Front opening type wafer conveying box

By designing the front-open wafer conveyor box with the shaped handling handle and wedge-shaped locking part, the problem of unreasonable handle design in the prior art is solved, the operation convenience and stability of the conveyor box are improved, and the operation is adapted to workers of different heights is adapted to operate , and reduces the risk of breakage of the conveyor box.

CN222355094UActive Publication Date: 2025-01-14BEIJING JINJINGTAI TECH CO LTD
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Patent Information

Application Number
CN202421101268.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-20
Publication Date
2025-01-14
Estimated Expiration
2034-05-20

AI Technical Summary

Technical Problem

The existing wafer conveyor box has unreasonable handle design during the handling process, making it difficult to adapt to the operations of workers of different heights, which increases the handling risk.

Method used

A front-open wafer conveyor box is designed, using a shaped conveyor handle and a wedge-shaped locking part, combining a support assembly and a slot assembly, providing multiple grip and clamping parts to adapt to workers with different heights, and The stability and maximum bearing capacity of the conveyor box are improved through the switch structure and snap assembly.

Benefits of technology

Improve the operation convenience of porters, reduce the risk of wafer transfer box falling, adapt to the operation of workers of different heights, and increase the bearing capacity of the top flange through the design of wedge-shaped locking part and slot assembly, and reduce the load-bearing capacity of the top flange and reduce the The risk of breakage of the conveyor box is extended and the service life is extended.

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Abstract

The utility model relates to the technical field of wafer accommodation or transportation, in particular to a front open type wafer conveying box. The front opening type wafer conveying box comprises a conveying box body, a top flange, a carrying handle, a door frame, a door plate and a supporting assembly. A first opening is formed in one side of the conveying box body; the top flange comprises a clamping part, a supporting part and a locking part, and the locking part is clamped to the top of the conveying box body through a clamping groove assembly; and the carrying handles are connected to the side face of the conveying box body in a clamped mode, the carrying handles are arranged to be in a U shape, the opening direction of the carrying handles is the same as the opening direction of the first opening, the number of the carrying handles is two, and the two carrying handles are symmetrically arranged on the two sides of the conveying box body. Through the arrangement of the front open type wafer conveying box, the carrying handle of the wafer conveying box is arranged to be in the shape of the U, the upper portion and the lower portion of the carrying handle can be used for grabbing, and workers of different heights can carry the wafer conveniently.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer accommodation or transportation, and particularly relates to a front-opening wafer transfer box. Background Art

[0002] In the production and manufacturing process of existing semiconductor wafers, multiple processes are required. In different processes, the wafers need to be transported to different devices, and various handling systems, in cooperation with wafer transfer boxes, also play an important role.

[0003] In different production processes, some involve handling, some involve storage, and some also involve cooling. During the handling process at the production site, since the wafers carried by the wafer transfer box are relatively valuable, a reasonable handling handle needs to be designed. Summary of the Utility Model

[0004] In order to optimize the above-mentioned existing wafer transfer box, the present application proposes a front-opening wafer transfer box for handling wafers by an aerial handling system, including:

[0005] A transfer box body, with a first opening provided on one side of the transfer box body;

[0006] Handling handles, which are arranged on both sides of the transfer box body. Each handling handle on one side includes at least two holding parts, and at least two of the holding parts are arranged parallel to each other at intervals outside the transfer box body, vertically;

[0007] A door frame, which is arranged on the first opening;

[0008] A door panel, which is locked or unlocked with the door frame through a switch structure;

[0009] A support assembly, which is arranged inside the transfer box body for supporting the wafers.

[0010] Specifically, in the above-mentioned front-opening wafer transfer box, a top flange is further included. The top flange includes a clamping part, a supporting part, and a locking part. A gap is provided between the clamping part and the locking part for the aerial handling system to clamp. The locking part is snap-connected to the top of the transfer box body through a slot component.

[0011] Furthermore, in the above-mentioned front-opening wafer transfer box, the handling handle is set in a "C" shape, and the two horizontally extending parts of the "C" shape structure form the holding parts; the handling handle is snap-connected to the side of the transfer box body, and the opening direction of the handling handle is the same as the opening direction of the first opening; there are two handling handles, and the two handling handles are symmetrically arranged on both sides of the transfer box body.

