Single laser repair equipment

Abstract

A method of operating a single laser repair apparatus for repairing a defective line in a circuit board. The circuit has a conductive portion and a defect portion. The operation method comprises the following steps: a laser light source of a single-laser dual-optical-path repairing piece of the single-laser repairing module emits an initial laser beam to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam; the second laser beam is shielded by the switching unit, and the first laser beam is transmitted to the circuit board through the switching unit, so that the defect part is converted into a sintering part; and shielding the first laser beam by the switching unit and transmitting the second laser beam to the circuit board through the switching unit so as to trim the sintered part, so that the sintered side surface of the sintered part is flush with the two conductive side surfaces of the two conductive parts.

Description

Technical Field

[0001] The utility model relates to a single laser repair device and an operating method of the single laser repair device, and in particular to a single laser repair device and an operating method thereof which can sinter and trim circuits of a circuit board with open circuit defects and short circuit defects. Background Art

[0002] Generally speaking, laser repair equipment can be used to repair circuits of circuit boards with short circuit defects and open circuit defects. For example, laser repair equipment uses a laser head to emit a laser beam to the defective part of the circuit. However, when the laser repair equipment is repairing the circuit, the defective circuit is prone to contact with the adjacent circuit after repair due to the excessive concentration of the energy power of the laser beam or the excessive divergence angle of the laser beam, resulting in a short circuit or other defects. Utility Model Content

[0003] In order to solve the technical problems existing in the prior art, the utility model provides a single laser repair device, which can prevent the repaired circuit from easily contacting its adjacent circuits and causing a circuit short circuit.

[0004] The technical solution of the utility model is that according to one embodiment of the utility model, the utility model provides a single laser repair device, which is used to repair a defective circuit in a circuit board, wherein the defective circuit has two conductive parts and a defective part located between the two conductive parts. The single laser repair device includes a single laser repair module. The single laser repair module includes a single laser dual-optical path repair component, and more specifically, the single laser dual-optical path repair component is arranged in the single laser repair module. The single laser dual-optical path repair component includes a laser light source, a power distribution unit, and a switching unit. The laser light source is used to emit an initial laser beam. The power distribution unit is arranged on one side of the laser light source. The initial laser beam passes through the power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam. The energy power of the first laser beam is different from the energy power of the second laser beam. The switching unit is arranged on one side of the power distribution unit. The switching unit is used to shield the second laser beam and allow the first laser beam to pass through the switching unit and be transmitted to the circuit board, so that the defective part of the circuit is transformed into a sintered part. After the defective part of the circuit is transformed into the sintered part, the switching unit is used to shield the first laser beam and transmit the second laser beam through the switching unit to the circuit board to trim the sintered part so that the sintered side surface of the sintered part is flush with the two conductive side surfaces of the two conductive parts.

[0005] According to one embodiment of the utility model, the above-mentioned single laser dual optical path repair component further includes a first light spot adjustment unit and a second light spot adjustment unit. The first light spot adjustment unit is located between the power distribution unit and the switching unit and is used to receive the first laser beam passing through the power distribution unit. The second light spot adjustment unit is located on one side of the first light spot adjustment unit and is used to receive the second laser beam passing through the power distribution unit. The divergence angle of the first laser beam passing through the first light spot adjustment unit is different from the divergence angle of the second laser beam passing through the second light spot adjustment unit.

[0006] According to one embodiment of the utility model, the energy power of the first laser beam passing through the power distribution unit is greater than the energy power of the second laser beam passing through the power distribution unit, and / or the divergence angle of the first laser beam passing through the first light spot adjustment unit is greater than the divergence angle of the second laser beam passing through the second light spot adjustment unit.

[0007] According to an embodiment of the utility model, the two conductive parts are two metal wires or two polysilicon fuses. The defect of the circuit is a short circuit defect. The defective part is sintered by the first laser beam so that a part of the defective part diffuses outward and exposes a part of the substrate of the circuit board, thereby converting the defective part into a sintered part. The width of each of the two conductive parts is smaller than the width of the part of the substrate exposed by the defective part.

