Graphene copper alloy heat dissipation device

Abstract

The utility model discloses a graphene copper alloy heat dissipation device, and relates to the technical field of electronic equipment heat dissipation, the graphene copper alloy heat dissipation device comprises a mounting frame, the mounting frame is provided with a clamping type heat dissipation mechanism, and the clamping type heat dissipation mechanism comprises a heat dissipation assembly which is arranged at the lower part of the mounting frame and comprises a graphene copper alloy sheet detachably mounted at the lower end of the mounting frame; a plurality of groups of heat dissipation holes are formed in the graphene copper alloy sheet; and the fixing assembly is arranged on the outer side of the mounting frame and used for fixing the graphene copper alloy sheet to the mounting frame, the first segment is extruded by attaching the peripheral clamping rods to the equipment edge shell, the first segment pushes the second segment to extrude outwards through the movable segment rods on the two sides, and the sliding columns contract along the inner wall of the sleeve, so that the graphene copper alloy sheet is fixed to the mounting frame. The electronic equipment is clamped and fixed through reset elastic force generated after the compression spring is compressed, so that the electronic equipment clamping device can adapt to various electronic equipment with different sizes and models; the graphene copper alloy sheet is attached to the electronic equipment, so that heat generated in the electronic equipment is quickly conducted and volatilized.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a graphene copper alloy heat dissipation device. Background Art

[0002] With the rapid development of science and technology, the performance of electronic devices is increasing, and the demand for heat dissipation technology is also increasing. Although traditional heat dissipation materials such as copper and aluminum have good thermal conductivity, their performance has gradually failed to meet the growing demand for heat dissipation. Therefore, finding a new and efficient heat dissipation material has become a current research hotspot.

[0003] In the prior art, for example, the patent with publication number CN212083605U discloses a semiconductor chip testing tool, including a plurality of test piece bodies and a test piece fixing element for fixing the test piece bodies, the adjacent test piece bodies are arranged at intervals, the test piece bodies are made of graphene or graphene-copper alloy, and include a testing part, an electrical connection part and a fixing part, and the testing part and the electrical connection part are respectively located at the two ends of the fixing part. The semiconductor chip testing tool in this scheme uses graphene or graphene-copper alloy as the main material, which can greatly improve the heat dissipation effect of the test piece, thereby ensuring its service life.

[0004] As described in the above patent, graphene has extremely high electrical and thermal conductivity, its thermal conductivity is dozens of times that of copper, its resistivity is low, and its electron mobility is high, which makes graphene have huge application potential in the field of heat dissipation. However, there are some problems in the preparation and application of simple graphene materials, such as high cost and high processing difficulty, which limits its wide application in heat dissipation devices. Therefore, researchers began to try to compound graphene with other metal materials (such as graphene-copper alloy) to take advantage of their respective advantages and improve heat dissipation performance. However, most traditional heat dissipation structures are fixed to corresponding electronic devices, so it is difficult to adjust the adaptability according to the size of different models of electronic devices, and the application breadth is small. For this reason, the utility model provides a graphene copper alloy heat dissipation device. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a graphene copper alloy heat dissipation device, which solves the problem that most traditional heat dissipation structures are fixed to the corresponding electronic equipment, making it difficult to adjust the adaptability according to the sizes of different models of electronic equipment and having a limited application range.

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: a graphene copper alloy heat dissipation device, including a mounting frame, on which a clamping type heat dissipation mechanism is provided, and the clamping type heat dissipation mechanism includes:

[0007] A heat dissipation component is arranged at the lower part of the installation frame, and comprises a graphene copper alloy sheet which is detachably mounted at the lower end of the installation frame, and the graphene copper alloy sheet is provided with a plurality of groups of heat dissipation holes;

[0008] A fixing component is arranged outside the installation frame and is used to fix the graphene copper alloy sheet on the installation frame;

[0009] The clamping assembly is arranged inside the installation frame and is used to clamp and fix the equipment that needs heat dissipation.

[0010] Preferably, the fixing assembly comprises a base rod bonded to the upper part of the graphene copper alloy sheet, a connecting block is fixedly connected to the upper end of the base rod, and a rotating sheet is rotatably mounted inside the connecting block.

