Blade needle mechanism for semiconductor testing device and semiconductor testing device

Abstract

The utility model provides a blade needle mechanism for a semiconductor testing device and the semiconductor testing device, and relates to the technical field of semiconductor testing. In the utility model, any blade needle comprises a body and an elastic abutting part connected with the body, the body is respectively connected with the mounting seat and at least one target test probe included in the semiconductor test device, any blade needle further comprises at least one metal needle, one end of any metal needle passes through the body and is connected with the corresponding target test probe, and the other end of any metal needle is connected with the elastic abutting part. And the other end of the elastic pressing part penetrates through the elastic pressing part and is butted with a corresponding bonding pad of the tested chip. During testing, under the downward pressing effect of the corresponding target test probe, the elastic abutting part is pressed to deform, any metal needle protrudes out of the elastic abutting part to be connected with the corresponding bonding pad, an oxide layer on the bonding pad is scraped and removed, in the compression process of the elastic abutting part, the metal needles can move in the horizontal direction, and therefore the oxide layer of the bonding pad is scraped off, and the test efficiency is improved. And the test result of the tested chip is prevented from being influenced by the oxide layer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a blade needle mechanism for a semiconductor testing device and a semiconductor testing device. Background Art

[0002] Generally, the material of the chip pad is aluminum, and the pad of the packaged device is generally made of copper or tin. Since the above metals are easily oxidized in the air or in some high-temperature processes, the direct contact of the test probe with the oxide layer during the test process will lead to inaccurate test results, mainly because the resistance of the metal oxide is higher than the resistance of the metal pad. In view of the problem of the oxide layer at the pad position in the above test process, the probe is usually used to pierce the oxide layer and then pierce the pad. In the packaged device, such as BGA (Ball Grid Array, ball grid array package) with balls or QFN (Quad Flat No-leads Package, square flat no-lead package) with solder layer, there is a certain thickness, and better electrical performance testing can be achieved after piercing the oxide layer. However, for the bare chip after cracking, the oxide layer of the chip pad is usually only 0.1μm or even thinner, so the use of the above method is likely to cause problems such as chip pad damage.

[0003] Therefore, it is urgent to design a method for removing the metal oxide layer on the surface of the bare chip after cracking to prevent the metal oxide layer on the pad from affecting the test results. Utility Model Content

[0004] One purpose of the utility model is to provide a blade needle mechanism for a semiconductor testing device, so as to solve the technical problem in the prior art that the metal oxide layer on the chip pad affects the test result.

[0005] In particular, the utility model provides a blade needle mechanism for a semiconductor testing device, comprising:

[0006] Mounting seat;

[0007] At least one blade needle, any one of the blade needles comprises a body and an elastic abutment portion connected to the body; the body is respectively connected to the mounting seat and at least one target test probe included in the semiconductor test device; any one of the blade needles further comprises at least one metal needle, one end of any one of the metal needles passes through the body and is connected to the corresponding target test probe, and the other end passes through the elastic abutment portion and is butted against the corresponding pad of the chip under test;

[0008] During testing, under the downward pressure of the corresponding target test probe, the elastic abutment portion is compressed and deformed, and any one of the metal needles protrudes from the elastic abutment portion and connects to the corresponding pad, and scrapes and removes the oxide layer on the pad.

[0009] Optionally, the body comprises:

[0010] A first part, the first part is connected to the elastic abutment portion, and the first part is movably abutted against at least one of the target test probes;

[0011] The second part has one end connected to the first part, and the other end of the second part away from the first part is connected to the mounting seat.

[0012] Optionally, the blade needle mechanism further comprises at least one rotating shaft, any one of the rotating shafts is inserted into the mounting seat, and any one of the second parts is rotatably connected to the mounting seat via the corresponding rotating shaft.

[0013] Optionally, the rotating shaft is made of insulating material.

[0014] Optionally, the first portion is elastic, and the elastic abutment portion is configured to be compressed after the first portion is deformed by pressure, so that the metal needle protrudes from the elastic abutment portion.

[0015] Optionally, the first part and the second part are both made of insulating material.

[0016] Optionally, an angle formed between any of the metal needles and the chip under test is an acute angle.

[0017] Optionally, the mounting seat is provided with at least one mounting groove, and at least a portion of the body of any one of the blade needles is located in the corresponding mounting groove; and at least a portion of the target test probe is located in the mounting groove.

[0018] In particular, the utility model also provides a semiconductor testing device, comprising:

[0019] A first test seat, having a limiting portion for placing a chip under test;

[0020] A second test socket having at least one probe assembly, each of which includes at least one test probe;

[0021] at least one blade needle mechanism as described above, the blade needle mechanism being mounted on the second test seat;

[0022] When the first test socket and the second test socket are buckled and installed with each other, the elastic abutment portion of any blade needle included in the blade needle mechanism is compressed and deformed, and any metal needle protrudes from the elastic abutment portion and is connected to the corresponding pad of the chip under test, and scrapes and removes the oxide layer on the pad.