[0008] According to one embodiment of the utility model, the two conductive parts are two metal wires or two polysilicon fused wires. The defect of the circuit is an open circuit defect. The two sides of the two conductive parts facing each other are sintered by the first laser beam to diffusely cover the defective part, so that the defective part is transformed into a sintered part and the two conductive parts are conductive.

[0009] According to one embodiment of the utility model, the two conductive parts are two metal wires or two polysilicon fuses. The defect of the circuit is an open circuit defect. The single laser repair module has an inkjet head. The inkjet head is used to spray the conductive glue on the defective part of the circuit. The conductive glue partially covers the two conductive parts. The first laser beam sinters the conductive glue located in the circuit so that the defective part becomes a sintered part.

[0010] According to one embodiment of the utility model, the above-mentioned single laser repair equipment further includes a first displacement module, a second displacement module, a third displacement module and a detection module. The first displacement module is connected to the single laser repair module and is used to move the single laser repair module in a first direction. The second displacement module is connected to the first displacement module and is used to move the first displacement module in a second direction. The third displacement module has a carrier. The carrier is used to carry a circuit board. The third displacement module is used to move the carrier in a third direction. Each of the first direction, the second direction and the third direction is perpendicular to the other two. The detection module is arranged on opposite sides of the third displacement module. When the third displacement module moves to drive the carrier to pass through the detection module, the detection module is used to detect the thickness of the circuit in the circuit board.

[0011] According to one embodiment of the utility model, the above-mentioned single laser repair module has a detection lens. The detection lens faces the circuit board and is used to detect the current position of the circuit board to generate a movement drive signal according to the current position. The movement drive signal is used to drive the first displacement module, the second displacement module and the third displacement module to move, so that the single laser repair module and the circuit board are positioned to a specific position.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] According to the above-mentioned embodiment of the utility model, a single laser repair device can be used to repair circuits with open circuits and short circuit defects on a circuit board, and a single laser dual-path repair component can emit a first laser beam and a second laser beam with different energy powers and / or different divergence angles to the circuit board. In addition, the first laser beam emitted by the single laser dual-path repair component can transform the defective portion of the circuit into a sintered portion between two conductive portions, and the second laser beam emitted by the single laser dual-path repair component can trim the sintered portion so that the sintered side of the sintered portion is flush with the two conductive side surfaces of the two conductive portions. The configuration of the single laser dual-path repair component of the single laser repair device to emit the first laser beam and the second laser beam allows the side of the repaired circuit to avoid contact with other circuits, thereby preventing the repaired circuit from having a short circuit or other defects. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of a single laser repair device according to one embodiment of the present invention.

[0015] Figure 2 yes Figure 1 Front view of the single laser repair module.

[0016] Figure 3 It is a schematic diagram of a single-laser dual-optical-path repair component emitting a first laser beam according to an embodiment of the present invention.

[0017] Figure 4It is a schematic diagram of a single-laser dual-optical-path repair component emitting a second laser beam according to an embodiment of the present invention.

[0018] Figure 5 It is a flow chart of an operation method of a single laser repair device according to one embodiment of the present invention.

[0019] Figures 6 to 8 The invention is a cross-sectional view of a circuit board with an open circuit defect in different states during repair.

[0020] Fig. 9 and Fig.10 It is a top view of a circuit board with an open circuit defect in different states when being repaired according to an embodiment of the present invention.

[0021] Fig.11 and Fig.12 It is a cross-sectional view of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present invention.

[0022] Fig.13 and Fig.14 It is a top view of a circuit board with an open circuit defect in different states when being repaired according to another embodiment of the present invention.

[0023] Fig.15 and Fig.16 The invention is a cross-sectional view of a circuit board with a short circuit defect in different states during repair.

[0024] Figures 17 to 19 It is a top view of a circuit board with a short circuit defect in different states when being repaired according to an embodiment of the utility model.

