Silicon wafer arranging device and sorting machine

Abstract

The utility model discloses a silicon wafer arranging device and a sorting machine, and belongs to the field of battery production. The silicon wafer neatening device comprises a first neatening mechanism and a second neatening mechanism which are symmetrically arranged on the two sides of a conveying belt for conveying silicon wafers, and each of the first neatening mechanism and the second neatening mechanism comprises a base, and a wheel set driving piece, a wheel set and a belt which are arranged on the base; the belt is sleeved on the wheel set and is driven by the wheel set to rotate so as to tidy and assist in conveying silicon wafers; the wheel set comprises a moving wheel and at least two supporting wheels, the moving wheel is arranged at the inlet end where the silicon wafers enter the position between the first normalizing mechanism and the second normalizing mechanism, and the belt section between the moving wheel and one supporting wheel comprises a leading-in section used for making contact with the silicon wafers. The belt section between the at least two supporting wheels comprises a neatening section used for being in contact with a silicon wafer; the silicon wafer enters the normalizing section through the leading-in section; and when the silicon wafer touches the lead-in section, the moving wheel elastically moves. The silicon wafer tidying device can reduce the damage of the silicon wafer to the belt, also plays a role in protecting the silicon wafer, and is good in tidying effect.

Description

Technical Field

[0001] The implementation mode of the utility model relates to the field of battery production, and more specifically, the utility model relates to a silicon wafer tidying device and a sorting machine. Background Art

[0002] During the processing of solar cells, silicon wafers are transported on a conveyor belt, and a aligning device is usually required to align the silicon wafers so that the silicon wafers can smoothly enter the inspection station, etc. The existing aligning device generally includes belts located on both sides of the silicon wafer conveyor belt. The distance between the two belts is adjustable. The two belts can be controlled to approach each other to align the silicon wafers transmitted by the conveyor belt. Due to the high transmission speed of the silicon wafer, the chamfer of the silicon wafer has a large impact on the belt, which is easy to cut the belt, shortening the life of the belt and easily causing damage to the silicon wafer. Utility Model Content

[0003] The example of the present application provides a silicon wafer tidying device and a sorting machine, in which a movable wheel that can elastically move back and forth is arranged in the wheel group on which the belt is mounted, thereby reducing the damage of the silicon wafer to the belt and also protecting the silicon wafer.

[0004] The solution of this application example is implemented through the following contents.

[0005] On the one hand, the utility model discloses a silicon wafer aligning device, the silicon wafer aligning device comprises a first aligning mechanism and a second aligning mechanism, the first aligning mechanism and the second aligning mechanism are symmetrically arranged on both sides of a conveyor belt for conveying silicon wafers, and the first aligning mechanism and the second aligning mechanism both comprise:

[0006] A base, and a wheel set driving member, a wheel set and a belt arranged on the base;

[0007] The belt is sleeved on the wheel set, the wheel set driving member is configured to drive the belt to rotate through the wheel set, and the belt is configured to regularize and assist in conveying the silicon wafers;

[0008] The wheel set includes a moving wheel and at least two supporting wheels, the moving wheel is elastically reciprocatingly arranged on the base, and the moving direction of the moving wheel is parallel to the conveying direction of the conveyor belt, the moving wheel is arranged at one end of the belt and the end is the entry end of the silicon wafer entering between the first regularization mechanism and the second regularization mechanism, the belt section between the moving wheel and one of the supporting wheels includes an introduction section for contacting the silicon wafer, and the belt section between the at least two supporting wheels includes a regularization section for contacting the silicon wafer;

[0009] The introduction sections of the first tidying mechanism and the second tidying mechanism are in a trumpet shape, so that the silicon wafer can enter between the first tidying mechanism and the second tidying mechanism, and the silicon wafer first passes through the introduction section and then enters the tidying section;

[0010] When the silicon wafer touches the introduction section, the moving wheel moves elastically.

[0011] When the inclined silicon wafer conveyed by the conveyor belt enters between the first regularization mechanism and the second regularization mechanism, the chamfer of the inclined silicon wafer will impact the belt at the introduction section. Because the moving wheel can move back and forth elastically, and the moving direction of the moving wheel is parallel to the conveying direction of the conveyor belt, when there is an impact force hitting the belt at the introduction section, the belt will pull the moving wheel to move adaptively along the conveying direction of the conveyor belt, thereby allowing the belt to be sunken due to the impact, avoiding the chamfer of the silicon wafer and the hard impact of the belt, and the impact force on the belt will be reduced, thereby reducing the damage to the belt and protecting the silicon wafer. After the belt of the introduction section is impacted by the silicon wafer, the moving wheel will be elastically reset, and the belt at the place where the sunken part occurs will also be reset. While the belt is reset, it will assist in regularizing the silicon wafer. After that, the silicon wafer enters the regularization section from the introduction section for further regularization, and the regularization effect is better.

