Wafer box feeding detection mechanism

Abstract

The utility model discloses a wafer box feeding detection mechanism, comprising a bottom plate used for bearing a wafer box and provided with a plurality of bottom plate through holes; the plurality of elastic detection assemblies are respectively mounted in the plurality of bottom plate through holes, the wafer box is pressed on the plurality of elastic detection assemblies, and the plurality of elastic detection assemblies are used for detecting whether the wafer box is stably placed on the bottom plate; wherein the elastic detection assembly comprises an elastic structure and a photoelectric switch, the photoelectric switch is located below the elastic structure, and an induction area of the photoelectric switch is arranged corresponding to the position of the lower end of the contact pin; through application of the wafer box feeding detection mechanism, the plurality of elastic detection assemblies are arranged and are divided into the first detection group and the second detection group so as to be compatible with the wafer boxes with different sizes, and the placement condition of the wafer boxes is judged through the plurality of elastic detection assemblies so as to ensure that the wafer boxes are placed in place.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer box loading detection mechanism. Background Art

[0002] In the field of semiconductor equipment technology, especially wafer loading mechanism, it is a widely used semiconductor manufacturing equipment. In wafer processing equipment, the wafer loading mechanism currently mainly uses the through-beam sensor to determine whether the wafer box is in place. Generally, it is determined whether the wafer box blocks the light path of the through-beam sensor to determine whether the wafer box is on the loading mechanism. However, if the wafer box is slightly tilted, it is easy to be disturbed during the transfer process, affecting the accuracy of the wafer box judgment. Utility Model Content

[0003] In view of this, in order to solve the above problems, the purpose of the utility model is to provide a wafer box loading detection mechanism, comprising:

[0004] A bottom plate, used for carrying the wafer box, the bottom plate is provided with a plurality of bottom plate through holes;

[0005] A plurality of elastic detection components, wherein the plurality of elastic detection components are respectively installed in the plurality of bottom plate through holes, the wafer box is pressed on the plurality of elastic detection components, and the plurality of elastic detection components are used to detect whether the wafer box is stably placed on the bottom plate;

[0006] Wherein, the elastic detection component comprises: an elastic structure and a photoelectric switch, wherein the photoelectric switch is located below the elastic structure, and the sensing area of ​​the photoelectric switch is arranged corresponding to the position of the lower end of the contact pin;

[0007] The elastic structure comprises: a contact pin, a spring, a spring cavity and a gland nut, the spring is sleeved on the outer wall of the contact pin, a limiting ring is arranged on the outer wall of the contact pin, the upper end of the spring is clamped against the lower end of the limiting ring, the spring is limited in the spring cavity by the gland nut, the contact pin moves in the spring cavity and the bottom plate through hole along the vertical direction through the spring, the upper end of each contact pin passes through a corresponding bottom plate through hole, and the lower end of the contact pin can be operably extended into the sensing area of ​​the photoelectric switch;

[0008] When the wafer box is placed on the bottom plate, the wafer box presses the contact pins and causes the contact pins to move downward under pressure, and the lower ends of the contact pins touch the sensing area of ​​the photoelectric switch and trigger a signal indicating that the wafer box is in place.

[0009] In another preferred embodiment, it further comprises: an elasticity detection component fixing block, which is used to fix the elasticity detection component on the bottom plate.

[0010] In another preferred embodiment, a limiting block is provided on the bottom plate for limiting the position of the wafer box, and the elastic detection component is arranged corresponding to the position of the limiting block.

[0011] In another preferred embodiment, the elasticity detection assembly includes: a first elasticity detection group and a second elasticity detection group, the first elasticity detection group is used for loading detection of a first-size wafer box, and the second elasticity detection group is used for loading detection of a second-size wafer box.

