Camera module heat dissipation structure

Abstract

The utility model provides a camera module heat dissipation structure, which comprises a heating element, a metal frame and a PCB (printed circuit board), a first end face of the metal frame is movably connected with the PCB, the heating element is overlapped with a second end face of the metal frame, the heating element is arranged along the edge of the PCB, and the first end face of the metal frame is movably connected with the PCB. The heat conduction and heat dissipation area is increased by adding the metal frame structure to the heating element of the camera module, and the congestion with other electronic components is reduced through the arrangement of the heating device, so that the heat dissipation is better carried out, the problems of rapid heat dissipation and cooling during the working of the module can be solved, and the working effect of the module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a heat dissipation structure of a camera module. Background Art

[0002] With the development of science and technology and people's pursuit of living standards, mobile terminals have added functions such as taking photos and recording videos in addition to the most basic communication functions. As people's requirements for such functions become increasingly stringent, the pixels of cameras are constantly increasing. The camera module is prone to heat up when working, especially the high-pixel module, which can reach a high temperature of 60°C after being lit for a few minutes. If the module works at high temperature for a long time, it is easy to accelerate the aging of the module material, shorten the service life of the module, and affect the overall optical performance of the module. The high temperature of related electronic components will cause them to automatically power off, causing the module to restart. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a camera module heat dissipation structure that can solve the problem of rapid heat dissipation and temperature reduction when the camera module itself is working, thereby improving the working effect of the module.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] The utility model provides a heat dissipation structure of a camera module, comprising a heating element, a metal frame, and a PCB board, wherein a first end face of the metal frame is movably connected to the PCB board, the heating element is fitted to a second end face of the metal frame, and the heating element is arranged along an edge of the PCB board, so that heat is conducted to the heating element, thereby efficiently dissipating heat and reducing instantaneous thermal shock of the heating element in the module.

[0006] In one embodiment, the metal frame is an iron frame or an aluminum alloy frame.

[0007] In one embodiment, the first end surface of the metal frame is fixed to the PCB board by snapping.

[0008] In one embodiment, the metal frame and the heating element are attached to each other via a heat-conducting layer, so that the instantaneous heat generated by the heating element can be conducted away more quickly.

[0009] In one embodiment, a groove portion is provided on the second end surface of the metal frame, and the groove portion corresponds to the position of the heating element. The heating element fits in the groove portion to reduce occupied space.

[0010] In one embodiment, a fitting portion is provided on the second end surface of the metal frame, the fitting portion corresponds to the position of the heating element, and the heating element is fitted on the fitting portion to facilitate processing and positioning.

[0011] In one embodiment, the metal frame may be provided with corrugated or grid-shaped patterns to expand the heat conduction area of ​​the metal frame.

[0012] In one embodiment, the metal frame is provided with a through hole penetrating the first end face and the second end face, the through hole is a circular or square straight through hole or a stepped hole, and the through hole is coated with a thermal conductive material, thereby increasing the heat conduction area on the metal frame and reducing the temperature caused by instantaneous heat generation.

[0013] The beneficial effects of the utility model are:

[0014] By adding a metal frame structure to the heating element of the camera module to increase the heat conduction and heat dissipation area, the area crowded with other electronic components is reduced, thereby better heat dissipation is achieved. The utility model can solve the problem of rapid heat dissipation and temperature reduction when the module itself is working, and improve the working effect of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 This is a top view of the heat dissipation structure of the camera module;

[0017] Figure 2 It is a schematic diagram of an embodiment of bonding a metal frame and a heating element;

[0018] Figure 3 Schematic diagram of another embodiment of bonding a metal frame to a heating element DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0020] It should be noted that in the description of the present invention, the terms "first end face" and "second end face" are only used to distinguish the description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated, or limiting their sequence. When an element is considered to be "connected" to another element, it may be directly connected to another element or there may be a central element at the same time, and it does not mean that it is the only implementation method.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0022] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] The utility model provides a camera module heat dissipation structure, which is used in scenarios where the camera module of a terminal device needs to dissipate heat. Figure 1 and Figure 2 The heat dissipation structure of the camera module includes a heating element 10, a metal frame 20, and a PCB board 30. The first end surface 21 of the metal frame is movably connected to the PCB board 30, and the heating element 10 is in contact with the second end surface 22 of the metal frame, so that the heat of the heating element 10 is conducted, the heat is efficiently dissipated, and the instantaneous thermal shock of the heat generated by the camera module is reduced. The heating element 10 is arranged along the edge of the PCB board 30, so that the heating element 10 can be more fully in contact with the outside world, reducing the crowding with other electronic components and the inability to dissipate heat well.