[0012] Optionally, the silicon wafer aligning device also includes a sliding seat slidably connected to the base, the sliding direction of the sliding seat is parallel to the conveying direction of the conveyor belt, the moving wheel is installed on the sliding seat, and an elastic component is provided between the sliding seat and the base, the elastic component provides an elastic force to reset the sliding seat, and the elastic reciprocating movement of the moving wheel is achieved through the sliding cooperation between the sliding seat and the base and the elastic force generated by the elastic component between the two.

[0013] Optionally, a limiting member is fixed on the base, and the elastic member includes a spring, both ends of the spring respectively abut against the limiting member and the sliding seat, and the length direction of the spring is parallel to the conveying direction of the conveyor belt. With the help of the elastic force of the spring, the sliding seat can be extended or rebounded along the conveying direction of the conveyor belt, thereby driving the elastic reciprocating movement of the moving wheel.

[0014] Optionally, the limit member includes a limit block and a screw, the limit block has a receiving groove on one end surface facing the spring, a threaded hole is provided at the bottom of the receiving groove, the screw is engaged in the threaded hole, the head of the screw is cantilevered in the receiving groove, the first end of the spring is against the sliding seat, the second end of the spring is cantilevered into the receiving groove and against the head of the screw, and the elastic force of the spring can be adjusted by screwing the screw to different positions to achieve the adjustment of the sliding stroke of the sliding seat and the moving wheel.

[0015] Optionally, in order to limit the deformation direction of the spring, a spring support shaft can also be fixed on the sliding seat, the first end of the spring support shaft cantilevers into the accommodating groove, and the first end face of the spring support shaft and the head of the screw are arranged at a distance, and the spring is sleeved on the spring support shaft.

[0016] Optionally, in order to guide the sliding direction between the sliding seat and the base, a guide member may be provided between the sliding seat and the base, and the guiding direction of the guide member is parallel to the conveying direction of the conveyor belt.

[0017] Optionally, there are two support wheels, namely a first support wheel and a second support wheel, the first support wheel and the second support wheel are respectively fixed on the base, a first driving member is installed on the base, the first driving member is configured to drive the first support wheel or the second support wheel to rotate, the second support wheel is located between the first support wheel and the moving wheel, the distance from the moving wheel to the conveyor belt is greater than the distance from the second support wheel to the conveyor belt, and the belt segment between the moving wheel and the second support wheel constitutes the introduction segment; the distance from the second support wheel to the conveyor belt is greater than or equal to the distance from the first support wheel to the conveyor belt, and the belt segment between the second support wheel and the first support wheel constitutes the regular segment.

[0018] Optionally, there are three support wheels, namely a third support wheel, a fourth support wheel and a fifth support wheel, the third support wheel is fixed to the base, a second driving member is installed on the base, the second driving member is configured to drive the third support wheel to rotate, a moving seat and a seat driving member are provided on the base, the seat driving member is configured to drive the moving seat to move along the width direction of the conveyor belt, the fourth support wheel and the fifth support wheel are installed on the moving seat at intervals along the width direction of the conveyor belt, and the fourth support wheel is closer to the conveyor belt than the fifth support wheel, and the fourth support wheel and the fifth support wheel are both located between the third support wheel and the Between the moving wheels, the distance from the moving wheel to the conveyor belt is greater than the distance from the third support wheel to the conveyor belt, the belt segment between the moving wheel and the fourth support wheel constitutes the introduction segment, and the belt segment between the fourth support wheel and the third support wheel constitutes the regular segment, and the seat driving member is configured to drive the moving seat and the fourth support wheel and the fifth support wheel thereon to move: the fourth support wheel lifts the first side belt segment between the third support wheel and the moving wheel toward the direction approaching the conveyor belt, and / or the fifth support wheel lifts the second side belt segment between the third support wheel and the moving wheel toward the direction away from the conveyor belt.

