Stamping die cooling assembly

Abstract

The utility model discloses a stamping die cooling assembly, and belongs to the technical field of die cooling. Comprising a working table, guide assemblies are arranged on the four sides of the top end of the working table, an upper mold is arranged on the four guide assemblies in a sliding mode, a lower mold is arranged at the position, located below the upper mold, of the top end of the working table, and a cooling mechanism is arranged at the bottom end of the working table. After the temperature detected by a temperature sensor reaches the standard, liquid in a refrigeration box is pumped into a water storage tank through a second water pump for standby application, a first water pump is started, cooling liquid is pumped from the interior of the water storage tank and enters the lower mold and the upper mold through a liquid conveying pipe and a connecting hose correspondingly, and a bent cavity is filled with liquid; and the lower mold and the upper mold synchronously cool the machined part, so that rapid forming is facilitated, liquid injected into the lower mold and the upper mold is always at a constant temperature, and the cooling effect is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of mold cooling, and more particularly to a stamping mold cooling assembly. Background Art

[0002] Stamping dies are special process equipment used to process materials into parts during cold stamping. Stamping is a pressure processing method that uses a die installed on a press to apply pressure to the material at room temperature to separate or plastically deform the material, thereby obtaining the desired parts. The cooling component is a mechanism that cools and dissipates the heat of the stamping die to enable rapid product molding and stable die operation.

[0003] In the related technology, the mold needs to be cooled during the stamping process. In order to quickly form the workpiece, the patent with the prior art publication number CN219520402U provides a metal processing forging and stamping equipment with a cooling component, including a shell, a forging table is provided in the middle of the shell, a metal part is placed on the upper end of the forging table, a cylinder assembly is provided at the upper end of the shell, and a stamping plate is connected to the bottom of the cylinder assembly.

[0004] Although the above-mentioned prior art solutions can achieve timely water replenishment and cooling of the water storage end by setting up a cooling component, thereby achieving the cooling effect, there are still the following defects: 1. The existing stamping mold cooling component adopts a water-cooling cycle for cooling, and its water temperature will continue to rise as it absorbs heat in the cavity. The cold water source connected from the outside is directly mixed with the hot water after heat absorption. Although the overall water temperature can be reduced, the temperature change is unstable and there is a large difference in the cooling effect; 2. The cooling component is centrally arranged under the lower mold, and the upper mold cannot be cooled, resulting in uneven cooling of the upper and lower molding of the product.

[0005] In view of this, we propose a stamping die cooling assembly. Utility Model Content

[0006] 1. Technical problems to be solved

[0007] The purpose of this application is to provide a stamping die cooling assembly, which solves the technical problems of unstable changes in water tank temperature and large differences in cooling effects, and achieves constant temperature refrigeration of the cooling assembly, thereby achieving the technical effect of uniform cooling of the mold.

[0008] 2. Technical solution

[0009] The present application provides a stamping die cooling assembly, comprising a workbench, wherein guide assemblies are arranged on four sides of the top of the workbench, upper dies are slidably arranged on the four guide assemblies, a lower die is arranged on the top of the workbench below the upper die, curved cavities are provided inside the lower die and the upper die, inlet grooves and outlet grooves are respectively provided on both sides of the curved cavity, three-way pipes are embedded on both sides of the lower die, a cooling mechanism is arranged at the bottom end of the workbench, and the cooling mechanism comprises a first water pump, a water storage tank and a refrigeration box.

[0010] Preferably, the water storage tank and the refrigeration box are fittedly arranged under the workbench, one side of the water storage tank is connected to the input pipe of the first water pump, the output pipe of the first water pump is connected to an infusion tube, one end of the infusion tube is connected to the three-way pipe on one side of the lower mold, the top of the three-way pipe is connected to a connecting hose, one end of the connecting hose is connected to one side of the upper mold, a return pipe 1 is provided on the side of the upper mold opposite to the connecting hose, a three-way pipe side at the bottom end of the return pipe 1 is connected to a return pipe 2, and an end of the return pipe 2 is connected to one side of the refrigeration box.

[0011] Preferably, a temperature sensor is provided on one side of the refrigeration box, a detection end of the temperature sensor extends to the interior of the refrigeration box, a second water pump is provided on the back of the water storage tank, and a heat dissipation component is provided at the bottom of the refrigeration box.

[0012] Preferably, the input pipe of the second water pump is connected to the refrigeration box through a pipeline, and the output pipe of the second water pump is connected to the water storage tank through a pipeline.

