LED device
By adopting a double-layer packaging structure and concave-convex structure design in LED devices, the problem of insufficient binding performance of packaging colloids and diaphragms and substrates in the prior art is solved, and the light output and packaging reliability of LED devices are improved, so as to achieve More stable connections and higher reliability.
Patent Information
- Application Number
- CN202420893610.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-26
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-26
AI Technical Summary
The binding performance between the packaging colloid of existing LED devices and the diaphragm and substrate is insufficient, resulting in cracking and separation easily after multiple hot and cold impact tests, affecting the light output and packaging reliability of LED devices.
Using a double-layer packaging structure, by setting an uneven surface structure between the transparent gel layer and the packaging colloid, and setting an uneven surface structure at the contact position between the packaging colloid and the substrate, the contact area is increased and the packaging stability of the LED device is improved.
It improves the light output and packaging reliability of LED devices, enhances the connection stability and reliability of LED devices, and extends the service life of the product.
Smart Images
Figure CN222339928U_ABST
Abstract
Description
Technical Field
[0001] The utility model mainly relates to the technical field of LEDs, and in particular to an LED device. Background Art
[0002] Existing high-power products such as HUD (Head-up-Display) head-up display systems and car headlights generally use white wall glue as the packaging colloid packaging to control the size of the light radiation surface of the LED device. The current automotive-grade LED devices have high requirements for product reliability and need to undergo multiple hot and cold shock tests. The bonding performance between the packaging colloid of existing LED devices and the diaphragm and substrate is insufficient, and cracking and separation are prone to occur after multiple tests, affecting the light output efficiency and packaging reliability of the LED device. Utility Model Content
[0003] The purpose of the utility model is to overcome the deficiencies of the prior art. The utility model provides an LED device, which improves the light output efficiency by performing double-layer packaging on the LED chip, and provides a concave-convex surface structure to improve the stability of the LED device packaging, thereby improving the reliability of the LED device.
[0004] The utility model provides an LED device, which comprises: a substrate, an LED chip arranged on the substrate, a membrane arranged on the LED chip, a packaging colloid covering the LED chip and the membrane, and a transparent adhesive layer arranged on the membrane and the packaging colloid;
[0005] The connecting position between the transparent adhesive layer and the encapsulating colloid is configured as a concave-convex surface structure, and / or the connecting position between the substrate and the encapsulating colloid is configured as a concave-convex surface structure.
[0006] Furthermore, the film is a transparent film, or the film is a light conversion film.
[0007] Furthermore, the side surface of the diaphragm is an inclined surface.
[0008] Furthermore, a pad area and a non-pad area are provided on the top surface of the substrate, a pad is provided in the pad area, and the LED chip is mounted in the pad.
[0009] Furthermore, the non-pad region of the substrate is configured as a concave-convex surface structure, and the portion of the packaging colloid corresponding to the non-pad region is configured as a concave-convex surface structure.
[0010] Furthermore, the transparent adhesive layer is a planar adhesive layer, or the transparent adhesive layer is a lens adhesive layer.
[0011] Furthermore, the length of the encapsulating colloid is h1, the length of the transparent adhesive layer is h2, and the length of the membrane is h3;
[0012] The constraint relationship among h1, h2 and h3 is: h3≤h2≤h1.
[0013] Furthermore, the thickness of the transparent adhesive layer is H, and the value range of H is: 0 μm<H≤200 μm.
[0014] Furthermore, when the LED device emits green or red light, the thickness H of the transparent adhesive layer has a value range of: 10 μm<H≤200 μm;
[0015] When the LED device emits blue light, the thickness H of the transparent adhesive layer has a value range of 0 μm<H≤100 μm.
[0016] Furthermore, the light refractive index of the transparent adhesive layer is α, and the value of α is: 1.4≤α≤1.6.