[0012] Furthermore, in the above-mentioned front-opening wafer transport box, a protruding buckle assembly is provided on the side of the transport box body for clamping the carrying handle.

[0013] Furthermore, in the above-mentioned front-opening wafer transfer box, three protruding snap-fit ​​assemblies are provided for snapping into three sides constituting the carrying handle.

[0014] Furthermore, in the above-mentioned front-opening wafer conveying box, the locking part is symmetrically arranged on both sides of the clamping part, and the locking part is a wedge-shaped block structure as a whole. The locking part is provided with a protrusion at its first end close to the first opening, and the thickness of the locking part gradually increases from the first end to the second end away from the protrusion.

[0015] Furthermore, in the above-mentioned front-opening wafer conveying box, the clamping part and the locking part are connected through the supporting part, and the clamping part extends along the circumference of the supporting part in a direction away from the center of the supporting part; the clamping part is fixedly connected to the top of the conveying box body.

[0016] Furthermore, in the above-mentioned front-opening wafer transport box, the slot assembly matches the locking portion, and the slot assembly includes three slots, and gaps are provided between the three slots and the transport box body for matching the locking portion.

[0017] Furthermore, in the above-mentioned front-opening wafer conveying box, the support portion is provided with a second opening on its first side close to the first opening, and the support portion moves along the direction from the second side away from the second opening to the first side to clamp the locking portion to the top of the conveying box body.

[0018] Furthermore, in the above-mentioned front-opening wafer transfer box, a plurality of groups of supporting grooves are arranged in the supporting assembly, and the supporting grooves are used to support the wafers.

[0019] One or more technical solutions provided by the utility model produce at least the following beneficial effects:

[0020] A front-opening wafer transfer box proposed in the present application includes: a transfer box body, a top flange, a handling handle, a door frame, a door panel, and a support assembly; a first opening is provided on one side of the transfer box body; the top flange includes a clamping portion, a support portion, and a locking portion, the clamping portion and the locking portion are connected by the support portion, a gap is provided between the clamping portion and the locking portion, and the gap is used for the overhead handling system to clamp, and the locking portion is snap-fitted to the top of the transfer box body through a card slot assembly; a handling handle, which is snap-fitted to the side of the transfer box body, the handling handle is set in a "C" shape, the opening direction of the handling handle is the same as the opening direction of the first opening, and there are two handling handles, and the two handling handles are symmetrically arranged on both sides of the transfer box body; the above-mentioned door frame is arranged on the first opening; the above-mentioned door panel and the above-mentioned door frame are locked or unlocked through a switch structure; the above-mentioned support assembly is arranged inside the transfer box body for supporting the wafer. Through the setting of the above front-opening wafer transfer box, the handle of the wafer transfer box is set in a "C" shape, which can be used for grasping both up and down, facilitating handling by workers of different heights. Description of the Drawings

[0021] In the following description of the exemplary embodiments with reference to the drawings, more details, features, and advantages of the present application are disclosed. In the drawings:

[0022] Figure 1 It is a schematic diagram of the overall structure of a front-opening wafer transfer box according to an embodiment of the present application;

[0023] Figure 2 It is another schematic diagram of the overall structure of a front-opening wafer transfer box according to an embodiment of the present application;

[0024] Figure 3 It is a schematic diagram of the handling handle of a front-opening wafer transfer box according to an embodiment of the present application;

[0025] Figure 4 It is a side view schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application;

[0026] Figure 5 It is a schematic diagram of the top flange structure of a front-opening wafer transfer box according to an embodiment of the present application.

