Component for camera module

Abstract

The utility model discloses an assembly for a camera module. The assembly comprises an insulating body, a metal substrate and a ceramic substrate. At least part of the metal substrate is embedded in the insulating body. At least part of the ceramic substrate is embedded in the insulating body, the ceramic substrate is provided with two opposite faces, and at least part of the area of one face of the ceramic substrate is attached to and connected with the metal substrate. According to the camera module assembly, the metal substrate is embedded in the insulating body, the structural strength of the insulating body can be enhanced, the overall structural strength of the camera module assembly is further enhanced, the ceramic substrate and the metal substrate are arranged in an attached and connected mode, and when the metal substrate and the ceramic substrate are embedded in the insulating body or the camera module assembly is used, the ceramic substrate and the metal substrate are arranged in an attached and connected mode. The metal substrate can bear part of impact force, the impact force borne by the ceramic substrate is reduced, and therefore the ceramic substrate is prevented from being broken.

Description

Technical Field

[0001] The utility model relates to the technical field of camera equipment, and in particular to a component for a camera module. Background Art

[0002] With the rapid development of electronic equipment, camera modules are widely used in consumer electronics, medical, security, industrial production and other fields. With the miniaturization of electronic products and people's increasing requirements for taking pictures, camera modules also need to continuously reduce their size, but this will lead to a weakening of the structural strength of the camera module. In the prior art, the camera module includes a camera module component and an optical element, and the optical element is driven by the camera module component to perform zooming, focusing or anti-shake, etc. In the process of driving the camera module component, the ceramic substrate is often used in the camera module component due to its better wear resistance and better hardness. Therefore, the camera module component may include an insulating body and a ceramic substrate buried in the insulating body, but the ceramic substrate of the prior art is fragile when bent, and the ceramic substrate is easy to break during the process of burying and using, which affects the structural strength and performance of the camera module component.

[0003] Therefore, existing components for camera modules need to be improved. Summary of the invention

[0004] The purpose of the utility model is to provide a camera module component, which can not only enhance the overall structural strength of the camera module component, but also reduce the impact force on the ceramic substrate, thereby avoiding the ceramic substrate from breaking.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A camera module assembly, comprising:

[0007] Insulation body;

[0008] A metal substrate, at least a portion of which is buried in the insulating body;

[0009] A ceramic substrate, at least a portion of which is buried in the insulating body, the ceramic substrate has two opposite surfaces, and at least a portion of one surface of the ceramic substrate is abutted against and connected to the metal substrate.

[0010] Preferably, a friction zone is provided on one side of the ceramic substrate, and the friction zone is exposed from the insulating body, so that the friction zone and another matching component are in contact with each other and move relative to each other.

[0011] Preferably, it further comprises electronic components and circuits disposed on the ceramic substrate, the electronic components are electrically connected to the circuits, and the electronic components are electrically connected to external components through the circuits; and / or,

[0012] The electronic component is electrically connected to other components in the camera module assembly through the circuit.

[0013] Preferably, two opposite surfaces of the ceramic substrate are respectively a first surface and a second surface, the first surface of the ceramic substrate faces the metal substrate, and the electronic component is arranged on the first surface or the second surface of the ceramic substrate.

[0014] Preferably, the electronic component is arranged on the first surface of the ceramic substrate, the circuit is provided with a connecting pin connected to the electronic component, and the metal substrate is provided with a notch at a position corresponding to the connecting pin so that the connecting pin is exposed to the notch and is connected and fixed to the electronic component.

[0015] Preferably, the electronic component and the friction area are arranged on the same surface of the ceramic substrate; or,

[0016] The electronic component and the friction area are respectively arranged on two opposite surfaces of the ceramic substrate.

[0017] Preferably, the metal substrate has a flat plate portion disposed close to the ceramic substrate and a bent portion extending from the flat plate portion, and one end of the bent portion is exposed to the insulating body; and / or,

[0018] At least a portion of the edge of the flat plate portion protrudes from a corresponding edge of the ceramic substrate.

[0019] Preferably, the insulating body comprises a bottom plate and a side wall provided on at least one side of the bottom plate, and the flat plate portions of the ceramic substrate and the metal substrate are both buried in the side wall of the insulating body; or,

[0020] The ceramic substrate and the flat plate portion of the metal substrate are both buried in the bottom plate of the insulating body.

