Rectifier bridge structure
By adopting multiple unidirectional bridge structures to arrange corresponding to the convex points in the rectifier bridge structure, the P-side of the grain is connected to the convex points, and the N-side is directly connected to the surface, the poor heat dissipation and forward surge capability of the existing rectifier bridge structure are solved. The problem of insufficient results has achieved higher welding flatness and performance improvement.
Patent Information
- Application Number
- CN202421129438.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-05-22
AI Technical Summary
During the welding process, the existing rectifier bridge structures have poor heat dissipation, low DVF reading and insufficient forward surge capacity.
Multiple unidirectional bridge structures are arranged corresponding to the bumps, the P-side of the grains are connected to the bumps, and the N-side is directly connected to the surface, increasing the contact area, improving welding flatness and heat dissipation, and improving forward surge capacity.
It effectively improves the flatness, heat dissipation and forward surge capacity after welding, avoids pressure loss of glass packaging, and makes full use of the effective contact area of the grain.
Smart Images
Figure CN222365596U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of rectifier bridges, in particular to a rectifier bridge structure. Background Art
[0002] A rectifier bridge is an electronic component used to convert alternating current into direct current. It can be used to meet the needs of stable DC voltage and current in the industrial field. Types include: single-phase rectifier bridge and three-phase rectifier bridge.
[0003] The crystal in the rectifier bridge is a semiconductor material wafer, which contains P-type and N-type semiconductor materials and forms a PN structure; it is covered with a layer of glass encapsulation on the P side (P-type semiconductor surface) and has a metal contact area in the middle area. The metal contact area is used to connect to the external circuit; while the glass encapsulation is used to protect the crystal surface, provide insulation and mechanical support, and mark it, which helps to protect the crystal from the external environment, prevent oxidation and corrosion, and ensure the performance and reliability of the rectifier bridge.
[0004] The current rectifier bridge structure is designed with bumps at the connection with the crystal grain, and is soldered to it to prevent the connecting piece or jumper piece from pressing onto the glass package on the P side of the crystal grain, thereby causing electrical failure.
[0005] However, this type of double-bump connection structure has a small contact area with the crystal grain, which can easily cause the crystal grain to become uneven during the welding process. In addition, since the N side of the crystal grain is the effective contact area, if it is connected with the bump, part of the effective contact area of the N side will not be utilized, resulting in poor heat dissipation of the material itself and reduced DVF readings and forward surge capabilities. Utility Model Content
[0006] The utility model aims to provide a rectifier bridge structure, which solves the technical problems of poor heat dissipation, DVF reading and forward surge capability of the rectifier bridge structure in the prior art.
[0007] The utility model discloses a rectifier bridge structure, comprising:
[0008] A first connecting piece having two or three first protrusions on the top surface;
[0009] a second connecting piece, arranged at an interval from the first connecting piece;
[0010] A first pin, disposed on the first connecting sheet;
[0011] A second pin, disposed on the second connecting piece;
[0012] A plurality of one-way bridge structures corresponding to the first protrusions one by one and arranged at intervals from each other, each of the one-way bridge structures comprising
[0013] The jumper has a second bump on the bottom surface of one end.
[0014] The first crystal grain has a P surface connected to the top surface of one of the first bumps, and an N surface connected to the bottom surface of the other end of the jumper sheet.
[0015] The second crystal grain has a P surface connected to the bottom surface of the second bump and an N surface connected to the top surface of the second connecting piece.
[0016] The third pin is arranged on the jumper sheet.
[0017] The present application connects the P surface of the crystal grain to the bump and the N surface directly to the surface, thereby avoiding pressure loss on the glass package on the P surface of the crystal grain and making full use of the effective contact area on both sides of the crystal grain, thereby improving the flatness after welding, enhancing the heat dissipation of the material, and improving the DVF reading and forward surge capability.
[0018] On the basis of the above technical solution, the solution of this application can also be improved as follows:
[0019] Preferably, the first bump and the second bump are both circular; adopting this solution, the contact area with the metal contact area on the P surface of the grain is increased.
[0020] Preferably, the thickness of the first bump and the second bump are equal, and the thickness of the first crystal grain and the second crystal grain are equal; by adopting this solution, the jumper piece can remain flat after welding, thereby improving the connection stability.