[0019] Optionally, there are five support wheels, namely, one sixth support wheel and four seventh support wheels, the sixth support wheel is fixed to the base, a third driving member is installed on the base, the third driving member is configured to drive the sixth support wheel to rotate, a moving seat and a seat driving member are provided on the base, the seat driving member is configured to drive the moving seat to move along the width direction of the conveyor belt, the four seventh support wheels are all installed on the moving seat, the four seventh support wheels are divided into two groups, each group includes two seventh support wheels, the two seventh support wheels in each group are arranged at intervals along the conveying direction of the conveyor belt, and the four seventh support wheels are all arranged at intervals. Between the sixth support wheel and the moving wheel, the seat driving member is configured to drive the moving seat and the four seventh support wheels thereon to move to: one group of the seventh support wheels lifts up one side belt segment between the sixth support wheel and the moving wheel toward the direction close to the conveyor belt and the belt segment between two of the seventh support wheels in the group constitutes the regular segment, the belt segment between one of the seventh support wheels close to the moving wheel in the group and the moving wheel constitutes the introduction segment, and / or another group of the seventh support wheels lifts up the other side belt segment between the sixth support wheel and the moving wheel toward the direction away from the conveyor belt.

[0020] In another aspect, the utility model further discloses a sorting machine, the sorting machine comprising a feeding device, a conveyor belt, any one of the aforementioned silicon wafer tidying devices, a detection device and a sorting device;

[0021] The loading device is used to move the silicon wafer onto the conveyor belt;

[0022] The conveyor belt is used to convey the silicon wafers to the silicon wafer aligning device in sequence;

[0023] The silicon wafer aligning device is used to align the silicon wafers conveyed on the conveyor belt;

[0024] The detection device is used to detect the silicon wafers regularized by the silicon wafer regularization device;

[0025] The sorting device is used to sort the silicon wafers detected by the detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a silicon wafer tidying device exemplified in this application;

[0027] Figure 2 for Figure 1 A bottom view schematic diagram of the three-dimensional structure of the silicon wafer tidying device according to an example of the present application;

[0028] Figure 3This is a schematic diagram of the structure of the sliding seat and the base being slidably connected in the example of this application;

[0029] Figure 4 This is a schematic diagram of the structure of a support wheel used as an example in this application;

[0030] Figure 5 This is a schematic diagram of the structure of another support wheel used as an example in this application;

[0031] Figure 6 This is a schematic diagram of the structure of another support wheel used as an example in this application;

[0032] Figure 7 This is a schematic diagram of the structure of the movable seat and seat driving member on the base of the present application example.

[0033] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0034] 1-first regularization mechanism; 2-second regularization mechanism;

[0035] 11-base; 12-wheel set; 13-belt; 14-wheel set driving member; 15-sliding seat; 16-elastic member; 17-guide member;

[0036] 111-limiting member; 112-moving seat; 141-seat driving member; 121-moving wheel; 122-supporting wheel; 131-introduction section; 132-regular section; 151-spring support shaft; 161-spring;

[0037] 1111-limiting block; 1112-screw; 1113-accommodating groove; 1114-threaded hole; 1221-first support wheel; 1222-second support wheel; 1223-third support wheel; 1224-fourth support wheel; 1225-fifth support wheel; 1226-sixth support wheel; 1227-seventh support wheel. DETAILED DESCRIPTION

[0038] As attached Figure 1 and attached Figure 2 The silicon wafer tidying device shown in FIG. Figure 1 This is a three-dimensional diagram of the silicon wafer regularization device. Figure 2 For attachment Figure 1 In the present application, the applicant proposes a silicon wafer aligning device, which includes a first aligning mechanism 1 and a second aligning mechanism 2. The first aligning mechanism 1 and the second aligning mechanism 2 are symmetrically arranged on a conveyor belt (attached with Figure 1 (not shown in the figure), wherein the first regularizing mechanism 1 and the second regularizing mechanism 2 have the same structural shape. When describing the specific structures of the first regularizing mechanism 1 and the second regularizing mechanism 2 in this embodiment, the first regularizing mechanism 1 is taken as an example.

