Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate, a bearing part, an optical chip and a light-transmitting glue layer. The bearing part is arranged on the substrate and comprises at least two cavity structures. The optical chip is arranged on the substrate and in the cavity structure. At least one optical chip is arranged in the cavity structure. And the light-transmitting glue layer is arranged in the cavity structure, covers the optical chip and is used for improving the light extraction rate and performing optical shaping. According to the utility model, the light extraction rate is improved by covering the light-transmitting glue layer on the optical chip; the reflecting surface is arranged on the side surface of the light-transmitting adhesive layer, so that the light energy utilization rate is further improved, and the high detection precision of the sensor device is further ensured. Meanwhile, the structure is simple, reasonable and stable.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is composed of at least two optical chips that emit and receive light. The light emitting chip emits a light beam, which passes through the optical system and irradiates the object to be measured. The light beam reflected or absorbed by the object passes through the optical system and irradiates the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and then output.

[0003] Existing sensor devices have problems such as low light energy utilization, low brightness, serious light interference and low accuracy.

[0004] Based on the above, a sensor device with high light energy utilization, high brightness, small light interference and high accuracy is currently provided. Utility Model Content

[0005] The utility model aims to provide a sensor device, aiming to solve the problems of low light energy utilization rate and low brightness of the sensor device in the prior art, as well as serious light interference and low accuracy.

[0006] The utility model is implemented as follows: a sensor device comprises:

[0007] substrate;

[0008] A receiving portion, which is arranged on the substrate, and includes at least two cavity structures;

[0009] An optical chip is disposed on the substrate and in the cavity structure, and at least one optical chip is disposed in the cavity structure;

[0010] A light-transmitting adhesive layer is arranged in the cavity structure and covers the optical chip, and is used to improve the light extraction rate and perform optical shaping.

[0011] Furthermore, the side surface of the light-transmitting adhesive layer is configured as a reflective surface for reflecting edge light at a large angle.

[0012] Furthermore, the light-transmitting adhesive layer covers the upper surface of the optical chip; or the light-transmitting adhesive layer covers the upper surface and side surfaces of the optical chip; or the light-transmitting adhesive layer covers the upper surface, side surfaces and upper surface of the substrate of the optical chip.

[0013] Furthermore, the upper surface of the light-transmitting adhesive layer is configured as a flat surface or a convex curved surface.

[0014] Furthermore, a light-transmitting hole or a lens is provided on a side of the cavity structure away from the substrate corresponding to the light-transmitting adhesive layer.

[0015] Furthermore, the lens is a convex lens, a concave lens or a plane lens.

[0016] Furthermore, the lens is a Fresnel lens.

[0017] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0018] The sensor device of the utility model integrates multiple optical chips 3. By setting the receiving part 2, the mutual interference of the emitted light / received light of each optical chip 3 can be effectively prevented. By covering the optical chip 3 with a light-transmitting adhesive layer 4, the light extraction rate is improved. The side of the light-transmitting adhesive layer 4 is set as a reflective surface 41 to improve the utilization rate of light energy, increase the brightness, and further improve the accuracy of sensor device detection. By setting a lens 6 and setting the surface shape of the lens 6, the outgoing light / incident light can be further optically adjusted to achieve a preset optical effect. The utility model has a simple and reasonable structure; it is small in size and easy to optically design. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0020] Figure 2 It is a schematic cross-sectional structure diagram of the first embodiment of the sensor device provided by the utility model;

[0021] Figure 3 It is a cross-sectional structural schematic diagram of the second embodiment of the sensor device provided by the utility model;

[0022] Figure 4 It is a schematic cross-sectional structure diagram of the third embodiment of the sensor device provided by the utility model;

[0023] In the figure: 1-substrate; 2-receiving part; 21-cavity structure; 3-optical chip; 4-light-transmitting adhesive layer; 41-reflecting surface; 5-light-transmitting hole; 6-lens. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0026] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] Reference Figure 1-4 As shown, it is a preferred embodiment provided by the utility model.

