SMT reflow soldering clamp

Abstract

The utility model relates to the field of PCBA (Printed Circuit Board Assembly), in particular to an SMT (Surface Mount Technology) reflow soldering fixture, which comprises a bottom plate, a plurality of positioning rods are fixed above the bottom plate, a pressing plate is arranged above the bottom plate, the positioning rods penetrate through the pressing plate and are in sliding connection with the pressing plate, a plurality of positioning devices are arranged on the pressing plate, each positioning device comprises a pressing block arranged below the pressing plate, and the pressing blocks are connected with the pressing plate in a sliding manner. A positioning spring is further fixed between the pressing block and the pressing plate, a pressing rod is further fixed on the pressing block, the pressing rod penetrates through the pressing plate and is in sliding connection with the pressing plate, and nuts in threaded connection with the positioning rod are arranged on the positioning rod above the pressing plate. The pressing block is pushed by the positioning spring to press the element on the circuit board, so that displacement of the element caused by vibration of the element when the clamp is placed can be effectively avoided, and the condition of pseudo soldering and false soldering is avoided.

Description

Technical Field

[0001] The present invention relates to the field of PCBA, and in particular to a SMT reflow soldering fixture. Background Art

[0002] With the in-depth application of intelligence, smart watches are becoming more and more widely used. The smart watch motherboard is the core component of the smart watch. During its manufacturing process, the smart watch motherboard needs to be reflowed after SMT patching. SMT is the surface assembly technology of electronic circuits. It is currently the most popular technology and process in the electronic assembly industry. It is a circuit assembly technology that installs pinless or short-lead surface assembly components on the surface of printed circuit boards or other substrates, and assembles them by reflow soldering or dip soldering. It is characterized by high assembly density and small size of electronic products.

[0003] Patent application number: CN202320164501.8 discloses an SMT patch reflow soldering fixture, including a support and an operating table arranged above the support; a plurality of legs are fixed between the support and the operating table; positioning plates are arranged around the upper end surface of the operating table, and the bottom ends of the four positioning plates are vertically connected to sliding plates A, and four sliding holes are opened on the operating table, and the four sliding plates A are respectively slidably arranged inside the four sliding holes, and each sliding plate A is installed with a linear drive mechanism. When working, the substrate to be clamped is placed on the upper end surface of the operating table, and then the substrate is straightened so that the substrate is placed between the four positioning plates, and the circuit board is fixed after the sides of the substrate are contacted by the positioning plates. After the circuit board is fixed, it is placed in a reflow soldering machine for reflow soldering, but this type of fixture performs reflow soldering by fixing the four sides of the circuit board, resulting in the components not being fixed when they are attached to the circuit board for reflow soldering. When the fixture is placed on the reflow soldering machine, it is easy to cause the components to vibrate, so that the components cannot be attached to the circuit board, resulting in the occurrence of false soldering.

[0004] The present invention is proposed in view of the deficiencies in the prior art. Summary of the invention

[0005] The purpose of the present invention is to overcome the disadvantages of the prior art and provide a SMT reflow soldering fixture.

[0006] The present invention can be implemented by the following technical solutions:

[0007] The present invention discloses an SMT reflow soldering fixture, comprising a base plate, a plurality of positioning rods fixed above the base plate, a pressure plate arranged above the base plate, the positioning rods passing through the pressure plate and being slidably connected to the pressure plate, a plurality of positioning devices arranged on the pressure plate, the positioning devices comprising a pressure block arranged below the pressure plate, a positioning spring fixed between the pressure block and the pressure plate, a pressure rod fixed on the pressure block, the pressure rod passing through the pressure plate and being slidably connected to the pressure plate, and nuts threadedly connected to the positioning rods are arranged on the positioning rods above the pressure plate. Place the circuit board with components placed on the bottom plate, and the positioning rod passes through the positioning holes on the circuit board. After the circuit board is placed, place the pressure plate on the circuit board, the positioning rod passes through the positioning holes on the pressure plate, and assemble the nut and the positioning rod thread. When the nut is rotated, the nut moves close to the pressure plate, and the nut pushes the pressure plate down after contacting the pressure plate, and the pressure block presses the components on the circuit board. After each nut is rotated to a suitable position, place the fixture on the reflow soldering machine for reflow soldering. When the device fixes the circuit board, the positioning spring pushes the pressure block to press the components on the circuit board, which can effectively avoid the displacement of components caused by component vibration when the fixture is placed, and avoid the occurrence of false soldering.

[0008] Preferably, the pressing plate is also provided with a plurality of vents penetrating the pressing plate, so as to facilitate the flow of air after heating and avoid heat accumulation and damage to components.