[0011] Preferably, a positioning strip is fixedly connected to the inner side of the base rod, and a plug hole for directional plugging of the positioning strip is provided on the outer side of the installation frame.

[0012] Preferably, the clamping assembly comprises a sleeve fixedly mounted on the inner wall of the mounting frame, a sliding column is slidably inserted into one end of the sleeve, and the other end of the sliding column is fixedly connected to the second section block.

[0013] Preferably, a compression spring is connected between the sleeve and the second segment, and the compression spring is sleeved on the outside of the sliding column.

[0014] Preferably, a movable joint rod is movably mounted on one end of the second section block, and a first section block is movably mounted on the other end of the movable joint rod, and a clamping rod is fixedly connected to one side of the first section block.

[0015] Beneficial Effects

[0016] The utility model provides a graphene copper alloy heat dissipation device. Compared with the prior art, it has the following beneficial effects:

[0017] (1) The graphene copper alloy heat dissipation device is configured such that the edge shell of the device is fitted with the surrounding clamping rods to squeeze the first block. The first block pushes the second block outward through the movable rods on both sides. The sliding column contracts along the inner wall of the sleeve and the electronic device is clamped by the return elastic force of the compressed compression spring. The device can be adapted to various electronic devices of different sizes and models. The graphene copper alloy sheet is fitted with the electronic device, so that the heat generated in the electronic device is quickly conducted and volatilized.

[0018] (2) The graphene copper alloy heat dissipation device is provided with a fixing assembly on the graphene copper alloy sheet, wherein base rods are provided at both ends of the graphene copper alloy sheet, and positioning is performed in advance by inserting a positioning strip into a plug hole provided on the outer side of the installation frame, and then the rotating piece on the upper part of the connecting block is rotated so that the rotating piece cooperates with the positioning strip to fix the base rod to the side of the installation frame, thereby facilitating the disassembly and replacement of the graphene copper alloy sheet and being flexible in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the split structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the fixing assembly of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the clamping assembly of the utility model.

[0023] In the figure: 1-installation frame, 2-clamping heat dissipation mechanism, 21-heat dissipation component, 211-graphene copper alloy sheet, 212-heat dissipation hole, 22-fixing component, 221-base rod, 222-connecting block, 223-rotating sheet, 224-positioning insert, 23-clamping component, 231-first section block, 232-movable section rod, 233-second section block, 234-sliding column, 235-sleeve, 236-compression spring, 237-clamping rod. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-4 The utility model provides a technical solution: a graphene copper alloy heat dissipation device, comprising a mounting frame 1, on which a clamping type heat dissipation mechanism 2 is arranged, and the clamping type heat dissipation mechanism 2 includes:

[0026] The heat dissipation component 21 is arranged at the lower part of the installation frame 1, and comprises a graphene copper alloy sheet 211 which is detachably mounted at the lower end of the installation frame 1, and a plurality of heat dissipation holes 212 are arranged on the graphene copper alloy sheet 211;

[0027] The fixing component 22 is arranged outside the installation frame 1 and is used to fix the graphene copper alloy sheet 211 on the installation frame 1;

[0028] The clamping assembly 23 is arranged inside the installation frame 1 and is used to clamp and fix the device that needs heat dissipation.

[0029] In this embodiment, the fixing component 22 includes a base rod 221 bonded to the upper part of the graphene copper alloy sheet 211, a connecting block 222 is fixedly connected to the upper end of the base rod 221, a rotating piece 223 is rotatably installed on the inner side of the connecting block 222, a positioning strip 224 is fixedly connected to the inner side of the base rod 221, and a socket for directional insertion of the positioning strip 224 is provided on the outer side of the installation frame 1. The positioning strip 224 is inserted into the socket provided on the outer side of the installation frame 1 to perform preliminary positioning, and then the rotating piece 223 on the upper part of the connecting block 222 is rotated so that the rotating piece 223 cooperates with the positioning strip 224 to fix the base rod 221 to the side of the installation frame 1.