[0021] Preferably, one side of the first connecting piece partially extends outward to form a first lead-out area, and the first pin is connected to the top surface of the first lead-out area;
[0022] One side of the second connecting piece partially extends outward to form a second lead-out area, and the second pin is connected to the top surface of the second lead-out area. By adopting this solution, the first pin and the second pin can be welded to the correct position conveniently and quickly, thereby improving the product yield and the efficiency of production and installation.
[0023] Preferably, it also includes:
[0024] substrate;
[0025] An insulating sheet, disposed on the top surface of the substrate;
[0026] Wherein, the first connecting piece and the second connecting piece are both arranged on the top surface of the insulating piece; adopting this solution, the first connecting piece and the second connecting piece can be supported, thereby improving the stability of the overall structure and extending the service life.
[0027] Preferably, the substrate is of a rectangular structure and is provided with a positioning chamfer at a corner; this solution improves the regularity of the product, facilitates installation and use, and makes it easy to identify the front and back, thereby improving assembly efficiency and reducing product defective rate.
[0028] Preferably, positioning through holes are provided at two opposite corners of the top surface of the substrate, and the insulating sheet is provided with avoidance grooves that are compatible with the positioning through holes; adopting this solution, it is convenient to correctly install the rectifier bridge structure in the packaging shell, thereby improving assembly efficiency, reducing product defective rate, and avoiding interference between the insulating sheet and the positioning column in the packaging shell during assembly, thereby reducing the accidental damage rate of the rectifier bridge structure during the assembly process.
[0029] Through the above technical solution, the utility model achieves the following beneficial effects:
[0030] The present application connects the P surface of the crystal grain to the bump and the N surface directly to the surface, thereby avoiding pressure loss on the glass package on the P surface of the crystal grain and making full use of the effective contact area on both sides of the crystal grain, thereby improving the flatness after welding, enhancing the heat dissipation of the material, and improving the DVF reading and forward surge capability. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 A top view of the rectifier bridge structure described in a specific embodiment of the utility model;
[0033] Figure 2 for Figure 1 A schematic diagram of the structure of the substrate and the insulating sheet in the rectifier bridge structure shown;
[0034] Figure 3 for Figure 1 A schematic diagram of the structure of the first connecting piece and the second connecting piece in the rectifier bridge structure shown;
[0035] Figure 4 for Figure 1 The front cross-sectional view of the rectifier bridge structure shown;
[0036] Figure 5 for Figure 1 A bottom view of the jumper in the rectifier bridge structure shown;
[0037] Description of reference numerals:
[0038] 1. First connecting piece; 2. Second connecting piece; 3. First pin; 4. Second pin; 5. One-way bridge structure; 6. Base plate; 7. Insulating sheet;
[0039] 11, first bump; 12, first lead-out area; 21, second lead-out area; 51, jumper; 52, first crystal grain; 53, second crystal grain; 54, third pin; 61, positioning chamfer; 62, positioning through hole; 71, avoidance groove;
[0040] 511. The second convex point. DETAILED DESCRIPTION
[0041] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.
[0042] First of all, it should be noted that in the following description, some directional words, such as "top surface" and "bottom surface", etc., are used to clearly explain the technical solution of the utility model, and all of them have the meanings inferred from the normal directions of the components in the rectifier bridge structure. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the utility model.
[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features.
[0044] In this application, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0045] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0046] Example:
[0047] like Figure 1As shown, an embodiment of the present application discloses a rectifier bridge structure, which is an electronic component used to convert alternating current into direct current, and its specific structure includes: a first connecting plate 1, a second connecting plate 2, a first pin 3, a second pin 4 and multiple unidirectional bridge structures 5.
[0048] The top surface of the first connecting piece 1 has two or three first protrusions 11; the first connecting piece 1 is preferably in a rectangular structure and the first protrusions 11 are evenly spaced along the axial direction on the top surface close to the second connecting piece 2, and the first protrusions 11 have good regularity and are easy to install and arrange; the top surface of the first protrusion 11 is a plane, which is used to increase the contact area with the grain.
[0049] The second connecting piece 2 is spaced apart from the first connecting piece 1; the shape and size of the second connecting piece 2 are preferably consistent with the first connecting piece 1, which is convenient for production and processing, and the two are centrally symmetrically arranged, which improves the compactness of the structure and good regularity.
[0050] The first pin 3 is arranged on the first connecting piece 1; the first pin 3 and the first connecting piece 1 can be an integrally formed part or a split type, without specific limitation; in the present embodiment, the first pin 3 is a split type and has an overall L-shaped structure, which is convenient for welding to the top surface of the first connecting piece 1 during assembly.