[0009] Preferably, a plurality of support plates are arranged above the bottom plate, and support springs are fixed between the support plates and the bottom plate. After the circuit board is welded, the pressure plate is removed, and the support springs push the support plate upward, and the circuit board is pushed upward by the support plate, so that the welded circuit board can be easily removed.

[0010] Compared with the prior art, the present invention has the following advantages:

[0011] 1. When the device fixes the circuit board, the positioning spring pushes the pressure block to press the components on the circuit board, which can effectively prevent the components from vibrating and causing the components to shift when the fixture is placed, and avoid the occurrence of false soldering.

[0012] 2. The circuit board and the pressure plate are separated by positioning springs to facilitate airflow to the positions of each component. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings, wherein:

[0014] Figure 1 It is a structural schematic diagram of the present invention;

[0015] In the figure: 1, bottom plate; 2, positioning rod; 3, circuit board; 4, component; 5, pressure plate; 6, pressure block; 7, positioning spring; 8, pressure rod; 9, limit block; 10, vent; 11, nut; 12, support plate; 13, support spring; DETAILED DESCRIPTION

[0016] The embodiments of the present invention are described in detail below with reference to the accompanying drawings: Example

[0017] like Figure 1 As shown, this embodiment discloses an SMT reflow soldering fixture, including a base plate 1, a plurality of positioning rods 2 are fixed above the base plate 1, a pressure plate 5 is arranged above the base plate 1, the positioning rods 2 pass through the pressure plate 5 and are slidably connected to the pressure plate 5, a plurality of positioning devices are arranged on the pressure plate 5, the positioning device includes a pressure block 6 arranged below the pressure plate 5, a positioning spring 7 is also fixed between the pressure block 6 and the pressure plate 5, a pressure rod 8 is also fixed on the pressure block 6, the pressure rod 8 passes through the pressure plate 5 and is slidably connected to the pressure plate 5, a limiting block 9 is fixed on the top of the pressure rod 8, and a nut 11 threadedly connected to the positioning rod 2 is arranged on the positioning rod 2 above the pressure plate 5. The circuit board 3 with the components 4 placed on it is placed above the base plate 1, and the positioning rod 2 passes through the positioning holes on the circuit board 3. After the circuit board 3 is placed, the pressure plate 5 is placed on the circuit board 3, the positioning rod 2 passes through the positioning holes on the pressure plate 5, and the nut 11 is threadedly assembled with the positioning rod 2. When the nut 11 rotates, the nut 11 moves close to the pressure plate 5, and the nut 11 contacts the pressure plate 5 and pushes the pressure plate 5 down, and the pressure block 6 presses the component 4 on the circuit board 3. After each nut 11 is rotated to a suitable position, the fixture is placed on the reflow soldering machine for reflow soldering. When the device fixes the circuit board 3, the positioning spring 7 pushes the pressure block 6 to press the component 4 on the circuit board 3, which can effectively prevent the component 4 from vibrating and causing the component 4 to shift when the fixture is placed, thereby avoiding the occurrence of false soldering.

[0018] The pressing plate 5 is also provided with a plurality of vents 10 penetrating the pressing plate 5. The vents 10 facilitate the flow of air after heating, thereby preventing heat accumulation from damaging the components 4. Example

[0019] This embodiment discloses an SMT reflow soldering fixture. Based on the structure and principle of the embodiment 1, a plurality of support plates 12 are further arranged above the base plate 1 of this embodiment, and a support spring 13 is further fixed between the support plate 12 and the base plate 1. After the circuit board 3 is soldered, the pressing plate 5 is removed, and the support spring 13 pushes the support plate 12 upward, and the circuit board 3 is pushed upward by the support plate 12, so that the soldered circuit board 3 can be conveniently removed.

[0020] The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, various changes, modifications, substitutions and variations can be made to these embodiments without departing from the technical principles of the present invention. These changes, modifications, substitutions and variations should also be regarded as the scope of protection of the present invention.

Claims

1. A SMT reflow fixture, comprising a base plate, characterized in that: A plurality of positioning rods are fixed above the base plate, a pressure plate is arranged above the base plate, the positioning rods pass through the pressure plate and are slidably connected to the pressure plate, a plurality of positioning devices are arranged on the pressure plate, the positioning device comprises a pressure block arranged below the pressure plate, a positioning spring is fixed between the pressure block and the pressure plate, a pressure rod is fixed on the pressure block, the pressure rod passes through the pressure plate and is slidably connected to the pressure plate, and nuts threadedly connected to the positioning rods are arranged on the positioning rods above the pressure plate.

2. The SMT reflow fixture according to claim 1, characterized in that: The pressing plate is also provided with a plurality of air holes penetrating through the pressing plate.

3. The SMT reflow fixture according to claim 1, characterized in that: A plurality of support plates are arranged above the bottom plate, and support springs are fixed between the support plates and the bottom plate.

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