[0021] Preferably, a bonding layer is provided between the ceramic substrate and the metal substrate, and the ceramic substrate and the metal substrate are connected via the bonding layer; or,

[0022] A welding pad is provided on a side of the ceramic substrate facing the metal substrate, and the ceramic substrate is connected to the metal substrate by welding the welding pad.

[0023] Preferably, the insulating body is made of plastic material, and the insulating body covers and fixes the ceramic substrate and the metal substrate by integral injection molding.

[0024] Compared with the prior art, the beneficial effects of the present invention include at least:

[0025] The camera module component of the utility model can enhance the structural strength of the insulating body and thus enhance the overall structural strength of the camera module component by burying the metal substrate in the insulating body, and can abut and connect the ceramic substrate and the metal substrate, so that when the metal substrate and the ceramic substrate are buried in the insulating body or the camera module component is used, the metal substrate can bear part of the impact force, thereby reducing the impact force on the ceramic substrate and avoiding breakage of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the structure of a camera module component at an angle according to an embodiment of the utility model.

[0027] Figure 2 It is a schematic diagram of an angled breakdown of components for a camera module according to an embodiment of the utility model.

[0028] Figure 3 This is a schematic structural diagram from another angle of a component for a camera module according to an embodiment of the utility model.

[0029] Figure 4 It is a schematic structural diagram of an angle of a component for a camera module according to another embodiment of the utility model.

[0030] Figure 5 It is a schematic structural diagram from another angle of a component for a camera module according to another embodiment of the utility model.

[0031] In the figure: 100, component for camera module; 1, insulating body; 11, bottom plate; 12, side wall; 13, accommodating space; 2, metal substrate; 21, flat plate portion; 211, notch; 22, bending portion; 3, ceramic substrate; 31, first surface; 32, second surface; 33, friction area; 34, pad; 4, electronic component; 5, circuit; 51, connecting pin. DETAILED DESCRIPTION

[0032] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0033] The words expressing positions and directions described in the present utility model are all explained by taking the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of the present utility model.

[0034] Reference Figures 1 to 5 The utility model provides a camera module component 100, including an insulating body 1, a metal substrate 2 and a ceramic substrate 3, wherein a portion of the metal substrate 2 and a portion of the ceramic substrate 3 are buried in the insulating body 1. The insulating body 1 may be a base fixed relative to an optical element or a bracket, carrier, etc. that carries the optical element to move together. The optical element may be a lens, a prism, etc. The camera module component 100 may also include an electronic component 4, and the electronic component 4 is disposed on the ceramic substrate 3. In other embodiments, the camera module component 100 may also include another matching component that cooperates with the insulating body 1 for relative movement. When the insulating body 1 is a base fixed relative to the optical element, the other matching component is a bracket, carrier, etc. that carries the optical element and moves together; when the insulating body 1 is a bracket, carrier, etc. that carries the optical element and moves together, the other matching component is a base fixed relative to the optical element.

[0035] Specifically, at least part of the metal substrate 2 is buried in the insulating body 1, and the metal substrate 2 supports the insulating body 1, and the structural strength of the metal substrate 2 is preferably greater than the structural strength of the insulating body 1, so that the structural strength of the insulating body 1 can be enhanced, and then the overall structural strength of the camera module assembly 100 can be enhanced. The metal substrate 2 is preferably made of a material with high structural strength and not easy to deform to ensure that the metal substrate 2 has a high structural strength. The material of the metal substrate 2 is, for example, stainless steel, copper, etc.

[0036] Reference Figure 1 , Figure 2 , the ceramic substrate 3 is flat as a whole, and the ceramic substrate 3 can be a quadrilateral, a circle, etc. In the present embodiment, the ceramic substrate 3 is a rounded quadrilateral. At least part of the ceramic substrate 3 is buried in the insulating body 1, and the ceramic substrate 3 has two opposite sides, and at least part of one side of the ceramic substrate 3 is abutted against and connected to the metal substrate 2. In other words, the ceramic substrate 3 and the metal substrate 2 are connected to each other, and the ceramic substrate 3 and the metal substrate 2 are buried together in the insulating body 1 after being connected. Since the ceramic substrate 3 is fragile when bent, the ceramic substrate 3 is easy to break when the ceramic substrate 3 is subjected to impact force. In the present application, by abutting and connecting the ceramic substrate 3 and the metal substrate 2, when the insulating body 1 is injection molded or the camera module component 100 is used, the metal substrate 2 can bear part of the impact force, thereby reducing the impact force on the ceramic substrate 3, thereby avoiding the ceramic substrate 3 from breaking.