[0039] Combined with Figure 1 and attached Figure 2 As shown, in one embodiment, the first tidying mechanism 1 and the second tidying mechanism 2 both include: a base 11, and a wheel group driving member 14, a wheel group 12 and a belt 13 arranged on the base 11; the belt 13 is sleeved on the wheel group 12, and the wheel group driving member 14 is configured to drive the belt 13 to rotate through the wheel group 12, and the belt 13 is configured to tidy and assist in conveying silicon wafers; the wheel group 12 includes a moving wheel 121 and at least two supporting wheels 122, and the moving wheel 121 is elastically reciprocatingly arranged on the base 11, and the moving direction of the moving wheel 121 is parallel to the conveying direction of the conveyor belt, and the moving wheel 121 is arranged on the belt 13. one end, wherein the end is the entry end for the silicon wafer to enter between the first regularization mechanism 1 and the second regularization mechanism 2, the belt section between the moving wheel 121 and one of the supporting wheels 122 includes an introduction section 131 for contacting the silicon wafer, and the belt section between at least two supporting wheels 122 includes a regularization section 132 for contacting the silicon wafer; the introduction section 131 of the first regularization mechanism 1 and the second regularization mechanism 2 is horn-shaped to allow the silicon wafer to enter between the first regularization mechanism 1 and the second regularization mechanism 2, and the silicon wafer first passes through the introduction section 131 and then enters the regularization section 132; when the silicon wafer touches the introduction section 131, the moving wheel 121 moves elastically.

[0040] Attached Figure 2 The number of support wheels 122 shown in the figure is only one embodiment, and other numbers of support wheels 122 are also possible as long as they can form an introduction section 131 for contacting the silicon wafer and a regular section 132 for contacting the silicon wafer.

[0041] When the inclined silicon wafer conveyed by the conveyor belt enters between the first regularization mechanism 1 and the second regularization mechanism 2, the chamfer of the inclined silicon wafer will impact the introduction section 131 of the belt 13. Since the moving wheel 121 can move back and forth elastically, and the moving direction of the moving wheel 121 is parallel to the conveying direction of the conveyor belt, when there is an impact force impacting the introduction section 131 of the belt 13, the belt 13 will pull the moving wheel 121 to move adaptively along the conveying direction of the conveyor belt, thereby allowing the belt 13 to be sunken due to the impact, avoiding the hard impact of the chamfer of the silicon wafer and the belt 13, and the impact force on the belt 13 will be reduced, thereby reducing the damage to the belt 13, and also protecting the silicon wafer. After the belt of the introduction section 131 is impacted by the silicon wafer, the moving wheel 121 will be elastically reset, and the belt 13 at the place where the indentation occurs will also be reset. While the belt 13 is reset, it will assist in regularizing the silicon wafer. After that, the silicon wafer enters the regularization section 132 from the introduction section 131 for further regularization, and the regularization effect is better.

[0042] As attached Figure 1As shown, in some embodiments, the silicon wafer aligning device further includes a sliding seat 15 slidably connected to the base 11, and the sliding seat 15 is arranged at the entry end between the silicon wafer entering the first aligning mechanism 1 and the second aligning mechanism 2; the sliding direction of the sliding seat 15 is parallel to the conveying direction of the conveyor belt, and the moving wheel 121 is installed on the sliding seat 15. Among them, the sliding connection between the sliding seat 15 and the base 11 can adopt the mode of matching the slider and the guide rail, or other modes, and the moving wheel 121 can drive the sliding seat 15 to slide on the base 11 parallel to the conveying direction of the conveyor belt.

[0043] In addition, if attached Figure 1 As shown, an elastic component 16 is provided between the sliding seat 15 and the base 11, and the elastic component 16 provides elastic force to reset the sliding seat 15. When the silicon wafer impacts the introduction section 131, the moving wheel 121 and the sliding seat 15 will move along the conveying direction of the conveyor belt on the base 11, and the elastic component 16 will be compressed at the same time. When the silicon wafer is tidied, the elastic component 16 will rebound, so that the moving wheel 121 can be restored to its original position, so as to facilitate the tidiness of the next silicon wafer.

[0044] Continue as attached Figure 1 and attached Figure 3 As shown, in some embodiments, by fixing a stopper 111 on the base 11, the elastic component 16 includes a spring 161, and the two ends of the spring 161 are respectively against the stopper 111 and the sliding seat 15, and the length direction of the spring 161 is parallel to the conveying direction of the conveyor belt. One end of the spring 161 is limited by the stopper 111, and the other end of the spring 161 is against the sliding seat 15. The sliding seat 15 is extended or rebounded along the conveying direction of the conveyor belt by the elastic force of the spring 161, so as to avoid damaging the belt 13 when the chamfer of the inclined silicon wafer impacts the belt 13 at the introduction section 131. It should be emphasized that in the specific implementation, the elastic component 16 is not limited to the structural form of the spring 161, as long as it is any component that can provide elastic force to reset the sliding seat after sliding on the base, for example, it can also be an elastic rubber pad, an elastic metal sheet, etc.