[0013] Preferably, the heat dissipation assembly comprises a first heat dissipation fin, a semiconductor cooling fin is fitted on the bottom end of the first heat dissipation fin, and a second heat dissipation fin is fitted on the bottom end of the semiconductor cooling fin.

[0014] Preferably, the first heat dissipation fins are embedded in the bottom of the refrigeration box, and the top ends of the first heat dissipation fins are arranged in a matrix and extend into the interior of the refrigeration box.

[0015] Preferably, the second heat dissipation fins are distributed with arc-shaped heat dissipation fins taking the center as a base point, and a heat dissipation fan is embedded in the middle of the second heat dissipation fins.

[0016] Preferably, a control panel is provided on the front side of the refrigeration box, and the control panel is electrically connected to the first water pump and the second water pump respectively.

[0017] 3. Beneficial effects

[0018] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0019] (1) The present application is provided with a cooling mechanism. Since the water storage tank and the refrigeration box are separated, the inside of the refrigeration box is cooled by the heat dissipation component. After the temperature sensor detects that the temperature reaches the standard, the second water pump draws the liquid inside the refrigeration box into the water storage tank for standby. The first water pump is started to draw the coolant from the inside of the water storage tank and enter the inside of the lower mold and the upper mold respectively through the infusion tube and the connecting hose. The liquid is filled into the curved cavity. The lower mold and the upper mold cool the workpiece synchronously, which is convenient for rapid molding. The liquid injected into the lower mold and the upper mold is always at a constant temperature, thereby ensuring the cooling effect.

[0020] (2) The present application is provided with a heat dissipation component. The heat absorbing surface of the semiconductor refrigeration plate cooperates with the first heat dissipation fin to cool the liquid inside the refrigeration box. In order to ensure the normal operation of the semiconductor refrigeration plate, the second heat dissipation fin and the heat dissipation fan cooperate to accelerate the heat dissipation of the heat dissipation surface of the semiconductor refrigeration plate. The heat dissipation fan rotates the air flow and discharges it to the outside through the arc-shaped channel formed by the arc-shaped heat dissipation fin, thereby accelerating the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a first-view stereoscopic overall structure disclosed in a preferred embodiment of the present application;

[0022] Figure 2 A schematic diagram of a second-viewing perspective three-dimensional overall structure disclosed in a preferred embodiment of the present application;

[0023] Figure 3 A schematic diagram of the three-dimensional structure of a heat dissipation assembly disclosed in a preferred embodiment of the present application;

[0024] Figure 4 This is a schematic diagram of a three-dimensional structure of a lower mold section disclosed in a preferred embodiment of the present application;

[0025] Explanation of the numbers in the figure: 1. Workbench; 101. Lower mold; 102. Upper mold; 103. Guide assembly; 104. Inlet groove; 105. Curved cavity; 106. Outlet groove; 2. Cooling mechanism; 201. First water pump; 202. Infusion tube; 203. Connecting hose; 204. Water storage tank; 205. Refrigeration box; 206. Temperature sensor; 207. Second water pump; 208. Refrigeration pipe one; 209. Refrigeration pipe two; 3. Heat dissipation assembly; 301. First heat dissipation fin; 302. Semiconductor refrigeration plate; 303. Second heat dissipation fin; 304. Cooling fan. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with the accompanying drawings.