[0023] Optionally, the blade needle is correspondingly provided at the gate pad of the chip under test.

[0024] According to the scheme of the utility model, any blade needle includes a main body and an elastic abutment portion connected to the main body, the main body is respectively connected to the mounting seat and at least one target test probe included in the semiconductor test device, and any blade needle also includes at least one metal needle, one end of any metal needle passes through the main body and is connected to the corresponding target test probe, and the other end passes through the elastic abutment portion and docks with the corresponding pad of the chip under test. During the test, under the downward pressure of the corresponding target test probe, the elastic abutment portion is compressed and deformed, and any metal needle protrudes from the elastic abutment portion and is connected to the corresponding pad, and scrapes off the oxide layer on the pad. During the compression of the elastic abutment portion, the metal needle will move in the horizontal direction, thereby scraping off the oxide layer on the pad, avoiding the oxide layer from affecting the test result of the chip under test, and ensuring the accuracy of the test result.

[0025] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0027] Figure 1 It is a schematic cross-sectional view of a blade needle mechanism, a chip under test, and a target test probe according to an embodiment of the utility model;

[0028] Figure 2 It is a schematic structural diagram of a blade needle mechanism, a chip under test, and a target test probe according to an embodiment of the utility model;

[0029] Figure 3 is a schematic structural diagram of an elastic abutment portion in an original state according to an embodiment of the utility model;

[0030] Figure 4 is a schematic structural diagram of an elastic abutment portion in a compressed state according to an embodiment of the utility model;

[0031] Figure 5 is a schematic structural diagram of a semiconductor testing device according to an embodiment of the utility model;

[0032] Figure 6 yes Figure 5 A schematic structural diagram of a first test socket in the semiconductor test device shown;

[0033] Figure 7is a schematic structural diagram of an elastic abutment portion in an original state according to another embodiment of the utility model;

[0034] Figure 8 It is a schematic structural diagram of an elastic abutting portion in a compressed state according to another embodiment of the utility model.

[0035] Reference numerals:

[0036] 1000-semiconductor testing device, 100-blade needle mechanism, 200-probe assembly, 210-target test probe, 220-probe seat, 300-chip under test, 310-pad, 520-limiting part, 400-second test seat, 500-first test seat, 10-mounting seat, 20-blade needle, 21-elastic abutment part, 22-main body, 222-second part, 221-first part, 23-metal needle, 24-rotating shaft, 25-mounting groove. DETAILED DESCRIPTION

[0037] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0038] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0039] In the description of the present invention, it is necessary to understand that the terms "upper" and "lower" etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0041] Unless otherwise clearly specified and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present utility model according to the specific circumstances.

[0042] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0043] Embodiment 1:

[0044] Figure 1 1 is a schematic cross-sectional view of a blade needle mechanism 100, a chip under test 300, and a target test probe 210 according to an embodiment of the present utility model. Figure 2 The schematic diagram of the blade needle mechanism 100, the chip under test 300, and the target test probe 210 according to an embodiment of the utility model. In this embodiment, the chip under test 300 refers to a bare chip (bare Die) after splitting. By performing Die-level static and dynamic tests on the chip under test 300, the performance indicators of the chip under test 300 can be screened, and the finished product yield of the module end after packaging can be improved. Figure 1 to Figure 2As shown, in this embodiment, the blade needle mechanism 100 for a semiconductor test device includes a mounting seat 10 and at least one blade needle 20, any blade needle 20 includes a body 22, an elastic abutment portion 21 connected to the body 22, the body 22 is respectively connected to the mounting seat 10 and at least one target test probe 210 included in the semiconductor test device, and the blade needle 20 also includes at least one metal needle 23, one end of any metal needle 23 passes through the body 22 and is connected to the corresponding target test probe 210, and the other end passes through the elastic abutment portion 21 and is connected to the corresponding pad 310 of the chip under test 300. During the test, under the downward pressure of the corresponding target test probe 210, the elastic abutment portion 21 is compressed and deformed, and any metal needle 23 protrudes from the elastic abutment portion 21 and is connected to the corresponding pad 310, and the oxide layer on the pad 310 is scraped and removed. Here, the functional surface side of the chip under test 300 has a pad 310.

[0045] This embodiment sets the elastic abutment portion 21 to be elastic. During the compression of the elastic abutment portion 21, the metal needle 23 built into the elastic abutment portion 21 will protrude from the elastic abutment portion 21 and generate horizontal displacement. During the movement of the metal needle 23, the oxide layer on the pad 310 is scraped off, thereby preventing the oxide layer from affecting the test result of the chip under test 300 and ensuring the accuracy of the test result.