[0051] The second pin 4 is arranged on the second connecting piece 2; it can also be an integrally formed part or a split type, without specific limitation; in this embodiment, the second pin 4 is a split type and has the same shape and structure as the first pin 3, which is easy to produce.
[0052] The number of the one-way bridge structures 5 corresponds to the number of the first protrusions 11 one by one, and they are arranged at intervals from each other; they are preferably arranged side by side and evenly, which is convenient for production and assembly and has high structural stability.
[0053] It should be noted that if the number of the unidirectional bridge structures 5 is two, the present application is a single-phase rectifier bridge structure; if the number of the unidirectional bridge structures 5 is three, the present application is a three-phase rectifier bridge structure.
[0054] Specifically, Figure 1 , Figure 4 and Figure 5 As shown, each unidirectional bridge structure 5 includes: a jumper 51 , a first die 52 , a second die 53 and a third pin 54 .
[0055] For example, Figure 5 As shown, the bottom surface of one end of the jumper piece 51 has a second protrusion 511; the jumper piece 51 is rectangular as a whole, has good regularity, and has a plurality of arc grooves on both sides of the middle part to save manufacturing materials.
[0056] like Figure 4As shown, the P surface of the first crystal grain 52 is connected to the top surface of a first bump 11, and the N surface of the first crystal grain 52 is connected to the bottom surface of the other end of the jumper sheet 51. The P surface of the second crystal grain 53 is connected to the bottom surface of the second bump 511, and the N surface of the second crystal grain 53 is connected to the top surface of the second connecting sheet 2; the connection method is specifically welding by soldering.
[0057] The third pin 54 is arranged on the jumper piece 51; it can also be an integrally formed part or a split type, without specific limitation; in the present embodiment, the third pin 54 is a split type and has the same shape and structure as the first pin 3 and the second pin 4, and is welded to the top surface of the jumper piece 51, which is convenient for production and manufacturing and reduces costs.
[0058] It is understandable that, to ensure circuit conduction, the first connecting piece 1, the second connecting piece 2, the first pin 3, the second pin 4, the jumper piece 51 and the third pin 54 are all made of conductive metal materials, and are preferably copper, but not limited thereto.
[0059] The utility model connects the P surface of the crystal grain with the convex point and the N surface directly with the surface, thereby avoiding pressure loss on the glass package on the P surface of the crystal grain and making full use of the effective contact area on both sides of the crystal grain, improving the flatness after welding, enhancing the heat dissipation of the material, and improving the DVF reading and positive surge capacity.
[0060] It should be noted that the DVF (Die Voltage Forward) reading refers to the voltage drop of the diode when it is forward-conducting, usually expressed in volts. It is determined by applying a forward voltage to the diode and measuring the voltage in the on state. This measurement can be used to determine whether the diode is in normal working condition. Under normal circumstances, the DVF reading should be close to the rated on-state voltage of the diode, indicating that the diode has normal conduction characteristics. If the DVF reading deviates from the rated value, it may indicate that there is a problem with the diode, such as aging, damage or failure.
[0061] It should be noted that forward surge capability refers to the ability of electronic devices to withstand instantaneous peak current in the forward conduction state. It is used to evaluate the performance and stability of the rectifier bridge and is one of the key indicators to ensure the safe operation of electronic devices under power switching, load mutation, transient faults, etc.
[0062] In some embodiments, Figure 3 and Figure 5 As shown, the first bump 11 and the second bump 511 are both circular, used to increase the contact area with the metal contact area on the P surface of the grain, but are not limited to this, and can also be other shapes such as regular hexagons and regular octagons.
[0063] In some embodiments, Figure 4 As shown, the thickness of the first bump 11 and the second bump 511 are equal, and the thickness of the first crystal grain 52 and the second crystal grain 53 are equal; thereby, the jumper piece 51 can remain flat after welding, thereby improving the connection stability.
[0064] In some embodiments, Figure 3 As shown, in order to improve the accuracy of the welding position, one side of the first connecting piece 1 partially extends outward to form a first lead-out area 12, and the first pin 3 is connected to the top surface of the first lead-out area 12; one side of the second connecting piece 2 partially extends outward to form a second lead-out area 21, and the second pin 4 is connected to the top surface of the second lead-out area 21.