[0037] The impact force on the ceramic substrate 3 mainly comes from the impact force generated during embedding and use. When the metal substrate 2 and the ceramic substrate 3 are embedded in the insulating body 1, the ceramic substrate 3 will be subjected to impact force, such as the impact force from the molten plastic used for injection molding the insulating body 1, the embedding equipment, etc. The metal substrate 2 can bear part of the impact force generated during embedding, reducing the impact force on the ceramic substrate 3, thereby avoiding the ceramic substrate 3 from breaking. At the same time, the metal substrate 2 has a supporting and positioning function for the ceramic substrate 3, which can not only prevent the ceramic substrate 3 from bending, but also prevent the ceramic substrate 3 from shifting when embedded, ensuring the accuracy of the embedded position of the ceramic substrate 3. In addition, when the camera module component 100 is working, the insulating body 1 of the camera module component 100 and another matching component (not shown) collide with each other and generate impact force. At this time, the metal substrate 2 can also bear part of the impact force generated during the collision, reducing the impact force on the ceramic substrate 3, thereby avoiding the ceramic substrate 3 from breaking.

[0038] As a preferred method, the ceramic substrate 3 and the metal substrate 2 can be bonded together by bonding or welding. Specifically, a bonding layer (not shown) can be provided between the ceramic substrate 3 and the metal substrate 2. The material of the bonding layer can be an adhesive. The ceramic substrate 3 and the metal substrate 2 are connected via the bonding layer. The bonding layer ensures that the ceramic substrate 3 and the metal substrate 2 can be tightly fitted together to prevent the ceramic substrate 3 and the metal substrate 2 from being separated during the injection molding process. At the same time, the bonding layer is simple to set up, has low process requirements, and is convenient for production operations. The bonding layer also has a certain buffering effect, which can absorb part of the impact force and further reduce the impact force on the ceramic substrate 3. Reference Figure 2 A pad 34 may also be provided on the side of the ceramic substrate 3 facing the metal substrate 2, and solder may be provided on the pad 34. The ceramic substrate 3 and the metal substrate 2 are connected by welding, which not only allows the ceramic substrate 3 and the metal substrate 2 to fit tightly, but also improves the connection strength between the ceramic substrate 3 and the metal substrate 2, and further prevents the ceramic substrate 3 and the metal substrate 2 from separating during the injection molding process; or, the pad 34 of the ceramic substrate 3 and the metal substrate 2 are welded to each other by laser welding or resistance welding, so that the ceramic substrate 3 and the metal substrate 2 are connected.

[0039] In a specific embodiment, referring to Figures 1 to 4, the insulating body 1 may include a bottom plate 11 and a side wall 12 arranged around the bottom plate 11, and the bottom plate 11 and the side wall 12 are arranged vertically or approximately vertically. The number of the side wall 12 may be one or more. In the present embodiment, the number of the side wall 12 is three, and the three side walls 12 are connected end to end in sequence. In the present embodiment, the three side walls 12 connected end to end in sequence and the bottom plate 11 are surrounded to form a receiving space 13, and an optical element or another matching component may be arranged in the receiving space 13. Part of the metal substrate 2 and part of the ceramic substrate 3 may be buried in the side wall 12 of the insulating body 1, or, in other embodiments, part of the metal substrate 2 and part of the ceramic substrate 3 may be buried in the bottom plate 11 of the insulating body 1. In the present embodiment, part of the metal substrate 2 and part of the ceramic substrate 3 may be buried in the side wall 12 of the insulating body 1. The insulating body 1 is preferably made of plastic material, and the ceramic substrate 3 and the metal substrate 2 are fixedly connected to the insulating body 1 by integral injection molding, so that the ceramic substrate 3 and the metal substrate 2 are fixedly connected to the insulating body 1 more stably.