[0012] In another preferred embodiment, when the first-size wafer box is loaded and inspected, the contact pins of the second elastic inspection group are not affected by the pressure of the first-size wafer box, and the contact pins of the second elastic inspection group are lifted upward by the corresponding springs, and the lower ends of the contact pins do not touch the sensing area of ​​the photoelectric switch, thereby not triggering the arrival signal of the second-size wafer box;

[0013] During the loading inspection of the second-size wafer box, the contact pins of the first elastic detection group are not affected by the pressure of the second-size wafer box, and the contact pins of the first elastic detection group are lifted upward by the corresponding springs. The lower ends of the contact pins do not touch the sensing area of ​​the photoelectric switch, thereby failing to trigger the arrival signal of the first-size wafer box.

[0014] In another preferred embodiment, the first elastic detection group and the second elastic detection group located on the same bottom plate are arranged in pairs, and the first elastic detection group and the second elastic detection group located on the same bottom plate are arranged in pairs.

[0015] In another preferred embodiment, a diagonal distance between two of the first elasticity detection groups is smaller than a diagonal distance between two of the second elasticity detection groups.

[0016] In another preferred embodiment, the size of the first-sized wafer box is smaller than the size of the second-sized wafer box.

[0017] In another preferred embodiment, the first-size wafer box is used to carry 6-inch wafers, and the second-size wafer box is used to carry 8-inch wafers.

[0018] Due to the adoption of the above technical solution, the utility model has the following positive effects compared with the prior art:

[0019] (1) The utility model arranges an elastic detection component on the bottom plate of the wafer loading mechanism. When the wafer box is placed, the spring in the elastic structure is compressed by the weight of the wafer box body. When the wafer box is placed in close contact with the bottom plate, the lower end of the contact pin in the elastic mechanism moves downward, causing the lower end of the contact pin to touch the sensing area of ​​the photoelectric switch, triggering a wafer box in place signal, thereby realizing the wafer box in place judgment.

[0020] (2) The elastic detection component used by the utility model to determine whether the wafer box is in place is a reliable mechanical mechanism that will not be interfered with or blocked by human interference. In addition, multiple elastic detection components in the utility model jointly help to determine whether the wafer box is placed stably on the bottom plate, thereby improving the shortcoming that the through-beam sensor can only determine whether the wafer box is in place but cannot determine whether it is placed stably. This ensures the accuracy of the wafer transfer mechanism in taking and placing the wafer, and ensures that the wafer processing process can run completely.

[0021] (3) The utility model can arrange elastic detection components on the same bottom plate of the loading mechanism according to the size of the wafer box, is compatible with wafer boxes of different sizes, and optimizes the wafer loading mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an overall schematic diagram of a first embodiment of a wafer box loading detection mechanism of the utility model;

[0023] Figure 2 It is an overall schematic diagram of a second embodiment of a wafer box loading detection mechanism of the utility model;

[0024] Figure 3 This is a bottom view of a wafer box loading detection mechanism of the utility model;

[0025] Figure 4 It is a schematic diagram of an elastic detection component of a wafer box loading detection mechanism of the utility model;

[0026] Figure 5 It is a cross-sectional view of an elastic detection component of a wafer box feeding detection mechanism of the utility model.

[0027] In the attached drawings: 1. bottom plate; 2. bottom plate through hole; 3. elastic detection component; 4. photoelectric switch; 5. contact pin; 6. spring; 7. spring cavity; 8. gland nut; 9. limit ring; 10. elastic detection component fixing block; 11. limit block; 12. first size wafer box; 13. second size wafer box. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0029] like Figures 1 to 5As shown, a wafer box loading detection mechanism of a preferred embodiment is shown, comprising:

[0030] The bottom plate 1 is used to carry the wafer box, and the bottom plate 1 is provided with a plurality of bottom plate 1 through holes;

[0031] A plurality of elastic detection components 3, the plurality of elastic detection components 3 are respectively installed in the plurality of through holes of the bottom plate 1, the wafer box is pressed on the plurality of elastic detection components 3, and the plurality of elastic detection components 3 are used to detect whether the wafer box is stably placed on the bottom plate 1;