[0046] In this embodiment, the body 22 includes a first portion 221 and a second portion 222, the first portion 221 is connected to the elastic abutment portion 21, and the first portion 221 is movably abutted against at least one target test probe 210. The first portion 221 is arranged relative to the corresponding pad 310 of the chip under test 300. One end of the second portion 222 is connected to the first portion 221, and the other end of the second portion 222 away from the first portion 221 is connected to the mounting seat 10. Here, the first portion 221 is arranged in the horizontal direction, and the second portion 222 is arranged at a preset angle with the first portion 221, and the preset angle is greater than 90° and less than 180°, for example, it can be 110°, 130° or 150°, etc.

[0047] In this embodiment, the metal needle 23 is disposed inside the elastic abutment 21 and the first portion 221. That is, the metal needle 23 is not only disposed inside the elastic abutment 21, but also disposed inside the first portion 221.

[0048] Figure 3 is a schematic structural diagram of the elastic abutment portion 21 in an original state according to an embodiment of the utility model, Figure 4 2 is a schematic structural diagram of the elastic contact portion 21 in a compressed state according to an embodiment of the utility model. Figure 3 and Figure 4As shown, in this embodiment, the blade needle mechanism 100 also includes at least one rotating shaft 24, and any rotating shaft 24 is disposed in the mounting seat 10. Any second part 222 is rotatably connected to the mounting seat 10 through the corresponding rotating shaft 24, and the elastic abutment portion 21 is configured to be compressed when the first part 221 is pressed and rotates around the rotating shaft 24, so that the metal needle 23 protrudes from the elastic abutment portion 21 to contact the pad 310, thereby scraping off the oxide layer on the pad 310. Here, the metal needle 23 is fixedly connected to the first part 221, and when the elastic abutment portion 21 is compressed, the bottom of the metal needle 23 protrudes from the elastic abutment portion 21. In this embodiment, the movement in the vertical direction is changed to the movement in the vertical direction and the horizontal direction through the rotation of the rotating shaft 24, so that the metal needle 23 produces a horizontal displacement on the pad 310 to scrape off the oxide layer. Here, the metal needle 23 produces a small amplitude displacement in the horizontal direction. Specifically, the target test probe 210 provides downward pressure (toward the direction of the chip under test 300) to the corresponding blade needle 20, and the blade needle 20 rotates around the rotating shaft 30 to generate a tangential movement trend, which is decomposed into a downward movement trend and a horizontal movement trend (parallel to the direction of the chip under test 300). The downward movement trend increases the pressure of the blade needle 20 on the corresponding pad, and the horizontal movement trend forms a horizontal movement of the blade needle 20 on the surface of the corresponding pad, that is, a scraping action of the metal needle 23 on the corresponding pad under a certain pressure is formed.

[0049] In this embodiment, the rotating shaft 24 is made of insulating material. The first part 221 and the second part 222 are both made of insulating material. The top of the metal needle 23 is connected to the target test probe 210 .

[0050] In this embodiment, the angle between any metal needle 23 and the chip under test 300 is an acute angle, preferably, the angle ranges from 45° to 85°, such as 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80° or 85°, etc. When there are multiple metal needles 23, the inclination directions of the multiple metal needles 23 are the same or different, which can be designed according to specific design requirements.

[0051] Figure 5 is a schematic structural diagram of a semiconductor testing device 1000 according to an embodiment of the present utility model. Figure 6 yes Figure 5 FIG. 1 is a schematic structural diagram of the first test socket 500 in the semiconductor testing device 1000. Figure 5 and Figure 6As shown, in this embodiment, the semiconductor testing device 1000 includes a first test socket 500, a second test socket 400 and at least one blade needle mechanism 100 of any of the above-mentioned embodiments, and the first test socket 500 has a limiting portion 520 for placing the chip under test 300. The second test socket 400 has at least one probe assembly 200, and each probe assembly 200 includes at least one target test probe 210. The blade needle mechanism 100 is installed on the second test socket 400. When the first test socket 500 and the second test socket 400 are mutually buckled and installed, the elastic abutment portion 21 of any blade needle 20 included in the blade needle mechanism 100 is compressed and deformed, and any metal needle 23 protrudes from the elastic abutment portion 21 to connect with the corresponding pad 310 of the chip under test 300, and the oxide layer on the pad 310 is scraped and removed.

[0052] In this embodiment, the target test probe 210 is arranged in a straight line and can be arranged to have elastic properties, such as a spring structure. In a preferred embodiment, the target test probe 210 is a curved line needle or sheet needle, which can achieve better results.

[0053] In this embodiment, a blade needle 20 is correspondingly arranged at the gate pad of the chip under test 300, that is, only the oxide layer on the gate pad needs to be removed. In other embodiments, a blade needle 20 is correspondingly arranged at each pad 310 of the chip under test 300 to remove the oxide layer on all pads 310.