[0040] Reference Figure 4 , a friction zone 33 is provided on one side of the ceramic substrate 3, and the friction zone 33 is exposed from the insulating body 1, so that the friction zone 33 and another matching component contact each other and move relative to each other, so as to drive the optical element to zoom, focus, etc. That is, the insulating body 1 with the ceramic substrate 3 buried therein moves relative to each other, and when the insulating body 1 is fixed, the other matching component moves relative to the insulating body 1, or, when the other matching component is fixed, the insulating body 1 moves relative to the other matching component. That is, the friction zone 33 and another matching component contact each other and move relative to each other, so that the insulating body 1 with the ceramic substrate 3 buried therein moves relative to each other, and the friction zone 33 and another matching component realize relative movement through rolling friction cooperation of rolling parts such as balls and rollers, or the friction zone 33 and another matching component realize relative movement through direct contact and sliding friction cooperation. That is, when the insulating body 1 is fixed, the other matching component moves relative to the insulating body 1, or, when the other matching component is fixed, the insulating body 1 moves relative to the other matching component. In the present invention, no circuit 5 is arranged on the surface of the ceramic substrate 3 corresponding to the friction zone 33 .

[0041] As an example, the insulating body 1 can be a bracket for carrying an optical element (not shown), and another matching component is a base matching with the bracket; or, the insulating body 1 is a base, and another matching component is a bracket for carrying an optical element matching with the base, that is, the insulating body 1 can be a movable bracket for carrying the movement of the optical element, or a fixed base. The optical element can be directly fixed on the bracket, or can be first fixed on a bearing member and then indirectly fixed on the bracket by being movably connected with the bearing member together with the bracket. However, no matter how it is set, when the insulating body 1 moves relative to another matching component, the optical element can move together with the insulating body 1 as a bracket or another matching component.

[0042] In some embodiments, reference Figure 1 , Figure 3 , Figure 4 and Figure 5 , the camera module component 100 may also include an electronic component 4 arranged on the ceramic substrate 3, the number of the electronic component 4 may be one or more, a circuit 5 may be arranged on the ceramic substrate 3, the number of the circuit 5 may also be one or more, and the electronic component 4 is electrically connected to the circuit 5 on the ceramic substrate 3. As an example, the electronic component 4 may be a Hall sensor, and the electronic component 4 may be used to detect the relative position of the insulating body 1 and another matching component, thereby controlling the position of the optical element. Of course, the electronic component 4 may also be other types of electronic devices. The electronic component 4 may be electrically connected to an external component (not shown) through the circuit 5, so that the electronic component 4 can communicate with the external component. The electronic component 4 may also be electrically connected to other components (not shown) in the camera module component 100 through the circuit 5, so that the electronic component 4 can communicate with other components in the camera module component 100.

[0043] As a preferred method, refer to Figure 2The metal substrate 2 has a flat plate portion 21 that is attached to and connected to the ceramic substrate 3 and a bent portion 22 that is bent and extended from the flat plate portion 21, and one end of the bent portion 22 is exposed to the insulating body 1. The flat plate portion 21 and part of the ceramic substrate 3 can be buried in the side wall 12 of the insulating body 1, or the flat plate portion 21 and part of the ceramic substrate 3 can be buried in the bottom plate 11 of the insulating body 1. The flat plate portion 21 is in the shape of a plate, and the number of the bent portions 22 can be one or more, and the bent portions 22 are preferably bent and extended from the four edges of the flat plate portion 21. In the present embodiment, the flat plate portion 21 is approximately quadrilateral as a whole, and the number of the bent portions 22 is two, and the two bent portions 22 are respectively arranged near two adjacent corners of the flat plate portion 21. In the present embodiment, the bent portion 22 is L-shaped as a whole, and other shapes can certainly be used. The L-shaped bending portion 22 can improve the overall stability of the metal substrate 2, especially when the metal substrate 2 is embedded in the insulating body 1 by integral injection molding, it can prevent the metal substrate 2 from shifting, ensure the accuracy of the position of the metal substrate 2, and further ensure the accuracy of the position of the ceramic substrate 3.

[0044] The metal substrate 2 can be produced by stamping, laser cutting and the like. During production, the metal substrate 2 is preferably obtained by stamping. A material strip (not shown) is provided at one end of the bending portion 22 exposed to the insulating body 1. The material strip is preferably obtained by stamping together with the metal substrate 2. The material strip can connect multiple metal substrates 2 together, and the ceramic substrate 3 is arranged in affixed with the metal substrate 2. Multiple ceramic substrates 3 are indirectly connected to the material strip through the metal substrate 2. Multiple metal substrates 2 and multiple ceramic substrates 3 are simultaneously buried in multiple insulating bodies 1 by integral injection molding. Therefore, the metal substrate 2 and the ceramic substrate 3 are injection molded with the insulating body 1 by the material strip, which facilitates automated production, and multiple groups of camera module components 100 can be produced at the same time, thereby improving production efficiency. At the same time, the material strip has a positioning effect on the metal substrate 2 and the ceramic substrate 3, and can further prevent the position of the metal substrate 2 and the ceramic substrate 3 on the insulating body 1 from shifting during the injection molding process.

