Packaging device, packaging assembly and electronic equipment

Abstract

The utility model provides a packaging device, a packaging assembly and electronic equipment, and the packaging device comprises a substrate, a first electronic device disposed on the bottom surface of the substrate, a first packaging body which is disposed on the bottom surface of the substrate and packages the first electronic device, at least one pin disposed in the first packaging body in a penetrating manner, and a solder body. At least part of the pin is exposed relative to the bottom surface of the first packaging body, and the bottom surface of the first packaging body is the surface, deviating from the substrate, of the first packaging body. Wherein the area, corresponding to the pin, in the bottom surface of the first packaging body is provided with a groove, and the wall surface of the groove is fixedly covered with a first bonding pad; the part, protruding out of the wall face of the groove, of the pin is wrapped in the first bonding pad, and the solder body is welded to the first bonding pad. According to the packaging device provided by the invention, the welding area of the welding flux body is effectively increased, the welding reliability of the packaging device and the circuit board is improved, and the electrical connection stability between the packaging device and the circuit board is further improved.

Description

Technical Field

[0001] The present application relates to the field of packaging technology, and in particular to a packaging device, a packaging assembly and an electronic device. Background Art

[0002] In recent years, electronic devices have been developed towards being smaller, lighter and more compact. In order to improve the performance of electronic devices and reduce the size of electronic devices, the packaging technology of electronic devices has been continuously improved. Multiple electronic devices are packaged together to form a packaged device using packaging technology, and then the packaged device is installed on a circuit board (for example, the motherboard of an electronic device). With the development of packaging technology, the density of electronic devices such as chips or devices per unit volume in packaged devices continues to increase, and the integration of packaged devices continues to increase.

[0003] As an important component of electronic equipment, the packaged device usually includes a substrate, a plurality of electronic devices mounted on the substrate, and a package body that packages all the electronic devices in the substrate. Pins are provided on the substrate through pads, and the pins pass through the corresponding package body and are soldered to the circuit board through a solder body (e.g., a tin block), so that some electronic devices in the packaged device can communicate and connect with the electronic devices on the circuit board through the substrate and the pins. In some special scenarios, pins can also be provided on some electronic devices in the packaged device through pads, and the pins pass through the corresponding package body and are soldered to the circuit board through a solder body, so that these electronic devices in the packaged device can communicate and connect directly with the electronic devices on the circuit board through the pins. Among them, the reliability of the welding between the packaged device and the circuit board is a key factor in ensuring the stability of the electrical connection between the two.

[0004] However, in order to improve the integration of electronic devices in the packaged device, it is necessary to reduce the spacing between adjacent pads in the packaged device, thereby limiting the size of the pins soldered on the pads, so as to prevent the pin size from being too large, which will cause the pad size to become larger, causing the adjacent pads to have a contact short circuit under the condition of small spacing, affecting the electrical connection. In addition, in the existing packaged device, the end face of the pin away from the substrate is flush with the surface of the package body away from the substrate, and is soldered to the circuit board through the solder body. However, the pins of the packaged device and the solder body are only soldered by the end face contact of the pins (especially, when the pins are made of metal wires, the end face diameter of the metal wire is generally about 50μm, and the contact mode between the pins and the solder body can be understood as point contact), the contact area is small, and the material bonding between the package body and the solder body is poor, which easily causes the pins of the packaged device to break at the solder body welding point, resulting in poor reliability of the welding between the packaged device and the circuit board.

[0005] It can be seen that in the prior art, when the pins in the packaged device are soldered to the circuit board through the solder body, the contact area between the pins and the solder body is small, and the material bonding between the package body and the solder body is poor, resulting in poor reliability of welding the packaged device and the circuit board, and further making the electrical connection stability between the packaged device and the circuit board low. Utility Model Content

[0006] The present application provides a packaging device, a packaging assembly and an electronic device, which solves the problem in the prior art that when the pins in the packaging device are soldered to the circuit board through the solder body, the contact area between the pins and the solder body is small, the material bonding between the packaging body and the solder body is poor, resulting in poor reliability of welding the packaging device to the circuit board, and further low stability of the electrical connection between the packaging device and the circuit board.

[0007] In a first aspect, an embodiment of the present application provides a packaged device, comprising a substrate, at least one first electronic device, a first package body, and at least one pin. The substrate has a top surface and a bottom surface disposed opposite to each other. The first electronic device is disposed on the bottom surface of the substrate. The first package body is disposed on the bottom surface of the substrate, and the first electronic device is packaged in the first package body. The pin is disposed in the first package body, and at least a portion of the pin is exposed relative to the bottom surface of the first package body, and the bottom surface of the first package body is the surface of the first package body facing away from the substrate.

[0008] Among them, the area corresponding to the pin in the bottom surface of the first package body is recessed inward to form a groove, the wall of the groove is fixedly covered with a first solder pad, one end of the pin protrudes from the wall of the groove, and the part of the pin protruding from the wall of the groove is wrapped in the first solder pad; the packaging device also includes a solder body, which is welded to the first solder pad.

[0009] In the packaged device of the present application, the pin is arranged in the first package body and partially exposed relative to the bottom surface of the first package body. The area corresponding to the pin is provided with an inwardly recessed groove on the bottom surface of the first package body, and the wall surface of the groove is fixedly covered with a first pad. Among them, the pin protrudes from the wall surface of the groove, and the part of the pin protruding from the wall surface of the groove is wrapped in the first pad. Or it can be understood that a groove is provided around the part of the pin exposed relative to the bottom surface of the first package body, the groove is covered with a first pad, and the exposed part of the pin is wrapped by the first pad. The solder body in the packaged device is welded to the first pad in the groove, and the solder body is welded to the circuit board. Or it can be understood that the first pad is welded and fixed to the circuit board through the solder body. When the packaged device is welded to the circuit board through the solder body, the pin is welded and electrically connected to the solder body through the first pad, and then welded and electrically connected to the circuit board. Thus, by adopting the above structure, at least one first electronic device on the packaged device can be electrically connected to at least one electronic device on the circuit board through the pin, the first pad, and the solder body. Compared with the method in the prior art in which the solder body is only welded to the end face of the pin away from the substrate, the present application sets a groove around the portion of the pin exposed relative to the bottom surface of the first package body, and covers the groove with a first solder pad, and the portion of the pin protruding from the wall of the groove is wrapped in the first solder pad, and the pin is welded to the solder body through the first solder pad.

[0010] Among them, the first pad has a strong material bonding with the first package body, and the first pad will react chemically with the solder body when being welded to it, thereby improving the welding firmness of the first pad and the solder body, and making the connection between the first package body, the pin, the first pad and the solder body more firmly. In addition, the surface of the first pad and the solder body is larger than the outer surface of the part of the pin exposed relative to the bottom surface of the first package body, which effectively increases the welding area of ​​the solder body in the packaged device, thereby enhancing the connection reliability of the packaged device when being welded to the circuit board through the solder body, and improving the electrical connection stability between the packaged device and the circuit board. Further, the first pad is covered in the groove and the solder body is partially filled in the groove, which increases the position constraint on the solder body, and further increases the welding area of ​​the solder body and the first pad in the packaged device, thereby enhancing the connection reliability of the packaged device when being welded to the circuit board through the solder body, and improving the electrical connection stability between the packaged device and the circuit board.

[0011] Therefore, when the packaging device provided in the embodiment of the present application is soldered to the circuit board through the solder body, the welding area between the solder body and the first pad in the packaging device is effectively increased, and the position of the solder body is constrained, thereby enhancing the reliability of the welding between the packaging device and the circuit board, and improving the electrical connection stability between the packaging device and the circuit board. It solves the problem in the prior art that when the pins in the packaging device are soldered to the circuit board through the solder body, the contact area between the pins and the solder body is small, the material bonding between the packaging body and the solder body is poor, resulting in poor reliability of the welding between the packaging device and the circuit board, and further low electrical connection stability between the packaging device and the circuit board.

[0012] In some embodiments, the wall of the groove includes a bottom surface and a side surface connected to the outer edge of the bottom surface. The first pad includes a first portion and a second portion, the first portion covers the entire bottom surface of the groove, and the second portion surrounds and connects to the outer periphery of the first portion and covers the side surface of the groove.