[0025] Description of the figure number:

[0026] 100: Single laser repair equipment

[0027] 110: Single laser repair module

[0028] 111: Single laser dual optical path repair parts

[0029] 112: Laser light source

[0030] 114: Power distribution unit

[0031] 115: Switching unit

[0032] 116: Detection Lens

[0033] 118: Inkjet head

[0034] 120: First displacement module

[0035] 130: Second displacement module

[0036] 140: Third displacement module

[0037] 142: Carrier

[0038] 150: Detection module

[0039] 200: Circuit board

[0040] 210: Line

[0041] 211: Sintered side

[0042] 212: Sintering department

[0043] 213: Conductive side

[0044] 214: Conductive part

[0045] 220: Substrate

[0046] 1131: First light spot adjustment unit

[0047] 1132: Second light spot adjustment unit

[0048] 2121: Defect Department

[0049] C: Conductive glue

[0050] D1: First direction

[0051] D2: Second direction

[0052] D3: Third direction

[0053] L0: Initial laser beam

[0054] L1: First laser beam

[0055] L2: Second laser beam

[0056] S1: Steps

[0057] S2: Steps

[0058] S3: Steps

[0059] T: Thickness

[0060] W1: Width

[0061] W2: width. DETAILED DESCRIPTION

[0062] Please refer to Figures 1 to 4 , Figure 1is a perspective view of a single laser repair device 100 according to an embodiment of the present invention. Figure 2 yes Figure 1 A front view of a single laser repair module 110, Figure 3 is a schematic diagram of a single laser dual optical path repair component 111 emitting a first laser beam L1 according to an embodiment of the present invention, and Figure 4 Schematic diagram of a single laser dual optical path repair member 111 emitting a second laser beam L2 according to an embodiment of the present invention. Figures 1 to 4 The single laser repair device 100 can be used to repair a defective circuit 210 of a circuit board 200 (described in detail below). The single laser repair device 100 includes a single laser repair module 110. The single laser repair module 110 includes a single laser dual optical path repair component 111.

[0063] In some embodiments, the single laser dual optical path patch 111 includes a laser light source 112, a power distribution unit 114, and a switching unit 115. The laser light source 112 is used to emit an initial laser beam L0. The power distribution unit 114 is disposed on one side of the laser light source 112. The initial laser beam L0 passes through the power distribution unit 114 to generate a first laser beam L1 and a second laser beam L2 different from the first laser beam L1. The energy power of the first laser beam L1 is different from the energy power of the second laser beam L2. For example, the energy power of the first laser beam L1 is greater than the energy power of the second laser beam L2.

[0064] In some embodiments, the single-laser dual-optical path patch 111 further includes a first light spot adjustment unit 1131 and a second light spot adjustment unit 1132. The first light spot adjustment unit 1131 is located between the power distribution unit 114 and the switching unit 115 and is used to receive the first laser beam L1 passing through the power distribution unit 114. The second light spot adjustment unit 1132 is located on one side of the first light spot adjustment unit 1131 and is used to receive the second laser beam L2 passing through the power distribution unit 114. The divergence angle of the first laser beam L1 passing through the first light spot adjustment unit 1131 is different from the divergence angle of the second laser beam L2 passing through the second light spot adjustment unit 1132. For example, the divergence angle of the first laser beam L1 is greater than the divergence angle of the second laser beam L2.

[0065] In some embodiments, the switch unit 115 is disposed at one side of the power distribution unit 114. The switch unit 115 is used to shield the second laser beam L2 and allow the first laser beam L1 to pass through the switch unit 115 and be transmitted to the circuit board 200, or shield the first laser beam L1 and allow the second laser beam L2 to pass through the switch unit 115 and be transmitted to the circuit board 200.

[0066] In some embodiments, the single laser repair device 100 further includes a first displacement module 120, a second displacement module 130, a third displacement module 140, and a detection module 150. The first displacement module 120 is connected to the single laser repair module 110 and is used to move the single laser repair module 110 in the first direction D1. The second displacement module 130 is connected to the first displacement module 120 and is used to move the first displacement module 120 in the second direction D2. The third displacement module 140 has a carrier 142. The carrier 142 is used to carry the circuit board 200. The third displacement module 140 is used to move the carrier 142 in the third direction D3. Each of the first direction D1, the second direction D2, and the third direction D3 is perpendicular to the other two. The detection module 150 is disposed on opposite sides of the third displacement module 140. When the third displacement module 140 moves to drive the carrier 142 to pass through the detection module 150 , the detection module 150 can be used to detect the thickness T of the circuit 210 in the circuit board 200 .