[0017] The utility model provides an LED device, wherein a transparent adhesive layer is arranged above a diaphragm to perform double-layer packaging on an LED chip, thereby improving the light output efficiency of the LED device; a concave-convex surface structure is arranged between the transparent adhesive layer and the packaging colloid to connect, and a concave-convex surface structure is arranged at the contact position between the packaging colloid and a substrate, thereby increasing the contact area between the packaging colloid, the transparent adhesive layer and the substrate, thereby improving the connection stability and reliability of the LED device packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 It is a schematic diagram of the LED device structure in the embodiment of the utility model;
[0020] Figure 2 It is a structural schematic diagram of another state of the LED device in the embodiment of the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of an LED device with a transparent adhesive layer of a lens structure in an embodiment of the utility model;
[0022] Figure 4It is a structural schematic diagram of another state of the LED device with a transparent adhesive layer of a lens structure in an embodiment of the utility model;
[0023] Figure 5 It is a structural schematic diagram of an LED device with a trapezoidal structure membrane in an embodiment of the utility model;
[0024] Figure 6 It is a structural schematic diagram of an LED device with an inverted trapezoidal structure membrane in an embodiment of the utility model;
[0025] Figure 7 It is a schematic diagram of the linear relationship between the thickness of the transparent adhesive layer and the luminous flux in the embodiment of the utility model;
[0026] Figure 8 It is a schematic diagram of the linear relationship between the thickness of the transparent adhesive layer and the luminous flux enhancement ratio in the embodiment of the utility model. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] Please refer to Figure 1 to Figure 6 The LED device includes: a substrate 1, an LED chip 2 arranged on the substrate 1, a membrane 3 arranged on the LED chip 2, a packaging colloid 4 wrapped around the LED chip 2 and the membrane 3, and a transparent adhesive layer 5 arranged on the membrane 3 and the packaging colloid 4, and the membrane 3 is used to adjust the light output effect of the LED chip 2.
[0029] The connecting position between the transparent adhesive layer 5 and the encapsulating colloid 4 is set as a concave-convex surface structure, and / or the connecting position between the substrate 1 and the encapsulating colloid 4 is set as a concave-convex surface structure. The concave-convex surface structure is set at the connecting position between the transparent adhesive layer 5 and the encapsulating colloid 4, which can increase the contact area between the transparent adhesive layer 5 and the encapsulating colloid 4. The concave-convex surface structure is set between the encapsulating colloid 4 and the substrate 1, which can increase the contact area between the encapsulating colloid 4 and the substrate 1, improve the bonding stability between the encapsulating colloid 4 and the substrate 1, and improve the reliability of LED device packaging.
[0030] Specifically, the diaphragm 3 is a transparent diaphragm, or the diaphragm 3 is a light conversion diaphragm, and the diaphragm 3 can be a transparent ceramic diaphragm, and the transparent ceramic diaphragm is used to improve the light output efficiency of the LED chip 2. The diaphragm 3 can be a fluorescent ceramic diaphragm, and the fluorescent ceramic diaphragm can be one of a green light diaphragm, a red light diaphragm, and a blue light diaphragm. The fluorescent ceramic diaphragm can be used in conjunction with the LED chip 2 to adjust the light output color of the LED device, so that the LED device meets the actual application requirements.
[0031] Furthermore, the membrane 3 may be a transparent glass membrane or a fluorescent glass membrane.
[0032] Specifically, the side surface of the diaphragm 3 is an inclined surface. Figure 5 and Figure 6 The side edge of the cross-sectional structural shape of the diaphragm 3 is a slant line, and the cross-sectional structural shape of the diaphragm 3 can be a trapezoid, that is, the size of the light-emitting surface of the diaphragm 3 is smaller than the size of the light-entering surface of the diaphragm 3, so that the light in the diaphragm 3 can converge along the light-emitting surface, thereby improving the light-emitting efficiency of the LED device. The cross-sectional structural shape of the diaphragm 3 can also be an inverted trapezoid, that is, the side walls around the diaphragm 3 are non-vertical structures, the size of the light-emitting surface of the diaphragm 3 is larger than the size of the light-entering surface of the diaphragm 3, and the light emitted by the LED chip 2 can pass through the diaphragm 3 to increase the light-emitting range.