[0027] Embodiment 1

[0028] See also Figure 1-4The utility model provides an embodiment: a stamping die cooling assembly, including a workbench 1, four sides of the top of the workbench 1 are provided with guide assemblies 103, an upper die 102 is slidably provided on the four guide assemblies 103, a lower die 101 is provided at the top of the workbench 1 below the upper die 102, a curved cavity 105 is provided inside the lower die 101 and the upper die 102, an inlet groove 104 and an outlet groove 106 are provided on both sides of the curved cavity 105, three-way pipes are embedded on both sides of the lower die 101, a cooling mechanism 2 is provided at the bottom of the workbench 1, and the cooling mechanism 2 includes a first water pump 201, a water storage tank 204 and a refrigeration box 2 05, the water storage tank 204 and the refrigeration box 205 are arranged in a close relationship under the workbench 1, one side of the water storage tank 204 is connected to the input pipe of the first water pump 201, the output pipe of the first water pump 201 is connected to the infusion tube 202, one end of the infusion tube 202 is connected to the three-way pipe on one side of the lower mold 101, the top of the three-way pipe is connected to a connecting hose 203, one end of the connecting hose 203 is connected to one side of the upper mold 102, a return pipe 1 208 is arranged on the side of the upper mold 102 opposite to the connecting hose 203, a three-way pipe at the bottom end of the return pipe 1 208 is connected to a return pipe 2 209, and the end of the return pipe 209 is connected to one side of the refrigeration box 205. The first water pump 201 is started, and the coolant is extracted from the water tank 204, and enters the lower mold 101 and the upper mold 102 through the infusion tube 202 and the connecting hose 203 respectively. The curved cavity 105 is opened to fit the mold, and the curved cavity 105 is filled with liquid. The lower mold 101 and the upper mold 102 absorb heat energy simultaneously to cool the workpiece to facilitate rapid molding. The cooled liquid enters the refrigeration box 205 from the return pipe 1 208 and the return pipe 2 209. Since the water tank 204 and the refrigeration box 205 are separated, the liquid can be circulated only after reaching the standard temperature.

[0029] Among them, a temperature sensor 206 is arranged on one side of the refrigeration box 205, and the detection end of the temperature sensor 206 extends to the inside of the refrigeration box 205. A second water pump 207 is arranged on the back of the water storage tank 204, and a heat dissipation component 3 is arranged at the bottom of the refrigeration box 205. The temperature sensor 206 can mainly detect the temperature change of the liquid inside the refrigeration box 205. After the water temperature reaches the set temperature, the second water pump 207 starts to pump.

[0030] Among them, the input pipe of the second water pump 207 is connected to the refrigeration box 205 through a pipeline, and the output pipe of the second water pump 207 is connected to the water storage tank 204 through a pipeline. The inside of the refrigeration box 205 is cooled by the heat dissipation component 3. After the temperature sensor 206 detects that the temperature reaches the standard, the second water pump 207 pumps the liquid inside the refrigeration box 205 into the water storage tank 204 for standby, thereby completing the recycling, so that the liquid injected into the lower mold 101 and the upper mold 102 is always at a constant temperature, ensuring the cooling effect.

[0031] A control panel is provided on the front side of the refrigeration box 205, and the control panel is electrically connected to the first water pump 201 and the second water pump 207. The second water pump 207, the first water pump 201 and the temperature sensor 206 used are all models that can be directly purchased on the market, and their specific working principles are all existing technologies that are well known to people in the field, so they will not be elaborated here.

[0032] Embodiment 2

[0033] The stamping die cooling assembly proposed in the present invention is compared with the first embodiment. Figure 3 The heat dissipation assembly 3 includes a first heat dissipation fin 301, a semiconductor cooling sheet 302 is attached to the bottom of the first heat dissipation fin 301, and a second heat dissipation fin 303 is attached to the bottom of the semiconductor cooling sheet 302. The heat absorption surface of the semiconductor cooling sheet 302 cools down the liquid inside the refrigeration box 205 by cooperating with the first heat dissipation fin 301. In order to ensure the normal operation of the semiconductor cooling sheet 302, the second heat dissipation fin 303 and the heat dissipation fan 304 cooperate to accelerate the heat dissipation of the heat dissipation surface of the semiconductor cooling sheet 302.

[0034] The first heat sink fins 301 are embedded in the bottom of the refrigeration box 205 , and the top of the first heat sink fins 301 are arranged in a matrix and extend into the interior of the refrigeration box 205 . The first heat sink fins 301 are used to accelerate the cooling of the liquid in the refrigeration box 205 .

[0035] The second heat sink 303 has arc-shaped heat sinks distributed around the center, and a heat sink fan 304 is embedded in the middle of the second heat sink 303. The heat sink fan 304 rotates the air flow and discharges it to the outside through the arc-shaped channel formed by the arc-shaped heat sink, thereby accelerating the heat dissipation effect.

