Multi-layer packaged gas sensor

Abstract

The multi-layer packaged gas sensor comprises a metal tube shell, a plurality of LGA sensors and a PCB (Printed Circuit Board), the LGA sensor adopts single packaging, the temperature of a heating chip is kept, and the performance of the sensor is improved; the packaging has a microporous structure, so that the waterproof effect can be realized, and the response speed and the stability are also improved; the plurality of LGA sensors are arranged on the PCB in the shell in parallel, so that the structural stability of the sensors is enhanced; the overall gas detection accuracy, substitutability and anti-interference capability are also improved; the reliability of circuit connection between the PCB and the MEMS micro hot plate gas sensor chip is realized by adopting a gold wire binding connection mode; the multi-layer circuit lead design aims at efficiently transmitting information collected by the MEMS micro hot plate gas sensor chip in a multi-line mode, the stability and accuracy of signal transmission are guaranteed, the overall performance of the gas sensor is remarkably improved, and it is guaranteed that the gas sensor is suitable for more practical applications.

Description

Technical Field

[0001] The utility model relates to the field of gas (odor) detection, in particular to a multi-layer packaged gas sensor. Background Art

[0002] In the field of gas sensors, the packaging technology of the sensor has an important impact on its performance. At present, common sensor packaging forms mainly include metal tube shell (T05) packaging and LGA packaging. Although these packaging forms meet the basic use requirements of sensors to a certain extent, they generally have some obvious shortcomings.

[0003] Specifically, the existing single-package sensor structure is relatively simple, which to some extent limits its application in complex environments. Due to the single structure, these sensors often lack accuracy and anti-interference ability. In practical applications, especially in gas detection situations that require high precision and high stability, the performance of these sensors often cannot meet actual needs.

[0004] In view of the above problems, the present invention proposes a multi-layer packaged gas (odor) sensor. By stacking the packaging, the performance of the sensor is significantly improved to meet the urgent market demand for high-precision and high-stability gas sensors. Utility Model Content

[0005] In order to solve the above technical problems, the utility model scientifically designs a multi-layer packaged gas (odor) sensor, the core of which is to combine the metal tube shell (T05) packaging and LGA packaging technology to improve the performance of the gas sensor.

[0006] The technical solution adopted by the utility model to solve the above problems is: a multi-layer packaged gas sensor, including a metal tube shell, a plurality of LGA sensors and a PCB board;

[0007] The metal tube shell includes a filter, a shell cap, a base and a plurality of pins. The filter is arranged at the opening of the top surface of the shell cap. The shell cap is arranged in a round cap shape. The base is composed of a round base and a round step on the top. The upper ends of the plurality of pins pass through the base from bottom to top and are welded and fixed to the plurality of electrode terminals on the PCB board one by one. The plurality of LGA sensors are respectively welded and fixed to the plurality of electrode terminals on the PCB board through the plurality of first lead terminals on the bottom plate.

[0008] Each of the LGA sensors comprises the base plate, an upper cover and a MEMS micro-thermal gas sensor chip. The upper cover is buckled on the front of the base plate to form a cavity, and an air hole is arranged on the top surface of the upper cover. The MEMS micro-thermal gas sensor chip is fixedly arranged in the middle of the front of the base plate, and a plurality of lead terminals are arranged around the front of the base plate. The plurality of first lead terminals on the base plate and the plurality of second lead terminals on the MEMS micro-thermal gas sensor chip are connected one by one through a plurality of gold wires to form a circuit.

[0009] Compared with the prior art, the advantages of the utility model are:

[0010] The utility model discloses a multi-layer packaged gas sensor, comprising a metal tube shell, a plurality of LGA sensors and a PCB board; the LGA sensor adopts a single package, which can make the package of the sensor small, maintain the temperature of the heating chip, and improve the performance of the sensor; by arranging a plurality of LGA sensors in parallel on the PCB board in the shell, not only the structural stability of the sensor is enhanced; but also the overall gas detection accuracy, substitutability and anti-interference ability are improved by integrating a plurality of sensors and working together; a gold wire binding connection method is adopted to achieve the reliability of the circuit connection between the PCB board and the MEMS micro-hotplate gas sensor chip; the multi-layer circuit lead design is intended to efficiently transmit the information collected by the MEMS micro-hotplate gas sensor chip through multiple lines, ensure the stability and accuracy of signal transmission, significantly improve the overall performance of the gas sensor, and ensure its applicability to more practical applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0012] Figure 2 It is an exploded schematic diagram of the overall structure of the utility model;

[0013] Figure 3 The overall structure of the LGA sensor of the utility model is shown in FIG. Figure 1 ;

[0014] Figure 4 The overall structure of the LGA sensor of the utility model is shown in FIG. Figure 2 ;

[0015] Figure 5 It is a schematic diagram of the overall structure explosion of the LGA sensor of the utility model. DETAILED DESCRIPTION

