DC module bare board patch power supply

Abstract

The utility model relates to the technical field of bare board patch power supplies, in particular to a DC module bare board patch power supply, which comprises a bare board body and a plurality of electronic elements arranged above the bare board body, pins are arranged above the plurality of electronic elements, the DC module bare board patch power supply further comprises a partition board arranged above the bare board body, and a power supply module arranged above the partition board, the copper sheet is arranged on the upper surface of the partition plate; the solder paste is arranged above the copper sheet; the limiting plate is arranged in the direction of the side, except the pins, of the electronic element, when the bare board patch power supply is used, solder paste is evenly smeared on the copper sheet through the height difference between the copper sheet and the partition plate when the bare board body passes through a printing machine, and therefore the solder paste can be prevented from being smeared on other places, and the service life of the bare board patch power supply is prolonged. And when tin connection or tin slag occurs after furnace passing, the situation that the electronic element turns due to different tensile forces caused by the activity of solder paste and the temperature of the furnace during furnace passing is prevented through the design of the limiting plate.

Description

Technical Field

[0001] The utility model relates to the technical field of bare board patch power supplies, in particular to a DC module bare board patch power supply. Background Art

[0002] Bare board bonding is a technology in the semiconductor device manufacturing process, usually used to manufacture semiconductor devices such as wafers and chips. Bare board bonding is to expose the conductive layer on the chip or wafer through chemical corrosion or mechanical grinding, and then assemble it with components such as heat sinks and packaging materials to form a complete semiconductor device.

[0003] In the existing patch process, the position of the patch is offset due to the accuracy of the machine and the size of the patch components. The material and active temperature of the solder paste will affect the tension of the solder paste, resulting in uneven tension, which will cause the electronic components to turn corners after passing through the furnace. For this reason, we propose a DC module bare board patch power supply. Utility Model Content

[0004] A technical problem to be solved by the present application is: how to ensure that the position of the patch will not be offset or rotated after passing through a high-temperature furnace.

[0005] To solve the above technical problems, an embodiment of the present application provides a DC module bare board chip power supply, comprising a bare board body and an electronic component arranged above the bare board body, wherein a plurality of the electronic components are arranged, and pins are arranged above the plurality of the electronic components, and further comprising: a partition, wherein the partition is arranged above the bare board body, and the partition is used to place wires and isolate the interference between the bare board body and the electronic components above; a copper sheet, wherein the copper sheet is arranged on the upper surface of the partition, and the copper sheet is used to contact with the pins of the electronic components to complete the connection of the circuit; solder paste, wherein the solder paste is arranged above the copper sheet, and the solder paste is used to fix the pins and thus fix the position of the electronic components; a limit plate, wherein the limit plate is arranged in the direction of the electronic component except the pin side, and the limit plate is used to prevent the solder paste from turning when passing through a high-temperature furnace.

[0006] In some embodiments, there is a height difference between the upper surface of the copper sheet and the upper surface of the partition, and the upper surface of the partition is above the upper surface of the copper sheet.

[0007] In some embodiments, the solder paste is alpha solder paste.

[0008] In some embodiments, an insulating coating is coated on the partition.

[0009] In some embodiments, a packaging process is used inside the bare board body.

[0010] In some embodiments, after the bare board body is connected to the electrical component, the isolation withstand voltage is 3000VDC0.5ma1Mintue, and the output voltage accuracy reaches ±3%.

[0011] In some embodiments, the limit plate is replaced by a limit line, and the limit line is coated on top of the insulating coating, and the material of the limit line is a high temperature resistant material.

[0012] The utility model has at least the following beneficial effects:

[0013] Different from the prior art, when using the bare board chip power supply, the height difference between the copper sheet and the partition is used to make the solder paste evenly smeared on the top of the copper sheet when the bare board body passes through the printing machine. This can prevent the solder paste from being smeared on other places, and the occurrence of tin bridging or solder slag after passing through the furnace. The design of the limit plate prevents the electronic components from turning corners due to different pulling forces caused by the activity of the solder paste and the influence of the furnace temperature when passing through the furnace. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 For this utility model Figure 1 A schematic diagram of the structure enlargement in the middle;

[0016] Figure 3 This is a schematic diagram of the structure of Embodiment 2 of the present utility model;

[0017] Figure 4 For this utility model Figure 2 Enlarged schematic diagram of the structure at point B in the middle.