[0067] In addition, the single laser repair module 110 has a detection lens 116 and an inkjet head 118. The detection lens 116 faces the circuit board 200 and is used to detect the current position of the circuit board 200 to generate a moving driving signal according to the current position. The moving driving signal is used to drive the first displacement module 120, the second displacement module 130 and the third displacement module 140 to move, so that the single laser repair module 110 and the circuit board 200 are positioned at a specific position.

[0068] In the following description, the operation of the single laser repair equipment will be explained. Figure 5 , Figure 5 1 is a flow chart of an operation method of a single laser repair device according to an embodiment of the present invention. The operation method of the single laser repair device comprises the following steps. First, in step S1, a laser light source of a single laser dual-optical path repair component of a single laser repair module emits an initial laser beam to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam, wherein the energy power of the first laser beam is different from the energy power of the second laser beam.

[0069] Please note that in other embodiments, other optical components may be used to generate the first laser beam and the second laser beam, and the energy power of the first laser beam may be designed to be the same as the energy power of the second laser beam, but the divergence angle of the first laser beam is different from the divergence angle of the second laser beam. In short, in the present invention, the energy power of the first laser beam is different from the energy power of the second laser beam, and / or the divergence angle of the first laser beam is different from the divergence angle of the second laser beam.

[0070] Next, in step S2, the second laser beam is shielded by the switching unit and the first laser beam is transmitted to the circuit board through the switching unit, so that the defective part of the defective circuit is transformed into a sintered part. Then, in step S3, the first laser beam is shielded by the switching unit and the second laser beam is transmitted to the circuit board through the switching unit to trim the sintered part so that the sintered side surface of the sintered part is flush with the two conductive side surfaces of the two conductive parts. In the following description, the above steps will be described in detail.

[0071] Figures 6 to 8 1 is a cross-sectional view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present invention. Fig. 9 and Fig.10 2 is a top view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present invention. Figure 1 , Figure 3 , Figures 6 to 10 The operation method of the single laser repairing device 100 can be used to repair a defective circuit 210 of a circuit board 200. The defective circuit 210 has two conductive portions 214 and a defective portion 2121 located between the two conductive portions 214.

[0072] First, the first displacement module 120, the second displacement module 130 and the third displacement module 140 can be driven to move along the first direction D1, the second direction D2 and the third direction D3 respectively, so that the single laser repair module 110 connected to the first displacement module 120 and the circuit board 200 on the stage 142 of the third displacement module 140 move. For example, the current position of the circuit board 200 can be detected by the detection lens 116 of the single laser repair module 110 to generate a moving driving signal according to the current position. The moving driving signal is used to drive the first displacement module 120, the second displacement module 130 and the third displacement module 140 to move, so that the single laser repair module 110 and the circuit board 200 are positioned at a specific position. In addition, the stage 142 can be moved on the third displacement module 140, so that the stage 142 detects the thickness T of the circuit 210 in the circuit board 200 through the detection modules 150 set on both sides of the third displacement module 140.

[0073] In some embodiments, the laser light source 112 of the single laser dual optical path repair component 111 of the single laser repair module 110 may emit an initial laser beam L0 to the power distribution unit 114 to generate a first laser beam L1 and a second laser beam L2 different from the first laser beam. Then, the first laser beam L1 passing through the power distribution unit 114 may be received by the first light spot adjustment unit 1131, and the second laser beam L2 passing through the power distribution unit 114 may be received by the second light spot adjustment unit 1132.