[0045] Combined with Figure 1 and attached Figure 3As shown, in some embodiments, the stopper 111 includes a stopper 1111 and a screw 1112. The stopper 1111 is provided with a receiving groove 1113 on one end surface facing the spring 161. A threaded hole 1114 is provided at the bottom of the receiving groove 1113. The screw 1112 is fitted in the threaded hole 1114. The head of the screw 1112 is suspended in the receiving groove 1113. The first end of the spring 161 is against the sliding seat 15. The second end of the spring 161 is suspended in the receiving groove 1113 and is against the head of the screw 1112. By screwing the screw 1112 to move it in the threaded hole 1114, the distance between the head of the screw 1112 and the sliding seat 15 can be adjusted, thereby adjusting the elastic force of the spring 161 to adjust the sliding stroke of the sliding seat 15 and the moving wheel 121 when they are subjected to force; it can prevent the sliding seat 15 from compressing the spring 161 too much each time the silicon wafer impacts the belt 13, thereby improving the life of the spring 161.

[0046] Continue as attached Figure 3 As shown, in some embodiments, a spring support shaft 151 is fixed on the sliding seat 15, and the first end of the spring support shaft 151 cantilevers into the accommodating groove 1113, and the first end face of the spring support shaft 151 and the head of the screw 1112 are arranged at a distance, and the spring 161 is sleeved on the spring support shaft 151, and the axial length direction of the spring support shaft 151 is parallel to the conveying direction of the conveyor belt. The spring support shaft 151 guides the expansion and contraction of the spring 161, that is, the spring 161 only deforms in the conveying direction of the conveyor belt, thereby avoiding deformation in other directions causing the moving direction of the sliding seat 15 to deviate, and at the same time improving the service life of the spring 161.

[0047] Continue as attached Figure 1 As shown, in some embodiments, a guide member 17 is provided between the sliding seat 15 and the base 11, and the guiding direction of the guide member 17 is parallel to the conveying direction of the conveyor belt. The guide member 17 can be used in the form of a slider and a guide rail to guide the direction of the sliding connection between the sliding seat 15 and the base 11.

[0048] Combined with Figure 1 and attached Figure 4 As shown, in some embodiments, there are two support wheels 122, namely a first support wheel 1221 and a second support wheel 1222. The first support wheel 1221 and the second support wheel 1222 are respectively fixed to the base 11, and a first driving member (attached Figure 4The first driving member is configured to drive the first support wheel 1221 or the second support wheel 1222 to rotate, the second support wheel 1222 is located between the first support wheel 1221 and the moving wheel 121, the distance from the moving wheel 121 to the conveyor belt is greater than the distance from the second support wheel 1222 to the conveyor belt, and the belt section between the moving wheel 121 and the second support wheel 1222 constitutes the introduction section 131; the distance from the second support wheel 1222 to the conveyor belt is greater than or equal to the distance from the first support wheel 1221 to the conveyor belt, and the belt section between the second support wheel 1222 and the first support wheel 1221 constitutes the regularization section 132. Since the first regularization mechanism 1 and the second regularization mechanism 2 are symmetrically arranged on both sides of the conveyor belt, correspondingly, Figure 4 The middle distance B is slightly larger than A, or the distance B is equal to A. Both of these distance relationships can enable the regularization section 132 to effectively regularize the silicon wafer.