[0032] The elastic detection component 3 includes: an elastic structure and a photoelectric switch 4, the photoelectric switch 4 is located below the elastic structure, and the sensing area of ​​the photoelectric switch 4 is arranged corresponding to the position of the lower end of the contact pin 5;

[0033] The elastic structure includes: a contact pin 5, a spring 6, a spring cavity 7 and a gland nut 8. The spring 6 is sleeved on the outer wall of the contact pin 5. A limiting ring 9 is provided on the outer wall of the contact pin 5. The upper end of the spring 6 is clamped against the lower end of the limiting ring 9. The spring 6 is limited in the spring cavity 7 by the gland nut 8. The contact pin 5 moves in the spring cavity 7 and the through hole of the bottom plate 1 in the vertical direction through the spring 6. The upper end of each contact pin 5 passes through a corresponding through hole of the bottom plate 1, and the lower end of the contact pin 5 can be operably extended into the sensing area of ​​the photoelectric switch 4.

[0034] When the wafer box is placed on the bottom plate 1 , the wafer box presses the contact pins 5 and causes the contact pins 5 to move downward under pressure, and the lower ends of the contact pins 5 touch the sensing area of ​​the photoelectric switch 4 and trigger a signal indicating that the wafer box is in place.

[0035] In actual use, when no wafer box is placed on the base plate 1, the contact pins 5 of the several elastic detection components 3 are not subjected to pressure, and the spring 6 lifts the contact pin 5 and positions it in the spring cavity 7. At this time, the lower end of the contact pin 5 will not block the sensing area of ​​the photoelectric switch 4, and the photoelectric switch 4 gives a signal that the wafer box is not in place. When a wafer box is placed on the base plate 1, the corresponding contact pins 5 of the several elastic detection components 3 are subjected to the pressure of the wafer box and then compress the spring 6. The lower end of the contact pin 5 moves downward in the vertical direction through the through hole of the base plate 1, and finally blocks the sensing area of ​​the photoelectric switch 4. The photoelectric switch 4 gives a signal that the wafer box is in place. When the photoelectric switch 4 of any elastic detection component 3 does not send a signal, it means that the wafer box is not in place.

[0036] Further, as a preferred embodiment, it further comprises: an elastic detection component fixing block 10, which is used to fix the elastic detection component 3 on the bottom plate 1. Further, the upper surface of the elastic detection component fixing block 10 is mounted on the lower surface of the bottom plate 1, and the lower surface of the elastic detection component fixing block 10 is mounted on the upper surface of the photoelectric switch 4, so that the elastic detection component 3 is installed through the elastic detection component fixing block 10.

[0037] Further, as a preferred embodiment, a limit block 11 is provided on the bottom plate 1 for limiting the wafer box, and the elastic detection component 3 is arranged corresponding to the position of the limit block 11. Further, the lower surfaces of the limit blocks 11 are all mounted on the upper surface of the bottom plate 1, and each elastic detection component 3 is arranged close to the inner edge of a corresponding limit block 11, and the limit blocks 11 are arranged in sequence along the circumference of the outer edge of the lower end of the wafer box, so as to limit and position the wafer box.

[0038] Further, as a preferred embodiment, the elasticity detection component 3 includes: a first elasticity detection group and a second elasticity detection group, the first elasticity detection group is used for loading detection of the first size wafer box 12, and the second elasticity detection group is used for loading detection of the second size wafer box 13.

[0039] Further, as a preferred embodiment, the first elasticity detection group at least includes: two elasticity detection components 3, and the two elasticity detection components 3 are arranged at opposite corners of a rectangle.

[0040] Further, as a preferred embodiment, the second elasticity detection group at least includes: two other elasticity detection components 3, and the two elasticity detection components 3 are arranged at opposite corners of another rectangle.

[0041] Further, as a preferred embodiment, the outer contour of the bottom of the first-size wafer box 12 is smaller than the outer contour of the bottom of the second-size wafer box 13 .