[0074] In some embodiments, a portion of the circuit 210 may be removed, so that the circuit 210 has a defective portion 2121, and the two conductive portions 214 are two metal wires or two polysilicon fuses, wherein the defect of the circuit is an open circuit defect. In some embodiments, the conductive glue C may be sprayed on the defective portion 2121 of the circuit 210 by the inkjet head 118 of the single laser repair module 110, and the conductive glue C partially covers the two conductive portions 214. Then, the second laser beam L2 may be shielded by the switching unit 115 and the first laser beam L1 may be transmitted to the circuit board 200 through the switching unit 115, so that the defective portion 2121 of the defective circuit 210 is transformed into a sintered portion 212. That is, the conductive glue C located in the circuit 210 is sintered by the first laser beam L1, so that the defective portion 2121 is transformed into a sintered portion 212. Afterwards, the first laser beam L1 can be shielded by the switching unit 115 and the second laser beam L2 can be transmitted to the circuit board 200 through the switching unit 115 to trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG. Fig.10 shown.

[0075] Please refer to Figures 11 to 14 , Fig.11 and Fig.12 is a cross-sectional view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to another embodiment of the present invention, and Fig.13 and Fig.14 1 is a top view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to another embodiment of the present invention.

[0076] Figures 11 to 14 The embodiment shown is similar to Figures 6 to 10 The embodiment shown is different in that the single laser repair module 110 does not use the inkjet head 118 to spray the conductive glue C (such as Figure 7 As shown), instead, the two opposite sides of the two conductive portions 214 are directly sintered by the first laser beam L1 to diffusely cover the defective portion 2121, so that the defective portion 2121 is transformed into the sintered portion 212 and the two conductive portions 214 are connected to each other.

[0077] Please refer to Figures 15 to 19 , Fig.15 and Fig.16 is a cross-sectional view of a circuit 210 of a circuit board 200 with a short circuit defect in different states during repair according to an embodiment of the present invention, and Figures 17 to 192 is a top view of a circuit 210 of a circuit board 200 with a short circuit defect in different states during repair according to an embodiment of the present invention. Figure 1 , Figure 3 , Figures 15 to 19 In this embodiment, there are two lines 210, and the defect between the two lines 210 is a short circuit defect. First, the defect portion 2121 can be sintered by the first laser beam L1, so that a part of the defect portion 2121 diffuses outward and exposes a part of the substrate 220 of the circuit board 200, so that the defect portion 2121 is transformed into a sintered portion 212. Fig.18 As shown, the width W1 of each of the two conductive portions 214 is smaller than the width W2 of a portion of the sintered portion 212 exposed from the substrate 220. After confirming that the width W2 of the sintered portion 212 exposed from the substrate 220 is larger than the width W1 of the conductive portion 214, the sintered portion 212 can be trimmed by the second laser beam L2 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG. Fig.19 shown.

[0078] In summary, the single laser repair device 100 can be used to repair the circuit 210 with open circuit and short circuit defects on the circuit board 200, and the single laser dual optical path repair component 111 can emit the first laser beam L1 and the second laser beam L2 with different energy powers and / or different divergence angles to the circuit board 200. In addition, the first laser beam L1 emitted by the single laser dual optical path repair component 111 can transform the defective portion 2121 of the circuit 210 into a sintered portion 212 between two conductive portions 214, and the second laser beam L2 emitted by the single laser dual optical path repair component 111 can trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the conductive side surface 213 of the conductive portion 214. The configuration of the single laser dual optical path repair component 111 of the single laser repair device 100 to emit the first laser beam L1 and the second laser beam L2 allows the side surface of the repaired circuit to avoid contact with other circuits, thereby preventing the repaired circuit from shorting.