[0013] The pin protrudes from the bottom surface of the groove, and the part of the pin protruding from the wall of the groove is wrapped in the first part of the first pad, and the solder body fills the space surrounded by the first part and the second part. Through such a design, the first pad covers the entire bottom surface, side surface and outer surface of the exposed part of the pin of the groove, further increasing the position constraint of the solder body, and increasing the welding area between the solder body and the first pad in the packaged device, thereby enhancing the connection reliability of the packaged device when being welded to the circuit board through the solder body, and improving the electrical connection stability between the packaged device and the circuit board.

[0014] In some embodiments, the area of ​​the first part corresponding to the pin protrudes in a direction away from the substrate relative to other areas, and a protrusion is formed, and part of the pin is wrapped in the protrusion. Through such a design, the welding area of ​​the solder body is increased, thereby enhancing the connection reliability when the packaged device is welded to the circuit board through the solder body, and improving the electrical connection stability between the packaged device and the circuit board.

[0015] In some embodiments, the second portion covers the entire side of the groove;

[0016] The side surface of the groove is inclined relative to the thickness direction of the substrate, and the notch of the groove is larger than the bottom surface of the groove. Through such a design, the second part covers the entire side surface of the groove, and the bottom surface and the side surface of the groove are inclined, and the first part and the second part of the first pad arranged in the groove are also inclined accordingly. The welding area of ​​the solder body and the first pad in the packaged device is further increased, and the connection reliability when the packaged device is welded to the circuit board through the solder body is enhanced. In addition, the shape of the groove is easy to process, saving production costs.

[0017] In some embodiments, the second portion of the first pad is configured as an integral structure with the first portion, which facilitates processing.

[0018] In some embodiments, the first pad includes a plating structure, which includes a seed layer, a substrate layer, and a protective layer stacked in sequence, wherein the seed layer contacts the bottom surface of the first package body, and the protective layer contacts the solder body.

[0019] Through such a design, the seed layer on one side of the substrate layer is used to increase the bonding strength between the first pad and the first package body, and the protective layer on the other side of the substrate layer prevents the first pad from being oxidized during the preparation of the packaged device. While enhancing the bonding strength between the first pad and the first package body, the first pad's anti-oxidation ability is also enhanced, thereby increasing the connection reliability between the first pad and the first package body and the stability of the first pad itself, thereby improving the connection reliability when the packaged device is soldered to the circuit board through the solder body.

[0020] In some embodiments, the first pad includes a plating structure, the plating structure includes a seed layer and a substrate layer stacked in sequence, the seed layer contacts the bottom surface of the first package body, and the substrate layer contacts the solder body.

[0021] Through such a design, the solder body in contact with the base material layer has the effect of preventing the surface of the first pad from being oxidized, thereby eliminating the processing of the first pad protection layer and reducing the production cost.

[0022] In some possible embodiments, the first pad is plated on the wall surface of the groove and the outer surface of the pin. This method is simple to process and has low manufacturing cost.

[0023] In some embodiments, at least one second pad is disposed on the bottom surface of the substrate, and the second pad is connected to the other end of the pin.

[0024] In some embodiments, one end of the plurality of pins is wrapped in the first pad, and the second pad is connected to the other end of the plurality of pins. With the above solution, one end of the plurality of pins shares the first pad, and the other end shares the second pad. By providing a plurality of pins on each pad, the heat dissipation performance and efficiency of the packaged device are enhanced while ensuring the stability of the electrical connection.

[0025] In some embodiments, at least one third pad is provided on the surface of the first electronic device away from the substrate, and the third pad is connected to the other end of the pin. With such a design, the first electronic device is directly connected to the pin through the third pad, and then connected to the first pad through the pin, thereby realizing electrical connection between the first electronic device and the electronic device on the circuit board. The transmission path of the electrical signal is shortened, and the reliability of the electrical signal transmission is improved.

[0026] In some embodiments, one end of the plurality of pins is wrapped in the first pad, and the third pad is connected to the other end of the plurality of pins. With the above solution, one end of the plurality of pins shares the first pad, and the other end shares the third pad. By providing a plurality of pins on each pad, the heat dissipation performance and efficiency of the packaged device are enhanced while ensuring the stability of the electrical connection.

[0027] In some embodiments, the pins are configured as metal wires. With the above solution, the linear pins are smaller in size, so that the pads for soldering the pins can be smaller in size, which can effectively prevent short circuits between different pads at small spacings, thereby affecting electrical connection.

[0028] In some embodiments, the packaged device further includes a second electronic device and a second package body, wherein the second electronic device is disposed on the top surface of the substrate; the second package body is disposed on the top surface of the substrate, and the second electronic device is packaged in the second package body.

[0029] With this design, the top surface of the substrate is provided with a second electronic device encapsulated in a second encapsulation body. The double-sided encapsulation of the encapsulated device allows more electronic devices to be arranged per unit area of ​​the substrate, thereby improving the integration of the encapsulated device and facilitating miniaturization and compactness of the electronic device.

[0030] In some embodiments, the first pad is made of metal and the first package body is made of insulating plastic material, which can effectively avoid contact short circuit and improve the stability and reliability of electrical connection.

[0031] In some possible embodiments, at least one electronic device among all the electronic devices disposed on the substrate is electrically connected to the electronic device on the circuit board through the substrate.

[0032] In some possible embodiments, the plurality of electronic devices include at least one chip and at least one discrete device.

[0033] In some possible embodiments, the at least one discrete device includes one or more of the following: a capacitor, a resistor, a filter, a power supply component, and a storage component.

[0034] It should be noted that the solder body mentioned in the packaged device of the first aspect may not be a part of the packaged device, and it and the packaged device are two relatively independent components. Or it can be understood that when the packaged device leaves the factory, the first pad is not welded with the solder body, that is, the first pad is exposed. When the packaged device is welded to the circuit board, the first pad of the packaged device is welded to the circuit board through the solder body.

[0035] Based on this, an embodiment of the present application provides a packaged device, including a substrate, at least one first electronic device, a first package body and at least one pin. The substrate has a top surface and a bottom surface arranged opposite to each other. The first electronic device is arranged on the bottom surface of the substrate. The first package body is arranged on the bottom surface of the substrate, and the first electronic device is packaged in the first package body. The pin is inserted into the first package body, and at least part of the pin is exposed relative to the bottom surface of the first package body, and the bottom surface of the first package body is the surface of the first package body facing away from the substrate.

[0036] Among them, the area corresponding to the pin in the bottom surface of the first package body is recessed inward to form a groove, the wall of the groove is fixedly covered with a first solder pad, one end of the pin protrudes from the wall of the groove, and the part of the pin protruding from the wall of the groove is wrapped in the first solder pad, and the first solder pad is used for soldering with the solder body.

[0037] Among them, the effect of this technical solution is similar to the effect produced by the packaging device of the first aspect mentioned above, and will not be explained in detail here.

[0038] In a second aspect, an embodiment of the present application further provides a packaging assembly, comprising a circuit board and a packaging device provided by any of the above embodiments, wherein the packaging device is soldered to the circuit board through a solder body. The connection reliability when the packaging device and the circuit board are soldered in the packaging assembly is enhanced, thereby improving the electrical connection stability between the packaging device and the circuit board in the packaging assembly.