[0049] Combined with Figure 1 and attached Figure 5 As shown, in other embodiments, there are three support wheels 122, namely a third support wheel 1223, a fourth support wheel 1224 and a fifth support wheel 1225. The third support wheel 1223 is fixed to the base 11, and a second driving member (attached Figure 5 The second driving member is configured to drive the third supporting wheel 1223 to rotate, and a moving seat (attached Figure 5 Not shown) and seat drive (attached Figure 5The seat driving member is configured to drive the movable seat to move along the width direction of the conveyor belt. The fourth support wheel 1224 and the fifth support wheel 1225 are installed on the movable seat at intervals along the width direction of the conveyor belt, and the fourth support wheel 1224 is arranged closer to the conveyor belt than the fifth support wheel 1225. The fourth support wheel 1224 and the fifth support wheel 1225 are both located between the third support wheel 1223 and the movable wheel 121. The distance from the movable wheel 121 to the conveyor belt is greater than the distance from the third support wheel 1223 to the conveyor belt. The distance between the movable wheel 121 and the fourth support wheel 1224 is greater than the distance from the third support wheel 1223 to the conveyor belt. The belt segment constitutes the introduction segment 131, the belt segment between the fourth support wheel 1224 and the third support wheel 1223 constitutes the regularization segment 132, and the seat driving member is configured to drive the mobile seat and the fourth support wheel 1224 and the fifth support wheel 1225 thereon to move to: the fourth support wheel 1224 lifts the first side belt segment between the third support wheel 1223 and the moving wheel 121 toward the direction close to the conveyor belt, and / or the fifth support wheel 1225 lifts the second side belt segment between the third support wheel 1223 and the moving wheel 121 toward the direction away from the conveyor belt. During the regularization process, the final position of the fourth support wheel 1224 and the fifth support wheel 1225 moving toward the conveyor belt can be controlled to be: the length direction of the regularization segment 132 between the fourth support wheel 1224 and the third support wheel 1223 is parallel to the conveying direction of the conveyor belt, ensuring that the regularization segments 132 located on both sides of the conveyor belt can effectively regularize the silicon wafers, and the regularization segments 132 can assist in conveying the silicon wafers along the conveying direction of the conveyor belt. In addition, as shown in the attached Figure 5 As shown, the fourth support wheel 1224 and the fifth support wheel 1225 respectively lift the belt segments on both sides between the third support wheel 1223 and the moving wheel 121 to both sides. When the fourth support wheel 1224 and the fifth support wheel 1225 are driven to move in a direction away from the conveyor belt, the belt segment on the second side increases, and the corresponding belt segment on the first side decreases. The reduction of the belt segment on the first side will compensate for the belt segment on the second side, so that the movement of the moving wheel 121 will be reduced accordingly, and the deformation of the spring 161 will also be reduced, which can improve the service life of the spring 161. On the contrary, when the fourth support wheel 1224 and the fifth support wheel 1225 are driven to move in a direction close to the conveyor belt, the belt segment on the first side increases, and the corresponding belt segment on the second side decreases. The reduction of the belt segment on the second side will compensate for the belt segment on the first side, so that the movement of the moving wheel 121 will be reduced accordingly, and the deformation of the spring 161 will also be reduced, which can also improve the service life of the spring 161.

[0050] Combined with Figure 1 and attached Figure 6 As shown, in other embodiments, there are five support wheels 122, namely, one sixth support wheel 1226 and four seventh support wheels 1227. The sixth support wheel 1226 is fixed on the base 11, and a third driving member (attached) is installed on the base 11. Figure 6 The third driving member is configured to drive the sixth supporting wheel 1226 to rotate, and a moving seat (attached Figure 6 Not shown) and seat drive (attached Figure 6 The seat driving member is configured to drive the movable seat to move along the width direction of the conveyor belt. The four seventh support wheels 1227 are all installed on the movable seat. The four seventh support wheels 1227 are divided into two groups, each group includes two seventh support wheels 1227, and the two seventh support wheels 1227 in each group are arranged at intervals along the conveying direction of the conveyor belt. The four seventh support wheels 1227 are all located between the sixth support wheel 1226 and the movable wheel 121. The seat driving member is configured to drive the movable seat and the four seventh support wheels 1227 thereon to move to: one of the groups The seventh support wheel 1227 lifts up the belt segment on one side between the sixth support wheel 1226 and the moving wheel 121 toward the direction close to the conveyor belt, and the belt segment between the two seventh support wheels 1227 in the group constitutes a regular segment 132, and the belt segment between the seventh support wheel 1227 close to the moving wheel 121 in the group and the moving wheel 121 constitutes an introduction segment 131, and / or another group of seventh support wheels 1227 lifts up the belt segment on the other side between the sixth support wheel 1226 and the moving wheel 121 toward the direction away from the conveyor belt, and the belt segment between the second support wheel 1226 and the moving wheel 121 constitutes a regular segment 132. Figure 5 In the same manner, when the four seventh support wheels 1227 move, the belt sections on both sides between the sixth support wheel 1226 and the moving wheel 121 will also compensate each other, so as to increase the service life of the spring 161. In addition, to ensure the regularization effect, the final position of the four seventh support wheels 1227 moving toward the conveyor belt can be controlled such that the length direction of the regularization section 132 between two seventh support wheels 1227 is parallel to the conveying direction of the conveyor belt.