[0024] Here, the heating element can be understood as a component that generates heat when working and needs to be cooled, for example, a photosensitive chip, a boost IC, a voltage regulator IC and other electronic components.

[0025] In one embodiment, the metal frame 20 is an iron frame or an aluminum alloy frame, which can be used as a support for the heating element and can also conduct heat over a large area.

[0026] In one embodiment, the first end surface 21 of the metal frame is fixed to the PCB board 30 by snapping, so that it can be assembled flexibly and replaced when necessary.

[0027] In one embodiment, the contact surface of the metal frame 20 and the heating element 10 is bonded via a heat-conducting layer 23. The heat-conducting layer 23 is made of a heat-conducting material that absorbs or releases a large amount of heat but does not change or changes little in its own temperature, thereby accelerating the conduction of instantaneous heat generated by the heating element.

[0028] In this way, most of the heat generated by the heating element is absorbed and stored by the heat-conducting layer, and then transferred to the outside through the metal frame, which can maintain the temperature of the heating element at a low level or at a low level when the heating element is working.

[0029] See also Figure 2 In one embodiment, a groove portion 201 is provided on the second end surface 22 of the metal frame, and the groove portion 201 corresponds to the position of the heating element 10. The heating element 10 fits in the groove portion 201, so that heat can be dissipated without increasing the occupied space of the heating element 10, thereby ensuring that the overall thickness of the camera module does not increase.

[0030] See also Figure 3 In one embodiment, a fitting portion 202 is provided on the second end surface 22 of the metal frame, and the fitting portion 202 corresponds to the position of the heating element 10. The heating element 10 is fitted on the fitting portion 202 for easy processing and positioning.

[0031] See also Figure 2 and Figure 3 In one embodiment, the metal frame 20 may be provided with a corrugated or grid-shaped pattern to expand the heat conduction area of ​​the metal frame.

[0032] In one embodiment, a through hole 203 is provided on the metal frame 20, which passes through the first end face and the second end face. The through hole 203 is a circular or square straight through hole or a stepped hole. The through hole 203 is coated with a thermal conductive material, which can further increase the thermal conductive area, accelerate the overall heat transfer speed of the frame, and reduce the temperature caused by instantaneous heat generation.

[0033] As mentioned above, the utility model increases the heat conduction and heat dissipation area by adding a metal frame structure to the heating element of the camera module, reduces crowding with other electronic components, and thus performs better heat dissipation. The utility model can solve the problem of rapid heat dissipation and temperature reduction when the module itself is working, and improve the working effect of the module.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A camera module heat dissipation structure, characterized in that: The invention comprises a heating element, a metal frame and a PCB board. The first end surface of the metal frame is movably connected with the PCB board, the heating element is fitted with the second end surface of the metal frame, and the heating element is arranged along the edge of the PCB board.

2. The camera module heat dissipation structure according to claim 1, characterized in that: The metal frame is an iron frame or an aluminum alloy frame.

3. The camera module heat dissipation structure according to claim 2, characterized in that: The first end surface of the metal frame is buckled and fixed to the PCB board.

4. The camera module heat dissipation structure according to claim 3, characterized in that: The metal frame and the heating element are bonded together via a heat-conducting layer.

5. The camera module heat dissipation structure according to claim 4, characterized in that: A groove portion is provided on the second end surface of the metal frame, and the groove portion corresponds to the position of the heating element.

6. The camera module heat dissipation structure according to claim 4, characterized in that: A fitting portion is disposed on the second end surface of the metal frame, and the fitting portion corresponds to the position of the heating element.

7. The camera module heat dissipation structure according to claim 5 or 6, characterized in that: The metal frame may be provided with a corrugated or grid-shaped pattern.

8. The camera module heat dissipation structure according to claim 7, characterized in that: The metal frame is provided with a through hole penetrating the first end surface and the second end surface.

9. The camera module heat dissipation structure according to claim 8, characterized in that: The through holes are coated with a thermally conductive material.

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