High-temperature-resistant mica heating plate

Abstract

The utility model discloses a high temperature resistant mica heating plate, which relates to the technical field of mica plates and comprises a base plate, mica plates are arranged on two sides of the base plate, a plurality of grooves are arranged on two sides of the base plate, each groove is of a fan-shaped structure, and a heating wire is arranged at the bottom of each groove in a penetrating manner. By arranging the substrate, arranging the mica plates on the two sides of the substrate, and arranging the metal sheets between the substrate and the mica plates, when the external temperature of the device is too high, the heat exchange efficiency between the heating wire in the device and the outside is reduced, and the heat in the device cannot be discharged in time, the metal sheets are overheated to deform; the mica plates can be pushed outwards by the metal sheets, so that a gap is formed between the two mica plates, heat in the device can be quickly discharged, the device can be prevented from being damaged due to the fact that the heat cannot be discharged in time due to too high external temperature, and the working performance of the device in a high-temperature environment can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of mica plates, in particular to a high-temperature resistant mica heating plate. Background Art

[0002] Existing mica heating plates generally wind the heating wire evenly on the mica board, using the mica board as a support and insulator. On the one hand, the resistance wire is easily oxidized when exposed to the air, and it is easy to get into water, causing the resistance wire to be damaged and leaking, which has poor safety. In addition, due to the overhead resistance wire inside, there are gaps between adjacent mica boards, which not only slows down the heat transfer, but also has poor pressure bearing capacity and short service life. On the other hand, the heating power per unit area is extremely uneven and unstable. During use, once the external temperature is high, heat may accumulate inside the heating plate in a high temperature environment, which may easily cause damage to the heating plate.

[0003] A mica heating plate with a publication number of CN203968411U comprises a rectangular mica substrate and two groups of heating wires pressed and fixed on two surfaces of the mica substrate, the ends of the heating wires are connected to solder pads, the mica substrate is provided with through holes for solder to pass through at the solder pad positions, and the solder pads on both sides of the mica substrate are electrically connected through solder; the solder pad is located at a vertex position of the mica substrate, the heating wires are arranged in a circuitous manner along the length direction of the mica substrate, and the other ends of the heating wires are folded back along the other three vertices of the mica substrate to be connected to the solder pad; each group of heating wires comprises three wires arranged in parallel; by arranging the heating wires on both sides of the mica substrate, the heat generation is large, and the heating wires are arranged in a reasonable manner, so that the gaps between the heating wires are small, the space utilization rate of the mica substrate is high, and when the area of ​​the mica substrate is constant, the length of the heating wires is relatively long, and the cross-sectional area of ​​the heating wires is large, so that the heating power of the heating wires is high.

[0004] When the above technical solution is actually applied, heat may easily accumulate inside the heating plate in a high temperature environment, which may easily cause damage to the inside of the heating plate.

[0005] Therefore, it is necessary to invent a high temperature resistant mica heating plate to solve the above problems. Utility Model Content

[0006] The purpose of the utility model is to provide a high temperature resistant mica heating plate to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-temperature resistant mica heating plate, comprising a substrate, mica plates are arranged on both sides of the substrate, multiple grooves are opened on both sides of the substrate, multiple grooves are arranged in a fan-shaped structure, and multiple grooves are arranged in a ring array, electric heating wires are arranged through the bottom of the grooves, and the electric heating wires are arranged in a serpentine structure, multiple strip grooves are arranged through the upper surface of the substrate, multiple strip grooves are arranged in a ring array, and multiple strip grooves are staggered with multiple grooves, circular grooves are opened in the middle of both sides of the substrate, and metal sheets are arranged inside the circular grooves.

[0008] Preferably, a plurality of heat-conducting plates with fan-shaped structures are fixedly provided on the inner side wall of the mica board, and the plurality of heat-conducting plates correspond to the plurality of grooves respectively.

[0009] Preferably, a plurality of strip blocks are fixedly disposed on the inner side surface of the mica board, and the plurality of strip blocks correspond to the plurality of strip grooves.

[0010] Preferably, a plurality of heat dissipation grooves with inclined structures are provided in the middle of the strip block, and two adjacent heat dissipation grooves are arranged in a staggered manner.