[0054] See also Figure 1 and Figure 2 , part of the target test probe 210 is penetrated inside the mounting seat 10 to contact the blade needle 20. The mounting seat 10 is provided with at least one mounting slot 25, at least part of the body 22 of any blade needle 20 is located in the corresponding mounting slot 25, and at least part of the target test probe 210 is located in the mounting slot 25. The elastic abutment portion 21 is located on the outside of the mounting slot 25. It can be understood that at least part of the target test probe 210 is penetrated inside the mounting slot 25. In this embodiment, a blade needle 20 is installed in each mounting slot 25. In other embodiments, the number of blade needles 20 in each mounting slot 25 can also be set according to specific design requirements.

[0055] Embodiment 2:

[0056] The difference between Example 2 and Example 1 is only that:

[0057] Figure 7 is a schematic structural diagram of the elastic abutment portion 21 in an original state according to another embodiment of the utility model. Figure 8 FIG. 2 is a schematic structural diagram of the elastic contact portion 21 in a compressed state according to another embodiment of the utility model. Figure 7 and Figure 8 The first part 221 is elastic, and the elastic abutment part 21 is configured to be compressed after the first part 221 is deformed by pressure, so that the metal needle 23 protrudes from the elastic abutment part 21 to contact the pad 310, thereby scraping off the oxide layer on the pad 310. Here, the second part 222 does not need to be connected to the mounting seat 10 through the rotating shaft 24, but only needs to be fixedly connected to the mounting seat 10.

[0058] In this embodiment, the first part 221 is configured to be deformed downwardly and tilted away from the second part 222 after being compressed. When the first part 221 is not compressed, it is arranged in a horizontal direction. When the first part 221 is subjected to the downward pressure of the target test probe 210, it is deformed downwardly and tilted, thereby compressing the elastic abutment 21, so that the metal needle 23 protrudes from the elastic abutment 21 and produces a small horizontal movement. When the pressure is removed, the first part 221 returns to its original state, that is, returns to a horizontal state. In this embodiment, the first part 221 is made of metal material.

[0059] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A blade needle mechanism for a semiconductor testing device, characterized in that: include: Mounting seat; At least one blade needle, any one of the blade needles comprises a body and an elastic abutment portion connected to the body; the body is respectively connected to the mounting seat and at least one target test probe included in the semiconductor test device; any one of the blade needles further comprises at least one metal needle, one end of any one of the metal needles passes through the body and is connected to the corresponding target test probe, and the other end passes through the elastic abutment portion and is butted against the corresponding pad of the chip under test; During testing, under the downward pressure of the corresponding target test probe, the elastic abutment portion is compressed and deformed, and any one of the metal needles protrudes from the elastic abutment portion and connects to the corresponding pad, and scrapes and removes the oxide layer on the pad.

2. The blade needle mechanism according to claim 1, characterized in that: The body comprises: A first part, the first part is connected to the elastic abutment portion, and the first part is movably abutted against at least one of the target test probes; The second part has one end connected to the first part, and the other end of the second part away from the first part is connected to the mounting seat.

3. The blade needle mechanism according to claim 2, characterized in that: The blade needle mechanism further comprises at least one rotating shaft, any of the rotating shafts is inserted into the mounting seat, and any of the second parts is rotatably connected to the mounting seat via the corresponding rotating shaft.

4. The blade needle mechanism according to claim 3, characterized in that: The rotating shaft is made of insulating material.

5. The blade needle mechanism according to claim 2, characterized in that: The first portion has elasticity, and the elastic abutment portion is configured to be compressed after the first portion is deformed by pressure, so that the metal needle protrudes from the elastic abutment portion.

6. The blade needle mechanism according to claim 4, characterized in that: The first part and the second part are both made of insulating material.

7. The blade needle mechanism according to claim 1, characterized in that: The angle formed by any of the metal needles and the chip under test is an acute angle.

8. The blade needle mechanism according to claim 1, characterized in that: The mounting seat is provided with at least one mounting groove, and at least a part of the body of any one of the blade needles is located in the corresponding mounting groove; at least a part of the target test probe is located in the mounting groove.

9. A semiconductor testing device, characterized in that: include: A first test seat, having a limiting portion for placing a chip under test; A second test socket having at least one probe assembly, each of which includes at least one test probe; at least one blade needle mechanism according to any one of claims 1 to 8, the blade needle mechanism being mounted on the second test seat; When the first test socket and the second test socket are buckled and installed with each other, the elastic abutment portion of any blade needle included in the blade needle mechanism is compressed and deformed, and any metal needle protrudes from the elastic abutment portion and is connected to the corresponding pad of the chip under test, and scrapes and removes the oxide layer on the pad.

10. The semiconductor testing device according to claim 9, characterized in that: The blade needle is correspondingly arranged at the gate pad of the chip under test.

Images