[0039] In a third aspect, an embodiment of the present application further provides an electronic device, comprising a packaging assembly provided by any of the above embodiments. The use of the packaging assembly provided by any of the above embodiments in the electronic device of the present application can solve the problem in the prior art that when the pins in the packaging device are soldered to the circuit board through the solder body, the contact area between the pins and the solder body is small, the material bonding between the packaging body and the solder body is poor, resulting in poor reliability of welding between the packaging device and the circuit board, and thus low stability of the electrical connection between the packaging device and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the structure in which the packaged device in the package assembly of the first solution is welded to the circuit board through the solder body, wherein only the substrate in the packaged device is welded to the circuit board through the pins;

[0041] Figure 2 The schematic diagram of the structure of the packaging component of the second solution is that the packaging component is welded to the circuit board through the solder body, wherein the substrate and the electronic components in the packaging component are welded to the circuit board through the pins;

[0042] Figure 3 It is a schematic cross-sectional structural diagram of an electronic device according to an embodiment of the present application;

[0043] Figure 4 This is a schematic diagram of the structure of the packaging assembly of an embodiment of the present application;

[0044] Figure 5 for Figure 4 A partial enlarged view of part A;

[0045] Figure 6 for Figure 4 Schematic diagram of the cross-sectional structure in the middle BB direction;

[0046] Figure 7 This is a schematic diagram of the enlarged structure of the area where the pins are located in the packaging component of the embodiment of the present application, wherein the pins are columnar structures;

[0047] Figure 8 This is a schematic diagram of the structure when the wall surface of the groove in the packaging device of the embodiment of the present application only includes the side surface;

[0048] Fig. 9 This is a schematic diagram of a structure in which the wall surface of the groove in the packaging device of an embodiment of the present application includes a bottom surface and a side surface, wherein the bottom surface and the side surface of the groove are not perpendicular to each other;

[0049] Fig.10 This is a schematic diagram of the plating structure of the first pad in the packaged device according to an embodiment of the present application, wherein the first pad includes a protective layer;

[0050] Fig.11 This is a schematic diagram of the plating structure of the first pad in the packaged device according to an embodiment of the present application, wherein the first pad does not include a protective layer;

[0051] Fig.12 It is a structural schematic diagram of another implementation of the packaging component of the embodiment of the present application, wherein a plurality of pins share a first pad and a second pad;

[0052] Fig.13 for Fig.12 A partial enlarged view of part C in the middle;

[0053] Fig.14 for Fig.12 Schematic diagram of the cross-sectional structure in the middle DD direction;

[0054] Fig.15 It is a structural schematic diagram of another implementation of the packaging assembly of the embodiment of the present application, wherein pins are provided on the bottom surface of the substrate and the first electronic device on the bottom surface of the substrate;

[0055] FIG. 16A to FIG. 16I This is a schematic diagram of the preparation process of the packaged device according to an embodiment of the present application.

[0056] Description of reference numerals:

[0057] The first option

[0058] 2', packaged device; 3', substrate; 4', electronic device; 6', pin; 10', circuit board; 11', solder body;

[0059] Second option

[0060] 2”, packaged device; 4”, electronic device; 6”, pin; 10”, circuit board; 11”, solder body;

[0061] This application:

[0062] 100. Electronic equipment;

[0063] 101. Display screen;

[0064] 102, housing; 103, back cover; 104, middle frame; 105, bottom plate; 106, outer frame;

[0065] 1. Package assembly; 10. Circuit board; 10A. Electronic device; 11. Solder body;

[0066] 2. Packaging devices;

[0067] 3. substrate; 31. bottom surface; 32. top surface;

[0068] 4. Electronic device; 40. Chip; 40A. First chip; 40B. Second chip; 41. Discrete device; 42. First electronic device; 43. Second electronic device;

[0069] 51, first package; 53, groove; 54, wall; 55, bottom; 56, side; 57, second package;

[0070] 6. Pins;

[0071] 71, first pad; 71A, seed layer; 71B, substrate layer; 71C, protective layer; 72, first portion; 73, second portion; 75, second pad; 76, third pad;

[0072] X, thickness direction of substrate; Y, length direction of substrate. DETAILED DESCRIPTION

[0073] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may extend based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0074] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0075] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0076] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0077] In the description of the present application, it should be understood that "electrical connection" in the present application can be understood as physical contact and electrical conduction between components; it can also be understood as a form in which different components in a circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals.

[0078] In the description of the present application, it should be noted that the mutual perpendicularity in the present application is not absolute perpendicularity, and the approximate perpendicularity caused by processing errors and assembly errors (for example, the angle between the two structural features is 89.9°) is also within the scope of the mutual perpendicularity in the present application. The mutual parallelism in the present application is also not absolute parallelism, and the approximate parallelism caused by processing errors and assembly errors (for example, the angle between the two structural features is 0.1°) is also within the scope of the mutual parallelism in the present application. The present application does not make specific limitations on this.

[0079] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0080] At present, electronic devices are developing towards smaller, lighter and more compact. In order to improve the performance of electronic devices and reduce the size of electronic devices, the packaging technology of electronic devices is constantly improving. Multiple electronic devices are packaged together to form a packaged device using packaging technology, and then the packaged device is installed on a circuit board (for example, the motherboard of an electronic device). With the development of packaging technology, the density of electronic devices such as chips or devices per unit volume in the packaged device is constantly increasing, and the integration of the packaged device is constantly improving. The following is a detailed description with reference to the accompanying drawings.

[0081] See also Figure 1 and Figure 2 , Figure 1 It is a schematic diagram of the structure in which the packaged device in the package assembly of the first solution is welded to the circuit board through the solder body, wherein only the substrate in the packaged device is welded to the circuit board through the pins; Figure 2 This is a schematic diagram of the structure in which the packaged device in the package assembly of the second solution is welded to the circuit board through a solder body, wherein the substrate and the electronic device in the packaged device are welded to the circuit board through pins.

[0082] like Figure 1 As shown, the package device 2' is an important component of the electronic device, which generally includes a substrate 3', a plurality of electronic devices 4' mounted on the substrate 3', and a package body that packages all the electronic devices 4' in the substrate 3'. The substrate 3' is provided with pins 6' through pads, and the pins 6' pass through the corresponding package body and are soldered to the circuit board 10' through a solder body 11' (for example, a tin block), so that some electronic devices 4' in the package device 2' are connected to the electronic devices (not shown in the figure) on the circuit board 10' through the substrate 3' and the pins 6'. In some special scenarios, such as Figure 2 As shown, some electronic devices (e.g., Figure 2The electronic devices 4" on the bottom surface of the middle substrate 3" may also be provided with pins 6" through pads. The pins 6" pass through the corresponding package body and are soldered to the circuit board 10" through the solder body 11", so that the electronic devices 4" in the package device 2" can be directly communicated with the electronic devices on the circuit board 10" through the pins 6". Among them, the reliability of the soldering between the package device and the circuit board is a key factor in ensuring the stability of the electrical connection between the two.

[0083] However, in order to improve the integration of electronic devices in the packaged device, it is necessary to reduce the spacing between adjacent pads in the packaged device, thereby limiting the size of the pins soldered on the pads, so as to prevent the pin size from being too large, which will cause the pad size to become larger, so that the adjacent pads will have a contact short circuit under the condition of small spacing, affecting the electrical connection. In addition, in the existing packaged device, the end face of the pin away from the substrate is flush with the surface of the package body away from the substrate, and is soldered to the circuit board through the solder body. However, the pins of the packaged device and the solder body are only soldered by the end face contact of the pins (especially, in the case where the pins are metal wires, the end face diameter of the metal wire is generally about 50μm, and the contact mode between the pins and the solder body can be understood as point contact), the contact area is small, and the material bonding between the package body and the solder body is poor, which easily causes the pins of the packaged device to break at the solder body welding point, resulting in poor reliability of the welding between the packaged device and the circuit board, and thus the electrical connection stability between the packaged device and the circuit board is low.

[0084] Based on this, the present application provides a packaging device, which effectively increases the welding area of ​​the solder body in the packaging device, improves the reliability of the welding between the packaging device and the circuit board, and further improves the stability of the electrical connection between the packaging device and the circuit board. It solves the problem in the prior art that when the pins in the packaging device are soldered to the circuit board through the solder body, the contact area between the pins and the solder body is small, the material bonding between the packaging body and the solder body is poor, resulting in poor reliability of welding between the packaging device and the circuit board, and further low stability of the electrical connection between the packaging device and the circuit board.

[0085] The present application also provides a packaging component and an electronic device, which uses the above-mentioned packaging device. It should be noted that the electronic device can be, but is not limited to, a display, a notebook computer, a tablet computer, a personal digital assistant (PDA), a personal computer (PC), a smart phone, a smart wearable device, and a vehicle-mounted device, which does not limit the scope of protection of the present application. The following uses a mobile phone as an example to illustrate the application scenario of the packaging device.

[0086] See also Figure 3 to Figure 4 , Figure 3 It is a schematic cross-sectional structural diagram of an electronic device according to an embodiment of the present application; Figure 4 This is a schematic diagram of the structure of the packaging component of an embodiment of the present application.