[0028] A sensor device, referring to Figure 1 , including a substrate 1, a receiving portion 2, an optical chip 3 and a light-transmitting adhesive layer 4. The receiving portion 2 is arranged on the substrate 1, and includes at least two cavity structures 21. The cavity structure 21 is used to accommodate the optical chip 3 and light propagation. The optical chip 3 is arranged in the cavity structure 21 on the substrate 1, and each cavity structure 21 is provided with at least one optical chip 3. The utility model is only described by taking two cavity structures 21 corresponding to two optical chips 3 as an example, and three or more cavity structures 21 can be arranged as needed, and each cavity structure 21 can accommodate multiple optical chips 3, and multiple optical chips 3 are regularly displayed or irregularly arrayed in the cavity structure 21. The above situations are all within the concept of the utility model.

[0029] The optical chip 3 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The sensor device of the utility model integrates a light-emitting chip for emitting light. When the emitted light is incident on the object to be detected or the object to be sensed, reflection occurs. The emitted light is incident on the photosensitive area of ​​the photosensitive chip and is received. The photosensitive chip converts the optical signal into an electrical signal, thereby making corresponding feedback. In order to prevent the emitted light and the received light of the light-emitting chip and the photosensitive chip from interfering with each other and preventing light from being transmitted, the receiving part 2 can be set as a light-absorbing part of an opaque material (such as black glue). According to the different functional requirements of different application scenarios, the receiving part 2 can also be set to be made of a translucent material in some application scenarios. There is no limit on the height of the receiving part 2.

[0030] To improve light extraction, the optical chip 3 is coated with a light-transmitting adhesive layer 4. The light-transmitting adhesive layer 4 can be configured to cover only the upper surface of the optical chip 3. Figure 3-4 ; It can also be set to cover the upper surface of the optical chip 3, and part or all of the side surfaces; the transparent adhesive layer 4 can also extend to the upper surface of the substrate 1, refer to Figure 1-2 A light-transmitting hole 5 is provided on the side of the cavity structure 21 away from the substrate 1 and above the light-transmitting adhesive layer 4. Figure 1-2 , or lens 6, refer to Figure 3-4 The cross section of the light-transmitting hole 5 can be set to a rectangular shape, an inverted "convex" shape, etc. The light-transmitting hole 5 is used for light transmission. The receiving portion 2 near the light-transmitting hole 5 can limit the divergence range of light as needed to obtain a preset light spot shape.

[0031] In order to optically shape the outgoing light or incident light of the light-transmitting adhesive layer 4 to meet the preset angle, brightness, uniformity and spot shape of the outgoing light / incident light, a lens 6 is arranged in the cavity structure 21. The lens 6 is arranged on the side of the cavity structure 21 away from the substrate 1, corresponding to the top of the light-transmitting adhesive layer 4. The lens 6 is set as a convex lens, or a concave lens, or a plane lens with both the incident surface and the exit surface being flat as needed. The lens 6 further optically adjusts the outgoing light / incident light to achieve optical effects such as convergence and shaping, and has a strong light control ability. Preferably, the lens 6 corresponding to the optical chip 3 receiving the light energy is a Fresnel lens. Through the converging effect of the Fresnel lens, the area of ​​the optical chip 3 for receiving the incident light energy is greatly reduced, thereby reducing the cost. In addition, 1. The Fresnel lens can reduce the volume of the optical chip 3 used; 2. The Fresnel lens is smaller than other convex lenses, so the volume of the overall device is greatly reduced, which is easy to integrate and design. Specifically, the lens 6 includes a first lens corresponding to the light emitting chip 3 and a second lens corresponding to the photosensitive chip. The first lens and the second lens are used to optically adjust the emitted light of the light emitting chip and the received light of the photosensitive chip, respectively. The first lens and the second lens can be set to the same or different types of lenses to meet the needs of different optical functions.