[0033] Specifically, a solder pad area and a non-solder pad area are provided on the top surface of the substrate 1, a solder pad 11 is provided in the solder pad area, the LED chip 2 is mounted in the solder pad 11, the LED chip 2 is soldered on the solder pad 11 based on a conductive material, and the top electrode of the LED chip 2 is connected to the solder pad 11 through a solder wire, so that the LED chip 2 is electrically connected to the metal circuit in the substrate 1, thereby realizing the driving and lighting operation of the LED chip 2.
[0034] Furthermore, the conductive material may be solder paste, silver paste, alloy, conductive die-bonding adhesive, etc.
[0035] Specifically, the non-pad area of the substrate 1 can be set to a concave-convex surface structure, and the portion of the encapsulation colloid 4 corresponding to the non-pad area can be set to a concave-convex surface structure. The non-pad area of the substrate 1 is processed to form a plurality of convex points, and a concave-convex structure surface is formed based on the plurality of convex points. By setting the encapsulation colloid 4 on the substrate 1, a concave-convex structure surface is formed at a portion where the encapsulation colloid 4 and the non-pad area of the substrate 1 are connected, thereby increasing the contact area between the encapsulation colloid 4 and the substrate 1, thereby improving the bonding stability between the encapsulation colloid 4 and the substrate 1.
[0036] Specifically, the transparent adhesive layer 5 may be a planar adhesive layer, that is, the transparent adhesive layer 5 is a layered structure, so that the overall structure of the LED device is flat, thereby improving the appearance of the overall structure of the LED device.
[0037] Furthermore, the transparent adhesive layer 5 may also be a lens adhesive layer, that is, the transparent adhesive layer 5 is a lens structure, so that the light emitted by the LED chip 2 can be focused by the lens and then emitted outward, thereby improving the light emission efficiency of the LED device.
[0038] Specifically, the length of the encapsulation colloid 4 is h1, the length of the transparent adhesive layer 5 is h2, the length of the diaphragm 3 is h3, and the constraint relationship among h1, h2 and h3 is: h3≤h2≤h1, the transparent adhesive layer 5 covers the upper position of the diaphragm 3, and the size of the transparent adhesive layer 5 can completely cover the top surface of the diaphragm 3, so that the light emitted by the LED chip 2 can pass through the diaphragm 3, and then pass through the transparent adhesive layer 5 and be emitted outward.
[0039] Furthermore, the size of the transparent adhesive layer 5 can be slightly larger than the size of the diaphragm 3, so that a partial area of the transparent adhesive layer 5 is connected to the top surface of the encapsulation colloid 4, so that the transparent adhesive layer 5 can be connected to the diaphragm 3 and the encapsulation colloid 4 at the same time, thereby improving the connection stability between the transparent adhesive layer 5 and the diaphragm 3 and the encapsulation colloid 4, and ensuring the light output efficiency of the LED device.
[0040] Furthermore, the transparent adhesive layer 5 can completely cover the top surface of the encapsulating colloid 4, that is, the bottom surface area of the transparent adhesive layer 5 is the same as the top surface area of the encapsulating colloid 4, so that the overall size structure of the LED device remains flat, thereby improving the appearance of the LED device.
[0041] For details, please refer to Figure 7 and Figure 8 The thickness of the transparent adhesive layer 5 is H, and the value range of H is: 0μm<H≤200μm. The thickness of the transparent adhesive layer 5 is positively correlated with the luminous flux passing through the transparent adhesive layer 5. By setting a transparent adhesive layer 5 with a certain thickness, the light output efficiency of the LED device is improved based on the transparent adhesive layer 5.
[0042] Specifically, when the light color of the LED device is green or red, the value range of the thickness H of the transparent adhesive layer 5 is: 10μm<H≤200μm. When the light color of the LED device is red, when the transparent adhesive layer 5 gradually increases in the range of 10μm to 200μm, the light flux improvement ratio of the LED device gradually increases, so that the red light flux of the LED device is increased to 6% to 19%, which can effectively improve the red light emission efficiency of the LED device; when the light color of the LED device is green, when the transparent adhesive layer 5 gradually increases in the range of 10μm to 200μm, the light flux improvement ratio of the LED device gradually increases, so that the green light flux of the LED device is increased by 4% to 8%, which can improve the green light emission efficiency.