[0087] like Figure 3 As shown, the electronic device 100 includes a housing 102 and a display screen 101 installed in the housing 102 . The housing 102 protects the electronic device 100 and supports the entire device. A receiving space is formed inside the housing for accommodating electronic devices inside the electronic device 100 .

[0088] It will be understood by those skilled in the art that the specific structure of the housing 102 is not limited. In one embodiment, the housing 102 includes a middle frame 104 and a back cover 103, the middle frame 104 includes a bottom plate 105 and an outer frame 106 arranged around and connected to the outer peripheral side of the bottom plate 105, and in the thickness direction X of the electronic device 100, the display screen 101 and the back cover 103 are respectively installed at both ends of the outer frame 106, so that the display screen 101 and the back cover 103 are respectively located on both sides of the bottom plate 105. An installation cavity is formed between the back cover 103 and the bottom plate 105 for installing internal components such as a battery, a circuit board 10 (described in detail below), a camera, and an antenna. In one embodiment, the circuit board 10 is installed in the installation cavity between the back cover 103 and the bottom plate 105.

[0089] It will be appreciated by those skilled in the art that the bottom plate 105 is a support frame located inside the electronic device 100. The outer frame 106 is a structure surrounding the outer periphery of the electronic device 100. In some embodiments, the outer frame 106 may be a metal frame, which is made of metal materials such as copper, magnesium alloy, stainless steel, etc. In other embodiments, the outer frame 106 may also be a non-metal frame (i.e., an insulating frame), which includes a plastic frame, a glass frame, a ceramic frame, etc., and may also be a structure combining a metal frame and a non-metal frame.

[0090] It should be noted that the bottom plate 105 and the outer frame 106 can be a split structure or an integrated structure, which is not limited in the embodiments of the present application. When the bottom plate 105 and the outer frame 106 are split structures, the bottom plate 105 and the outer frame 106 are two different components of the housing 102, and the two can be assembled together by means of snap connection, buckling, etc., and the two can be separated when disassembly is required. When the bottom plate 105 and the outer frame 106 are an integrated structure, the connection relationship between the bottom plate 105 and the outer frame 106 cannot be separated, for example, the bottom plate 105 and the outer frame 106 are processed and made by an integrated molding method, or assembled by a permanent connection method such as welding, etc.

[0091] Among them, the back cover 103 is a structure arranged on the electronic device 100 opposite to the display screen 101, which is used to seal the electronic device 10A of the electronic device 100 inside the electronic device 100, and can also prevent dust, collision, and hardware scratches. The back cover 103 can be a back cover 103 made of a metal material (i.e., a metal back cover 103), or a back cover 103 made of a non-conductive material (i.e., a non-metal back cover 103), such as a glass back cover 103, a plastic back cover 103, etc. In some embodiments, the electronic device 100 may also not include a separately arranged back cover 103, but use the bottom plate 105 of the middle frame 104 as the back cover 103, and this application does not limit this. The above is a detailed introduction to the housing 102 of the electronic device 100, and other components will be described below.

[0092] like Figure 3 to Figure 4 As shown, the electronic device 100 further includes a packaging assembly 1, which is installed in the accommodation space of the housing 102. The packaging assembly 1 includes a circuit board 10 and a packaging device 2. The packaging device 2 is soldered to the circuit board 10 through a solder body 11. The circuit board 10 may also be provided with an electronic device 10A.

[0093] The packaged device 2 can be understood as a packaging structure that uses packaging technology to package multiple electronic devices 4 together. The packaged device 2 includes a substrate 3 and multiple electronic devices 4 arranged on the substrate 3, and at least two electronic devices 4 are electrically connected through the substrate 3. In addition, at least one electronic device 4 on the substrate 3 is electrically connected to the electronic device 10A on the circuit board 10 through the substrate 3 to achieve signal interaction between the two. It can be understood by those skilled in the art that some electronic devices on the substrate 3 (for example, the first chip 40A) may not be electrically connected to the electronic device 10A on the circuit board 10 through the substrate 3 (specifically described in detail below), and the present application does not limit this.

[0094] Among them, those skilled in the art can select the number and type of the electronic devices 10A and the packaged devices 2 on the circuit board 10 according to actual needs, and this application does not limit this. In some examples, any of the electronic devices 10A and the packaged devices 2 on the circuit board 10 can be an electronic module such as a charging management module, a power management module, a wireless communication module, an audio module, etc., and this application does not limit this.

[0095] It should be further explained that the circuit board 10, as a carrier for the electrical connection of the electronic device 10A, can be either the main board of the electronic device 100 or a sub-board. In one example, the circuit board 10 is the main board of the electronic device 100. The size of the circuit board 10 and its position in the electronic device 100 are not limited. The figure is only for illustration and does not limit the scope of the embodiments of the present application. In one example, the circuit board 10 is mounted on the bottom plate 105 of the middle frame 104 and is located in the mounting cavity. Other introductions to the circuit board 10 will be expanded in detail below and will not be explained in detail here.

[0096] It should be noted that the types of the circuit board 10 and the substrate 3 in the package device 2 are not limited, for example, they can be PCB boards, aluminum substrates, copper substrates, single-sided boards, double-sided boards, etc. Exemplarily, the circuit board 10 and the substrate 3 in the package device 2 are both PCB boards.

[0097] Furthermore, the number and type of electronic devices 4 disposed on the substrate 3 in the packaged device 2 are not limited and can be selected according to actual needs. In one embodiment, the multiple electronic devices 4 on the substrate 3 may include two chips 40, namely a first chip 40A and a second chip 40B, the first chip 40A is disposed on the bottom surface 31 of the substrate 3, and the second chip 40B is disposed on the top surface 32 of the substrate 3. It should be noted that the number and type of chips 40 on the substrate 3 are not limited, and can also be one, three or more. The chips 40 can all be arranged on the top surface 32 or the bottom surface 31 of the substrate 3, and this application does not limit this.

[0098] Among them, the multiple electronic devices 4 on the substrate 3 may also include at least one discrete device 41, and the discrete device 41 includes one or more of the following: capacitors, resistors, filters, power supply components, and storage components. In one example, the discrete device 41 is only arranged on the top surface 32 of the substrate 3. In other examples, the discrete device 41 may also be only arranged on the bottom surface 31 of the substrate 3, or simultaneously arranged on the top surface 32 and the bottom surface 31 of the substrate 3. Those skilled in the art can design this according to actual needs.

[0099] It should be noted that the packaged device 2 may also be provided with only the chip 40 or only the discrete device 41, which is not limited in this application. The electronic device 4 in the packaged device 2 may also be provided with other types except the chip 40 and the discrete device 41, which is not limited in this application.

[0100] It should be noted that if Figure 4As shown, the solder body 11 can be a part of the package device 2, or it can be understood that the solder body 11 is prefabricated in the package device 2 before the package device 2 is welded to the circuit board 10. The solder body 11 may also exist independently without being a part of the package device 2, or it can be understood that the solder body 11 is not prefabricated in the package device 2 before the package device 2 is welded to the circuit board 10. This application does not limit this, and those skilled in the art can design this according to actual needs. In one example, the solder body 11 is a part of the package device 2.

[0101] In one embodiment, if Figure 3 As shown, the electronic device 100 further includes a processor (not shown in the figure), which is integrated on the circuit board 10. The processor can realize functions such as running an operating system, processing various data, running application programs, and controlling multiple hardware connected to the processor.

[0102] It should be noted that if Figure 4 As shown, the arrangement position of the electronic device 4 in the packaged device 2 on the substrate 3 is not limited. The electronic device 4 can be arranged only on one of the top surface 32 or the bottom surface 31 of the substrate 3, or the electronic device 4 can be arranged on both surfaces. Among them, the electronic device 4 arranged on the bottom surface 31 of the substrate 3 is a first electronic device 42, and the electronic device 4 arranged on the top surface 32 of the substrate 3 is a second electronic device 43. In one embodiment, the bottom surface 31 and the top surface 32 of the substrate 3 are both provided with electronic devices 4. In addition, the top surface 32 and the bottom surface 31 of the substrate 3 are arranged opposite to each other in the thickness direction X of the substrate 3, and the bottom surface 31 of the substrate 3 is located on the side close to the circuit board 10.

