Anti-static integrated circuit packaging testing device

Abstract

The utility model discloses an anti-static integrated circuit packaging testing device, belongs to the technical field of integrated circuit packaging testing, and aims to solve the problems that the static elimination effect is poor, and an integrated circuit is easily damaged due to the fact that a clamping plate moves too quickly. Comprising a test board, a rotating disc, a supporting plate, a pin testing plate, a placing mechanism, an integrated circuit board, an anti-static device and supporting legs, the rotating disc is rotationally connected to the middle of the upper portion of the test board, the supporting plate is fixedly connected to the rear side of the upper portion of the test board, the pin testing plate is arranged below a transverse plate of the supporting plate, the placing mechanism is arranged above the rotating disc, and the integrated circuit board is arranged on the integrated circuit board. The integrated circuit is mounted in the placement mechanism; by means of the anti-static device, static electricity in the bottom plate can be guided, charged particles are conducted to the ground, static electricity is prevented from being generated, an integrated circuit board is prevented from being damaged, the safety performance of the device is improved, and the accuracy of a test result is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit packaging and testing, and in particular relates to an anti-static integrated circuit packaging and testing device. Background Art

[0002] Integrated circuits are microelectronic devices or components. After existing integrated circuits are produced, they are packaged. Packaging refers to the bridge or means of connecting integrated circuits and other components to a system-level substrate to form electronic products, and packaging includes the welding of integrated circuit pins. Existing integrated circuit packaging and testing devices cannot quickly and effectively detect the pins of integrated circuits, resulting in some pins with cold soldering or unstable soldering that cannot be detected, which has a certain impact on the later installation of integrated circuits. Therefore, it is necessary to design an integrated circuit packaging and testing device that can quickly and effectively detect the pins of integrated circuits.

[0003] The prior art discloses an integrated circuit packaging test device with a patent announcement number of CN219625268U. The above patent, through the setting of a turntable and a first gear, can make the clamping seat rotate out for easy placement when placing the integrated circuit, and then rotate the clamping seat with the integrated circuit to the bottom of the pin test board when needed. The rotation of the pin test board and the turntable is performed synchronously without the need for distributed operations, thereby improving the efficiency of use. However, there are still the following deficiencies in actual use: from a practical point of view, during the test process, the static electricity elimination effect is not good, and a large amount of static electricity accumulation may cause damage to the integrated circuit, thereby affecting the test results. Moreover, when placing the integrated circuit, the motor drives the lead screw to rotate, and then drives the clamping plate to clamp the integrated circuit, so that the clamping plate moves too quickly, which is easy to cause damage to the integrated circuit and affect the service life of the integrated circuit.

[0004] Therefore, there is a need for an anti-static integrated circuit packaging test device to solve the problems in the prior art of poor static elimination effect and too rapid movement of the clamping plate, which easily causes damage to the integrated circuit. Utility Model Content

[0005] The purpose of the utility model is to provide an anti-static integrated circuit packaging test device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an anti-static integrated circuit packaging test device, comprising a test bench, a turntable, a support plate, a pin test board, a placement mechanism, an integrated circuit board, an anti-static device and a support leg, wherein the turntable is rotatably connected to the upper middle part of the test bench, the support plate is fixedly connected to the upper rear side of the test bench, the pin test board is arranged below the horizontal plate of the support plate, the placement mechanism is arranged above the turntable, the integrated circuit board is installed inside the placement mechanism, the anti-static device is arranged on one side of the placement mechanism, and the support legs are symmetrically fixedly connected to the bottom of the test bench.

[0007] The anti-static device consists of an electrostatic wire, a guide sleeve, a grounding block, a grounding plate and a third spring. The guide sleeve is fixedly connected to the lower side of the support leg, and the end of the electrostatic wire passes through the guide sleeve and extends into the interior of the guide sleeve.

[0008] It should be noted in the solution that the electrostatic conductor passes through the test bench through an insulating sleeve, and both the insulating sleeve and the guide sleeve are made of insulating rubber.

[0009] It is further worth noting that the grounding block is slidably connected to the inside of the guide sleeve, and the top of the grounding block is connected to the end of the guide sleeve, and the grounding plate is fixedly connected to the bottom of the grounding block.

[0010] It should be further explained that the third spring is fixedly connected between the grounding plate and the bottom surface of the guide sleeve, and the third spring is sleeved on the outside of the grounding block.

[0011] As a preferred embodiment, the placement mechanism consists of a placement frame, a base plate, a positioning block, a push-pull plate, a first spring, a second spring and a placement plate. The placement frame is fixedly connected to the top of the turntable, the base plate is arranged inside the placement frame, the positioning block is symmetrically slidably connected to both sides of the placement frame, and the push-pull plate is fixedly connected to one end of the positioning block away from the inside of the placement frame.

[0012] As a preferred implementation, the first spring is fixedly connected between the push-pull plate and the outer surface of the placement frame, and is symmetrically arranged along the positioning block.

