Backlight module capable of preventing EMI (Electro-Magnetic Interference) shielding film from being reversely pasted
By setting anti-stup notch at the top corner of the black aluminum foil of the EMI shielding film and adding an insulating layer and thermal conductivity layer on the FPC, the problem of EMI shielding film is solved, short circuits and display abnormalities are avoided, and assembly stability is improved Heat dissipation effect.
Patent Information
- Application Number
- CN202420169474.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-23
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-01-23
AI Technical Summary
When assembling the TFT liquid crystal display module, the EMI shielding film is prone to be inverted, resulting in short circuits and abnormal display of black aluminum foil contacting components.
The black aluminum foil designed with rectangular EMI shielding film is set with anti-stup notch at a top corner, and the insulation layer is completely covered with the component area to ensure that the assembly staff can clearly check the drawings when applying, avoid backlash, and set up a supplement on the FPC. Strong plates and thermal conductive layers for improved heat dissipation and stability.
It effectively prevents the EMI shielding film from being inverted, avoids direct contact between black aluminum foil and components, avoids short circuits and display abnormalities, and improves the heat dissipation efficiency and stability of FPC.
Smart Images
Figure CN222354227U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a backlight module for preventing an EMI shielding film from being pasted in reverse. Background Art
[0002] The FPC of the TFT liquid crystal display module is bent to the iron frame on the back of the backlight module, and then the FPC is adhered to the lower surface of the iron frame with double-sided tape. In order to improve the anti-interference ability of the module, an EMI shielding film is usually pasted on the surface of the FPC components to prevent the components from being interfered with by the outside world. The structure of the EMI shielding film is generally black aluminum foil plus insulating PET film. Generally, the EMI shielding film adopts a rectangular design. Since the shape of the EMI shielding film remains unchanged after rotating 180°, it is difficult for the assembly staff to find assembly problems after checking the drawings. Therefore, the assembly staff is likely to rotate the EMI shielding film 180° and paste it on the surface of the FPC device area during operation. When the insulating PET film in the EMI shielding film is not centered on the black aluminum foil, it is easy to cause the black aluminum foil to directly contact the components and cause a short circuit, thereby causing display abnormalities. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to prevent the EMI shielding film from being pasted upside down during assembly.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] To solve the above technical problems, the utility model provides a backlight module that prevents EMI shielding film from being pasted upside down, which includes a lower frame, an FPC and a rectangular EMI shielding film, the FPC is bent to the lower surface of the lower frame, and a component area is arranged on the FPC; the rectangular EMI shielding film is attached to the lower surface of the FPC, the rectangular EMI shielding film includes a rectangular black aluminum foil and an insulating layer arranged on the upper surface of the black aluminum foil, the insulating layer completely covers the lower surface of the component area, the rectangular black aluminum foil is pasted to the lower surface of the lower frame and the FPC, and an anti-fool notch is arranged at one of the top corners of the rectangular black aluminum foil.
[0006] As a preferred implementation of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, the shape of the fool-proof notch is a triangle.
[0007] As a preferred embodiment of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, the FPC includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.
[0008] As a preferred embodiment of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, the FPC also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a thermal conductive layer in contact with the circuit layer and the metal heat dissipation layer.
[0009] As a preferred implementation of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
[0010] As a preferred implementation of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.
[0011] As a preferred implementation of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, two reinforcing plates staggered from each other are provided on both sides of the FPC.
[0012] As a preferred implementation of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, the widths of the two reinforcing plates are different.
[0013] As a preferred implementation of the backlight module for preventing the EMI shielding film from being pasted upside down provided by the utility model, the material of the reinforcement plate is FR4, PI or stainless steel.
[0014] As a preferred implementation of the backlight module for preventing the EMI shielding film from being reversed provided by the utility model, the outer surfaces of the two reinforcement plates are both provided with a surface treatment layer for improving the surface roughness.
[0015] The utility model has the following beneficial effects:
[0016] Since an anti-mistake notch is provided at one of the top corners of the rectangular black aluminum foil, that is, a notch is cut at the right angle of one end of the rectangular black aluminum foil, the assembly staff can clearly check whether it is pasted upside down when checking the drawings after pasting, which plays an anti-mistake effect and is also convenient for the assembly staff to operate, avoiding the black aluminum foil directly contacting the components and causing a short circuit, thereby avoiding display abnormalities. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 The utility model provides a structural schematic diagram of a backlight module for preventing an EMI shielding film from being pasted upside down.
[0019] Figure 2 for Figure 1 Schematic diagram of the decomposition structure.
[0020] Figure 3 for Figure 1 Bottom view of the medium rectangular EMI shielding film.
[0021] Figure 4 This is a schematic diagram of the structure of Example 2.