[0103] Furthermore, if Figure 4 As shown, the packaged device 2 also includes a first package body 51 and a second package body 57. The first package body 51 is arranged on the bottom surface 31 of the substrate 3, and all the first electronic devices 42 on the bottom surface 31 of the substrate 3 are packaged in the first package body 51. The second package body 57 is arranged on the top surface 32 of the substrate 3, and all the second electronic devices 43 on the top surface 32 of the substrate 3 are packaged in the second package body 57. Or it can be understood that the packaged device 2 is arranged as a double-sided packaging structure for packaging the electronic devices 4 on the top surface 32 and the bottom surface 31 of the substrate 3. The double-sided packaging method of the packaged device 2 allows more electronic devices 4 to be arranged per unit area of ​​the substrate 3, thereby improving the integration of the packaged device 2 and facilitating the miniaturization and compactness of the electronic device 100. In other alternative embodiments, the electronic devices 4 in the packaged device 2 are only arranged on the bottom surface 31 of the substrate 3, and only the first package body 51 is used to package all the first electronic devices 42 on the bottom surface 31 of the substrate 3.

[0104] It should be noted that the material of the first package body 51 is an insulating plastic material, and the material of the second package body 57 is also an insulating plastic material, which can effectively avoid contact short circuit and improve the stability and reliability of electrical connection. In addition, the insulating material used by the first package body 51 and the second package body 57 is not limited, and can be but not limited to insulating plastic material.

[0105] It should be further explained that the bottom surface of the first package body 51 may be flush with the surface of the first electronic device 42 farthest from the substrate 3, or may not be flush. Among them, the bottom surface of the first package body 51 is the surface of the first package body 51 facing away from the substrate 3. In one embodiment, the bottom surface of the first package body 51 is flush with the surface of the first electronic device 42 farthest from the substrate 3, and the size of the package device 2 in the thickness direction X of the substrate 3 is smaller, which is more conducive to the thinness of the electronic device 100. In one example, the surface of the first chip 40A away from the substrate 3 is flush with the bottom surface of the first package body 51. In another embodiment, the bottom surface of the first package body 51 is not flush with the surface of the first electronic device 42 farthest from the substrate 3, and the first package body 51 covers each surface of the first electronic device 42, thereby improving the aesthetics of the package device 2.

[0106] The structure of the electronic device and the functions of its components are described in detail above in conjunction with the accompanying drawings. The manner and specific structure of the fixed connection between the packaged device and the circuit board in the present application are described in detail below in conjunction with the accompanying drawings.

[0107] See also Figures 5 to 7 , Figure 5 for Figure 4 A partial enlarged view of part A and a schematic diagram of the exploded structure; Figure 6 for Figure 4 Schematic cross-sectional view in the middle BB direction; Figure 7 This is a schematic diagram of the enlarged structure of the area where the pins are located in the packaging component of an embodiment of the present application, wherein the pins are a columnar structure.

[0108] like Figure 4 and Figure 5As shown, the package device 2 further includes a pin 6, which is inserted into the first package body 51, and a portion of the pin 6 is exposed relative to the bottom surface of the first package body 51, and the bottom surface of the first package body 51 is the surface of the first package body 51 facing away from the substrate 3. The area corresponding to the pin 6 in the bottom surface of the first package body 51 is recessed inward to form a groove 53, and the wall surface 54 of the groove 53 is fixedly covered with a first pad 71, one end of the pin 6 protrudes from the wall surface 54 of the groove 53, and the portion of the pin 6 protruding from the wall surface 54 of the groove 53 is wrapped in the first pad 71. The package device 2 also includes a solder body 11, and the solder body 11 is welded to the first pad 71. Among them, at least a portion of the solder body 11 (for example, a portion or the entirety of the solder body 11) can be filled in the groove 53. The package device 2 is welded to the circuit board 10 through the solder body 11.

[0109] The bottom surface 31 of the substrate 3 has a second pad 75, and the second pad 75 is connected to the other end of the pin 6. The pin 6 is fixed to the substrate 3 via the second pad 75 (for example, fixed by welding), so that the pin 6 and the substrate 3 can be electrically connected. In other alternative embodiments, the pin 6 is not only provided on the bottom surface 31 of the substrate 3, but also on the surface of the first electronic device 42 away from the substrate 3, or it can be understood that the pin 6 is provided on both the bottom surface 31 of the substrate 3 and the first electronic device 42 on the bottom surface 31 of the substrate 3. Specifically, for example, the bottom surface 31 of the substrate 3 can be welded with the pin 6 via the second pad 75, and the surface of the first electronic device 42 away from the substrate 3 can be welded via the third pad 76 (see Fig.15 ) soldering pin 6, which is not limited in this application. This situation will not be described in detail here, and will be described in detail below. In order to facilitate the distinction between the pins 6, the pin 6 connected to the second pad 75 can be defined as the first pin, and the pin 6 connected to the third pad 76 can be defined as the second pin.

[0110] It should be noted that the pin 6 may extend in a straight line along the thickness direction X of the substrate 3 , or may be arranged obliquely or bent according to the connection requirements of the pin 6 , and the present application does not limit this.

[0111] It should be noted that if Figure 4As shown, the other end of the pin 6 in the packaged device 2 is electrically connected to the electronic device 4 (for example, the first electronic device 42 and / or the second electronic device 43) on the substrate 3 through the second pad 75, and one end is electrically connected to the electronic device 10A on the circuit board 10 through the corresponding first pad 71 and the solder body 11. The electronic device 4 (for example, the first electronic device 42 and / or the second electronic device 43) in the packaged device 2 is electrically connected to the electronic device 10A in the circuit board 10 in the following manner: the electrical signal generated by the electronic device 4 in the packaged device 2 is transmitted to the corresponding electronic device 10A on the circuit board 10 through the substrate 3, the second pad 75, the pin 6, the first pad 71, the solder body 11 and the circuit board 10 in sequence. Alternatively, the electrical signal generated by an electronic device 10A on the circuit board 10 is transmitted in sequence through the circuit board 10, the solder body 11, the first solder pad 71, the pin 6 and the second solder pad 75, and the substrate 3 to the corresponding electronic device 4 in the packaged device 2, thereby realizing communication between the electronic device 4 of the packaged device 2 and the corresponding electronic device 10A on the circuit board 10.

[0112] The first pad 71 and the second pad 75 should be configured as a conductive material, for example, a metal material, or a non-metal material such as graphite, silicon, conductive rubber, etc. Exemplarily, the first pad 71 and the second pad 75 are both made of a metal material, which has a high thermal conductivity and is conducive to transferring and diffusing the heat generated by the packaged electronic device 4 on the substrate 3, thereby enhancing the heat dissipation performance of the substrate 3.

[0113] like Figure 4 and Figure 5 As shown, compared with the method in the prior art in which the solder body 11 is only welded to the end face of the pin 6 away from the substrate 3, the present application sets a groove 53 around the portion of the pin 6 exposed relative to the bottom surface of the first package body 51, and the groove 53 is covered with a first solder pad 71, and the portion of the pin 6 protruding from the wall 54 of the groove 53 is wrapped in the first solder pad 71, and the pin 6 is welded to the solder body 11 through the first solder pad 71.

[0114] Among them, the first pad 71 has a strong material bonding with the first package body 51, and the first pad 71 will react chemically with the solder body 11 when being welded, thereby improving the welding firmness of the first pad 71 and the solder body 11, and making the connection between the first package body 51, the pin 6, the first pad 71 and the solder body 11 more firmly. In addition, the surface of the first pad 71 welded with the solder body 11 is larger than the outer surface of the portion of the pin 6 exposed relative to the bottom surface of the first package body 51, which effectively increases the welding area of ​​the solder body 11 in the package device 2, thereby enhancing the connection reliability of the package device 2 when being welded with the circuit board 10 through the solder body 11, and improving the electrical connection stability between the package device 2 and the circuit board 10. Furthermore, the first solder pad 71 is covered in the groove 53 and the solder body 11 is partially filled in the first solder pad 71, which increases the position constraint on the solder body 11 and further increases the welding area between the solder body 11 and the first solder pad 71 in the packaging device 2, thereby enhancing the connection reliability when the packaging device 2 is welded to the circuit board 10 through the solder body 11, and improving the electrical connection stability between the packaging device 2 and the circuit board 10.