[0045] At least part of the edge of the flat plate portion 21 protrudes from the edge of the ceramic substrate 3. In this embodiment, at least two opposite edges of the flat plate portion 21 protrude from the edge of the ceramic substrate 3, that is, the size of at least two opposite edges of the flat plate portion 21 is larger than the size of the edge of the ceramic substrate 3, so that at least two opposite edges of the flat plate portion 21 exceed the corresponding edges of the ceramic substrate 3. As a preferred embodiment, excluding the position of the notch 211 on the flat plate portion 21, the edges of the remaining positions of the flat plate portion 21 all protrude from the edges of the ceramic substrate 3, so that the flat plate portion 21 can bear more impact force, further reducing the impact force on the ceramic substrate 3, thereby avoiding the ceramic substrate 3 from breaking, and ensuring that the edge position of the ceramic substrate 3 is damaged by the impact force.

[0046] Reference Figure 2 A notch 211 may be provided at a position corresponding to the metal substrate 2 and the circuit 5, that is, a notch 211 may be provided at a position corresponding to the flat plate portion 21 and the circuit 5, and a position corresponding to the notch 211 of the ceramic substrate 3 is exposed to the insulating body 1, so that the circuit 5 is exposed to the insulating body 1, which can facilitate electrical connection between the circuit 5 and the electronic component 4, and can also facilitate electrical connection between the circuit 5 and external components or other components in the camera module component 100.

[0047] In a specific embodiment, referring to Figure 1 , Figure 3 , Figure 4 and Figure 5 The two opposite sides of the ceramic substrate 3 are respectively the first side 31 and the second side 32. In this embodiment, the metal substrate 2 is arranged closer to the accommodation space 13, the first side 31 of the ceramic substrate 3 is arranged toward the accommodation space 13, the first side 31 of the ceramic substrate 3 is arranged toward the inner side of the insulating body 1, and the first side 31 of the ceramic substrate 3 can be arranged toward the metal substrate 2, that is, the first side 31 of a part of the ceramic substrate 3 is arranged in contact with the metal substrate 2, and the position corresponding to the first side 31 of a part of the ceramic substrate 3 and the notch 211 is exposed to the insulating body 1, and the second side 32 of the ceramic substrate 3 is arranged away from the accommodation space 13 and exposed from the insulating body 1, and the second side 32 of the ceramic substrate 3 is arranged toward the outer side of the insulating body 1. The electronic component 4 can be arranged on the first side 31 or the second side 32 of the ceramic substrate 3.

[0048] The circuit 5 can be arranged on the first surface 31 of the ceramic substrate 3, that is, the circuit 5 is arranged on the inner side of the insulating body 1, which has a protective effect on the circuit 5 and can prevent the circuit 5 from being damaged. Figure 2 , the circuit 5 is provided with a connection pin 51 connected to the electronic component 4, and a notch 211 is provided at a position corresponding to the connection pin 51 on the metal substrate 2, so that the connection pin 51 is exposed to the notch 211 and is connected and fixed to the electronic component 4. Of course, in other embodiments, the circuit 5 can also be provided on the second surface 32 of the ceramic substrate 3 as needed, that is, the circuit 5 is provided on the outside of the insulating body 1.

[0049] In some embodiments, the ceramic substrate 3 is arranged closer to the accommodation space 13, the first surface 31 of the ceramic substrate 3 is arranged toward the accommodation space 13 and exposed from the insulating body 1, and the second surface 32 of the ceramic substrate 3 can be oriented toward the metal substrate 2, that is, the second surface 32 of a part of the ceramic substrate 3 is arranged in contact with the metal substrate 2, and the position of the second surface 32 of a part of the ceramic substrate 3 corresponding to the notch 211 is exposed to the insulating body 1. The circuit 5 can be arranged on the first surface 31 of the ceramic substrate 3, and the electronic component 4 can be arranged on the first surface 31 or the second surface 32 of the ceramic substrate 3. The circuit 5 is arranged on the inner side of the insulating body 1, which has a protective effect on the circuit 5 and can prevent the circuit 5 from being damaged.