[0022] Figure 5 This is a schematic diagram of the structure of Example 3.
[0023] Description of Figure Numbers:
[0024] Lower frame 1; FPC 2; rectangular EMI shielding film 3; component area 4; black aluminum foil 31; insulating layer 32; fool-proof notch 33; substrate layer 21; circuit layer 22; metal heat dissipation layer 23; perforation 24; reinforcing plate 5. DETAILED DESCRIPTION
[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0027] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0028] The utility model provides a backlight module for preventing an EMI shielding film from being pasted upside down, comprising a lower frame, an FPC and a rectangular EMI shielding film, wherein the FPC is bent to the lower surface of the lower frame, and a component area is arranged on the FPC; the rectangular EMI shielding film is attached to the lower surface of the FPC, the rectangular EMI shielding film comprises a rectangular black aluminum foil and an insulating layer arranged on the upper surface of the black aluminum foil, the insulating layer completely covers the lower surface of the component area, the rectangular black aluminum foil is pasted to the lower frame and the lower surface of the FPC, and an anti-fool notch is arranged at one of the top corners of the rectangular black aluminum foil.
[0029] Since an anti-mistake notch is provided at one of the top corners of the rectangular black aluminum foil, that is, a notch is cut at the right angle of one end of the rectangular black aluminum foil, the assembly staff can clearly check whether it is pasted upside down when checking the drawings after pasting, which plays an anti-mistake effect and is also convenient for the assembly staff to operate, avoiding the black aluminum foil directly contacting the components and causing a short circuit, thereby avoiding display abnormalities.
[0030] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0031] Example 1
[0032] See also Figures 1 to 3, a backlight module for preventing EMI shielding film from being pasted upside down provided by the utility model, comprises a lower frame 1, an FPC2 and a rectangular EMI shielding film 3, the FPC2 is bent to the lower surface of the lower frame 1, and a component area 4 is arranged on the FPC2; the rectangular EMI shielding film 3 is attached to the lower surface of the FPC2, the rectangular EMI shielding film 3 comprises a rectangular black aluminum foil 31 and an insulating layer 32 arranged on the upper surface of the black aluminum foil 31, the insulating layer 32 completely covers the lower surface of the component area 4, the rectangular black aluminum foil 31 is pasted to the lower surface of the lower frame 1 and the FPC2, and an anti-fool notch 33 is arranged at one of the top corners of the rectangular black aluminum foil 31. Since an anti-mistake notch 33 is provided at one of the top corners of the rectangular black aluminum foil 31, that is, a notch is cut at the right angle of one end of the rectangular black aluminum foil 31, the assembly staff can clearly check whether it is pasted upside down when checking the drawings after pasting, which plays an anti-mistake effect and is also convenient for the assembly staff to operate, avoiding the black aluminum foil 31 directly contacting the components and causing a short circuit, thereby avoiding display abnormalities.
[0033] Furthermore, the fool-proof notch 33 is in the shape of a triangle.
[0034] Furthermore, the material of the insulating layer 32 is PET.
[0035] Example 2
[0036] See also Figure 4 As a further optimization scheme of Example 1, in this embodiment, the FPC2 includes a substrate layer 21, a circuit layer 22 arranged on the upper surface of the substrate layer 21, and a metal heat dissipation layer 23 arranged on the lower surface of the substrate layer 21. The arrangement method can be that the circuit layer 22 and the metal heat dissipation layer 23 are respectively attached to the substrate layer 21 by double-sided adhesive. Since the thickness of the substrate layer 21 is relatively thin, the heat on the FPC2 can be diffused to the metal heat dissipation layer 23 through the substrate layer 21. The metal heat dissipation layer 23 can effectively increase the heat dissipation area of the FPC2 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC2. The substrate layer 21 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 23 can be a copper foil layer.
[0037] Furthermore, the FPC2 further includes at least one through-hole 24 penetrating the substrate layer 21, the circuit layer 22 and the metal heat dissipation layer 23, and the inner wall of the through-hole 24 is provided with a heat-conducting layer in contact with the circuit layer 22 and the metal heat dissipation layer 23. By utilizing the good thermal conductivity of the through-hole 24, the circuit layer 22 and the metal heat dissipation layer 23 on both sides of the substrate layer 21 can be electrically connected, and a good thermal conductivity function can be exerted, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.
[0038] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 24. The heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 22 and is also in contact with the heat-conducting layer in the through hole 24, so that the circuit layer 22 and the metal heat dissipation layer 23 can be connected to the external heat-conducting structure through the through hole 24, so that the heat in the FPC 2 is diffused to the external heat-conducting structure through the heat conductor in the through hole 24, so as to further improve the heat dissipation efficiency of the FPC 2. Preferably, in order to enable the through hole 24 to be connected to the external heat-conducting structure, the through hole 24 is disposed at the edge of the FPC 2.