[0115] Therefore, when the packaging device 2 provided in the embodiment of the present application is soldered to the circuit board 10 through the solder body 11, the welding area between the solder body 11 and the first solder pad 71 in the packaging device 2 is effectively increased, and the solder body 11 is positionally constrained, thereby enhancing the reliability of the welding between the packaging device 2 and the circuit board 10, and improving the electrical connection stability between the packaging device 2 and the circuit board 10. This solves the problem in the prior art that when the pin 6 in the packaging device 2 is soldered to the circuit board 10 through the solder body 11, the contact area between the pin 6 and the solder body 11 is small, and the material bonding between the packaging body and the solder body 11 is poor, resulting in poor reliability of the welding between the packaging device 2 and the circuit board 10, and further causing low electrical connection stability between the packaging device 2 and the circuit board 10.

[0116] It should be noted that the structure of the pin 6 is not limited. For example, it can be set to a columnar structure or a linear structure.

[0117] like Figure 4 As shown, in one embodiment, the pin 6 is configured as a linear structure, such as a metal wire. In one example, the pin 6 is configured as a linear structure extending in a straight line in the thickness direction X of the substrate 3. In other examples, the pin 6 may also be configured as a linear structure extending in other shapes, for example, the pin 6 is configured as a linear structure extending in a spiral or corrugated shape in the thickness direction X of the substrate 3, and the present application does not limit this.

[0118] like Figure 7As shown, in another embodiment, the pin 6 is configured as a columnar structure extending in the thickness direction X of the substrate 3. It should be further explained that the outer surface of the pin 6 may be provided with a protective layer (not shown in the figure). The anti-oxidation performance of the protective layer material is stronger than the anti-oxidation performance of the pin 6 material. The material used for the protective layer may be but is not limited to tin. In one embodiment, the outer surface of the pin 6 is provided with a protective layer, which can protect the pin 6, reduce or avoid the oxidation of the material used for the pin 6, thereby facilitating the improvement of the connection reliability of the packaged device 2.

[0119] like Figure 4 and Figure 6 As shown, the number of the second pads 75 provided on the substrate 3 is not limited, and may be one or more, and the number of the pins 6 provided on each second pad 75 is not limited, and may be one or more (see Fig.12 ), which is not limited in the present application. A person skilled in the art may adjust the number of pins 6 according to the requirements of the packaged device 2. Exemplarily, a plurality of second pads 75 are provided on the substrate 3 of the packaged device 2, and each pad 75 is provided with a pin 6.

[0120] It should be noted that if Figure 4 and Figure 6 As shown, the arrangement of the plurality of second pads 75 is not limited. For example, the plurality of second pads 75 can be arranged symmetrically along the length direction Y of the substrate 3, or can be distributed equidistantly along the length direction Y of the substrate 3, or can be arranged with equal differences along the length direction Y of the substrate 3. Those skilled in the art can design this according to actual needs, and this application is not limited to this. In one example, the plurality of second pads 75 are arranged symmetrically along the length direction Y of the substrate 3.

[0121] The material of the pin 6 is set to be a conductive material, for example, it can be a metal material (for example, copper, nickel or stainless steel, etc.), or it can be a non-metallic material such as graphite, silicon, conductive rubber, etc. Exemplarily, the pin 6 is made of a metal material, which has a high thermal conductivity, which is conducive to transferring and diffusing the heat generated by the electronic device 4 packaged on the substrate 3, thereby enhancing the heat dissipation performance of the substrate 3.

[0122] Furthermore, the main material used for the pin 6 is different from the material used for the solder body 11, and the melting point of the main material used for the pin 6 should be greater than the melting point of the material of the solder body 11. The material of the solder body 11 is not limited, but should meet the characteristics required in the electrical connection and production process, such as relatively low melting point, good conductivity, strong plasticity, and non-toxicity. In one example, the material used for the solder body 11 is tin, and the main material used for the pin 6 can be, but is not limited to, copper.

[0123] Among them, the pin 6 can be non-electrically connected to the electronic device 4, and is not used to achieve the transmission of electrical signals. For example, it can be used to enhance the heat dissipation performance of the packaged device 2. The present application does not limit the electrical connection relationship between the multiple pins 6 and the electronic device 4, and those skilled in the art can design this according to actual needs. For example, some of the multiple pins 6 are electrically connected to the electronic device 4 to achieve signal transmission; another part of the pins 6 are non-electrically connected to the electronic device 4, and are only used to improve the overall heat dissipation performance of the substrate 3.

[0124] The above is a detailed description of the method and specific structure of fixed connection between the packaged device and the circuit board in the present application in combination with the accompanying drawings. The following is a detailed description of the structure, function, layout and other features of the first solder pad in combination with the accompanying drawings.

[0125] See also Figures 8 to 14 , Figure 8 This is a schematic diagram of the structure when the wall surface of the groove in the packaging device of the embodiment of the present application only includes the side surface; Fig. 9 This is a schematic diagram of a structure in which the wall surface of the groove in the packaging device of an embodiment of the present application includes a bottom surface and a side surface, wherein the bottom surface and the side surface of the groove are not perpendicular to each other; Fig.10 This is a schematic diagram of the plating structure of the first pad in the packaged device according to an embodiment of the present application, wherein the first pad includes a protective layer; Fig.11 This is a schematic diagram of the plating structure of the first pad in the packaged device according to an embodiment of the present application, wherein the first pad does not include a protective layer; Fig.12 It is a structural schematic diagram of another implementation of the packaging component of the embodiment of the present application, wherein a plurality of pins share a first pad and a second pad; Fig.13 for Fig.12 A partial enlarged view of part C in the middle; Fig.14 for Fig.12 Schematic diagram of the cross-sectional structure in the DD direction. It should be noted that Figure 5 As shown, the structure of the wall surface 54 of the groove 53 is not limited. For example, it may include only the side surface 56, or it may include both the side surface 56 and the bottom surface 55. In one embodiment, the wall surface 54 of the groove 53 includes the bottom surface 55 and the side surface 56 connected to the outer edge of the bottom surface 55, and the side surface 56 of the groove 53 is also connected to other areas of the bottom surface of the first package body 51 (other areas of the bottom surface of the first package body 51 except the groove 53).

[0126] In another embodiment, Figure 8 As shown, the wall surface 54 of the groove 53 only includes the side surface 56 , and the outer edge of the side surface 56 of the groove 53 is connected to other areas of the bottom surface of the first package body 51 (other areas of the bottom surface of the first package body 51 except the groove 53 ).

[0127] Furthermore, if Figure 5 and Fig. 9 As shown, the angle between the bottom surface 55 and the side surface 56 of the groove 53 is not limited. For example, the bottom surface 55 and the side surface 56 of the groove 53 can be vertically arranged, or can be arranged at an angle of 30°, 45°, 60°, 135°, etc.

[0128] In one embodiment, if Figure 5 As shown, the surface where the bottom surface 55 of the groove 53 is located is perpendicular to the thickness direction X of the substrate 3, and the bottom surface 55 of the groove 53 is perpendicular to the side surface 56. The shape of the groove 53 is regular, easy to process, and saves production costs.

[0129] In another embodiment, Fig. 9 The surface where the bottom surface 55 of the groove 53 is located is perpendicular to the thickness direction X of the substrate 3, and the side surface 56 of the groove 53 is inclined relative to the thickness direction X of the substrate 3, or it can be understood that the bottom surface 55 and the side surface 56 of the groove 53 are not perpendicular. And the notch of the groove 53 is larger than the bottom surface 55 of the groove 53, or it can be understood that the groove 53 is set to a structure with a wide notch and a narrow groove bottom.

[0130] It should be noted that the structure of the bottom surface 55 of the groove 53 is not limited, and can be a plane, a curved surface, etc. The surface where the bottom surface 55 of the groove 53 is located may not be perpendicular to the thickness direction X of the substrate 3, for example, it may be inclined, and the present application does not impose any restrictions on this.