[0042] Further, as a preferred embodiment, when the first size wafer box 12 is loaded and inspected, the contact pins 5 of the second elastic detection group are not affected by the pressure of the first size wafer box 12, and the contact pins 5 of the second elastic detection group are lifted upward by the corresponding springs 6, and the lower ends of the contact pins 5 do not touch the sensing area of ​​the photoelectric switch 4, thereby not triggering the arrival signal of the second size wafer box 13;

[0043] When the second-size wafer box 13 is loaded and inspected, the contact pins 5 of the first elastic detection group are not affected by the pressure of the second-size wafer box 13. The contact pins 5 of the first elastic detection group are lifted upward by the corresponding springs 6, and the lower ends of the contact pins 5 do not touch the sensing area of ​​the photoelectric switch 4, thereby failing to trigger the arrival signal of the first-size wafer box 12. Furthermore, in actual use, when the first-size wafer box 12 is placed on the base plate 1, the pressure of the first-size wafer box 12 compresses the spring 6, and the upper ends of the contact pins 5 move downward in the vertical direction through the through-hole of the base plate 1, and finally block the sensing area of ​​the photoelectric switch 4. The photoelectric switch 4 gives a signal that the first-size wafer box 12 is in place. When any of the photoelectric switches 4 of the first elastic detection group does not send a signal, it means that the first-size wafer box 12 is not in place, and at this time the contact pins 5 of the second elastic detection group are not in place. The pins 5 are not subjected to pressure. When the second size wafer box 13 is placed on the base plate 1, the contact pins 5 of the second elastic detection group are subjected to the pressure of the second size wafer box 13 and then compress the spring 6. The upper ends of the contact pins 5 move downward in the vertical direction through the through hole of the base plate 1, and finally block the sensing area of ​​the photoelectric switch 4. The photoelectric switch 4 gives a signal that the second size wafer box 13 is in place. When any photoelectric switch 4 of the second elastic detection group does not send a signal, it means that the second size wafer box 13 is not in place, and at this time, the contact pins 5 of the first elastic detection group are not subjected to pressure.

[0044] Further, as a preferred embodiment, the first elastic detection group and the second elastic detection group on the bottom plate 1 are both arranged in pairs, and the first elastic detection group and the second elastic detection group on the same bottom plate 1 are both arranged opposite to each other. Further, the first elastic detection group and the second elastic detection group each include at least two elastic detection components 3, and the two elastic detection components 3 of the first elastic detection group are located at opposite corners of a rectangle, and the other two elastic detection components 3 of the second elastic detection group are located at opposite corners of another rectangle, so as to be suitable for the first size wafer box 12 and the second size wafer box 13.

[0045] Further, as a preferred embodiment, the diagonal distance between the two first elastic detection groups is smaller than the diagonal distance between the two second elastic detection groups. Figure 3 As shown, the first elastic detection group includes two elastic detection components 3 located at the upper left corner and the lower right corner of the base plate 1, and the line connecting the contact pins 5 of the two elastic detection components 3 is preferably the diagonal distance of the first elastic detection group. The second elastic detection group includes two elastic detection components 3 located at the upper right corner and the lower left corner of the base plate 1, and the line connecting the contact pins 5 of the two elastic detection components 3 is preferably the diagonal distance of the second elastic detection group.

[0046] Further, as a preferred embodiment, the size of the first size wafer box 12 is smaller than the size of the second size wafer box 13. Further, when the first size wafer box 12 is placed on the bottom plate 1, the first size wafer box 12 is pressed on the contact pins 5 of the two first elastic detection components 3, so that the lower ends of the contact pins 5 of the first elastic detection components 3 extend into the sensing area of ​​the photoelectric switch 4 and send out corresponding signals, and when the second size wafer box 13 is placed on the bottom plate 1, the second size wafer box 13 is pressed on the contact pins 5 of the two second elastic detection components 3, so that the lower ends of the contact pins 5 of the second elastic detection components 3 extend into the sensing area of ​​the photoelectric switch 4 and send out corresponding signals.