[0011] Preferably, a sealing plate with an annular structure is fixedly provided on the outer side of the mica plate, and the two sealing plates are in contact with each other.

[0012] Preferably, a first protrusion and a second protrusion are provided on the upper surface of the metal sheet, the upper surfaces of the first protrusion and the second protrusion are fixedly connected to the lower surface of the mica board, a recess is provided between the first protrusion and the second protrusion, and the lower surface of the recess is fixedly connected to the bottom of the circular groove.

[0013] Technical effects and advantages of the utility model:

[0014] 1. The utility model provides a substrate, and mica boards are provided on both sides of the substrate. A metal sheet is provided between the substrate and the mica board. When the external temperature of the device is too high, the heat exchange efficiency between the internal heating wire of the device and the outside is reduced, resulting in the inability to discharge the internal heat of the device in time. The metal sheet is overheated and deformed, and the metal sheet can push the mica board outward, so that a gap is generated between the two mica boards. At this time, the heat inside the device can be quickly discharged, thereby avoiding damage to the device caused by the inability to discharge the heat in time due to the excessively high external temperature, and thus improving the working performance of the device in a high temperature environment.

[0015] 2. The utility model sets a substrate, and both sides of the substrate are provided with a plurality of fan-shaped grooves, and the interior of the grooves is provided with a serpentine-shaped heating wire. By setting a fan-shaped heat-conducting plate on the inner side of the mica board, the heat-conducting plate cooperates with the heating wire to ensure that the heat generated by the heating wire is discharged in time, while ensuring the heating capacity of the device, avoiding heat accumulation and damage inside the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0017] Figure 2 It is an exploded view of the overall structure of the utility model.

[0018] Figure 3 This is a schematic diagram of the substrate structure of the utility model.

[0019] Figure 4 This is a schematic diagram of the structure of the mica board of the present utility model.

[0020] Figure 5 It is a schematic diagram of the metal sheet structure of the utility model.

[0021] In the figure: 1, substrate; 2, mica board; 3, groove; 4, heating wire; 5, strip groove; 6, circular groove; 7, metal sheet; 8, heat conducting plate; 9, strip block; 10, heat dissipation groove; 11, sealing plate; 12, first protrusion; 13, second protrusion; 14, recessed portion. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The utility model provides Figure 1-5A high temperature resistant mica heating plate shown in the figure comprises a substrate 1, mica plates 2 are arranged on both sides of the substrate 1, a plurality of grooves 3 are provided on both sides of the substrate 1, the plurality of grooves 3 are arranged in a fan-shaped structure, and the plurality of grooves 3 are arranged in a ring array, a heating wire 4 is provided through the bottom of the groove 3, and the heating wire 4 is arranged in a serpentine structure, a plurality of strip grooves 5 are provided through the upper surface of the substrate 1, the plurality of strip grooves 5 are arranged in a ring array, and the plurality of strip grooves 5 are arranged staggered with the plurality of grooves 3, circular grooves 6 are provided in the middle of both sides of the substrate 1, a metal sheet 7 is provided inside the circular groove 6, and the metal sheet 7 is provided as a metal material that will deform when heated, and can deform when the inside of the device is overheated to push the mica plate 2 outward;

[0024] Specifically, the inner wall of the mica board 2 is fixedly provided with a plurality of heat conducting plates 8 of fan-shaped structures, and the plurality of heat conducting plates 8 respectively correspond to the plurality of grooves 3, and the inner side of the mica board 2 is fixedly provided with a plurality of strip blocks 9, and the plurality of strip blocks 9 correspond to the plurality of strip grooves 5, and the middle of the strip block 9 is provided with a plurality of heat dissipation grooves 10 of inclined structures, and two adjacent heat dissipation grooves 10 are staggered, and the arrangement of the heat dissipation grooves 10 can play a role in assisting heat dissipation, and the arrangement of the inclined structure allows more air to enter the heat dissipation grooves 10, so as to increase the contact area between the inside of the device and the air, thereby achieving the effect of improving the heat dissipation effect;

[0025] More specifically, a sealing plate 11 of an annular structure is fixedly disposed on the outer side of the mica plate 2, and the two sealing plates 11 are in contact with each other. When the device works normally, the two sealing plates 11 can seal the substrate 1, thereby protecting the substrate 1.

