Graphite electroplating treatment device capable of removing redundant graphite film layer

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a graphite electroplating processing device capable of removing redundant graphite film layers, which comprises a connecting plate, a telescopic cylinder I, a pressing plate, a cutter and a driving component, the number of the connecting plates is at least two. Each connecting plate is fixedly connected with at least two first telescopic air cylinders. At least two pressing plates are jointly arranged among all the connecting plates, and the pressing plates are connected with the telescopic ends of the corresponding telescopic air cylinders I; all the connecting plates are jointly connected with a driving assembly; the driving assembly is connected with a cutter; when the circuit board is used, the graphene layers on the lower edge of the front side face and the lower edge of the rear side face of the circuit board body are pressed and limited through cooperation of the two pressing plates, the graphene layers are prevented from being torn down by the graphene layers on the thickness faces, and the protection function is achieved; the graphene layers on the lower portion of the front side face and the lower portion of the rear side face of the circuit board body are protected through the rubber pads; and the protection effect can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, and more specifically, to a graphite electroplating processing device capable of removing redundant graphite film layers. Background Art

[0002] Existing Chinese patent: A method for direct electroplating of circuit boards based on graphene film formation (CN110351956A). The utility model forms a conductive layer on the circuit board based on the graphene film formation process to replace chemical copper deposition. The circuit board direct electroplating process based on graphene has a short process flow, mild operating conditions, does not contain formaldehyde, EDTA and other complexes, has low pollution, is easy to control, and has simple wastewater treatment.

[0003] When the film forming process is carried out, a layer of graphene mixture slurry is first coated on the surface of the circuit board, and then the circuit board coated with the graphene mixture slurry is transferred to a dryer, the graphene mixture slurry is dried by the dryer to form a conductive film, and then the floating powder on the surface of the conductive film is removed by acid washing. During the coating and transfer process, part of the graphene mixture slurry will accumulate on the thickness surface of the lower side of the circuit board. The graphene layer remaining on the thickness surface of the lower side of the circuit board cannot be completely removed by acid washing. If a scraper is used to scrape off the graphene layer remaining on the thickness surface, the graphene layer on the thickness surface of the circuit board will tear off the graphene layers on the front and rear sides of the circuit board. Utility Model Content

[0004] In order to overcome the disadvantage that the graphene layers on the front and rear sides of a circuit board will be torn off together when the graphene layer remaining on the thickness surface is scraped off by a scraper, the utility model provides a graphite electroplating processing device capable of removing excess graphite film layers.

[0005] The technical solution of the utility model is: a graphite electroplating processing device capable of removing redundant graphite film layers, comprising a connecting plate, a telescopic cylinder, a pressure plate, a cutter and a driving assembly; at least two connecting plates are provided; at least two telescopic cylinders are fixedly connected to each connecting plate; at least two pressure plates are commonly provided between all the connecting plates, and the pressure plates are connected to the telescopic ends of the corresponding telescopic cylinders; a driving assembly is commonly connected between all the connecting plates; a cutter is connected to the driving assembly; and the driving assembly is used to drive the cutter to move horizontally.

[0006] Furthermore, the cutter is made of rust-proof material.

[0007] Furthermore, the driving assembly includes an electric slide rail and an electric slider; each connecting plate is fixedly connected to an electric slide rail; each electric slide rail is slidably connected to an electric slider, and the electric slider is detachably connected to the cutter.

[0008] Furthermore, it also includes a rubber pad; each pressing plate is fixedly connected with a rubber pad.

[0009] Furthermore, it also includes an auxiliary component; the auxiliary component is connected to the telescopic cylinder one; the auxiliary component includes a linkage block, a linkage plate, a connecting block and a telescopic cylinder two; each connecting plate is slidably connected to at least two linkage blocks; each pressure plate is slidably connected to a linkage plate, the linkage plate is fixedly connected to the corresponding linkage block, and the linkage plate is fixedly connected to the corresponding telescopic end of the telescopic cylinder one; each linkage plate is fixedly connected to at least two connecting blocks; each connecting block is fixedly connected to a telescopic cylinder two, and the telescopic end of the telescopic cylinder two is fixedly connected to the corresponding pressure plate.

[0010] Furthermore, a distance sensor is provided on the electric slider.