[0013] As a preferred embodiment, a rectangular groove is formed on the top surface of the bottom plate, the placement plate slides inside the rectangular groove, and a second spring is fixedly connected between the placement plate and the bottom surface of the rectangular groove.

[0014] As a preferred implementation, the head end of the electrostatic wire passes through the placement frame and is connected to the bottom plate.

[0015] Compared with the prior art, the anti-static integrated circuit packaging test device provided by the utility model has at least the following beneficial effects:

[0016] (1) The anti-static device can be used to conduct static electricity inside the bottom plate, so that the charged particles are conducted to the ground, thereby preventing static electricity from damaging the integrated circuit board, improving the safety performance of the device, and ensuring the accuracy of the test results.

[0017] (2) The integrated circuit board is placed on the top of the base plate through the placement mechanism, and then fixed by the positioning block. After the test is completed, the positioning block is pulled to release the fixation of the integrated circuit board, and then it is ejected by the second spring, so that the integrated circuit board is disassembled and the test efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 It is a front view structural schematic diagram of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the anti-static device of the utility model;

[0021] Figure 4 It is a schematic diagram of the internal structure of the placement frame of the utility model.

[0022] In the figure: 1. test bench; 2. turntable; 3. support plate; 4. pin test board; 5. placement mechanism; 6. integrated circuit board; 7. anti-static device; 8. support leg; 501. placement frame; 502. bottom plate; 503. positioning block; 504. push-pull plate; 505. first spring; 506. second spring; 507. placement plate; 701. electrostatic wire; 702. guide sleeve; 703. grounding block; 704. grounding plate; 705. third spring. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the embodiments.

[0024] See also Figure 1-4 The utility model provides an anti-static integrated circuit packaging test device, including a test table 1, a turntable 2, a support plate 3, a pin test board 4, a placement mechanism 5, an integrated circuit board 6, an anti-static device 7 and a support leg 8. The turntable 2 is rotatably connected to the upper middle part of the test table 1, the support plate 3 is fixedly connected to the upper rear side of the test table 1, the pin test board 4 is arranged below the horizontal plate of the support plate 3, the placement mechanism 5 is arranged above the turntable 2, the integrated circuit board 6 is installed inside the placement mechanism 5, the anti-static device 7 is arranged on one side of the placement mechanism 5, and the support leg 8 is symmetrically fixedly connected to the bottom of the test table 1.

[0025] The anti-static device 7 consists of an electrostatic wire 701, a guide sleeve 702, a grounding block 703, a grounding plate 704 and a third spring 705. The guide sleeve 702 is fixedly connected to the lower side of the support leg 8, and the end of the electrostatic wire 701 passes through the guide sleeve 702 and extends into the interior of the guide sleeve 702.

[0026] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth to explain in detail that the electrostatic conductor 701 passes through the test bench 1 through the insulating sleeve, and the insulating sleeve and the guide sleeve 702 are both made of insulating rubber.

[0027] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth explaining in detail that the grounding block 703 is slidably connected to the inside of the guide sleeve 702, and the top of the grounding block 703 is connected to the end of the guide sleeve 702, and the grounding plate 704 is fixedly connected to the bottom of the grounding block 703.

[0028] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth to explain in detail that the third spring 705 is fixedly connected between the grounding plate 704 and the bottom surface of the guide sleeve 702, and the third spring 705 is sleeved on the outside of the grounding block 703;

[0029] By providing the third spring 705, the grounding plate 704 can contact the ground at various heights, thereby increasing the use range of the device.

[0030] According to the above working process, it can be known that: through the anti-static device 7, the static electricity inside the bottom plate 502 can be diverted, so that the charged particles are conducted to the ground, preventing static electricity from occurring and damaging the integrated circuit board 6, thereby improving the safety performance of the device and ensuring the accuracy of the test results.

[0031] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth specifically explaining that the placement mechanism 5 is composed of a placement frame 501, a base plate 502, a positioning block 503, a push-pull plate 504, a first spring 505, a second spring 506 and a placement plate 507. The placement frame 501 is fixedly connected to the top of the turntable 2, the base plate 502 is arranged inside the placement frame 501, the positioning block 503 is symmetrically slidably connected to both sides of the placement frame 501, and the push-pull plate 504 is fixedly connected to the end of the positioning block 503 away from the inside of the placement frame 501.

[0032] Further as Figure 1 , Figure 2 and Figure 3As shown, it is worth to explain in detail that the first spring 505 is fixedly connected between the push-pull plate 504 and the outer surface of the placement frame 501, and is symmetrically arranged along the positioning block 503, the top surface of the bottom plate 502 is provided with a rectangular groove, the placement plate 507 slides inside the rectangular groove, and the second spring 506 is fixedly connected between the placement plate 507 and the bottom surface of the rectangular groove;

[0033] When the test is completed, the second spring 506 is used to elastically drive the placement plate 507 to move upward, and the integrated circuit board 6 is ejected, so that the staff can take away the integrated circuit board 6 .