[0050] The electronic component 4 and the friction zone 33 may also be arranged on two opposite sides of the ceramic substrate 3, that is, the electronic component 4 is arranged on the first side 31 of the ceramic substrate 3, and the friction zone 33 is arranged on the second side 32 of the ceramic substrate 3, or the friction zone 33 is arranged on the first side 31 of the ceramic substrate 3, and the electronic component 4 is arranged on the second side 32 of the ceramic substrate 3. In one embodiment of the present application, referring to Figure 1 , Figure 3 The electronic component 4 is arranged on the first surface 31 of the ceramic substrate 3 , and the friction area 33 is arranged on the second surface 32 of the ceramic substrate 3 .

[0051] Reference Figure 5 , the electronic component 4 and the friction zone 33 can be arranged on the same surface of the ceramic substrate 3, that is, the electronic component 4 and the friction zone 33 can be arranged on the first surface 31 or the second surface 32 of the ceramic substrate 3 at the same time, or, the first surface 31 of the ceramic substrate 3 is provided with the electronic component 4 and the friction zone 33 at the same time, and the second surface 32 of the ceramic substrate 3 is also provided with the electronic component 4 and the friction zone 33. It can be arranged according to actual needs to meet the needs of different application occasions. In another embodiment of the present application, the electronic component 4 and the friction zone 33 can be arranged on the second surface 32 of the ceramic substrate 3 at the same time.

[0052] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the utility model. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the utility model.

Claims

1. A camera module component, characterized in that: include: Insulation body; A metal substrate, at least a portion of which is buried in the insulating body; A ceramic substrate, at least a portion of which is buried in the insulating body, the ceramic substrate has two opposite surfaces, and at least a portion of one surface of the ceramic substrate is abutted against and connected to the metal substrate.

2. The camera module assembly according to claim 1, characterized in that: A friction zone is arranged on one side of the ceramic substrate, and the friction zone is exposed from the insulating body, so that the friction zone and another matching component are in contact with each other and move relative to each other.

3. The camera module assembly according to claim 2, characterized in that: It also includes electronic components and circuits disposed on the ceramic substrate, wherein the electronic components are electrically connected to the circuits, and the electronic components are electrically connected to external components through the circuits; and / or, The electronic component is electrically connected to other components in the camera module assembly through the circuit.

4. The camera module assembly according to claim 3, characterized in that: The two opposite surfaces of the ceramic substrate are respectively a first surface and a second surface. The first surface of the ceramic substrate faces the metal substrate. The electronic component is arranged on the first surface or the second surface of the ceramic substrate.

5. The camera module assembly according to claim 4, characterized in that: The electronic component is arranged on the first surface of the ceramic substrate, the circuit is provided with a connecting pin connected to the electronic component, and the metal substrate is provided with a notch at a position corresponding to the connecting pin so that the connecting pin is exposed in the notch and is connected and fixed to the electronic component.

6. The camera module assembly according to claim 3, characterized in that: The electronic component and the friction area are arranged on the same surface of the ceramic substrate; or, The electronic component and the friction area are respectively arranged on two opposite surfaces of the ceramic substrate.

7. The camera module assembly according to claim 1, characterized in that: The metal substrate comprises a flat plate portion disposed close to the ceramic substrate and a bent portion extending from the flat plate portion, wherein one end of the bent portion is exposed to the insulating body; and / or, At least a portion of the edge of the flat plate portion protrudes from a corresponding edge of the ceramic substrate.

8. The camera module assembly according to claim 7, characterized in that: The insulating body comprises a bottom plate and a side wall disposed on at least one side of the bottom plate, and the flat plate portions of the ceramic substrate and the metal substrate are both buried in the side wall of the insulating body; or, The ceramic substrate and the flat plate portion of the metal substrate are both buried in the bottom plate of the insulating body.

9. The camera module assembly according to claim 1, characterized in that: A bonding layer is provided between the ceramic substrate and the metal substrate, and the ceramic substrate and the metal substrate are connected via the bonding layer; or, A welding pad is provided on a side of the ceramic substrate facing the metal substrate, and the ceramic substrate is connected to the metal substrate by welding the welding pad.

10. The camera module assembly according to claim 1, characterized in that: The insulating body is made of plastic material, and the insulating body covers and fixes the ceramic substrate and the metal substrate by integral injection molding.

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