[0011] Beneficial effect: The utility model adopts the above technical solution, and through the cooperation of two pressing plates, the graphene layer at the lower edge of the front side and the lower edge of the rear side of the circuit board body is pressed and limited to prevent the graphene layer on the thickness surface from being torn off, thereby realizing the protection function;

[0012] The graphene layer at the lower part of the front side and the lower part of the rear side of the circuit board body is protected by the rubber pad to prevent the pressing plate from crushing the graphene layer at the lower part of the front side and the lower part of the rear side of the circuit board body, which is beneficial to improving the protection effect;

[0013] The pressing plate is driven to move upward by the telescopic cylinder 2, so that the thickness surface of the rubber pad that originally bulges downward is transformed into an oblique upward inclination, avoiding the movement path of the cutter, thereby effectively avoiding the problem of the cutter cutting the rubber pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The schematic diagram of the structure of the graphite electroplating processing device capable of removing the redundant graphite film layer of the utility model is shown;

[0015] Figure 2 A partial structural schematic diagram of a graphite electroplating treatment device capable of removing excess graphite film layers according to the utility model is shown;

[0016] Figure 3 The structure diagram of the cutter of the utility model is shown;

[0017] Figure 4 The operating state diagram of the graphite electroplating processing device of the utility model which can remove the redundant graphite film layer is shown.

[0018] In the accompanying drawings: 1-connecting plate, 2-telescopic cylinder 1, 3-pressing plate, 4-cutter, 5-electric slide rail, 6-electric slider, 7-rubber pad, 8-linkage block, 9-linkage plate, 10-connecting block, 11-telescopic cylinder 2, 12-circuit board body. DETAILED DESCRIPTION

[0019] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0020] Example 1

[0021] A graphite electroplating treatment device capable of removing excess graphite film layers, such as Figure 1-Figure 4 As shown, it includes a connecting plate 1, a telescopic cylinder 2, a pressure plate 3, a cutter 4 and a driving assembly; two connecting plates 1 are provided, and the connecting plates 1 are set to an alloy material; each connecting plate 1 is bolted with two telescopic cylinders 2; two pressure plates 3 are commonly provided between all the connecting plates 1, and the pressure plates 3 are connected to the telescopic ends of the corresponding telescopic cylinders 2; a driving assembly is commonly connected between all the connecting plates 1; a cutter 4 is connected to the driving assembly; the driving assembly is used to drive the cutter 4 to move horizontally.

[0022] The cutter 4 is made of rust-proof material to prevent the blade of the cutter 4 from rusting, thereby preventing the cutting operation from being affected.

[0023] The driving assembly includes an electric slide rail 5 and an electric slider 6; each connecting plate 1 is bolted with an electric slide rail 5; each electric slide rail 5 is slidably connected with an electric slider 6, and the electric slider 6 is detachably connected to the cutter 4. The cutter 4 is driven by the electric slider 6 to move horizontally to scrape off the graphite layer remaining on the thickness surface of the circuit board body 12.

[0024] It also includes a rubber pad 7; each pressing plate 3 is fixed with a rubber pad 7, and the rubber pad 7 protects the graphite layer on the front side and the rear side of the circuit board body 12.

[0025] It also includes an auxiliary component; the telescopic cylinder 2 is connected to an auxiliary component; the auxiliary component includes a linkage block 8, a linkage plate 9, a connecting block 10 and a telescopic cylinder 2 11; each connecting plate 1 is slidably connected to two linkage blocks 8, and the linkage block 8 is set to a smooth material; each pressing plate 3 is slidably connected to a linkage plate 9, the linkage plate 9 is bolted to the corresponding linkage block 8, the linkage plate 9 is fixedly connected to the corresponding telescopic end of the telescopic cylinder 2, and the linkage plate 9 is set to an alloy material; each linkage plate 9 is bolted to two connecting blocks 10; each connecting block 10 is bolted to a telescopic cylinder 2 11, the telescopic end of the telescopic cylinder 2 11 is bolted to the corresponding pressing plate 3, and the pressing plate 3 is driven to move upward through the telescopic cylinder 2 11, and the pressing plate 3 drives one side of the rubber pad 7 to move upward.

[0026] The electric slide block 6 is provided with a distance sensor, which can accurately measure the movement distance of the cutter 4 .

[0027] After the circuit board body 12 is coated and dried, the circuit board body 12 is driven to move to the left by the external conveying mechanism, so that the circuit board body 12 moves to the middle of the gap between the two connecting plates 1. Figure 1 As shown, the telescopic cylinder 2 is then started, and the telescopic cylinder 2 drives the pressure plate 3 to move, so that the two pressure plates 3 move toward each other, clamp the lower end of the circuit board body 12, and the lower side of the pressure plate 3 is flush with the thickness surface of the lower side of the circuit board body 12, and then the electric slide rail 5 and the electric slider 6 are started, and the electric slider 6 drives the cutter 4 to move to the left, so that the graphene layer remaining on the thickness surface of the lower side of the circuit board body 12 is scraped off by the cutter 4. In this process, the two pressure plates 3 cooperate to press and limit the graphene layers at the lower edges of the front side and the rear side of the circuit board body 12 to avoid being torn off by the graphene layer on the thickness surface, thereby realizing the protection function.