[0034] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth to explain in detail that the head end of the electrostatic wire 701 passes through the placement frame 501 and is connected to the bottom plate 502;

[0035] When the integrated circuit board 6 is placed on the bottom plate 502 , the charged particles are conducted to the electrostatic conductor 701 through the bottom plate 502 , and then the charged particles are conducted to the ground through the electrostatic conductor 701 , thereby preventing static electricity from occurring.

[0036] This solution has the following working process: when in use, the integrated circuit board 6 is placed inside the placement frame 501, and is placed above the placement plate 507 by squeezing the second spring 506, and then the integrated circuit board 6 is limited and fixed by the positioning block 503, and then the integrated circuit board 6 is tested by moving the pin test board 4 downward, and at the same time, the charged particles are conducted to the grounding block 703 through the electrostatic wire 701, and then conducted to the ground through the grounding plate 704, so as to prevent static electricity and ensure the safety of the integrated circuit board 6; after the test is completed, the push-pull plate 504 is pulled outward to drive the positioning block 503 to move, release the fixation of the integrated circuit board 6, and through the elastic action of the second spring 506 at the bottom, drive the placement plate 507 to reset, and eject the integrated circuit board 6 above, so as to facilitate the removal of the integrated circuit board 6 after the test.

[0037] In summary: through the anti-static device 7, the static electricity inside the base plate 502 can be diverted, and the charged particles can be conducted to the ground, so as to prevent static electricity from occurring and damaging the integrated circuit board 6, thereby improving the safety performance of the device and ensuring the accuracy of the test results; through the placement mechanism 5, the integrated circuit board 6 is placed above the base plate 502, and then fixed by the positioning block 503. After the test is completed, the positioning block 503 is pulled to release the fixation of the integrated circuit board 6, and then it is ejected by the second spring 506, so that the integrated circuit board 6 is disassembled, thereby improving the test efficiency.

Claims

1. An anti-static integrated circuit packaging test device, comprising a test table (1), a turntable (2), a support plate (3), a pin test board (4), a placement mechanism (5), an integrated circuit board (6), an anti-static device (7) and a support leg (8), characterized in that: The turntable (2) is rotatably connected to the upper middle part of the test bench (1), the support plate (3) is fixedly connected to the upper rear side of the test bench (1), the pin test board (4) is arranged below the horizontal plate of the support plate (3), the placement mechanism (5) is arranged above the turntable (2), the integrated circuit board (6) is installed inside the placement mechanism (5), the anti-static device (7) is arranged on one side of the placement mechanism (5), and the support legs (8) are symmetrically fixedly connected to the bottom of the test bench (1); The anti-static device (7) is composed of an electrostatic wire (701), a guide sleeve (702), a grounding block (703), a grounding plate (704) and a third spring (705). The guide sleeve (702) is fixedly connected to the lower side of the support leg (8), and the end of the electrostatic wire (701) passes through the guide sleeve (702) and extends into the interior of the guide sleeve (702).

2. The anti-static integrated circuit packaging test device according to claim 1, characterized in that: The electrostatic conductor (701) passes through the test bench (1) via an insulating sleeve, and both the insulating sleeve and the guide sleeve (702) are made of insulating rubber.

3. The anti-static integrated circuit packaging test device according to claim 1, characterized in that: The grounding block (703) is slidably connected to the inside of the guide sleeve (702), and the top end of the grounding block (703) is connected to the end of the guide sleeve (702), and the grounding plate (704) is fixedly connected to the bottom of the grounding block (703).

4. The anti-static integrated circuit packaging test device according to claim 1, characterized in that: The third spring (705) is fixedly connected between the grounding plate (704) and the bottom surface of the guide sleeve (702), and the third spring (705) is sleeved on the outside of the grounding block (703).

5. The anti-static integrated circuit packaging test device according to claim 1, characterized in that: The placing mechanism (5) is composed of a placing frame (501), a bottom plate (502), a positioning block (503), a push-pull plate (504), a first spring (505), a second spring (506) and a placing plate (507); the placing frame (501) is fixedly connected to the top of the rotating disk (2); the bottom plate (502) is arranged inside the placing frame (501); the positioning block (503) is symmetrically slidably connected to both sides of the placing frame (501); and the push-pull plate (504) is fixedly connected to one end of the positioning block (503) away from the inside of the placing frame (501).

6. The anti-static integrated circuit packaging test device according to claim 5, characterized in that: The first spring (505) is fixedly connected between the push-pull plate (504) and the outer surface of the placement frame (501), and is symmetrically arranged along the positioning block (503).

7. The anti-static integrated circuit packaging and testing device according to claim 5, characterized in that: A rectangular groove is formed on the top surface of the bottom plate (502), the placement plate (507) slides inside the rectangular groove, and a second spring (506) is fixedly connected between the placement plate (507) and the bottom surface of the rectangular groove.

8. The anti-static integrated circuit packaging test device according to claim 5, characterized in that: The head end of the electrostatic wire (701) passes through the placement frame (501) and is connected to the bottom plate (502).

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