[0065] Specifically, the shapes and sizes of the first lead-out area 12 and the second lead-out area 21 correspond to the bottom surfaces of the first pin 3 and the second pin 4 , and are rectangular in this embodiment, but are not limited thereto.
[0066] By designing the first lead-out area 12 and the second lead-out area 21 , the first pin 3 and the second pin 4 can be welded at the correct position conveniently and quickly, thereby improving the yield of the product and the efficiency of production and installation.
[0067] In some embodiments, Figures 1 to 4 As shown, in order to improve the structural stability, it also includes: a substrate 6 and an insulating sheet 7. The substrate 6 is preferably made of copper; the insulating sheet 7 is arranged on the top surface of the substrate 6; the insulating sheet 7 can be made of a ceramic sheet or other insulating materials. Among them, the first connecting sheet 1 and the second connecting sheet 2 are both arranged on the top surface of the insulating sheet 7.
[0068] The first connecting sheet 1 and the second connecting sheet 2 can be supported by providing the base plate 6 and the insulating sheet 7, thereby improving the stability of the overall structure and extending the service life.
[0069] Based on the above embodiments, Figure 1 As shown, the base plate 6 is a rectangular structure, and a positioning chamfer 61 is provided at a corner. This design improves the regularity of the product, facilitates installation and use, and can easily identify the front and back, improves assembly efficiency, and reduces product defect rate.
[0070] Based on the above embodiments, Figure 1 As shown, two opposite corners of the top surface of the substrate 6 are provided with positioning through holes 62 , and the insulating sheet 7 is provided with avoidance grooves 71 matched with the positioning through holes 62 .
[0071] By designing the positioning through hole 62, the rectifier bridge structure can be easily installed in the packaging shell, which improves the assembly efficiency and reduces the product defect rate; by providing the avoidance groove 71, the insulation sheet 7 is prevented from interfering with the positioning column in the packaging shell during assembly, thereby reducing the accidental damage rate of the rectifier bridge structure during the assembly process.
[0072] In the specification of the present utility model, a lot of specific details are described. However, it is understood that the embodiments of the present utility model can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this specification.
[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.
[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and specification of the utility model.
Claims
1. A rectifier bridge structure, characterized in that: include: A first connecting piece (1) having two or three first protrusions (11) on its top surface; A second connecting piece (2) arranged at an interval from the first connecting piece (1); A first pin (3) is arranged on the first connecting piece (1); A second pin (4) is provided on the second connecting piece (2); A plurality of one-way bridge structures (5) corresponding to the first protrusions (11) one by one and arranged at intervals from each other, each of the one-way bridge structures (5) comprising The jumper piece (51) has a second protrusion (511) on the bottom surface of one end. The first crystal grain (52) has a P surface connected to the top surface of one of the first bumps (11), and an N surface connected to the bottom surface of the other end of the jumper sheet (51). The second crystal grain (53) has a P surface connected to the bottom surface of the second bump (511), and an N surface connected to the top surface of the second connecting piece (2). The third pin (54) is arranged on the jumper sheet (51).
2. The rectifier bridge structure according to claim 1, characterized in that: The first convex point (11) and the second convex point (511) are both circular.
3. The rectifier bridge structure according to claim 1, characterized in that: The thickness of the first bump (11) and the second bump (511) are equal, and the thickness of the first crystal grain (52) and the second crystal grain (53) are equal.
4. The rectifier bridge structure according to claim 1, characterized in that: One side of the first connecting piece (1) partially extends outward to form a first lead-out area (12), and the first lead (3) is connected to the top surface of the first lead-out area (12); One side of the second connecting piece (2) partially extends outward to form a second lead-out area (21), and the second lead (4) is connected to the top surface of the second lead-out area (21).
5. The rectifier bridge structure according to claim 1, characterized in that: Also includes: base(6); An insulating sheet (7) is arranged on the top surface of the substrate (6); Wherein, the first connecting sheet (1) and the second connecting sheet (2) are both arranged on the top surface of the insulating sheet (7).
6. The rectifier bridge structure according to claim 5, characterized in that: The base plate (6) is in a rectangular structure and is provided with a positioning chamfer (61) at a corner.
7. The rectifier bridge structure according to claim 6, characterized in that: Two opposite corners of the top surface of the base plate (6) are provided with positioning through holes (62), and the insulating sheet (7) is provided with avoidance grooves (71) matched with the positioning through holes (62).