[0028] Before the scraping operation, the telescopic cylinder 2 drives the pressing plate 3 to move, and the pressing plate 3 drives the rubber pad 7 to move, so that the two rubber pads 7 move toward each other and contact the circuit board body 12, so that the lower end of the pressing plate 3 is clamped and limited by the cooperation of the pressing plate 3 and the rubber pad 7, and then the scraping operation is performed by the cutter 4. When in use, the graphene layer at the lower part of the front side and the lower part of the rear side of the circuit board body 12 is protected by the rubber pad 7, so as to avoid the pressing plate 3 from crushing the graphene layer at the lower part of the front side and the lower part of the rear side of the circuit board body 12, which is beneficial to improve the protection effect.

[0029] When the pressing plate 3 and the rubber pad 7 clamp the lower end of the circuit board body 12 to limit the position, the rubber pad 7 will be flattened and deformed by the extrusion force, so that the thickness surface of the lower side of the rubber pad 7 bulges downward. At this time, the lowermost part of the rubber pad 7 is lower than the lower side of the circuit board body 12, so that the cutter 4 moving along the lower side of the circuit board body 12 cuts the bulge on the lower side of the rubber pad 7. Therefore, when the pressing plate 3 and the rubber pad 7 clamp the lower end of the circuit board body 12, the telescopic cylinder 11 drives the pressing plate 3 to slide upward on the linkage plate 9, and the pressing plate 3 applies an upward pulling force to one side of the rubber pad 7, while the other side of the rubber pad 7 is tightly attached to the circuit board body 12 through friction, so that the rubber pad 7 is tilted and deformed. Figure 4 As shown, at this time, the rubber pad 7 is still clamped and limited to the lower part of the front side and the lower part of the rear side of the circuit board body 12, and the thickness surface of the rubber pad 7 that originally protrudes downward is transformed into an oblique upward inclination to avoid the movement path of the cutter 4, and then the cutting operation is performed. When in use, the pressing plate 3 is driven to move upward by the telescopic cylinder 11, so that the thickness surface of the rubber pad 7 that originally protrudes downward is transformed into an oblique upward inclination to avoid the movement path of the cutter 4, thereby effectively avoiding the problem of the cutter 4 cutting the rubber pad 7.

[0030] Although the utility model is described in detail with reference to the above embodiments, it is obvious to those skilled in the art through this disclosure that various changes or modifications can be made to the utility model without departing from the principle and spirit of the utility model defined by the claims. Therefore, the detailed description of the embodiments of the present disclosure is only used to explain, not to limit the utility model, but the scope of protection is limited by the content of the claims.

Claims

1. A graphite electroplating treatment device capable of removing excess graphite film layers, characterized in that: The invention comprises a connecting plate (1), a telescopic cylinder (2), a pressing plate (3), a cutter (4) and a driving assembly; at least two connecting plates (1) are provided; at least two telescopic cylinders (2) are fixedly connected to each connecting plate (1); at least two pressing plates (3) are provided between all the connecting plates (1), and the pressing plates (3) are connected to the telescopic ends of the corresponding telescopic cylinders (2); a driving assembly is connected between all the connecting plates (1); the cutter (4) is connected to the driving assembly; and the driving assembly is used to drive the cutter (4) to move horizontally.

2. A graphite electroplating treatment device capable of removing excess graphite film layer according to claim 1, characterized in that: The cutter (4) is made of rust-proof material.

3. A graphite electroplating treatment device capable of removing excess graphite film layer according to claim 1, characterized in that: The driving assembly comprises an electric slide rail (5) and an electric slider (6); each connecting plate (1) is fixedly connected to an electric slide rail (5); each electric slide rail (5) is slidably connected to an electric slider (6), and the electric slider (6) is detachably connected to the cutter (4).

4. A graphite electroplating treatment device capable of removing excess graphite film layer according to claim 3, characterized in that: It also includes a rubber pad (7); each pressing plate (3) is fixedly connected to a rubber pad (7).

5. A graphite electroplating treatment device capable of removing excess graphite film layer according to claim 4, characterized in that: The invention also comprises an auxiliary component; the auxiliary component is connected to the telescopic cylinder 1 (2); the auxiliary component comprises a linkage block (8), a linkage plate (9), a connection block (10) and a telescopic cylinder 2 (11); each connection plate (1) is slidably connected to at least two linkage blocks (8); each pressing plate (3) is slidably connected to a linkage plate (9), the linkage plate (9) is fixedly connected to the corresponding linkage block (8), and the linkage plate (9) is fixedly connected to the telescopic end of the corresponding telescopic cylinder 1 (2); each linkage plate (9) is fixedly connected to at least two connection blocks (10); each connection block (10) is fixedly connected to a telescopic cylinder 2 (11), and the telescopic end of the telescopic cylinder 2 (11) is fixedly connected to the corresponding pressing plate (3).

6. A graphite electroplating treatment device capable of removing excess graphite film layers according to any one of claims 3 to 5, characterized in that: A distance sensor is provided on the electric slider (6).

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