[0043] Preferably, the thickness H of the transparent adhesive layer 5 is in the range of 50 μm to 120 μm. The thickness H of the transparent adhesive layer 5 in the range of 50 μm to 120 μm can effectively improve the light emission effects of red light and green light.
[0044] Specifically, when the LED device emits blue light, the thickness H of the transparent adhesive layer 5 has a value range of: 0μm<H≤100μm, and a more preferred value range of: 0μm<H≤50μm. When the transparent adhesive layer 5 gradually increases in the range of 0μm to 50μm, the light flux increase ratio of the LED device gradually increases, so that the blue light flux of the LED device gradually increases by 4%, thereby improving the blue light output efficiency of the LED device.
[0045] Specifically, the refractive index of the transparent adhesive layer 5 is α, and the value of α is: 1.4≤α≤1.6. In the present embodiment, the refractive index of the transparent adhesive layer 5 is 1.42, which can gather the light passing through the diaphragm 3 and improve the light output efficiency of the LED device.
[0046] The utility model provides an LED device, in which a transparent adhesive layer 5 is arranged above a diaphragm 3 to perform double-layer packaging on an LED chip 2, thereby improving the light output efficiency of the LED device; a concave-convex surface structure is arranged between the transparent adhesive layer 5 and the packaging colloid 4 to connect, and a concave-convex surface structure is arranged at the contact position between the packaging colloid 4 and the substrate 1 to increase the contact area between the packaging colloid 4 and the transparent adhesive layer 5 and the substrate 1, thereby improving the connection stability and reliability of the LED device packaging structure.
[0047] In addition, the above embodiments of the present invention are introduced in detail. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.
Claims
1. An LED device, characterized in that: The LED device comprises: a substrate, an LED chip arranged on the substrate, a membrane arranged on the LED chip, a packaging colloid covering the LED chip and the membrane, and a transparent adhesive layer arranged on the membrane and the packaging colloid; The connecting position between the transparent adhesive layer and the encapsulating colloid is configured as a concave-convex surface structure, and / or the connecting position between the substrate and the encapsulating colloid is configured as a concave-convex surface structure.
2. The LED device according to claim 1, characterized in that The film is a transparent film, or the film is a light conversion film.
3. The LED device according to claim 1, characterized in that The side surface of the diaphragm is an inclined surface.
4. The LED device according to claim 1, characterized in that A soldering pad area and a non-soldering pad area are provided on the top surface of the substrate, a soldering pad is provided in the soldering pad area, and the LED chip is mounted in the soldering pad.
5. The LED device according to claim 4, characterized in that: The non-pad area of the substrate is configured as a concave-convex surface structure, and the portion of the packaging colloid corresponding to the non-pad area is configured as a concave-convex surface structure.
6. The LED device according to claim 1, characterized in that: The transparent adhesive layer is a plane adhesive layer, or the transparent adhesive layer is a lens adhesive layer.
7. The LED device according to claim 1, characterized in that The length of the encapsulating colloid is h1, the length of the transparent adhesive layer is h2, and the length of the diaphragm is h3; The constraint relationship among h1, h2 and h3 is: h3≤h2≤h1.
8. The LED device according to claim 1, characterized in that: The thickness of the transparent adhesive layer is H, and the value range of H is: 0 μm<H≤200 μm.
9. The LED device according to claim 8, characterized in that When the LED device emits green or red light, the thickness H of the transparent adhesive layer is in the range of 10 μm ≤ H ≤ 200 μm; When the LED device emits blue light, the thickness H of the transparent adhesive layer has a value range of 0 μm<H≤100 μm.
10. The LED device according to claim 1, characterized in that The light refractive index of the transparent adhesive layer is α, and the value of α is: 1.4≤α≤1.6.