[0051] In addition, if attached Figure 7 As shown, in this embodiment, the first driving member, the second driving member, and the third driving member use motors as driving sources; the moving seat 112 and the seat driving member 141 are attached Figure 4 , Attachment Figure 5 , Attachment Figure 6 The structure is not shown in the figure. Figure 7 Examples in .

[0052] Attached Figure 4 , Attachment Figure 5 , Attachment Figure 6 The three implementation modes of different numbers of support wheels provided in this embodiment, and other structures that can form an introduction section and a regular section and can lift the belt toward the conveyor belt and away from the conveyor belt are all within the protection scope of this application.

[0053] Based on the same application concept, this embodiment also provides a sorting machine, which includes a loading device, a conveyor belt, the aforementioned silicon wafer tidying device, a detection device and a sorting device; the loading device is used to move the silicon wafers to the conveyor belt; the conveyor belt is used to transport the silicon wafers to the silicon wafer tidying device in sequence; the silicon wafer tidying device is used to tidy the silicon wafers transported on the conveyor belt; the detection device is used to detect the silicon wafers tidy after the silicon wafer tidying device; the sorting device is used to sort the silicon wafers after the detection by the detection device. It should be pointed out here that the silicon wafer tidying device in the above sorting machine has the same structure as the silicon wafer tidying device embodiment described above, and has the same beneficial effects as the above silicon wafer tidying device embodiment, so it will not be repeated. For the technical details not disclosed in the embodiment of the sorting machine of this application, technicians in this field please refer to the previous description for understanding, and in order to save space, it will not be repeated here.

[0054] The embodiments described above with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as limiting the present application.

[0055] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the foregoing describes one or more embodiments with reference to the accompanying drawings. Wherein, similar reference numerals throughout the text are used to refer to similar components. In the above description, for the purpose of explanation, many specific details are set forth in order to provide a more thorough understanding of one or more embodiments. However, it is obvious that in various cases, one or more embodiments can be practiced without these specific details, and each embodiment can be combined with each other and referenced to each other without contradiction.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described.

[0058] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0059] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A silicon wafer tidying device, characterized in that: The silicon wafer aligning device comprises a first aligning mechanism and a second aligning mechanism, wherein the first aligning mechanism and the second aligning mechanism are symmetrically arranged on both sides of a conveyor belt for conveying silicon wafers, and the first aligning mechanism and the second aligning mechanism both comprise: A base, and a wheel set driving member, a wheel set and a belt arranged on the base; The belt is sleeved on the wheel set, the wheel set driving member is configured to drive the belt to rotate through the wheel set, and the belt is configured to regularize and assist in conveying the silicon wafers; The wheel set includes a moving wheel and at least two supporting wheels, the moving wheel is elastically reciprocatingly arranged on the base, and the moving direction of the moving wheel is parallel to the conveying direction of the conveyor belt, the moving wheel is arranged at one end of the belt and the end is the entry end of the silicon wafer entering between the first regularization mechanism and the second regularization mechanism, the belt section between the moving wheel and one of the supporting wheels includes an introduction section for contacting the silicon wafer, and the belt section between the at least two supporting wheels includes a regularization section for contacting the silicon wafer; The introduction sections of the first tidying mechanism and the second tidying mechanism are in a trumpet shape, so that the silicon wafer can enter between the first tidying mechanism and the second tidying mechanism, and the silicon wafer first passes through the introduction section and then enters the tidying section; When the silicon wafer touches the introduction section, the moving wheel moves elastically.

2. The silicon wafer aligning device according to claim 1, characterized in that: The silicon wafer aligning device also includes a sliding seat slidably connected to the base, the sliding direction of the sliding seat is parallel to the conveying direction of the conveyor belt, the moving wheel is installed on the sliding seat, and an elastic component is provided between the sliding seat and the base, and the elastic component provides elastic force to reset the sliding seat.

3. The silicon wafer aligning device according to claim 2, characterized in that: A limiting member is fixed on the base, and the elastic member comprises a spring. Two ends of the spring are respectively pressed between the limiting member and the sliding seat, and the length direction of the spring is parallel to the conveying direction of the conveyor belt.

4. The silicon wafer aligning device according to claim 3, characterized in that: The limiting member includes a limiting block and a screw. The limiting block is provided with a receiving groove on one end surface facing the spring. A threaded hole is provided at the bottom of the receiving groove. The screw is engaged in the threaded hole. The head of the screw is cantilevered in the receiving groove. The first end of the spring is against the sliding seat, and the second end of the spring is cantilevered into the receiving groove and against the head of the screw.