[0027] Description of the Reference Numerals:

[0028] 1 - Transfer box body; 11 - Card slot assembly; 12 - Protruding snap assembly; 13 - First opening; 2 - Top flange; 21 - Clamping portion; 22 - Support portion; 23 - Locking portion; 231 - Protrusion; 3 - Handling handle; 31 - Locking snap protrusion; 32 - Holding portion; 4 - Door frame; 5 - Door panel. Detailed Description of the Invention

[0029] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0030] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0031] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in this application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0032] It should be noted that the modifications of "one" and "plurality" mentioned in the present application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0033] The names of the messages or information exchanged between multiple devices in the embodiments of the present application are only used for illustrative purposes and are not used to limit the scope of these messages or information. Specific embodiments

[0034] The utility model relates to the technical field of wafer accommodation or transportation, and specifically to a front-opening wafer transfer box used for transporting wafers in an aerial transport system, comprising: a transfer box body 1, a top flange 2, a transport handle 3, a door frame 4, a door panel 5, and a support assembly.

[0035] Figure 1 This is a schematic diagram of the overall structure of a front-opening wafer transfer box according to an embodiment of the present application; Figure 2 This is another overall structural schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application; Figure 3 A top schematic diagram of a front-opening wafer transfer box according to an embodiment of the present application; Figure 4Schematic diagram of the top flange of a front-opening wafer transfer box according to an embodiment of the present application; Figure 5 Schematic structural diagram of the top flange of a front-opening wafer transfer box according to an embodiment of the present application.

[0036] As Figure 1-5 shown, a first opening 13 is provided on one side of the above-mentioned wafer transfer box body 1, the top flange 2 is arranged on the top of the wafer transfer box body 1, the handling handle 3 is clamped on the side of the above-mentioned transfer box body 1, and the door frame 4 is arranged on the first opening 13 of the above-mentioned transfer box body 1; a locking or unlocking is performed between the above-mentioned door panel 5 and the above-mentioned door frame 4 through a switching structure; the above-mentioned support assembly is arranged inside the above-mentioned transfer box body 1 for supporting the above-mentioned wafers.

[0037] Among them, the above-mentioned handling handle 3 is arranged on both sides of the above-mentioned transfer box body 1, and each side of the handling handle 3 includes at least two holding parts 32, and at least two of the above-mentioned holding parts 32 are arranged outside the above-mentioned transfer box body 1 at intervals in parallel up and down.

[0038] Furthermore, the above-mentioned handling handle 3 is arranged in a "C" shape, and the two horizontally extending parts of the "C" shape structure constitute the above-mentioned holding part 32; the above-mentioned handling handle 3 is clamped on the side of the above-mentioned transfer box body 1, and the opening direction of the above-mentioned handling handle 3 is the same as the opening direction of the above-mentioned first opening 13; there are two of the above-mentioned handling handles, and the two above-mentioned handling handles are symmetrically arranged on both sides of the above-mentioned transfer box body.

[0039] Through the setting of the above-mentioned front-opening wafer transfer box, compared with the existing L-shaped handling handle, for the handling handle arranged in a "C" shape, the handling worker can select a suitable着力点 on the holding part of the handling handle for handling, which is suitable for workers of different heights to operate, improves the convenience of the on-site worker operation, and reduces the risk of dropping during the manual handling of the wafer transfer box.

[0040] In some embodiments, in the above-mentioned front-opening wafer transfer box, the above-mentioned top flange 2 includes a clamping part 21, a supporting part 22 and a locking part 23. The above-mentioned clamping part 21 and the above-mentioned locking part 23 are connected through the above-mentioned supporting part 22. The above-mentioned clamping part 21 extends along the circumferential direction of the above-mentioned supporting part 22 away from the center of the above-mentioned supporting part 22. A gap is provided between the clamping part 21 and the locking part 23, and the above-mentioned gap is used for the above-mentioned aerial handling system to clamp, and the above-mentioned locking part 23 is clamped on the top of the above-mentioned transfer box body 1 through a slot component 11.

[0041] In some embodiments, in the front-opening wafer pod, a protruding buckle assembly 12 is provided on the side of the pod body 1 for clamping the transport handle 3. There are three protruding buckle assemblies 12 for clamping the three sides of the transport handle 3, and locking buckle protrusions 31 are provided on the three sides. Through the provision of the protruding buckle assembly 12, the transport handle 3 can be conveniently fixed to the side of the wafer pod, and can also be conveniently removed when it needs to be removed.