[0036] In summary, when the stamping die cooling assembly disclosed in the embodiment of the present application is in use, the first water pump 201 is started, and the coolant is extracted from the water storage tank 204, and enters the lower mold 101 and the upper mold 102 through the infusion pipe 202 and the connecting hose 203 respectively, the curved cavity 105 is opened in accordance with the mold, and the curved cavity 105 is filled with liquid, and the lower mold 101 and the upper mold 102 absorb heat energy synchronously to cool the workpiece, so as to facilitate rapid molding, and the cooled liquid is discharged from the reflux pipe 208 and the reflux pipe 209. Flow tube 209 enters into refrigeration box 205. Since water storage tank 204 and refrigeration box 205 are separated, the liquid can be circulated only after reaching the standard temperature. The inside of refrigeration box 205 is cooled by heat dissipation component 3. After temperature sensor 206 detects that the temperature reaches the standard, the liquid inside refrigeration box 205 is pumped into water storage tank 204 for standby by second water pump 207, thus completing the recycling, so that the liquid injected into lower mold 101 and upper mold 102 is always at a constant temperature, thereby ensuring the cooling effect.

[0037] The heat absorbing surface of the semiconductor refrigeration plate 302 cooperates with the first heat sink fins 301 to cool the liquid inside the refrigeration box 205. In order to ensure the normal operation of the semiconductor refrigeration plate 302, the second heat sink fins 303 and the heat sink fan 304 cooperate to accelerate the heat dissipation of the heat sink surface of the semiconductor refrigeration plate 302. The heat sink fan 304 rotates the air flow and discharges it to the outside through the arc-shaped channel formed by the arc-shaped heat sink, thereby accelerating the heat dissipation effect.

[0038] The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The content not described in detail in this specification belongs to the prior art known to professional and technical personnel in this field.

[0039] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A stamping die cooling assembly, characterized in that: It comprises a workbench (1), wherein the four sides of the top of the workbench (1) are provided with guide components (103), upper molds (102) are slidably provided on the four guide components (103), and a lower mold (101) is provided at the top of the workbench (1) below the upper mold (102); A curved cavity (105) is provided inside the lower mold (101) and the upper mold (102), and an inlet groove (104) and an outlet groove (106) are provided on both sides of the curved cavity (105). A cooling mechanism (2) is provided at the bottom end of the workbench (1), and the cooling mechanism (2) comprises a first water pump (201), a water storage tank (204) and a refrigeration box (205). A heat dissipation component (3) is provided at the bottom end of the refrigeration box (205).

2. The stamping die cooling assembly according to claim 1, characterized in that: The water storage tank (204) and the refrigeration box (205) are arranged in close proximity below the workbench (1); one side of the water storage tank (204) is connected to the input pipe of the first water pump (201); the output pipe of the first water pump (201) is connected to the infusion pipe (202); two sides of the lower mold (101) are embedded with three-way pipes; one end of the infusion pipe (202) is connected to the three-way pipe on one side of the lower mold (101); the top of the three-way pipe is connected to a connecting hose (203); one end of the connecting hose (203) is connected to one side of the upper mold (102); a return pipe 1 (208) is arranged on the side of the upper mold (102) opposite to the connecting hose (203); one side of the three-way pipe at the bottom of the return pipe 1 (208) is connected to a return pipe 2 (209); the end of the return pipe 2 (209) is connected to one side of the refrigeration box (205).

3. The stamping die cooling assembly according to claim 2, characterized in that: A temperature sensor (206) is provided on one side of the refrigeration box (205), and a detection end of the temperature sensor (206) extends into the interior of the refrigeration box (205). A second water pump (207) is provided on the back side of the water storage tank (204).

4. The stamping die cooling assembly according to claim 3, characterized in that: The input pipe of the second water pump (207) is connected to the refrigeration box (205) through a pipeline, and the output pipe of the second water pump (207) is connected to the water storage tank (204) through a pipeline.

5. The stamping die cooling assembly according to claim 1, characterized in that: The heat dissipation component (3) comprises a first heat dissipation fin (301), a semiconductor cooling sheet (302) is fitted on the bottom end of the first heat dissipation fin (301), and a second heat dissipation fin (303) is fitted on the bottom end of the semiconductor cooling sheet (302).

6. The stamping die cooling assembly according to claim 5, characterized in that: The first heat dissipation fins (301) are embedded in the bottom of the refrigeration box (205), and the top ends of the first heat dissipation fins (301) are arranged in a matrix and extend into the interior of the refrigeration box (205).

7. The stamping die cooling assembly according to claim 5, characterized in that: The second heat dissipation fins (303) are distributed with arc-shaped heat dissipation fins with the center as a base point, and a heat dissipation fan (304) is embedded in the middle of the second heat dissipation fins (303).

8. The stamping die cooling assembly according to claim 2, characterized in that: A control panel is provided on the front side of the refrigeration box (205), and the control panel is electrically connected to the first water pump (201) and the second water pump (207) respectively.

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