[0039] Furthermore, the metal heat dissipation layer 23 is a uniform heat dissipation structure, and its structure can be any one of a mesh structure, a strip structure, a wavy structure or a honeycomb structure. Through the uniform heat dissipation structure, the heat dissipation effect can be better improved.
[0040] Example 3
[0041] See also Figure 5 As a further optimization scheme of Example 1, in this embodiment, two reinforcing plates 5 are provided on both sides of FPC2 and are staggered with each other. In the traditional FPC2 design, reinforcing plates 5 are usually not provided or are provided at the same position and have the same width, resulting in the pressure applied being concentrated on the same straight line when plugging and unplugging FPC2, causing a slight break in the FPC2 line. The FPC2 provided by the utility model has two reinforcing plates 5 located on both sides of the connecting portion and staggered with each other. When the FPC2 is pulled out, the pressure exerted by the reinforcing plates 5 on both sides on the FPC2 is not on the same line segment, and the stress will not be concentrated on the same straight line when bending, thereby avoiding stress concentration and the problem of easy slight break in the line at the gold finger, thereby improving the product yield.
[0042] Furthermore, the two mutually staggered reinforcing plates 5 referred to in the utility model can be respectively arranged at two different positions; or the center point position can be the same, but the widths of the two reinforcing plates 5 are different. It is sufficient to make the stress of the two reinforcing plates 5 not be concentrated on the same straight line when they are bent, which can avoid stress concentration and the problem of easy micro-breakage of the line at the gold finger, thereby improving the product yield. In this embodiment, the reinforcing plates 5 include a first reinforcing plate and a second reinforcing plate, and the widths of each reinforcing plate 5 are different, and the center points thereof are on the same horizontal line, so that the edges of the reinforcing plates 5 are staggered and not concentrated on the same straight line.
[0043] Furthermore, the material of the reinforcing plate 5 is FR4, PI or stainless steel. In other embodiments, if the heat generated by the FPC 2 is relatively large, a heat dissipation material with better heat dissipation effect, such as an aluminum foil reinforcing plate 5 , may also be used.
[0044] Furthermore, the outer surfaces of the first reinforcing plate and the second reinforcing plate are both provided with a surface treatment layer for increasing the surface roughness, so as to increase the friction between the worker and the first reinforcing plate and the second reinforcing plate, so that the FPC2 is easy to pull out.
[0045] Furthermore, the surface treatment layer is provided with diamond knurling on the outer surfaces of the first reinforcement plate and the second reinforcement plate, so that the FPC2 can be pulled out more easily, reducing the risk of the FPC2 circuit being broken.
[0046] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0047] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A backlight module for preventing an EMI shielding film from being pasted upside down, characterized in that: It includes a lower frame, an FPC and a rectangular EMI shielding film, the FPC is bent to the lower surface of the lower frame, and a component area is arranged on the FPC; the rectangular EMI shielding film is attached to the lower surface of the FPC, the rectangular EMI shielding film includes a rectangular black aluminum foil and an insulating layer arranged on the upper surface of the black aluminum foil, the insulating layer completely covers the lower surface of the component area, the rectangular black aluminum foil is pasted to the lower frame and the lower surface of the FPC, and an anti-fool notch is arranged at one of the top corners of the rectangular black aluminum foil.
2. The backlight module for preventing the EMI shielding film from being reversed according to claim 1, characterized in that: The shape of the fool-proof notch is a triangle.
3. The backlight module for preventing the EMI shielding film from being reversed according to claim 1, characterized in that: The FPC includes a substrate layer, a circuit layer disposed on an upper surface of the substrate layer, and a metal heat dissipation layer disposed on a lower surface of the substrate layer.
4. The backlight module for preventing the EMI shielding film from being reversed according to claim 3, characterized in that: The FPC further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and an inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.
5. The backlight module for preventing the EMI shielding film from being reversed according to claim 4, characterized in that: A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
6. The backlight module for preventing the EMI shielding film from being pasted upside down according to claim 3, characterized in that: The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.
7. The backlight module for preventing the EMI shielding film from being reversed according to claim 1, characterized in that: Two reinforcing plates staggered with each other are arranged on both sides of the FPC.
8. The backlight module for preventing the EMI shielding film from being reversed according to claim 7, characterized in that: The widths of the two reinforcing plates are different.
9. The backlight module for preventing the EMI shielding film from being reversed according to claim 7, characterized in that: The reinforcement plate is made of FR4, PI or stainless steel.
10. The backlight module for preventing the EMI shielding film from being reversed according to claim 7, characterized in that: The outer surfaces of the two reinforcing plates are both provided with a surface treatment layer for improving the surface roughness.