5. The silicon wafer aligning device according to claim 4, characterized in that: A spring support shaft is fixed on the sliding seat, the first end of the spring support shaft is cantilevered into the accommodating groove, and the first end surface of the spring support shaft and the head of the screw are arranged at a distance, and the spring is sleeved on the spring support shaft.

6. The silicon wafer aligning device according to claim 3, characterized in that: A guide member is provided between the sliding seat and the base, and a guiding direction of the guide member is parallel to a conveying direction of the conveyor belt.

7. The silicon wafer aligning device according to claim 1, characterized in that: There are two support wheels, namely a first support wheel and a second support wheel, the first support wheel and the second support wheel are respectively fixed on the base, a first driving member is installed on the base, the first driving member is configured to drive the first support wheel or the second support wheel to rotate, the second support wheel is located between the first support wheel and the moving wheel, the distance from the moving wheel to the conveyor belt is greater than the distance from the second support wheel to the conveyor belt, and the belt section between the moving wheel and the second support wheel constitutes the introduction section; the distance from the second support wheel to the conveyor belt is greater than or equal to the distance from the first support wheel to the conveyor belt, and the belt section between the second support wheel and the first support wheel constitutes the regular section.

8. The silicon wafer aligning device according to claim 1, characterized in that: The three support wheels are respectively a third support wheel, a fourth support wheel and a fifth support wheel. The third support wheel is fixed to the base, a second driving member is installed on the base, and the second driving member is configured to drive the third support wheel to rotate. A moving seat and a seat driving member are provided on the base, and the seat driving member is configured to drive the moving seat to move along the width direction of the conveyor belt. The fourth support wheel and the fifth support wheel are installed on the moving seat at intervals along the width direction of the conveyor belt, and the fourth support wheel is closer to the conveyor belt than the fifth support wheel. The fourth support wheel and the fifth support wheel are both located between the third support wheel and the moving seat. The conveyor belt is arranged between the wheels, the distance from the moving wheel to the conveyor belt is greater than the distance from the third support wheel to the conveyor belt, the belt segment between the moving wheel and the fourth support wheel constitutes the introduction segment, and the belt segment between the fourth support wheel and the third support wheel constitutes the regular segment, and the seat driving member is configured to drive the moving seat and the fourth support wheel and the fifth support wheel thereon to move: the fourth support wheel lifts the first side belt segment between the third support wheel and the moving wheel toward the direction close to the conveyor belt, and / or the fifth support wheel lifts the second side belt segment between the third support wheel and the moving wheel toward the direction away from the conveyor belt.

9. The silicon wafer aligning device according to claim 1, characterized in that: There are five support wheels, namely, one sixth support wheel and four seventh support wheels. The sixth support wheel is fixed on the base. A third driving member is installed on the base. The third driving member is configured to drive the sixth support wheel to rotate. A moving seat and a seat driving member are provided on the base. The seat driving member is configured to drive the moving seat to move along the width direction of the conveyor belt. The four seventh support wheels are all installed on the moving seat. The four seventh support wheels are divided into two groups, each group includes two seventh support wheels, and the two seventh support wheels in each group are arranged at intervals along the conveying direction of the conveyor belt. The four seventh support wheels are all located at Between the sixth support wheel and the moving wheel, the seat driving member is configured to drive the moving seat and the four seventh support wheels thereon to move to: one group of the seventh support wheels lifts up one side belt segment between the sixth support wheel and the moving wheel toward the direction close to the conveyor belt and the belt segment between two of the seventh support wheels in the group constitutes the regular segment, the belt segment between one of the seventh support wheels close to the moving wheel in the group and the moving wheel constitutes the introduction segment, and / or another group of the seventh support wheels lifts up the other side belt segment between the sixth support wheel and the moving wheel toward the direction away from the conveyor belt.

10. A sorting machine, characterized in that: The sorting machine comprises a loading device, a conveyor belt, a silicon wafer aligning device as described in any one of claims 1 to 9 above, a detection device and a sorting device; The loading device is used to move the silicon wafer onto the conveyor belt; The conveyor belt is used to convey the silicon wafers to the silicon wafer aligning device in sequence; The silicon wafer aligning device is used to align the silicon wafers conveyed on the conveyor belt; The detection device is used to detect the silicon wafers regularized by the silicon wafer regularization device; The sorting device is used to sort the silicon wafers detected by the detection device.

Images