[0042] In some embodiments, in the front-opening wafer pod, the locking parts 23 are symmetrically arranged on both sides of the clamping part 21, and the locking parts 23 are wedge-shaped block structures as a whole. The locking parts 23 are provided with a protrusion at the first end close to the first opening, and the thickness of the locking parts 23 gradually increases from the first end to the second end away from the protrusion. The support part 22 is provided with a second opening at the first side close to the first opening, and the support part 22 moves along the direction from the second side away from the second opening to the first side to clamp the locking parts 23 to the top of the pod body 1. Through the symmetrically arranged locking parts, the clamping force of the aerial handling system is dispersed to the two locking parts, and through the setting of the wedge-shaped block structure, the maximum bearing capacity threshold of the top flange is increased, the risk of the top flange breaking is reduced, and the service life of the pod is increased. Among them, the slot assembly 11 matches the locking part 23, and the slot assembly 11 includes three slots, and a gap is provided between the three slots and the pod body 1 for matching the locking part. A gap is provided between the three slots and the transmission box body 1 for accommodating the locking portion when the top flange is clamped to the top of the transmission box body.

[0043] In some embodiments, in the front-opening wafer pod, the support assembly is provided with a plurality of support grooves, and the plurality of support grooves are used to support the wafers. The support assembly (not marked in the figure) is provided inside the wafer pod.

[0044] The above descriptions are only some embodiments of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solutions formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above disclosed concepts. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

[0045] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A front-opening wafer transfer box, used for transporting wafers in an aerial transport system, characterized in that: Comprising: A transfer box body, with a first opening provided on one side of the transfer box body; Carrying handles, which are arranged on both sides of the transfer box body. Each side's carrying handle includes at least two gripping parts, and at least two of the gripping parts are arranged outside the transfer box body, spaced parallel to each other vertically; A door frame, which is arranged on the first opening; A door panel, and the door panel and the door frame are locked or unlocked through a switch structure; A support component, which is arranged inside the transfer box body and is used to support the wafer.

2. The front-opening wafer transfer box according to claim 1, characterized in that: It further includes a top flange. The top flange includes a clamping part, a support part and a locking part. There is a gap between the clamping part and the locking part, and the gap is used for the overhead handling system to clamp. The locking part is snap-connected to the top of the transfer box body through a slot component.

3. The front-opening wafer transfer box according to claim 2, characterized in that: The carrying handle is set in a "C" shape, and the two horizontally extending parts of the "C" shape structure form the gripping part; the carrying handle is snap-connected to the side of the transfer box body, and the opening direction of the carrying handle is the same as the opening direction of the first opening; there are two carrying handles, and the two carrying handles are symmetrically arranged on both sides of the transfer box body.

4. The front-opening wafer transfer box according to claim 3, characterized in that: A raised snap component is arranged on the side of the transfer box body for snap-connecting the carrying handle.

5. The front-opening wafer transfer box according to claim 4, characterized in that: There are three raised snap components, which are used to snap-connect the three sides that make up the carrying handle.

6. The front-opening wafer transfer box according to claim 5, characterized in that: The locking parts are symmetrically arranged on both sides of the clamping part. The locking part is a wedge-shaped block structure as a whole. The locking part is provided with a protrusion at its first end close to the first opening, and the thickness of the locking part gradually increases from the first end to the second end away from the protrusion.

7. The front-opening wafer transfer box according to claim 6, characterized in that: The clamping part and the locking part are connected through the support part. The clamping part extends along the circumferential direction of the support part in a direction away from the center of the support part; the clamping part is fixedly connected to the top of the transfer box body.

8. The front-opening wafer transfer box according to claim 7, characterized in that: The slot component matches the locking part. The slot component includes three slots, and there is a gap between the three slots and the transfer box body for matching the locking part.

9. The front-opening wafer transfer box according to claim 8, characterized in that: The support part is provided with a second opening on its first side close to the first opening. The support part moves along the direction from the second side away from the second opening to the first side to snap the locking part onto the top of the transfer box body.

10. The front-opening wafer transfer box according to any one of claims 1 to 9, characterized in that: The support component includes multiple groups of support grooves, and the support grooves are used to support the wafer.