[0016] The specific implementation methods of the present invention are further described in detail below in conjunction with the accompanying drawings. It should be noted that the following descriptions of the implementation methods are only used to help understand the present invention, but are not intended to limit the technical solutions described in the present invention. In addition, the technical features involved in the various implementation methods of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0017] In this specific embodiment, Figure 1-5 As shown, a multi-layer packaged gas sensor includes a metal tube shell, a plurality of LGA sensors 5 and a PCB board 7;

[0018] The metal tube shell includes a filter 1, a shell cap 2, a base 3 and a plurality of pins 4. The filter 1 is arranged at the opening on the top surface of the shell cap 2 to filter impurities while allowing air to circulate; the shell cap 2 is arranged in a round cap shape, and the base 3 is composed of a circular base and a circular step on the top; the upper ends of the plurality of pins 4 pass through the base 3 from bottom to top and are welded and fixed to the plurality of electrode terminals 6 on the PCB board 7 in a one-to-one correspondence; the plurality of LGA sensors 5 are respectively welded and fixed to the plurality of electrode terminals 6 on the PCB board 7 through the plurality of first lead terminals 54 of the bottom plate 53.

[0019] In this specific embodiment, Figure 1-5 As shown, each of the LGA sensors 5 includes the base plate 53, the upper cover 52 and the MEMS micro-thermal gas sensor chip 57; the upper cover 52 is snapped on the front of the base plate 53 to form a cavity, and a vent hole 51 is arranged on the top surface of the upper cover 52 for air circulation; the MEMS micro-thermal gas sensor chip 57 is fixedly arranged in the middle of the front of the base plate 53, and a plurality of lead terminals 54 are arranged around the front of the base plate 53, and the plurality of first lead terminals 54 on the base plate 53 and the plurality of second lead terminals 56 on the MEMS micro-thermal gas sensor chip 57 are connected one by one through a plurality of gold wire binding wires 55 to form a circuit, so that the gas information collected by the MEMS micro-thermal gas sensor chip 57 is transmitted to form the sensing collection of gas information.

[0020] Compared with the prior art, the advantages of the utility model are:

[0021] The utility model discloses a multi-layer packaged gas sensor, comprising a metal tube shell, a plurality of LGA sensors and a PCB board; the LGA sensor adopts a single package, which can make the package of the sensor small, maintain the temperature of the heating chip, and improve the performance of the sensor; the package has a microporous structure, which can not only achieve a waterproof effect, but also improve the response speed and stability; by arranging a plurality of LGA sensors in parallel on the PCB board in the shell, not only the structural stability of the sensor is enhanced; but also the integration of multiple sensors to work together improves the overall gas detection accuracy, substitutability and anti-interference ability; a gold wire binding connection method is adopted to achieve the reliability of the circuit connection between the PCB board and the MEMS micro-hotplate gas sensor chip; the multi-layer circuit lead design is intended to efficiently transmit the information collected by the MEMS micro-hotplate gas sensor chip through multiple lines, ensure the stability and accuracy of signal transmission, significantly improve the overall performance of the gas sensor, and ensure that it is suitable for more practical applications.

[0022] Finally, it should be noted that the specific embodiments described in this article are merely examples of the spirit of the utility model, and are not intended to limit the implementation methods of the utility model. Those skilled in the art of the utility model can make various modifications or supplements to the specific embodiments described, or replace them in similar ways. It is not necessary and impossible to provide all examples of all implementation methods here. These obvious changes or modifications derived from the essential spirit of the utility model still fall within the scope of protection of the utility model, and interpreting them as any additional restrictions is contrary to the spirit of the utility model.

Claims

1. A multi-layer packaged gas sensor, characterized in that: A multi-layer packaged gas sensor, comprising a metal tube shell, a plurality of LGA sensors and a PCB board; The metal tube shell includes a filter, a shell cap, a base and a plurality of pins. The filter is arranged at the opening of the top surface of the shell cap. The shell cap is arranged in a round cap shape. The base is composed of a round base and a round step on the top. The upper ends of the plurality of pins pass through the base from bottom to top and are welded and fixed to the plurality of electrode terminals on the PCB board one by one. The plurality of LGA sensors are respectively welded and fixed to the plurality of electrode terminals on the PCB board through the plurality of first lead terminals on the bottom plate.

2. A multi-layer packaged gas sensor according to claim 1, characterized in that: Each of the LGA sensors comprises the base plate, an upper cover and a MEMS micro-thermal gas sensor chip. The upper cover is buckled on the front of the base plate to form a cavity, and an air hole is arranged on the top surface of the upper cover. The MEMS micro-thermal gas sensor chip is fixedly arranged in the middle of the front of the base plate, and a plurality of lead terminals are arranged around the front of the base plate. The plurality of first lead terminals on the base plate and the plurality of second lead terminals on the MEMS micro-thermal gas sensor chip are connected one by one through a plurality of gold wires to form a circuit.

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