Claims

1. A single laser repair device, characterized in that: Used to repair a circuit (210) with a defect on a circuit board (200), wherein the circuit (210) with the defect has two conductive parts (214) and a defective part (2121) located between the two conductive parts (214), and the single laser repair device comprises: A single laser repair module (110) comprising: A single-laser dual-optical path repair component (111) is disposed in the single-laser repair module (110) and comprises: A laser light source (112) for emitting an initial laser beam (L0); A power distribution unit (114) is disposed on one side of the laser light source (112), and the initial laser beam (L0) passes through the power distribution unit (114) to generate a first laser beam (L1) and a second laser beam (L2) different from the first laser beam (L1), wherein an energy power of the first laser beam (L1) is different from an energy power of the second laser beam (L2); as well as A switching unit (115) is arranged on one side of the power distribution unit (114), wherein the switching unit (115) is used to shield the second laser beam (L2) and allow the first laser beam (L1) to pass through the switching unit (115) and be transmitted to the circuit board (200), so that the defective portion (2121) of the circuit (210) is transformed into a sintered portion (212), and after the defective portion (2121) of the circuit (210) is transformed into the sintered portion (212), the switching unit (115) is used to shield the first laser beam (L1) and allow the second laser beam (L2) to pass through the switching unit (115) and be transmitted to the circuit board (200) to trim the sintered portion (212), so that a sintered side surface (211) of the sintered portion (212) is flush with two conductive side surfaces (213) of the two conductive portions (214).

2. The single laser repair device according to claim 1, characterized in that: The single laser dual optical path repair component (111) further comprises: a first light spot adjustment unit (1131), located between the power distribution unit (114) and the switching unit (115), and used for receiving the first laser beam (L1) passing through the power distribution unit (114); and A second light spot adjustment unit (1132) is located on one side of the first light spot adjustment unit (1131) and is used to receive the second laser beam (L2) passing through the power distribution unit (114), wherein a divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is different from a divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132).

3. The single laser repair device as claimed in claim 2, characterized in that: The energy power of the first laser beam (L1) passing through the power distribution unit (114) is greater than the energy power of the second laser beam (L2) passing through the power distribution unit (114), and / or the divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is greater than the divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132).

4. The single laser repair device as claimed in claim 1, characterized in that: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is a short circuit defect. The defect part (2121) is sintered by the first laser beam (L1) so that a part of the defect part (2121) diffuses outward and exposes a part of a substrate (220) of the circuit board (200), thereby transforming the defect part (2121) into the sintered part (212), wherein a width W1 of each of the two conductive parts (214) is smaller than a width W2 of the part of the defect part (2121) that exposes the substrate (220).

5. The single laser repair device as claimed in claim 1, characterized in that: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is an open circuit defect. The two sides of the two conductive parts (214) opposite to each other are sintered by the first laser beam (L1) to diffusely cover the defective part (2121), so that the defective part (2121) is transformed into the sintered part (212) and the two conductive parts (214) are conductive.

6. The single laser repair device as claimed in claim 1, characterized in that: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is an open circuit defect. The single laser repair module (110) has an inkjet head (118), and the inkjet head (118) is used to spray a conductive glue (C) on the defective part (2121) of the circuit (210). The conductive glue (C) partially covers the two conductive parts (214), and the first laser beam (L1) sinters the conductive glue (C) located on the circuit (210) so that the defective part (2121) becomes the sintered part (212).

7. The single laser repair device as claimed in claim 1, characterized in that: Also includes: a first displacement module (120), connected to the single laser repair module (110) and used for moving the single laser repair module (110) in a first direction (D1); a second displacement module (130), connected to the first displacement module (120) and used to move the first displacement module (120) in a second direction (D2); a third displacement module (140) having a carrier (142), wherein the carrier (142) is used to carry the circuit board (200), and the third displacement module (140) is used to move the carrier (142) in a third direction (D3), wherein each of the first direction (D1), the second direction (D2) and the third direction (D3) is perpendicular to the other two; and A detection module (150) is arranged on two opposite sides of the third displacement module (140), wherein when the third displacement module (140) moves to drive the carrier (142) to pass through the detection module (150), the detection module (150) is used to detect a thickness (T) of the circuit (210) in the circuit board (200).

8. The single laser repair device as claimed in claim 7, characterized in that: The single laser repair module (110) has a detection lens (116) facing the circuit board (200) and used to detect a current position of the circuit board (200) to generate a moving drive signal according to the current position, wherein the moving drive signal is used to drive the first displacement module (120), the second displacement module (130) and the third displacement module (140) to move, so that the single laser repair module (110) and the circuit board (200) are positioned at a specific position.

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