[0030] In this embodiment, the clamping assembly 23 includes a sleeve 235 fixedly installed on the inner wall of the installation frame 1, and a sliding column 234 is slidably inserted at one end of the sleeve 235, and a second section block 233 is fixedly connected to the other end of the sliding column 234. A compression spring 236 is connected between the sleeve 235 and the second section block 233, and the compression spring 236 is sleeved on the outside of the sliding column 234. An active section rod 232 is movably installed at one end of the second section block 233, and a first section block 231 is movably installed at the other end of the active section rod 232. A clamping rod 237 is fixedly connected to one side of the first section block 231. The first section block 231 pushes the second section block 233 to be squeezed outward through the active section rods 232 on both sides. The sliding column 234 contracts along the inner wall of the sleeve 235, and the electronic device is clamped by the restoring elastic force of the compression spring 236 after compression.

[0031] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0032] When working, the corresponding electronic device is placed inside the device. When the device is placed inside, the edge shell of the device fits the surrounding clamping rod 237 and then squeezes the first block 231. The first block 231 pushes the second block 233 to squeeze outward through the movable block rods 232 on both sides. The sliding column 234 shrinks along the inner wall of the sleeve 235, and the electronic device is clamped by the restoring elastic force of the compression spring 236 after compression. It can adapt to various electronic devices of different sizes and models; the graphene copper alloy sheet 211 is fitted with the electronic device, so that the electronic device The heat generated in the equipment is quickly conducted and volatilized, and can cooperate with an external heat sink similar to a heat dissipation fan to quickly dissipate heat; in addition, a fixing component 22 is provided on the graphene copper alloy sheet 211, wherein the base rod 221 is provided at both ends of the graphene copper alloy sheet 211, and the positioning strip 224 is inserted into the socket provided on the outside of the installation frame 1 to perform a first-step positioning, and then the rotating piece 223 on the upper part of the connecting block 222 is rotated, so that the rotating piece 223 cooperates with the positioning strip 224 to fix the base rod 221 to the side of the installation frame 1.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A graphene copper alloy heat sink, comprising a mounting frame (1), characterized in that: The installation frame (1) is provided with a clamping type heat dissipation mechanism (2), and the clamping type heat dissipation mechanism (2) comprises: A heat dissipation component (21) is arranged at the lower part of the installation frame (1), comprising a graphene copper alloy sheet (211) detachably mounted at the lower end of the installation frame (1), wherein the graphene copper alloy sheet (211) is provided with a plurality of groups of heat dissipation holes (212); A fixing component (22) is arranged outside the installation frame (1) and is used to fix the graphene copper alloy sheet (211) on the installation frame (1); The clamping assembly (23) is arranged inside the installation frame (1) and is used to clamp and fix the device requiring heat dissipation.

2. A graphene copper alloy heat sink according to claim 1, characterized in that: The fixing assembly (22) comprises a base rod (221) bonded to the upper part of the graphene copper alloy sheet (211), a connecting block (222) is fixedly connected to the upper end of the base rod (221), and a rotating sheet (223) is rotatably mounted inside the connecting block (222).

3. A graphene copper alloy heat sink according to claim 2, characterized in that: A positioning insert (224) is fixedly connected to the inner side of the base rod (221), and a plug hole for directional plugging of the positioning insert (224) is provided on the outer side of the installation frame (1).

4. The graphene copper alloy heat sink according to claim 1, characterized in that: The clamping assembly (23) comprises a sleeve (235) fixedly mounted on the inner wall of the mounting frame (1); a sliding column (234) is slidably inserted at one end of the sleeve (235); and a second segment block (233) is fixedly connected at the other end of the sliding column (234).

5. A graphene copper alloy heat sink according to claim 4, characterized in that: A compression spring (236) is connected between the sleeve (235) and the second segment block (233), and the compression spring (236) is sleeved on the outside of the sliding column (234).

6. A graphene copper alloy heat sink according to claim 4, characterized in that: A movable joint rod (232) is movably mounted on one end of the second joint block (233), and a first joint block (231) is movably mounted on the other end of the movable joint rod (232), and a clamping rod (237) is fixedly connected to one side of the first joint block (231).

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