[0131] The present application does not limit the width and depth of the groove 53. The width and depth of the groove 53 in the figure are only examples and do not limit the present application. Those skilled in the art can design the size of the groove 53 according to actual needs or machine requirements.

[0132] Furthermore, the number of grooves 53 provided on the bottom surface of the first package body 51 is not limited. A groove 53 may be provided in the surrounding area of ​​each exposed portion of the pin 6, or a groove 53 may be provided for multiple pins 6. Those skilled in the art can design this according to actual needs. Figure 4 As shown, a plurality of pins 6 are provided on the packaged device 2 , and a groove 53 is provided in the surrounding area of ​​the exposed portion of each pin 6 .

[0133] The structures of the grooves 53 may be the same or different. For example, they may be vertical grooves with a bottom surface 55 and a side surface 56, or they may be inclined grooves with a bottom surface 55 and a side surface 56, or one of the grooves 53 may have only a side surface 56, while the other grooves 53 may have a bottom surface 55 and a side surface 56 that are perpendicular to each other. Figure 4 and Figure 5As shown, a plurality of grooves 53 are arranged on the bottom surface of the first package body 51 in the package device 2 , and the grooves 53 are all vertical structure grooves having a bottom surface 55 and a side surface 56 .

[0134] It should be noted that the size of the first pad 71 covering the wall 54 of the groove 53 is not limited. For example, the first pad 71 may only cover part of the bottom surface 55 of the groove 53, or the entire bottom surface 55, or both the bottom surface 55 and the side surface 56.

[0135] like Figure 5 As shown, in one embodiment, the first pad 71 includes a first portion 72 and a second portion 73, the first portion 72 covers the entire bottom surface 55 of the groove 53, and the second portion 73 surrounds and connects to the outer periphery of the first portion 72, and covers the side surface 56 of the groove 53. Among them, the pin 6 protrudes from the bottom surface 55 of the groove 53, and the portion of the pin 6 protruding from the wall surface 54 of the groove 53 is wrapped in the first portion 72 of the first pad 71, and the solder body 11 fills the space surrounded by the first portion 72 and the second portion 73. Among them, the solder body 11 can extend outside the space, or it can not extend out of the space surrounded by the first portion 72 and the second portion 73. The first solder pad 71 covers the entire bottom surface 55, the side surface 56 of the groove 53 and the outer surface of the exposed portion of the pin 6, further increasing the position constraint on the solder body 11, and increasing the fixing area of ​​the first solder pad 71 and the first package body 51, as well as the welding area of ​​the first solder pad 71 and the solder body 11, thereby enhancing the connection reliability when the packaged device 2 is welded to the circuit board 10 through the solder body 11, and improving the electrical connection stability between the packaged device 2 and the circuit board 10.

[0136] Furthermore, the pin 6 region corresponding to the first portion 72 protrudes in a direction away from the substrate 3 relative to other regions and forms a protrusion, and the portion of the pin 6 protruding from the first pad 71 is wrapped in the protrusion. The soldering area between the solder body 11 and the first pad 71 in the package device 2 is increased, thereby enhancing the connection reliability when the package device 2 is soldered to the circuit board 10 through the solder body 11, and improving the electrical connection stability between the package device 2 and the circuit board 10.

[0137] The area of ​​the second portion 73 of the first solder pad 71 covering the side 56 of the groove 53 is not limited, and it can cover part of the side 56 of the groove 53 or the entire side 56 of the groove 53. In one embodiment, the second portion 73 of the first solder pad 71 covers the entire side 56 of the groove 53, and the second portion 73 of the first solder pad 71 is arranged perpendicular to the first portion 72. This further increases the soldering area between the solder body 11 and the first solder pad 71 in the package device 2, and enhances the connection reliability when the package device 2 is soldered to the circuit board 10 through the solder body 11. Fig. 9As shown, in another embodiment, the second portion 73 of the first pad 71 covers the entire side surface 56 of the groove 53 , and the second portion 73 of the first pad 71 is inclined with respect to the first portion 72 .

[0138] Furthermore, the second portion 73 and the first portion 72 of the first pad 71 may be an integrated structure or a split structure. In one example, the second portion 73 and the first portion 72 of the first pad 71 are configured as an integrated structure, which facilitates processing.

[0139] Furthermore, if Fig.10 As shown, the first pad 71 may include a plating structure, and the plating structure includes a seed layer 71A, a substrate layer 71B and a protective layer 71C which are stacked in sequence. Among them, the seed layer 71A contacts the bottom surface of the first package body 51, and the protective layer 71C contacts the solder body 11. The seed layer 71A on one side of the substrate layer 71B is used to increase the bonding force between the first pad 71 and the first package body 51, and the protective layer 71C on the other side of the substrate layer 71B makes it difficult for the first pad 71 to be oxidized during the preparation of the package device 2. While enhancing the bonding force between the first pad 71 and the first package body 51, the first pad 71's anti-oxidation ability is enhanced, the connection reliability between the first pad 71 and the first package body 51 and the stability of the first pad 71 itself are increased, thereby improving the connection reliability of the package device 2 when it is soldered to the circuit board 10 through the solder body 11.

[0140] Among them, the first pad 71 is set to a conductive material, but the specific material of each plating layer is not limited. The material of the seed layer 71A can be, for example, titanium or stainless steel. The material of the substrate layer 71B can be, for example, copper or aluminum. The material of the protective layer 71C can be, for example, gold. In one example, the material of the seed layer 71A is titanium, the material of the substrate layer 71B is copper, and the material of the contact layer 71C is gold.

[0141] Further, the first pad 71 may include a protective layer 71C, or may not include the protective layer 71C. Exemplarily, the first pad 71 includes the protective layer 71C. In other alternative embodiments, such as Fig.11 As shown, the plating structure may include a seed layer 71A and a base layer 71B stacked in sequence, the seed layer 71A contacts the bottom surface of the first package body 51, and the base layer 71B contacts the solder body 11. The solder body 11 in contact with the base layer 71B has the effect of preventing the surface of the first pad 71 from being oxidized, thereby eliminating the need to process the protective layer 71C of the first pad 71, thereby reducing production costs.

[0142] It should be noted that the first pad 71 is coated on the wall surface 54 of the groove 53 in the first package body 51 and the outer surface of the pin 6 in any manner, for example, the first pad 71 can be coated by spraying, bonding, plating, etc. In one example, the first pad 71 is plated on the wall surface 54 of the groove 53 and the outer surface of the pin 6. This method is simple to process and has low manufacturing cost. Figure 5 As shown, the proportion of the space enclosed by the first pad 71 filled by the solder body 11 is not limited. For example, the solder body 11 may partially fill the space enclosed by the first pad 71, or may completely fill the space enclosed by the first pad 71, or may completely fill the space enclosed by the first pad 71 and overflow. In one embodiment, the solder body 11 completely fills the space enclosed by the first pad 71 and extends outside the space.

[0143] It should be noted that one or more pins 6 may be connected between the second pad 75 and the first pad 71. Figure 4 and Figure 5 As shown, in one embodiment, a pin 6 is connected between the second pad 75 and the first pad 71 , one end of the pin 6 is wrapped in the first pad 71 , and the other end is connected to the second pad 75 .

[0144] like Figure 12 to Figure 14 As shown, in another embodiment, a plurality of pins 6 (for example, Fig.13 As shown in FIG. 1 , one end of each pin 6 (i.e., one end of the plurality of pins 6) is wrapped in the first pad 71, and the second pad 75 is connected to the other end of each pin 6 (i.e., the other end of the plurality of pins 6). Alternatively, it can be understood that one end of the plurality of pins 6 arranged at intervals shares the first pad 71, and the other end shares the second pad 75. By providing a plurality of pins 6 on each pad, the heat dissipation performance and efficiency of the packaged device 2 are enhanced while ensuring the stability of the electrical connection.

[0145] It should be noted that the number of pins 6 provided between each second soldering pad 75 and the corresponding first soldering pad 71 may be equal or unequal, and the present application does not limit this.