[0032] In order to further improve the utilization rate of light energy and enhance the brightness, the side of the light-transmitting adhesive layer 4 is configured as a reflective surface 41 for reflecting edge light at a large angle (refer to Figure 2-4 ), the reflecting surface 41 is a plane or a curved surface in the shape of an inverted cone, that is, the side of the light-transmitting adhesive layer 4 is set as a plane or a curved surface at a certain angle to the upper surface of the optical chip 3. The above-mentioned setting increases the incident angle, and the edge large-angle light is incident on the reflecting surface 41, which satisfies the incident angle greater than or equal to the critical angle, and total reflection is easy to occur. After total reflection, the light propagates in the direction close to the optical axis, and finally emerges from the front of the optical chip 3 or is incident on the photosensitive area of ​​the optical chip 3. This setting utilizes the large-angle edge light that is not easily utilized on the edges around, which is beneficial to the utilization rate of light energy and improves the overall brightness. At the same time, the setting of the reflecting surface 41 can reduce the light output angle range, which is easy for optical design. The upper surface of the light-transmitting adhesive layer 4 is set to a plane or a curved surface.

[0033] Example 1: Reference Figure 2The sensor device includes a substrate 1, a receiving portion 2, an optical chip 3 and a light-transmitting adhesive layer 4. The receiving portion 2 is arranged on the substrate 1, and includes at least two cavity structures 21. The optical chip 3 is arranged in the cavity structure 21 on the substrate 1, and the optical chip 3 corresponds to the cavity structure 21 one by one. The light-transmitting adhesive layer 4 covers the upper surface and all side surfaces of the optical chip 3, and covers part of the upper surface of the substrate 1. The upper surface of the light-transmitting adhesive layer 4 is a convex surface, and a reflective surface 41 is arranged on the side of the light-transmitting adhesive layer 4. A light-transmitting hole 5 is arranged in the cavity structure 21 and above the light-transmitting adhesive layer 4. The cross-section of the light-transmitting hole 5 is arranged in a rectangular shape. The diameter of the light-transmitting hole 5 is smaller than the diameter of the cavity structure 21, and the light-transmitting hole 5 is used to reduce the angle range of the outgoing or incident light.

[0034] Example 2: Reference Figure 3 , which is mainly different from the first embodiment: the light-transmitting adhesive layer 4 only covers the upper surface of the optical chip 3, but does not cover the side of the optical chip 3. A light-transmitting lens 6 is arranged in the cavity structure 21 and above the light-transmitting adhesive layer 4. The lens 6 is a lens with a flat upper surface and a flat lower surface, and the cross section of the lens 6 is arranged to be rectangular. There is an air layer between the lens 6 and the light-transmitting adhesive layer 4. The other settings are the same as those of the first embodiment.

[0035] Example 3: Reference Figure 4 , which is mainly different from the second embodiment: the upper surface of the light-transmitting adhesive layer 4 is a plane. The cross section of the lens 6 is set to be an inverted "convex" shape. Other settings are the same as the second embodiment.

[0036] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: substrate(1); A receiving portion (2) disposed on the substrate (1), the receiving portion (2) comprising at least two cavity structures (21); An optical chip (3) disposed on the substrate (1) and in the cavity structure (21), wherein at least one optical chip (3) is disposed in the cavity structure (21); A light-transmitting adhesive layer (4) is arranged in the cavity structure (21) and covers the optical chip (3), and is used to improve the light extraction rate and perform optical shaping.

2. The sensor device according to claim 1, characterized in that The side surface of the light-transmitting adhesive layer (4) is arranged as a reflection surface (41) for reflecting edge light at a large angle.

3. The sensor device according to claim 1, characterized in that: The light-transmitting adhesive layer (4) covers the upper surface of the optical chip (3); or the light-transmitting adhesive layer (4) covers the upper surface and side surfaces of the optical chip (3); or the light-transmitting adhesive layer (4) covers the upper surface, side surfaces of the optical chip (3) and the upper surface of the substrate (1).

4. The sensor device according to claim 1, characterized in that The upper surface of the light-transmitting adhesive layer (4) is configured as a flat surface or a convex curved surface.

5. The sensor device according to any one of claims 1 to 4, characterized in that: A light-transmitting hole (5) or a lens (6) is provided on a side of the cavity structure (21) away from the substrate (1) corresponding to the light-transmitting adhesive layer (4).

6. The sensor device according to claim 5, characterized in that The lens (6) is a convex lens, a concave lens, or a plane lens.

7. The sensor device according to claim 6, characterized in that: The lens (6) is a Fresnel lens.

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