silicon wafer falling off. After the silicon wafer is clamped, the inside of the shell 1 is cleaned and ultrasonic cleaning is performed. After the tilting is completed, the servo motor 501 is started, and the servo motor 501 allows the driving screw rod 502 to rotate, so that the connecting plate 11 drives the first support plate 301 to move upward together. In order to fix the sliding block 401 and the threaded column 402 with the support plate, the upward movement of the first support plate 301 will also drive the second support plate 302 to move upward, allowing all the components inside the cleaning shell 1 to move upward. After the silicon wafer moves upward, the water on the surface will naturally fall, fall into the second clamping groove, and then flow away from both sides. The driving screw rod 502 continues to move upward, which will cause the connecting plate 11 to separate from the driving screw rod 502. After separating from the driving screw rod 502, it will continue to be pressed down due to gravity and cooperate with the driving screw rod 502 thread again. When it suddenly falls and cooperates with the driving screw rod 502 again, the first support plate 301 will also vibrate due to the vibration of the fall, thereby transmitting the vibration to the silicon wafer. In this way, the driving screw rod 502 continues to rotate, which will produce continuous vibration. The vibrating silicon wafer will allow the water droplets to slide down, thereby quickly making the water on the surface of the silicon wafer disappear, so that the silicon wafer can be dried faster after cleaning.

[0030] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A silicon wafer production cleaning device, comprising a cleaning housing (1) for cleaning using ultrasonic waves, characterized in that: A plurality of clamping assemblies capable of clamping silicon wafers of different sizes are arranged inside the cleaning housing (1); support assemblies for supporting and fixing the plurality of clamping assemblies are arranged on both sides of the plurality of clamping assemblies; fixing assemblies for fixing the clamping assemblies after the clamping assemblies clamp the silicon wafers are arranged on both sides of the support assemblies; a drying assembly for driving the supporting assembly to move upward and vibrate to dry the surface of the silicon wafer after the silicon wafers are cleaned is arranged on one side of the cleaning housing (1).

2. A silicon wafer production cleaning device as claimed in claim 1, characterized in that: The clamping assembly comprises a first clamping strip (201) arranged inside the cleaning housing (1) and having a first clamping groove, and a second clamping strip (202) arranged on one side of the first clamping strip (201) and having a second clamping groove.

3. A silicon wafer production cleaning device as claimed in claim 2, characterized in that: A first mounting frame (6) fixedly mounted to a plurality of first clamping strips (201) is provided inside the cleaning shell (1), and a second mounting frame (7) fixedly mounted to a plurality of second clamping strips (202) is provided inside the cleaning shell (1). A bidirectional screw rod (8) is provided between the first mounting frame (6) and the second mounting frame (7), and both ends of the bidirectional screw rod (8) are threadedly passed through the first mounting frame (6) and the second mounting frame (7), and a rotating block (9) is fixedly mounted on one end of the bidirectional screw rod (8).

4. A silicon wafer production cleaning device as claimed in claim 2, characterized in that: The support assembly comprises a first support plate (301) slidably arranged on one side of the interior of the cleaning shell (1) and a second support plate (302) slidably arranged on the other side of the interior of the cleaning shell (1); the first support plate (301) and the second support plate (302) are provided with a plurality of movable grooves on their opposing surfaces; and the plurality of first clamping strips (201) and the plurality of second clamping strips (202) are slidably matched with adjacent movable grooves.

5. A silicon wafer production cleaning device as claimed in claim 4, characterized in that: The first support plate (301) and the second support plate (302) are provided with sliding grooves (10) on their opposing surfaces, and the fixing assembly comprises a sliding block (401) slidably arranged inside the sliding groove (10) and fixedly mounted on one side of the first support plate (301), and a threaded column (402) arranged on one side of the sliding block (401), one end of the threaded column (402) is threadedly penetrated through the sliding block (401) and fits against the inner wall of the sliding groove (10).

6. A silicon wafer production cleaning device as claimed in claim 4, characterized in that: The drying component comprises a servo motor (501) fixedly mounted on one side of a cleaning housing (1) and a driving screw (502) fixedly mounted on the output end of the servo motor (501); a connecting plate (11) is fixedly mounted on one side of the first support plate (301) and one side of the second support plate (302); a fixing plate is fixedly mounted on one side of the cleaning housing (1); a supporting column (12) is fixedly mounted on one side of the fixing plate; one of the connecting plates (11) is threadedly engaged with the driving screw (502), and the other connecting plate (11) is slidably engaged with the supporting column (12); a limiting column (13) is fixedly mounted on one end of the driving screw (502); and a limiting plate is fixedly mounted on one end of the limiting column (13).

Images