[0146] The above is a detailed description of the case where only the pins are arranged on the bottom surface of the substrate in combination with the accompanying drawings. The following is a detailed description of the case where both the bottom surface of the substrate and the first electronic device on the bottom surface of the substrate are arranged with the accompanying drawings. Fig.15 , Fig.15 This is a structural schematic diagram of another implementation of the packaging component of the embodiment of the present application, wherein pins are provided on the bottom surface of the substrate and the first electronic device on the bottom surface of the substrate.

[0147] In one embodiment, if Fig.15 As shown, compared to Figure 4 and Figure 5 In the structure shown, in addition to the pin 6 being provided on the bottom surface 31 of the substrate 3, the pin 6 is also provided on the first electronic device 42 (for example, the second chip 40B) on the bottom surface 31 of the substrate 3, and one end of the pin 6 is wrapped in the first pad 71. A third pad 76 is provided on the surface of the first electronic device 42 away from the substrate 3, and the third pad 76 is connected to the other end of the pin 6. Further, a groove 53 may be provided only around the pin 6 on the bottom surface 31 of the substrate 3 and the wall 54 of the groove 53 may be fixedly covered with the first pad 71, or a groove 53 may be provided only around the pin 6 provided on the first electronic device 42 and the wall 54 of the groove 53 may be fixedly covered with the first pad 71, or a groove 53 may be provided around all the pins 6 on the packaged device 2 and the wall 54 of the groove 53 may be fixedly covered with the first pad 71, and the present application does not limit this.

[0148] It should be further explained that one end of the plurality of pins 6 is wrapped in the first pad 71, and the third pad 76 can be connected to the other end of the plurality of pins 6. Alternatively, it can be understood that one end of the plurality of pins 6 arranged at intervals shares the first pad 71, and the other end shares the third pad 76.

[0149] The above is a detailed description of various situations that can improve the reliability of the connection between the pin and the solder body in combination with the accompanying drawings. The following is a detailed description of the processing flow of the packaged device when multiple pins share the first solder pad in combination with the accompanying drawings.

[0150] See also FIG. 16A to FIG. 16I , FIG. 16A to FIG. 16I This is a schematic diagram of the preparation process of the packaged device according to an embodiment of the present application.

[0151] like FIG. 16A to FIG. 16I As shown, the packaging process of double-sided plastic packaging of the packaged device 2 is as follows: first, Fig.16A As shown, the electronic device 4 (for example, Figure 4 The second electronic device 43 shown in FIG. Fig. 16B As shown, the electronic device 4 mounted on the top surface 32 of the substrate 3 is plastic-encapsulated to form a second packaging body 57 that encapsulates the electronic device 4 on the top surface 32 of the substrate 3. Fig. 16C As shown, after the top surface 32 of the substrate 3 is plastic-sealed, the substrate 3 is turned over to carry out the electronic device 4 (for example, Figure 4 The first electronic device 42 shown in FIG. Fig.16D As shown, after the electronic device 4 is installed, the pin 6 is further arranged on the second pad 75 on the bottom surface 31 of the substrate 3 (for example, a metal wire is formed on the second pad 75). Fig.16EAs shown, after the electronic devices 4 on the bottom surface 31 of the substrate 3 are installed, the electronic devices 4 on the bottom surface 31 of the substrate 3 are plastic-sealed to form a packaging body preform that packages the electronic devices 4 on the top surface 32 of the substrate 3.

[0152] After the top surface 32 and the bottom surface 31 of the substrate 3 are both sealed, Fig.16F As shown in FIG. 1 , a laser process is used to groove the surrounding area of ​​the pin 6 on the bottom surface of the package preform so that the pin 6 is exposed to the package preform. Figure 16G As shown, a coating layer, namely a conductive layer, is plated on the bottom surface of the package preform by electroplating, sputtering or other processes; Fig.16H As shown, the surface of the package preform plated with the coating away from the substrate 3 is ground to obtain the first pad 71 covering the wall 54 of the groove 53 and wrapping the lead 6. After cleaning the ground surface, Fig.16I As shown, the solder body 11 is soldered on the surface of the first pad 71 to finally obtain the packaged device 2.

[0153] Among them, the conductive layer plated in other areas outside the groove 53 on the surface of the package preform facing away from the substrate 3 is completely ground away to prevent the plating layers in each groove 53 from being connected to each other, causing a short circuit when the pins 6 correspondingly arranged in each groove are electrically connected.

[0154] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and modifications of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and modifications.

Claims

1. A packaging device, characterized in that: include: A substrate having a top surface and a bottom surface disposed opposite to each other; at least one first electronic device, the at least one first electronic device being disposed on the bottom surface of the substrate; A first package body, wherein the first package body is disposed on the bottom surface of the substrate, and the at least one first electronic device is packaged in the first package body; at least one pin, the pin being inserted through the first package body, and at least a portion of the pin being exposed relative to a bottom surface of the first package body, the bottom surface of the first package body being a surface of the first package body facing away from the substrate; Among them, the area on the bottom surface of the first package body corresponding to at least part of the pin is recessed inward to form a groove, the wall of the groove is fixedly covered with a first soldering pad, one end of the pin protrudes from the wall of the groove, and the part of the pin protruding from the wall of the groove is wrapped in the first soldering pad; the packaging device also includes a solder body, which is soldered to the first soldering pad.

2. The packaged device according to claim 1, characterized in that: The wall surface of the groove includes a bottom surface and a side surface connected to the outer edge of the bottom surface; The first pad includes a first portion and a second portion, the first portion covers the entire bottom surface of the groove, and the second portion surrounds and connects to the outer periphery of the first portion and covers the side surface of the groove; The pin protrudes from the bottom surface of the groove, and the portion of the pin protruding from the wall surface of the groove is wrapped in the first portion of the first solder pad, and the solder body fills the space enclosed by the first portion and the second portion.

3. The packaged device according to claim 2, characterized in that: The area of ​​the first part corresponding to the pin protrudes in a direction away from the substrate relative to other areas and forms a protruding portion, and at least a part of the pin is wrapped in the protruding portion.

4. The packaged device according to claim 2, characterized in that: The second portion covers the entire side surface of the groove; The side surface of the groove is inclined relative to the thickness direction of the substrate, and the notch of the groove is larger than the bottom surface of the groove.

5. The packaged device according to claim 2, characterized in that: The second portion and the first portion of the first pad are configured as an integrated structure.

6. The packaged device according to claim 1, characterized in that: The first pad includes a plating structure, and the plating structure includes a seed layer and a base layer stacked in sequence, the seed layer contacts the bottom surface of the first package body, and the base layer contacts the solder body.

7. The packaged device according to claim 1, characterized in that: The first pad includes a plating structure, which includes a seed layer, a base material layer and a protection layer stacked in sequence, the seed layer contacts the bottom surface of the first package body, and the protection layer contacts the solder body.

8. The packaged device according to claim 1, characterized in that: At least one second pad is disposed on the bottom surface of the substrate, and the second pad is connected to the other end of the lead.

9. The packaged device according to claim 8, characterized in that: One ends of the plurality of pins are wrapped in the first pad, and the second pad is connected to the other ends of the plurality of pins.

10. The packaged device according to any one of claims 1 to 7, characterized in that: At least one third pad is disposed on a surface of the first electronic device away from the substrate, and the third pad is connected to the other end of the lead.

11. The packaged device according to claim 10, characterized in that: One ends of the plurality of pins are wrapped in the first pad, and the third pad is connected to the other ends of the plurality of pins.

12. The packaged device according to any one of claims 1 to 9, characterized in that: The pins are configured as metal wires.

13. The packaged device according to any one of claims 1 to 9, characterized in that: The packaged device further comprises: at least one second electronic device, the at least one second electronic device being disposed on the top surface of the substrate; A second package body is provided on the top surface of the substrate, and the at least one second electronic device is packaged in the second package body.

14. The packaged device according to any one of claims 1 to 9, characterized in that: The first pad is made of metal, and the first package body is made of insulating plastic material.

15. A packaging component, characterized in that: The packaging assembly comprises a circuit board and a packaging device as claimed in any one of claims 1 to 14, wherein the packaging device is soldered to the circuit board through the solder body.

16. An electronic device, characterized in that: Comprising the packaging assembly as claimed in claim 15.

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