[0026] In addition, a first protrusion 12 and a second protrusion 13 are provided on the upper surface of the metal sheet 7, and the upper surfaces of the first protrusion 12 and the second protrusion 13 are fixedly connected to the lower surface of the mica board 2. A recessed portion 14 is provided between the first protrusion 12 and the second protrusion 13, and the lower surface of the recessed portion 14 is fixedly connected to the bottom of the circular groove 6. When the metal sheet 7 is overheated and deformed, the first protrusion 12 and the second protrusion 13 can be deformed outward to realize the pushing out of the mica board 2. At the same time, the recessed portion 14 can be deformed inward to assist in pushing out the mica board 2.

[0027] The utility model provides a substrate 1, and mica plates 2 are provided on both sides of the substrate 1. A metal sheet 7 is provided between the substrate 1 and the mica plates 2. When the external temperature of the device is too high, the heat exchange efficiency between the internal heating wire 4 of the device and the outside is reduced, resulting in the inability to discharge the internal heat of the device in time. The metal sheet 7 is overheated and deformed, and the metal sheet 7 can push the mica plates 2 outward, so that a gap is generated between the two mica plates 2. At this time, the heat inside the device can be quickly discharged, thereby avoiding damage to the device caused by the inability to discharge the heat in time due to the excessively high external temperature, thereby improving the working performance of the device in a high temperature environment. A plurality of fan-shaped grooves 3 are provided on both sides of the substrate 1, and the interior of the grooves 3 is provided with a heating wire 4 with a serpentine structure. A heat conducting plate 8 with a fan-shaped structure is provided on the inner side of the mica plate 2. The heat conducting plate 8 cooperates with the heating wire 4 to ensure that the heat generated by the heating wire 4 is discharged in time, while ensuring the heating capacity of the device, avoiding heat accumulation damage inside the device.

[0028] Finally, it should be noted that the above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A high temperature resistant mica heating plate, comprising a substrate (1), characterized in that: Mica plates (2) are provided on both sides of the substrate (1), a plurality of grooves (3) are provided on both sides of the substrate (1), the plurality of grooves (3) are arranged in a fan-shaped structure, and the plurality of grooves (3) are arranged in a ring array, a heating wire (4) is provided through the bottom of the groove (3), and the heating wire (4) is arranged in a serpentine structure, a plurality of strip grooves (5) are provided through the upper surface of the substrate (1), the plurality of strip grooves (5) are arranged in a ring array, and the plurality of strip grooves (5) are arranged in an alternating manner with the plurality of grooves (3), and a circular groove (6) is provided in the middle of both sides of the substrate (1), and a metal sheet (7) is provided inside the circular groove (6).

2. A high temperature resistant mica heating plate according to claim 1, characterized in that: A plurality of heat-conducting plates (8) with fan-shaped structures are fixedly arranged on the inner side wall of the mica plate (2), and the plurality of heat-conducting plates (8) respectively correspond to the plurality of grooves (3).

3. A high temperature resistant mica heating plate according to claim 2, characterized in that: A plurality of strip blocks (9) are fixedly arranged on the inner side surface of the mica plate (2), and the plurality of strip blocks (9) correspond to the plurality of strip grooves (5).

4. The high temperature resistant mica heating plate according to claim 3, characterized in that: A plurality of heat dissipation grooves (10) with an inclined structure are provided in the middle of the strip block (9), and two adjacent heat dissipation grooves (10) are arranged in a staggered manner.

5. The high temperature resistant mica heating plate according to claim 4, characterized in that: A sealing plate (11) with an annular structure is fixedly arranged on the outer side of the mica plate (2), and the two sealing plates (11) are in contact with each other.

6. The high temperature resistant mica heating plate according to claim 5, characterized in that: The upper surface of the metal sheet (7) is provided with a first protrusion (12) and a second protrusion (13); the upper surfaces of the first protrusion (12) and the second protrusion (13) are fixedly connected to the lower surface of the mica plate (2); a recessed portion (14) is provided between the first protrusion (12) and the second protrusion (13); and the lower surface of the recessed portion (14) is fixedly connected to the bottom of the circular groove (6).

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