[0047] Further, as a preferred embodiment, the first-size wafer box 12 is used to carry 6-inch wafers, and the second-size wafer box 13 is used to carry 8-inch wafers.

[0048] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer box loading detection mechanism, characterized in that: include: A bottom plate, used for carrying the wafer box, the bottom plate is provided with a plurality of bottom plate through holes; A plurality of elastic detection components, wherein the plurality of elastic detection components are respectively installed in the plurality of bottom plate through holes, the wafer box is pressed on the plurality of elastic detection components, and the plurality of elastic detection components are used to detect whether the wafer box is stably placed on the bottom plate; Wherein, the elastic detection component comprises: an elastic structure and a photoelectric switch, wherein the photoelectric switch is located below the elastic structure, and the sensing area of ​​the photoelectric switch is arranged corresponding to the position of the lower end of the contact pin; The elastic structure comprises: a contact pin, a spring, a spring cavity and a gland nut, the spring is sleeved on the outer wall of the contact pin, a limiting ring is arranged on the outer wall of the contact pin, the upper end of the spring is clamped against the lower end of the limiting ring, the spring is limited in the spring cavity by the gland nut, the contact pin moves in the spring cavity and the bottom plate through-hole along the vertical direction through the spring, the upper end of each contact pin passes through a corresponding bottom plate through-hole, and the lower end of the contact pin can be operably extended into the sensing area of ​​the photoelectric switch; When the wafer box is placed on the bottom plate, the wafer box presses the contact pins and causes the contact pins to move downward under pressure, and the lower ends of the contact pins touch the sensing area of ​​the photoelectric switch and trigger a signal indicating that the wafer box is in place.

2. The wafer box loading detection mechanism according to claim 1, characterized in that: Also includes: The elasticity detection component fixing block is used to fix the elasticity detection component on the bottom plate.

3. The wafer box loading detection mechanism according to claim 2, characterized in that: A limiting block is arranged on the bottom plate for limiting the wafer box, and the elastic detection component is arranged corresponding to the position of the limiting block.

4. The wafer box loading detection mechanism according to claim 1, characterized in that: The elasticity detection assembly includes: a first elasticity detection group and a second elasticity detection group, the first elasticity detection group is used for loading detection of a wafer box of a first size, and the second elasticity detection group is used for loading detection of a wafer box of a second size.

5. The wafer box loading detection mechanism according to claim 4, characterized in that: During the loading inspection of the first-size wafer box, the contact pins of the second elastic detection group are not affected by the pressure of the first-size wafer box, and the contact pins of the second elastic detection group are lifted upward by the corresponding springs, and the lower ends of the contact pins do not touch the sensing area of ​​the photoelectric switch, thereby not triggering the arrival signal of the second-size wafer box; During the loading inspection of the second-size wafer box, the contact pins of the first elastic detection group are not affected by the pressure of the second-size wafer box, and the contact pins of the first elastic detection group are lifted upward by the corresponding springs. The lower ends of the contact pins do not touch the sensing area of ​​the photoelectric switch, thereby failing to trigger the arrival signal of the first-size wafer box.

6. The wafer box loading detection mechanism according to claim 5, characterized in that: The first elastic detection group and the second elastic detection group located on the same bottom plate are both arranged in pairs, and the first elastic detection group and the second elastic detection group located on the same bottom plate are both arranged in pairs.

7. The wafer box loading detection mechanism according to claim 6, characterized in that: A distance between diagonal lines connecting two of the first elasticity detection groups is smaller than a distance between diagonal lines connecting two of the second elasticity detection groups.

8. The wafer box loading detection mechanism according to claim 7, characterized in that: The size of the first-sized wafer box is smaller than the size of the second-sized wafer box.

9. The wafer box loading detection mechanism according to claim 8, characterized in that: The first-size wafer box is used to carry 6-inch wafers, and the second-size wafer box is used to carry 8-inch wafers.

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