[0018] In the figure: 1-bare board body; 2-electronic component; 3-pin; 4-partition; 5-copper sheet; 6-limiting plate; 7-limiting line. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example 1

[0021] See also Figure 1-2The utility model provides a technical solution: a DC module bare board patch power supply, including to solve the above technical problems, the embodiment of the present application provides a DC module bare board patch power supply, including a bare board body 1 and an electronic component 2 arranged above the bare board body 1, a plurality of electronic components 2 are arranged, and pins 3 are arranged above the plurality of electronic components 2, and also includes: a partition 4, the partition 4 is arranged above the bare board body 1, the partition 4 is used to place wires and isolate the interference between the bare board body 1 and the upper electronic components 2; a copper sheet 5, the copper sheet 5 is arranged on the upper surface of the partition 4, the copper sheet 5 is used to contact with the pins 3 of the electronic component 2 to complete the connection of the circuit; solder paste, the solder paste is arranged above the copper sheet 5, the solder paste is used to fix the pins 3 and thus fix the position of the electronic component 2; a limit plate 6, the limit plate 6 is arranged in the direction of the electronic component 2 except the pin 3 side, the limit plate 6 is used to prevent the solder paste from turning when passing through the high temperature furnace, the limit plate 6 is used to ensure that the electronic component 2 will not turn when passing through the furnace, and to ensure that the maintenance personnel at the rear are convenient for maintenance, thereby accelerating the production process of the production line.

[0022] There is a height difference between the upper surface of the copper sheet 5 and the upper surface of the partition 4, and the upper surface of the partition 4 is above the upper surface of the copper sheet 5. When passing through the printing machine, the solder paste is evenly applied on the upper part of the copper sheet 5. This can prevent the solder paste from being applied to other places, resulting in tin bridging or tin slag after passing through the furnace.

[0023] The solder paste uses Alpha solder paste. The main components of Alpha solder paste are tin, lead, nickel, silver and other components, among which tin accounts for 60%-70%, and has good electrical conductivity and thermal conductivity. The lead component accounts for 30%-40%, which makes the solder paste fluid and wettable. The nickel component accounts for 1%-2%, which increases the strength and corrosion resistance of the solder paste. The silver component accounts for 0.1%-0.5%, which increases the conductivity and oxidation resistance of the solder paste.

[0024] The top of the partition 4 is coated with insulating paint, and the insulating paint is used to prevent the wires in the partition 4 from leaking electricity and thus affecting the use of the electronic components 2 above.

[0025] The bare board body 1 is packaged to provide physical protection for the chip inside, to prevent the impurities in the air from corroding the chip circuit and causing degradation of electrical performance, and to facilitate the transportation and installation of the bare board.

[0026] After the bare board body 1 is connected to the electrical components, the isolation withstand voltage is 3000VDC 0.5ma 1Mintue, and the output voltage accuracy reaches ±3%.

[0027] Example 2

[0028] See also Figure 1-4The utility model provides a technical solution: the limit plate 6 is replaced by a limit line 7, the limit line 7 is coated on the top of the insulating coating, and the material of the limit line 7 is a high temperature resistant material.

[0029] Different from Example 1, Example 2 adopts the process of limiting line 7 to prevent the position of the patch from being offset due to problems in the mounting process of the patch machine. When the limit plate 6 is hit during the offset process, the suction nozzle of the patch machine will tip over, which will cause the suction nozzle to bend and reduce the accuracy of the patch.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A DC module bare board chip power supply, comprising a bare board body (1) and an electronic component (2) arranged above the bare board body (1), wherein a plurality of the electronic components (2) are provided, and pins (3) are arranged above the plurality of the electronic components (2), characterized in that: Also included are: A partition (4), the partition (4) being arranged above the bare board body (1), the partition (4) being used to place electric wires and isolate interference between the bare board body (1) and the electronic components (2) above; A copper sheet (5), the copper sheet (5) being arranged on the upper surface of the partition (4), the copper sheet (5) being used to contact with the pins (3) of the electronic component (2) to complete the connection of the circuit; Solder paste, the solder paste is disposed on the copper sheet (5), and the solder paste is used to fix the pin (3) and thus fix the position of the electronic component (2); A limit plate (6), wherein the limit plate (6) is arranged in a direction of the electronic component (2) except the side of the pin (3), and the limit plate (6) is used to prevent the solder paste from turning when passing through a high-temperature furnace.

2. The DC module bare board chip power supply according to claim 1, characterized in that: There is a height difference between the upper surface of the copper sheet (5) and the upper surface of the partition (4), and the upper surface of the partition (4) is above the upper surface of the copper sheet (5).

3. The DC module bare board chip power supply according to claim 2, characterized in that: The solder paste adopts alpha solder paste.

4. The DC module bare board chip power supply according to claim 3, characterized in that: The upper part of the partition (4) is coated with insulating paint.

5. The DC module bare board chip power supply according to claim 4, characterized in that: The bare board body (1) is internally packaged using a packaging process.

6. The DC module bare board chip power supply according to claim 5, characterized in that: After the bare board body (1) is connected to the electrical component, the isolation withstand voltage is 3000VDC 0.5ma 1Mintue, and the output voltage accuracy reaches ±3%.

7. The DC module bare board chip power supply according to claim 6, characterized in that: The limiting plate (6) is replaced by a limiting line (7), and the limiting line (7) is coated on the top of the insulating paint. The material of the limiting line (7) is a high temperature resistant material.

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